SMD Schottky Barrier Diode CDBV3-706F-HF Io = 30 mA VR = 40 Volts RoHS Device Halogen Free SOT-323 Features 0.087(2.20) 0.079(2.00) - Small package 3 0.053(1.35) - Low VF and Low IR 0.045(1.15) - High reliability 1 2 0.055(1.40) 0.047(1.20) Mechanical data - Case: SOT-323, molded plastic. 0.006(0.15) 0.003(0.08) - Terminals: Soldeable per MIL-STD-750, method 2026. - Mounting position: Any. 0.039(1.00) 0.096(2.45) 0.035(0.90) 0.085(2.15) - Weight: 0.005 grams(approx.). 0.004(0.10) 0.000(0.00) 0.016(0.40) 0.018(0.46) 0.010(0.26) 0.008(0.20) Circuit Diagram 3 1 Dimensions in inches and (millimeter) 2 Maximum Rating (at Ta=25°C unless otherwise noted) Symbol Value Unit Peak reverse voltage VRM 45 V DC reverse voltage VR 40 V Mean rectifying current IO 30 mA Non-repetitive peak forward surge current @ t=8.3ms IFSM 200 mA Power dissipation PD 200 mW RΘJA 500 °C/W Junction temperature range Tj -40 to +125 °C Storage Temperature range TSTG -55 to +150 °C Parameter Thermal resistance from Junction to ambient Electrical Characteristics (at Ta=25°C unless otherwise noded) Parameter Test Conditions Symbol Min Typ Max Unit Forward voltage IF = 1mA VF 0.37 V Reverse current VR = 10V IR 1 μA Capacitance between terminals VR = 1V, f=1MHz CT 2 pF Company reserves the right to improve product design , functions and reliability without notice. REV:A QW-JB064 Page 1 Comchip Technology CO., LTD. SMD Schottky Barrier Diode RATING AND CHARACTERISTIC CURVES (CDBV3-706F-HF) Fig.1 - Typical Forward Characteristics Fig.2 - Typical Reverse Characteristics 100 Reverse Current, (μA) Forward Current, (mA) 100 10 TA=100°C TA=75°C TA=50°C TA=25°C 1 10 TA=100°C TA=75°C 1 TA=50°C 0.1 TA=25°C 0.01 0 0 0 0.1 0.2 0.4 0.3 0.5 0.6 0.7 0 10 Forward Voltage, (V) 30 40 Reverse Voltage, (V) Fig.3 - Typical Capacitance Characteristics 4 Fig.4 - Typical Power Derating Curve 0.30 O TA=25 C f=1MHz Mounting on glass epoxy PCBs 0.25 Power Dissipation, (w) Capacitance Between Terminals, (PF) 20 3 2 1 0.20 0.15 0.10 0.05 0 0 0 5 10 15 20 25 30 Reverse Voltage, (V) 0 25 50 75 100 125 Ambient Temperature, (°C) Company reserves the right to improve product design , functions and reliability without notice. REV:A QW-JB064 Page 2 Comchip Technology CO., LTD. SMD Schottky Barrier Diode Reel Taping Specification P1 F E d P0 W B 3 XXX 1 2 C A P 12 o 0 D2 D1 D W1 SOT-323 SOT-323 SYMBOL A B C d D D1 D2 (mm) 2.25 ± 0.05 2.55 ± 0.05 1.19 ± 0.05 1.55 ± 0.10 178 ± 2.00 54.40 ± 1.00 13.00 ± 1.00 (inch) 0.089 ± 0.002 0.100 ± 0.002 0.047 ± 0.002 0.061 ± 0.004 7.008 ± 0.079 2.142 ± 0.039 0.512 ± 0.039 SYMBOL E F P P0 P1 W W1 (mm) 1.75 ± 0.10 3.50 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 8.00 + 0.30 /–0.10 12.30 ± 1.00 (inch) 0.069 ± 0.004 0.138 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.004 0.315 + 0.012 /–0.004 0.484 ± 0.039 Company reserves the right to improve product design , functions and reliability without notice. REV:A QW-JB064 Page 3 Comchip Technology CO., LTD. SMD Schottky Barrier Diode Marking Code 3 Part Number Marking Code CDBV3-706F-HF 3J XXX ● ● 1 2 xxx = Product type marking code Solid dot = Halogen free parts Suggested PAD Layout B SOT-323 SIZE (mm) (inch) A 0.80 0.031 B 0.50 0.020 C 1.30 0.051 D 2.20 0.087 A D C Standard Packaging REEL PACK Case Type SOT-323 REEL Reel Size ( pcs ) (inch) 3,000 7 Company reserves the right to improve product design , functions and reliability without notice. REV:A QW-JB064 Page 4 Comchip Technology CO., LTD.