RClamp0522P

RClamp0524PA
RClamp0522P
Ultra Low Capacitance TVS Arrays
PROTECTION PRODUCTS - RailClamp®
Description
PRELIMINARY
Features
RailClamp® TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. This series has been specifically designed to
protect sensitive components which are connected to
high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast
transients).
The RClamp®0522P and RClamp®0524PA have a
typical capacitance of only 0.30pF between I/O pins.
This allows it to be used on circuits operating in excess
of 3GHz without signal attenuation. They may be used
to meet the ESD immunity requirements of IEC 610004-2. The RClamp0522P is designed to protect two
lines, while the RClamp0524PA will protect four lines.
The RClamp0522P is in a 6-pin SLP1610P4 package. It
measures 1.6 x 1.0 with a nominal height of 0.58mm.
The RClamp0524PA is in a 10-pin SLP2510P8 package.
It measures 2.5 x 1.0 with a nominal height of 0.58mm.
The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. They are designed for easy
PCB layout by allowing the traces to run straight through
the device. The combination of small size, low capacitance, and high level of ESD protection makes them a
flexible solution for applications such as HDMI,
DisplayPortTM, MDDI, and eSATA interfaces.
‹ ESD protection for high-speed data lines to
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Mechanical Characteristics
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High Definition Multi-Media Interface (HDMI)
Digital Visual Interface (DVI)
DisplayPortTM Interface
MDDI Ports
PCI Express
eSATA Interfaces
Circuit Diagram - RClamp0524PA
Pin 1
Pin 2
3, 4
Pin 2
Pin 4
Pin 5
3, 8
2-Line Protection
Revision 2/23/2011
SLP1610P4 6-pin package (1.6 x 1.0 x 0.58mm)
SLP2510P8 10-pin package (2.5 x 1.0 x 0.58mm)
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead Pitch: 0.5mm
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel
Applications
Circuit Diagram - RClamp0522P
Pin 1
IEC 61000-4-2 (ESD) ±17kV (air), ±12kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
Flow-Through design
Protects two or four I/O lines
Low capacitance: 0.3pF typical (I/O to I/O)
Low clamping voltage
Low operating voltage: 5V
Solid-state silicon-avalanche technology
4-Line Protection
1
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RClamp0524PA
RClamp0522P
Ultra Low Capacitance TVS Arrays
PROTECTION PRODUCTS - RailClamp®
Pin Identification and Configuration
PRELIMINARY
RClamp0522P
RClamp0524PA
6
5
4
10
9
8
7
6
1
2
3
1
2
3
4
5
Pin
Identification
Pin
Identification
1-2
Input Lines
1, 2, 4, 5
Input Lines
5-6
Output Lines
(No Internal Connection)
6, 7, 9, 10
Output Lines
(No Internal Connection)
3-4
Ground
3, 8
Ground
SLP2510P8 Pin Configuration (Top View)
SLP1610P4 Pin Configuration (Top View)
Pin 1
Pin 2
Pin 1
3, 4
Pin 2
Pin 4
Pin 5
3, 8
Circuit Diagram
Circuit Diagram
Ordering Information
Part Number
Number
of Lines
Qty per
Reel
Reel
Size
RClamp0522P.TCT
2
3000
7 Inch
RClamp0524PATCT
4
3000
7 Inch
RailClamp and RClamp are marks of Semtech Corporation.
2
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Ppk
150
Watts
Peak Pulse Current (tp = 8/20μs)
IPP
5
A
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
+/- 17
+/- 12
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Any I/O p in to ground
Reverse Breakdown Voltage
V BR
It = 1mA
Any I/O p in to ground
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Any I/O p in to ground
1
μA
Clamp ing Voltage
VC
IPP = 1A, tp = 8/20μs
Any I/O p in to ground
15
V
Junction Cap acitance
Cj
VR = 0V, f = 1MHz
Between I/O p ins
0.4
pF
Junction Cap acitance
Cj
VR = 0V, f = 1MHz
Any I/O p in to ground
0.8
pF
© 2011 Semtech Corp.
3
Minimum
Typical
Maximum
Units
5
V
6
V
0.30
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
Peak Pulse Power - PPP (kW)
100
% of Rated Power or IPP
90
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Duration - tp (us)
Pulse Waveform
Clamping Voltage vs. Peak Pulse Current
(Between any I/O and Ground)
110
Waveform
Parameters:
tr = 8祍
td = 20祍
100
90
70
35
Clamping Voltage -VC (V)
Percent of I
PP
80
40
e-t
60
50
40
td = IPP/2
30
20
10
30
Line to Line
25
20
Line to Gnd
15
Waveform
Parameters:
tr = 8 s
td = 20 s
10
5
0
0
5
10
15
20
25
0
30
0
1
2
Time (祍)
4
5
6
Insertion Loss S21 - I/O to GND
Normalized Capacitance vs. Reverse Voltage
CH1 S21
CJ(VR) / CJ(VR=0)
3
Peak Pulse Current - IPP (A)
1.5
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
LOG
6 dB / REF 0 dB
1: -0.086 dB
900 MHz
3
0 dB
1
2: -0.0336 dB
1.8 GHz
2
3: -0.126 dB
2.5 GHz
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
f = 1 MHz
-42 dB
0
1
2
3
Reverse Voltage - VR (V)
4
5
-48 dB
1
MHz
START . 030 MHz
© 2011 Semtech Corp.
4
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
Insertion Loss S21 - I/O to I/O
CH1 S21
LOG
6 dB / REF 0 dB
1: -0.076 dB
900 MHz
3
0 dB
1
2: -0.062 dB
1.8 GHz
2
3: -0.1087 dB
2.5 GHz
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
MHz
START . 030 MHz
© 2011 Semtech Corp.
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
5
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Design Recommendations for HDMI Protection
Adding external ESD protection to HDMI ports can be
challenging. First, ESD protection devices have an
inherent junction capacitance. Furthermore, adding
even a small amount of capacitance will cause the
impedance of the differential pair to drop. Second,
large packages and land pattern requirements cause
discontinuities that adversely affect signal integrity.
The RClamp0524PA and RClamp0522P are specifically
designed for protection of high-speed interfaces such
as HDMI. They present <0.4pF capacitance between
the pairs while being rated to handle >±8kV ESD
contact discharges (>±15kV air discharge) as outlined
in IEC 61000-4-2. Each device is in a leadless SLP
package that is less than 1.1mm wide. They are
designed such that the traces flow straight through the
device. The narrow package and flow-through design
reduces discontinuities and minimizes impact on signal
integrity. This becomes even more critical as signal
speeds increase.
HDMI Connector
12
11
10
1
GND
GND
9
8
7
6
5
4
1
GND
GND
3
2
1
Figure 1. Flow through Layout Using
R Clam
p052
4P
A
Clamp052
p0524P
4PA
Pin Configuration
Figure 1 is an example of how to route the high speed
differential traces through the RClamp0524PA. The
solid line represents the PCB trace. The PCB traces
are used to connect the pin pairs for each line (pin 1 to
pin 10, pin 2 to pin 9, pin 4 to pin 7, pin 5 to pin 6).
For example, line 1 enters at pin 1 and exits at Pin 10
and the PCB trace connects pin 1 and 10 together.
This is true for lines connected at pins 2, 4, and 5 also.
Ground is connected at pins 3 and 8. One large
ground pad should be used in lieu of two separate
pads. The same layout rules apply for the
RClamp0522P.
TDR Measurements for HDMI
The combination of low capacitance, small package, and
flow-through design means it is possible to use these
devices to meet the HDMI impedance requirements of
100 Ohms ±15% without any PCB board modification.
Figure 3 shows a typical impedance test result for a
TDR risetime of 200ps using a Semtech evaluation
board with 100 Ohm traces throughout. Measurements were taken using a TDR method as outlined in
the HDMI Compliance Test Specification (CTS). In each
© 2011 Semtech Corp.
6
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
case, the device meets the HDMI CTS requirement of
100 Ohm ±15% with plenty of margin.
Figure 3 shows a typical HDMI 1.3 eye pattern at
1080p resolution. As shown there are no violations of
the eye pattern with RClamp0524PA in the circuit. The
RClamp0524PA may also be used to protect the
remaining lines (I2C, CEC, and hot plug). Figure 4
shows the complete protection solution.
Layout Guidelines for Optimum ESD Protection
Good circuit board layout is critical not only for signal
integrity, but also for effective suppression of ESD induced transients. For optimum ESD protection, the
following guidelines are recommended:
z Place the device as close to the connector as possible. This practice restricts ESD coupling into
adjacent traces and reduces parasitic inductance.
z The ESD transient return path to ground should be
kept as short as possible. Whenever possible, use
multiple micro vias connected directly from the device
ground pad to the ground plane.
z Avoid running critical signals near board edges.
X-axis
Y-axis
1.79
98.3
(nsec)
(Ohm)
Figure 2 - TDR Measurement with 200ps risetime
using Semtech Evaluation Board
Note: Measurements were taken on SLP HDMI EVAL Rev C Board that has 100Ω
differential traces impedance throughout (No trace Compensation).
Protecting MDDI Ports with RClamp0524PA and
RClamp0522P
The small package size and low capacitance of the
RClamp0522P and RClamp0524PA make them ideal
for high-speed lines in portable applications. One such
application is the protection of MDDI ports in cellular
phones. MDDI is a serial data interface operating at
480Mb/s per line pair. The lines are scalable for
increased speed and display resolution. A MDDI port
protection example is shown in Figure 5. The
RClamp0524PA is used to protect two differential line
pairs while an RClamp0522P is used to protect the
MDDI strobe lines. Note that devices are used on
both the main board and LCD side of the MDDI port.
Devices on the main board are needed to protect the
MDDI controller in the Baseband processor and
devices on the LCD board to protect MDDI controller in
LCD module. A single line TVS such as the
uClamp0501P is used to protect the MDDI power line.
The protection devices should be placed close to the
connector of each board. Traces are routed directly
through each device, minimizing parasitic inductance.
Connections to the ground plane should be made with
multiple micro vias when possible.
© 2011 Semtech Corp.
Figure 3 - Typical HDMI 1.3 Eye Pattern (1080p)
with RClamp0524PA
7
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Data 2+
Data 2Data 1+
Data 1-
To HDMI
Graphics Chip
Data 0+
Data 0-Clk+
Clk-
RClamp0524PA(3(3
Each)
RClamp0544T
Each)
CEC
SCL
SDA
HP Detect
5VPower
Gnd
Figure 4. HDMI Protection
MDDI_Data0+
MDDI_Data0Gnd
MDDI Link
Controller
MDDI_Data1+
Gnd
MDDI Link
Controller
MDDI_Data1RClamp0524P
RClamp0524PA
RClamp0524P
RClamp0524PA
MDDI_Stb+
MDDI_StbGnd
Gnd
RClamp0522P
RClamp0522P
RClamp0522P
RClamp0522P
Host Pwr
HOST
Host Gnd
uClamp0501P
uClamp0501P
Figure 5. MDDI Port Protection
© 2011 Semtech Corp.
8
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information Spice Model
RClamp0522P Spice Model
R Clamp0522P Spice Parameters
© 2011 Semtech Corp.
Parameter
Unit
D1
D2
D3
IS
A mp
1E-20
1E-20
2E-12
BV
Volt
100
100
8.2
VJ
Volt
0.83
0.83
0.6
RS
Ohm
1.5
0.6
0.2
IB V
Amp
1E-3
1E-3
1E-3
CJO
Farad
0.25E-12
0.25E-12
56E-12
TT
sec
2.541E-9
2.541E-9
2.541E-9
M
--
0.01
0.01
0.23
N
--
1.1
1.1
1.1
EG
eV
1.11
1.11
1.11
9
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information Spice Model
RClamp0524PA Spice Model
R Clamp0524PA Spice Par ame te r s
© 2011 Semtech Corp.
Par ame te r
Unit
D1
D2
D3
IS
Amp
4.6722E-5
1E-20
1.0017E-12
BV
Volt
100
100
8.3312
VJ
Volt
1.0508
1.0508
0.75
RS
Ohm
1.2
0.41766
0.3
IB V
Amp
1E-4
1E-4
3.1155E-3
CJO
Farad
1.6031E-13
1.6031E-13
1.0555E-10
TT
sec
2.541E-9
2.541E-9
2.541E-9
M
--
0.1
0.1
0.33194
N
--
5
0.60891
4.995
IKF
Amp
0
959.36
1.1141E-9
EG
eV
1.11
1.11
1.11
10
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - SO-8
Outline
SLP1610P4
A
D
B
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A2
b1xN
bbb
2
1
E/2
.020 .023 .026
0.00 .001 .002
(.005)
.006 .008 .010
.014 .016 .018
.059 .063 .067
.035 .039 .043
.020 BSC
.039 BSC
.012 .015 .017
4
.003
.004
0.50 0.58 0.65
0.00 0.03 0.05
(0.13)
0.15 0.20 0.25
0.35 0.40 0.45
1.50 1.60 1.70
0.90 1.00 1.10
0.50 BSC
1.00 BSC
0.30 0.38 0.43
4
0.08
0.10
C
A1
bxN
C A B
bbb
A
A1
A2
b
b1
D
E
e
e1
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
C A B
R0.125
LxN
N
2X R0.075
3 PLACES
e
e1
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1610P4
P1
P
DIMENSIONS
DIM
C
G
P
P1
X
X1
Y
Y1
Z
Y
Z (C) G
(Y1)
X
X1
INCHES
(.034)
.007
.020
.039
.008
.016
.027
(.061)
.061
MILLIMETERS
(0.87)
0.19
0.50
1.00
0.20
0.40
0.68
(1.55)
1.55
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2011 Semtech Corp.
11
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - SO-8
Outline
SLP2510P8
A
D
B
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A2
b1xN
bbb
1
E/2
C
A1
R0.125
A
A1
A2
b
b1
D
E
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.020 .023 .026 0.50 0.58 0.65
0.00 .001 .002 0.00 0.03 0.05
(.005)
(0.13)
.006 .008 .010 0.15 0.20 0.25
.014 .016 .018 0.35 0.40 0.45
.094 .098 .102 2.40 2.50 2.60
.035 .039 .043 0.90 1.00 1.10
.020 BSC
0.50 BSC
.012 .015 .017 0.30 0.38 0.425
8
8
.003
0.08
.004
0.10
C A B
2
LxN
2X R0.075
7 PLACES
N
bxN
e
bbb
D/2
C A B
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP2510P8
P1
P
DIMENSIONS
DIM
C
G
P
P1
X
X1
Y
Y1
Z
Y
Z (C)
(Y1)
G
X
X1
INCHES
(.034)
.008
.020
.039
.008
.016
.027
(.061)
.061
MILLIMETERS
(0.875)
0.20
0.50
1.00
0.20
0.40
0.675
(1.55)
1.55
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2011 Semtech Corp.
12
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Marking Codes
RClamp0524PA
RClamp0522P
0524P
PIN 1
INDICATOR
YYWW
0522P
PIN 1
INDICATOR
YYWW = Date Code
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
Part Number
A0
B0
K0
RClamp0522P
1.30 +/-0.05 mm
1.75 +/-0.05 mm
0.70 +/-0.05 mm
RClamp0524PA
1.23 +/-0.05 mm
2.70 +/-0.05 mm
0.70 +/-0.05 mm
Tape
Width
B, (Max)
D
8 mm
4.2 mm
1.5 + 0.1 mm
- 0.0 mm )
D1
E
0.5 mm
±0.05
1.750±.10
mm
F
K
(MAX)
P
P0
P2
T(MAX)
3.5±0.05
mm
2.4 mm
4.0±0.1
mm
4.0±0.1
mm
2.0±0.05
mm
0.4 mm
W
8.0 mm
+ 0.3 mm
- 0.1 mm
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2011 Semtech Corp.
13
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RClamp0524PA
RClamp0522P
PRELIMINARY
PROTECTION PRODUCTS
Date
Description
Release of "A" Sp ecification
N ote that electrical characteristics match
RClamp 0544T
2/26/10
3/8/2010
Change elecetrical sp ecification & typ curves back
to match original RClamp 0522/24P
Add HDMI ap p s diagram
Up date TDR & add EPT diagrams
Up dated ESD sp ecification on p age 1
2/23/11
© 2011 Semtech Corp.
Remove "A" suffix from RClamp 0522P
14
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