SEMTECH SD05TC

SD05 & SD12
Single Line TVS Diode for ESD
Protection in Portable Electronics
PROTECTION PRODUCTS
Description
Features
u 350 Watts peak pulse power (tp = 8/20µs)
u Transient protection for data lines to
The SDxx TVS diodes are designed to replace multilayer
varistors (MLVs) in portable applications such as cell
phones, notebook computers, and PDA’s. They offer
superior electrical characteristics such as lower clamping voltage and no device degradation when compared
to MLVs. The SDxx series TVS diodes are designed to
protect sensitive semiconductor components from
damage or upset due to electrostatic discharge (ESD)
and other voltage induced transient events.
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u
The SDxx is in a SOD-323 package and will protect one
unidirectional line. They are available with working
voltages of 5 volts (SD05) and 12 volts (SD12). These
devices will fit on the same PCB pad area as an 0805
MLV device. They give the designer the flexibility to
protect one line in applications where arrays are not
practical. Additionally, it may be “sprinkled” around the
board in applications where board space is at a premium.
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
IEC 61000-4-5 (Lightning) 24A (tp = 8/20µs)
Small package for use in portable electronics
Suitable replacement for MLV’s in ESD protection
applications
Protects one I/O or power line
Low clamping voltage
Working voltages: 5V & 12V
Low leakage current
Solid-state silicon-avalanche technology
Mechanical Characteristics
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u
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EIAJ SOD-323 package
Molding compound flammability rating: UL 94V-0
Marking : Marking code, cathode band
Packaging : Tape and Reel per EIA 481
Applications
They may may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV
contact discharge).
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Cell Phone Handsets and Accessories
Microprocessor based equipment
Personal Digital Assistants (PDA’s)
Notebooks, Desktops, & Servers
Portable Instrumentation
Pagers Peripherals
Schematic & PIN Configuration
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2
SOD-323 (Top View)
Revision 9/2000
1
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SD05 & SD12
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbo l
Value
Units
Peak Pulse Pow er (tp = 8/20µs)
Pp k
350
Watts
Peak Pulse Current (tp = 8/20µs)
I PP
24
A
ESD Voltage (HBM Waveform p er IEC 61000-4-2)
V PP
30
kV
Lead Soldering Temp erature
TL
260 (10 sec.)
°C
Op erating Temp erature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temp erature
Electrical Characteristics
SD05
Par ame te r
Symbo l
Co nd itio ns
Minimum
Typ ical
Maximum
Units
5
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdow n Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
10
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µs
9.8
V
Clamp ing Voltage
VC
IPP = 24A, tp = 8/20µs
14.5
V
Junction Cap acitance
Cj
V R = 0V, f = 1MHz
350
pF
Symbo l
Co nd itio ns
Maximum
Units
12
V
6
V
SD12
Par ame te r
Minimum
Typ ical
Reverse Stand-Off Voltage
VRWM
Reverse Breakdow n Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 12V, T=25°C
1
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µs
19
V
Clamp ing Voltage
VC
IPP = 15A, tp = 8/20µs
25
V
Junction Cap acitance
Cj
VR = 0V, f = 1MHz
150
pF
ã 2000 Semtech Corp.
2
13.3
V
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SD05 & SD12
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
% of Rated Power or IPP
Peak Pulse Power - PPP (kW)
100
1
0.1
90
80
70
60
50
40
30
20
10
0
0.01
0
0.1
1
10
100
25
1000
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Duration - tp (µ s)
Pulse Waveform
Clamping Voltage vs. Peak Pulse Current
110
80
70
e
60
Clamping Voltage - VC (V)
90
Percent of IPP
30
Waveform
Parameters:
tr = 8µs
td = 20µs
100
-t
50
40
td = IPP/2
30
20
Waveform
Parameters:
tr = 8µs
td = 20µs
25
SD12
20
15
SD05
10
5
10
0
0
0
5
10
15
20
25
30
0
Time (µs)
ã 2000 Semtech Corp.
5
10
15
20
25
30
Peak Pulse Current - IPP (A)
3
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SD05 & SD12
PROTECTION PRODUCTS
Applications Information
Device Schematic & Pin Configuration
Device Connection Options
The SDxx TVS diodes are designed to protect one data,
I/O, or power supply line. The device is designed to
replace multi-layer varistors (MLVs) in portable
applications. It is easily implemented on existing 0805
MLV pads and is only slightly larger than 0603 MLV
pads. The device is unidirectional and may be used on
lines where the signal polarity is above ground. The
cathode band should be placed towards the line that is
to be protected.
Size Comparison to 0805 MLV
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended (Refer to application note
SI99-01 for more detailed information):
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Place the TVS near the input terminals or
connectors to restrict transient coupling.
Minimize the path length between the TVS and
the protected line.
The ESD transient return path to ground should
be kept as short as possible.
Place a TVS & decoupling capacitor between
power and ground of components that may be
vulnerable to electrostatic discharges to the
ground plane.
Minimize all conductive loops including power
and ground loops.
Use multilayer boards when possible.
Minimize interconnecting line lengths
Never run critical signals near board edges.
Fill unused portions of the PCB with ground
plane.
SOD-323
Component Placement Comparison
0805 MLV on
0805 Solder Pad
ã 2000 Semtech Corp.
0805 MLV
Note: Nominal dimensions in inches
4
SOD-323 on 0805
MLV Pad
SOD-323 on Recommended
(SOD-323) Solder Pad
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SD05 & SD12
PROTECTION PRODUCTS
Outline Drawing - SOD-323
Land Pattern - SOD-323
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SD05 & SD12
PROTECTION PRODUCTS
Marking Codes
Par t Numbe r
Mar king
Co d e
SD05
5U
SD12
6U
Ordering Information
P ar t
Numbe r
Wo r king
Vo ltage
Qty p e r
Reel
R e e l Size
SD05.TC
5V
3,000
7”
SD05.TG
5V
10,000
13”
SD12.TC
12V
3,000
7”
SD12.TG
12V
10,000
13”
Contact Information
Semtech Corporation
Protection Products Division
652 Mitchell Rd., Newbury Park, CA 91320
Phone: (805)498-2111 FAX (805)498-3804
ã 2000 Semtech Corp.
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