DATE 18 March, 2015 No. V-70033C Messrs. SPECIFICATION Semiconductor Pressure Sensor - Standard Product Model: AP4, AG4 Pressure Sensor Project: Distributor: Reference: Yoshiyuki Uchiumi, Application Engineer Sensor Department Fujikura Ltd. V-70033C Table of Contents 1. General ......................................................................................................................................... 2 2. Principle ........................................................................................................................................ 2 3. Device Lineup................................................................................................................................ 2 4. RoHS.............................................................................................................................................. 2 5. Block Diagram and Pin Connections ............................................................................................. 3 6. Device Name Code........................................................................................................................ 4 7. Absolute Maximum Ratings.......................................................................................................... 5 8. General Specifications .................................................................................................................. 5 9. Electrical Characteristics ............................................................................................................... 6 10. Communication Interface ............................................................................................................. 7 11. Communication Protocol .............................................................................................................. 8 12. Output versus Input Pressure ....................................................................................................... 9 13. Transfer Function........................................................................................................................ 10 14. Operating Sequence ................................................................................................................... 10 15. Device Marking ........................................................................................................................... 11 16. Soldering ..................................................................................................................................... 12 17. Dimensions and Weights ............................................................................................................ 12 18. Ordering Information ................................................................................................................. 13 19. Tape & Reel Information ............................................................................................................ 13 20. Footprint for PCB (for Reference)............................................................................................... 14 21. Notes........................................................................................................................................... 15 Appendix: Dimension Drawing .......................................................................................................... 16 9-772-001 APxxN ............................................................................................................................ 16 9-772-002 APxxR ............................................................................................................................ 17 9-772-003 AGxx3 ............................................................................................................................ 18 9-772-004 AGxx6 ............................................................................................................................ 19 Table shown below is revision records of this specification Rev. C Rev. B Rev. A Est. 18 Mar., 2015 7 Jan., 2015 29 July, 2014 15 May, 2014 Date Y. Uchiumi Y Uchiumi Y Uchiumi Y Uchiumi Name Change arrangement of Slave address code and Custom ID Added 700kPa(700KG). Correction 10. Communication Interface C B A Comment Mark 1 of 19 V-70033C 1. General This document describes the specifications of Fujikura Pressure Sensors, AP4 and AG4 series. 2. Principle Fujikura Pressure Sensor is composed of a silicon piezoresistive pressure sensing chip and a signal conditioning integrated circuit. The low-level signal from the sensing chip is amplified, temperature compensated, calibrated, and finally converted to digital data that is proportional to the applied pressure. 3. Device Lineup This device has the following lineup. Model Pressure Type Supply Voltage Pressure Range Accuracy -100 -50 (-15) 0 (-7) 25 50 100 200 500 700 1000 kPa (3) (15) (30) (70) (100) (150) psi (7) 025KG 050KG 100KG AP4 or AG4 Gauge 5.0 Vdc 3.3 Vdc 3.0 Vdc 200KG 500KG ±1.5 %FS 700KG 001MG 050KV 100KV 100KW Features Applications Digital output Low power consumption High accuracy Package compatible with XFPM & XFGM integrated pressure sensor Modification available Battery-operated devices Medical devices Industrial pneumatic devices Consumer devices 4. RoHS This device is compliant with the Restriction of the use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). 2 of 19 V-70033C 5. Block Diagram and Pin Connections 3.0, 3.3 or 5.0 Vdc Pin 4 VDD VDD Temperature Sensor 0.1 µF Sensor Bridge MUX ADC DSP Communication Interface Pin 3 SCL Pre-amplifier Pin 2 SDA EEPROM Pin 5 VSS Pin 1 NC AG4 4 56 4 5 6 Index Index Pipe 3 21 3 2 1 Power On Reset Oscillator Pin 6 NC Pin Assignment AP4 Rpu x 2 Pipe Pin No. Pin Name I/O Type 1 2 3 4 5 6 NC SDA SCL VDD VSS NC I/O I - Digital Digital - Notes: *1) Put a 0.1 µF capacitor between Pin 4 (VDD) and VSS. *2) Pin 1 and 6 must be open. 3 of 19 Function Serial bidirectional data Serial clock input Power supply connection Common voltage connection - *2 *1 *2 V-70033C 6. Device Name Code C The device name code is consisted of Sensor code, Pressure code, Slave address code and Packing style. For the exact ordering device number, please refer to Chapter 18 Ordering Information. Sensor Code Pressure Code AP4 0 N - 025K G - 2 - Packing style Custom ID if applicable (3 characters) 2: 0x28 Slave address code G: V: Pressure type W: 025K: 050K: 100K: 200K: 500K: 700K: Pressure value 001M: Blank: Tray TP: Tape & Reel STICK: Stick 7: 0x78 Gauge / Positive-pressure Gauge / Negative-pressure Gauge / Bi-pressure 25 kPa 50 kPa 100 kPa 200 kPa 500 kPa 700 kPa 1 MPa N: Normal Pin direction for AP4 R: Opposite 3: 3 mm Port length for AG4 Supply voltage Model 6: 6 mm 0: 5.0 Vdc 1: 3.3 Vdc 2: 3.0 Vdc AP4: DIP / Digital Output AG4: SMD / Digital Output 4 of 19 V-70033C 7. Absolute Maximum Ratings Item Load Pressure Symbol 025KG 050KG 100KG 200KG 500KG 700KG 001MG 050KV 100KV 100KW Pressure Code Pmax+ Supply Voltage Voltage at Digital I/O pins Operating Temperature Storage Temperature VDDmax Vdiomax Topt Tstg Min. -0.3 -0.3 -40 -40 Rating Typ. - Max. +50 +100 +200 +400 +1 +1.4 +1.5 +100 +200 +200 6 VDD+0.3 +125 +125 Unit kPa kPa kPa kPa MPa MPa MPa kPa kPa kPa Vdc Vdc deg. C deg. C B Note: Absolute maximum ratings are the limits that the device will withstand without damage. 8. General Specifications Item Supply Voltage Condition Sensor Code Symbol AP40x, AG40x AP41x, AG41x AP42x, AG42x Type of Pressure Pressure Media Pressure Range Compensated Temperature Operating Humidity Storage Humidity Dielectric Strength Insulation Resistance VDD - Pressure Code 025KG 050KG 100KG 200KG 500KG 700KG 001MG 050KV 100KV 100KW Popt Hopt Hstg Non-condensing Non-condensing Rating Typ. Max. 5 5.25 3.3 3.465 3.0 3.15 Gauge pressure Non-corrosive gases 0 +25 0 +50 0 +100 0 +200 0 +500 0 +700 0 +1 -50 0 -100 0 -100 +100 0 +85 30 85 30 85 1 100 - Min. 4.75 3.135 2.85 Unit Vdc kPa kPa kPa kPa kPa kPa MPa kPa kPa kPa deg. C %RH %RH mA MΩ Notes: *1) Supply voltage (VDD) should be constant. *2) Gauge pressure is defined as the difference between applied pressure to the pressure port and atmospheric pressure of the device. *3) Ensure the pressure media contains no particulates. The device is not compatible with liquids. *4) Pressure range is defined as the measurable pressure range of the device. Do not expose intentionally beyond minimum Popt and maximum Popt. *5) Please also refer to Chapter 13 Transfer Function. *6) Do not wet the device with dew. *7) Dielectric strength is defined as the leakage current between all pins and the package with AC 500 V, 1 minute. *8) Insulation resistance is defined as the resistance value between all pins and the package with DC 500 V. 5 of 19 *1 *2 *3 *4 B *5 *6 *6 *7 *8 V-70033C 9. Electrical Characteristics Item Offset Pressure Data Full Scale Pressure Data Span Pressure Data Accuracy Supply Current Response Time Condition Symbol Min. Popt, 050KV, 100KV: Max. Popt Max. Popt, 050KV, 100KV: Min. Popt Min. to max. Popt 0 to 85 deg. C VDD = 5 Vdc VDD = 3.3, 3.0 Vdc for reference Doff Dfs SD Error Ic tr Min. 598 15344 -1.5 - Ambient temperature Ta=25deg. C Rating Unit Typ. Max. 819 1040 Count 15565 15786 Count 14746 Count +1.5 %FS 4.5 mAdc 3.5 1 msec. Notes: *1) Offset pressure data (Doff) is defined as the pressure data at minimum Popt. In case of 050KV and 100KV, Offset pressure data (Doff) is defined as the pressure data of maximum Popt. *2) Offset error is calibration error of Offset pressure data (Doff) at production. It does not include Long term offset drift. It would be suggested that applications have Auto-zeroing function. *3) Full scale pressure data (Dfs) is defined as the pressure data at maximum Popt. In case of 050KV and 100KV, Full scale pressure data (Dfs) is defined as the pressure data of minimum Popt. *4) Span pressure data (SD) is defined as the pressure data difference between Offset pressure data (Doff) and Full scale pressure data (Dfs). *5) Accuracy consists of the following: Non-linearity Temperature errors over the temperature range 0 to 85 degree C Pressure hysteresis Calibration errors of sensitivity and offset *6) The unit of Accuracy “%FS” is defined as a percent error by Span pressure data (SD). *7) We can offer lower power mode products as modification line. Please ask to Fujikura. *8) Response time (tr) is defined as the time for the change in the pressure data from 10 % to 90 % or from 90 % to10 % of its final value when the input pressure makes a step change. Input Pressure 0 kPa Final value 90 % of Final value Pressure Data 10 % of Final value Doff tr tr 6 of 19 *1, 2 *3 *4 *5, 6 *7 *8 V-70033C 10. Communication Interface A Item Condition Symbol Min. Interface Input Low Voltage Sensor Code Input High Voltage Sensor Code Output Low Voltage Sensor Code AP40x, AG40x AP41x, AG41x AP42x, AG42x AP40x, AG40x AP41x, AG41x AP42x, AG42x AP40x, AG40x AP41x, AG41x AP42x, AG42x VIL VIH VOL SCL clock frequency Start condition hold time relative to SCL edge Minimum SCL clock low width Minimum SCL clock high width Start condition setup time relative to SCL edge Data hold time on SDA relative to SCL edge Data setup time on SDA relative to SCL edge Stop condition setup time on SCL Bus free time between stop condition and start condition Load Capacitance Pin2 SDA, 400kHz Pull-up Resistor Pin2 SDA, Pin3 SCL Slave address 7 bit fSCL tHDSTA tLOW tHIGH tSUSTA tHDDAT tSUDAT tSUSTO tBUS Cmax Rpu 0 0 0 4 2.64 2.4 100 0.1 0.6 0.6 0.1 0 0.1 0.1 2 1 Ambient temperature Ta=25deg. C Rating Unit Typ. Max. 2 TM IC 1 V 0.66 V 0.6 V 5 V 3.3 V 3 V 0.5 V 0.33 V 0.3 V 400 kHz μsec. μsec. μsec. μsec. μsec. μsec. μsec. μsec. 200 pF kΩ 0x28 to 0x78 Notes: 2 TM *1) I C is a trademark of NXP Semiconductors. *2) There are three differences in this device protocol compared with the original I2C™ protocol: Sending a start-stop condition without any transitions on the CLK line (no clock pulses in between) creates a communication error for the next communication, even if the next start condition is correct and the clock pulse is applied. An additional start condition must be sent, which results in restoration of proper communication. The restart condition - a falling SDA edge during data transmission when the CLK clock line is still high - creates the same situation. The next communication fails, and an additional start condition must be sent for correct communication. A falling SDA edge is not allowed between the start condition and the first rising SCL edge. If using an I2C™ address with the first bit 0, SDA must be held low from the start condition through the first bit. *3) Combined low and high widths must equal or exceed minimum SCLK period. *4) Slave address is set by the factory. Please designate the slave address in the device name code. If you can accept any address, 0x28 is recommended. Timing Diagram SDA tSUDAT tLOW tHDSTA tBUS SCL tHDSTA tHDDAT tHIGH tSUSTO tSUSTA 7 of 19 *1, 2 *3 *3 *4 V-70033C 11. Communication Protocol Item Measurement Packet Slave Address [6:0] Status Pressure Data Bit [13:8] Pressure Data [7:0] S 6 5 4 3 2 1 0 R A 15 14 13 12 11 10 9 8 A 7 6 5 4 3 2 1 0 N S From Master to Slave From Slave to Master Data Fetch From Master to Slave S Start Condition R Status bits From Slave to Master Read (1) S Stop Condition A ACK From Master to Slave Slave Address Data Bit N NACK 00 Normal operation , good data packet 01 10 11 Device in Command Mode Stale data: Data has aleady been feched since the last measurement cycle. EEPROM Error Note: *1) Temperature data fetch is available after pressure data. For more information, please ask Fujikura. *2) If the status bits are 01, the device must be re-started to turn power supply off and on again. *3) If a data fetch is performed before or during the first measurement after power-on reset, then “stale” will be returned, but this data is actually invalid because the first measurement has not been completed. *4) If the status bits are 11, do not use the device anymore. 8 of 19 *1 *2 *3 *4 V-70033C 12. Output versus Input Pressure Pressure Code Output vs. Input pressure Temp. = 0 to 85℃ Dfs: 15565 Count 025KG 050KG 100KG 200KG 500KG 700KG 001MG Error: ±1.5 %FS SD: 14746 Doff: 819 Max. Popt Min. Popt: 0 kPa Input Pressure Temp. = 0 to 85℃ 050KV 100KV Count Dfs: 15565 SD: 1474 6 Error: ±1.5 %FS Doff: 819 Max. Popt: 0 kPa Min. Popt Input Pressure Temp. = 0 to 85℃ Count Dfs: 15565 Error: ±1.5 %FS SD: 14746 8192 100KW Doff: 819 Min. Popt 0 kPa Input Pressure 9 of 19 Max. Popt V-70033C 13. Transfer Function Pressure Data (Count) = P × α + β ± (Pressure Error × Temperature Error Multiplier) Parameters Parameter Pressure Code 025KG 050KG 100KG 200KG 500KG 700KG 001MG 050KV 100KV 100KW 0 0 0 0 0 0 0 -50 -100 -100 P (kPa) α β Pressure Error (Count) ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ 14746/25 7373/25 7373/50 7373/100 7373/250 7373/350 7373/500 -7373/25 -7373/50 7373/100 819 819 819 819 819 819 819 819 819 8192 221 221 221 221 221 221 221 221 221 221 +25 +50 +100 +200 +500 +700 +1000 0 0 +100 Temperature Error Multiplier 4 Error Multiplier 3 2 1 0 -40 -20 0 85 125 20 40 60 80 100 120 Temperature (℃) 14. Operating Sequence Supply Voltage VDD 2.7 V VSS 10 msec Max. Sensor Status Operation Initializing 10 of 19 V-70033C 15. Device Marking AP4 AG4 Production Lot YMDD AP40 025K 2 YMDD Sensor Code AG40 050K 2 Pressure Code Slave Address Code and Custom ID Items Production Lot Y M DD Sensor Code Marking Last digit of Production year Production month Production date 0~9 1, 2, 3 ~ 8, 9, X=Oct., Y=Nov., Z=Dec. 01~31 *1 AP40x AP41x AP42x AG40x AG41x AG42x AP40 AP41 AP42 AG40 AG41 AG42 025KG 025K 050KG 050K 100KG 100K 200KG 200K 500KG 500K Pressure Code 700KG 700K 001MG 001M 050KV 050V 100KV 100V 100KW 100W 2 3 4 5 6 7 2 3 4 5 6 7 If applicable Slave Address Code Custom ID Notes: *1) Pin direction for AP4 or Port length for AG4 is not marked on the face plate. *2) Custom ID will be added when product is customized for a customer. 11 of 19 *2 V-70033C 16. Soldering Process Sensor code Hand Soldering AP4xx Wave Soldering AP4xR Reflow Soldering AG4xx Condition Soldering iron temperature: 350 deg. C max. Soldering time: 3 seconds max. Soldering bath temperature: 260 deg. C max. Soldering time: 5 seconds max. *1, 2 *1, 2 *1, 2 3, 4 Soldering Profile 245 250 Temperature(℃) 230 200 150 100 50 0 A C B D Time A Ramp up B Pre-heating C Ramp up D Heating E Ramp down 2 to 4 deg. C / sec. 150 to 180 deg. C 60 to 120 sec. 2 to 4 deg. C / sec. Above 230 deg. C, 45 sec. max. 245 deg. C max., 10 sec. max. 2 to 4 deg. C / sec. Notes: *1) NEVER wash the device with any washing liquid. NEVER wash the device with any ultrasonic washing machine. *2) Do not put the solder and flux on the device’s package. *3) Temperature means Surface temperature of the device’s package. *4) Do not reflow more than twice. 17. Dimensions and Weights Refer to the following drawing as attached. Sensor Code Dimension Drawing AP4xN 9-772-001 AP4xR 9-772-002 AG4x3 9-772-003 approx. 0.3 grams AG4x6 9-772-004 approx. 0.4 grams 12 of 19 Weight approx. 1.4 grams E V-70033C 18. Ordering Information Model Package Supply Voltage Pin Direction Normal 5.0 Vdc Opposite Normal AP4 DIP 3.3 Vdc Opposite Normal 3.0 Vdc Opposite Packing Ordering Device Number Tray Stick Tray Stick Tray Stick Tray Stick Tray Stick Tray Stick AP40NAP40NAP40RAP40RAP41NAP41NAP41RAP41RAP42NAP42NAP42RAP42R- [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] Tray Tape & Reel Tray Tape & Reel Tray Tape & Reel Tray Tape & Reel Tray Tape & Reel Tray Tape & Reel AG403AG403AG406AG406AG413AG413AG416AG416AG423AG423AG426AG426- [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] [Pressure Code] -[Slave] -STICK -STICK -STICK -STICK -STICK -STICK Qty./Packing 150 40 150 40 150 40 150 40 150 40 150 40 Pcs/Tray Pcs/Stick Pcs/Tray Pcs/Stick Pcs/Tray Pcs/Stick Pcs/Tray Pcs/Stick Pcs/Tray Pcs/Stick Pcs/Tray Pcs/Stick Port Length 3 mm 5.0 Vdc 6 mm 3 mm AG4 SMD 3.3 Vdc 6 mm 3 mm 3.0 Vdc 6 mm Pressure 0 ~ 0 ~ 0 ~ 0 ~ 0 ~ 0 ~ 0 ~ -50 ~ -100 ~ -100 ~ Range +25 kPa +50 kPa +100 kPa +200 kPa +500 kPa +700 kPa +1 MPa 0 kPa 0 kPa +100 kPa Pressure Code 025KG 050KG 100KG 200KG 500KG 700KG 001MG 050KV 100KV 100KW -TP -TP -TP -TP -TP -TP Slave Address 0x28 0x38 0x48 0x58 0x68 0x78 19. Tape & Reel Information Reel Pin 6 Embossed carrier tape Feed direction Pin 1 Index 13 of 19 300 500 300 500 300 500 300 500 300 500 300 500 Pcs/Tray Pcs/Reel Pcs/Tray Pcs/Reel Pcs/Tray Pcs/Reel Pcs/Tray Pcs/Reel Pcs/Tray Pcs/Reel Pcs/Tray Pcs/Reel Slave Address Code 2 3 4 5 6 7 V-70033C 20. Footprint for PCB (for Reference) Sensor Code Footprint Hole for Pressure Port Diameter is depending on your design. 6 - φ1.8 mm AP4xN 2.54 mm 6 - φ0.9 mm 2.54 mm Land pads 15.2 mm 6 - φ1.8 mm 2.54 mm 6 - φ0.9 mm AP4xR 2.54 mm Land pads 15.2 mm 1.7 mm 1.4 mm 2.54 mm AG4x3 2.54 mm Land pads 9.4 mm 1.7 mm 2 - φ1.1 mm (Holes for Projections) 1.4 mm 2.54 mm 6.0 mm 2.54 mm AG4x6 Land pads 6.0 mm 9.4 mm Notes: *1) These footprints are for reference. Please evaluate well these footprints, before your mass production. *2) When designing your PCB, please also refer to the outline diagrams. 14 of 19 V-70033C 21. Notes Fujikura reserves all rights. This document is subject to change without notice. Limitation, usage, environment, standard warranty and so on are listed on Fujikura web site. Please refer to the latest specifications. 15 of 19 Appendix: Dimension Drawing 9-772-001 APxxN 16 of 19 9-772-002 APxxR 17 of 19 9-772-003 AGxx3 18 of 19 9-772-004 AGxx6 19 of 19