PHP54N06T N-channel TrenchMOS standard level FET Rev. 02 — 14 December 2009 Product data sheet 1. Product profile 1.1 General description Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only. 1.2 Features and benefits Low conduction losses due to low on-state resistance Suitable for thermally demanding environments due to 175 °C rating 1.3 Applications DC-to-DC convertors Switched-mode power supplies 1.4 Quick reference data Table 1. Quick reference Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - - 55 V ID drain current Tmb = 25 °C; VGS = 10 V; see Figure 1 and 3 - - 54 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - - 118 W VGS = 10 V; ID = 40 A; VDS = 44 V; Tj = 25 °C; see Figure 13 - 11.5 - nC VGS = 10 V; ID = 25 A; Tj = 175 °C; see Figure 11 and 12 - - 40 mΩ VGS = 10 V; ID = 25 A; Tj = 25 °C; see Figure 11 and 12 - 17 20 mΩ Dynamic characteristics QGD gate-drain charge Static characteristics RDSon drain-source on-state resistance PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 G gate 2 D drain 3 S source mb D mounting base; connected to drain Graphic symbol D mb G mbb076 S 1 2 3 SOT78 (TO-220AB) 3. Ordering information Table 3. Ordering information Type number PHP54N06T Package Name Description Version TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead SOT78 TO-220AB 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 55 V VDGR drain-gate voltage RGS = 20 kΩ - 55 V VGS gate-source voltage ID drain current -20 20 V VGS = 10 V; Tmb = 100 °C; see Figure 1 - 38 A VGS = 10 V; Tmb = 25 °C; see Figure 1 and 3 - 54 A - 217 A IDM peak drain current tp ≤ 10 µs; pulsed; Tmb = 25 °C; see Figure 3 Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 118 W Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C Source-drain diode IS source current Tmb = 25 °C - 54 A ISM peak source current tp ≤ 10 µs; pulsed; Tmb = 25 °C - 217 A - 115 mJ Avalanche ruggedness EDS(AL)S non-repetitive VGS = 10 V; Tj(init) = 25 °C; ID = 48 A; Vsup ≤ 55 V; drain-source avalanche unclamped; RGS = 50 Ω energy PHP54N06T_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 2 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 03aa24 120 03na19 120 Ider (%) Pder (%) 80 80 40 40 0 0 0 50 100 150 200 0 50 100 150 Fig 1. 200 Tmb (°C) Tmb (°C) Fig 2. Normalized continuous drain current as a function of mounting base temperature Normalized total power dissipation as a function of mounting base temperature 03nc66 103 ID (A) RDSon = VDS/ID tp = 10 μs 102 100 μs δ= P 10 tp 1 ms T D.C. 10 ms 100 ms t tp T 1 1 102 10 VDS (V) Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PHP54N06T_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 3 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - - 1.2 K/W Rth(j-a) thermal resistance from junction to ambient vertical in still air - - 60 K/W 03nc67 10 Zth(j-mb) (K/W) 1 δ = 0.5 0.2 10−1 0.1 0.05 0.02 δ= P 10−2 Single Shot t tp 10−3 10−6 tp T T 10−5 10−4 10−3 10−2 10−1 1 tp (s) Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration PHP54N06T_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 4 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 6. Characteristics Table 6. Symbol Characteristics Parameter Conditions Min Typ Max Unit drain-source breakdown voltage ID = 0.25 mA; VGS = 0 V; Tj = -55 °C 50 - - V ID = 0.25 mA; VGS = 0 V; Tj = 25 °C 55 - - V gate-source threshold voltage ID = 1 mA; VDS= VGS; Tj = 175 °C; see Figure 10 1 - - V ID = 1 mA; VDS= VGS; Tj = -55 °C; see Figure 10 - - 4.4 V ID = 1 mA; VDS= VGS; Tj = 25 °C; see Figure 10 2 3 4 V drain leakage current VDS = 55 V; VGS = 0 V; Tj = 25 °C - 0.05 10 µA VDS = 55 V; VGS = 0 V; Tj = 175 °C - - 500 µA Static characteristics V(BR)DSS VGS(th) IDSS IGSS gate leakage current VGS = 20 V; VDS = 0 V; Tj = 25 °C - 2 100 nA VGS = -20 V; VDS = 0 V; Tj = 25 °C - 2 100 nA RDSon drain-source on-state resistance VGS = 10 V; ID = 25 A; Tj = 175 °C; see Figure 11 and 12 - - 40 mΩ VGS = 10 V; ID = 25 A; Tj = 25 °C; see Figure 11 and 12 - 17 20 mΩ ID = 40 A; VDS = 44 V; VGS = 10 V; Tj = 25 °C; see Figure 13 - 36 - nC - 8.4 - nC - 11.5 - nC - 1200 1592 pF - 290 356 pF - 179 240 pF - 15 - ns - 74 - ns - 70 - ns Dynamic characteristics QG(tot) total gate charge QGS gate-source charge QGD gate-drain charge Ciss input capacitance Coss output capacitance Crss reverse transfer capacitance td(on) turn-on delay time tr rise time td(off) turn-off delay time tf fall time LD internal drain inductance LS internal source inductance VDS = 25 V; VGS = 0 V; f = 1 MHz; Tj = 25 °C; see Figure 14 VDS = 30 V; RL = 1.2 Ω; VGS = 10 V; RG(ext) = 10 Ω; Tj = 25 °C - 40 - ns from drain lead 6 mm from package to centre of die; Tj = 25 °C - 4.5 - nH from contact screw on mounting base to centre of die; Tj = 25 °C - 3.5 - nH from source lead to source bond pad; Tj = 25 °C - 7.5 - nH Source-drain diode VSD source-drain voltage IS = 20 A; VGS = 0 V; Tj = 25 °C; see Figure 15 - 0.85 1.2 V trr reverse recovery time - 45 - ns Qr recovered charge IS = 20 A; dIS/dt = -100 A/µs; VGS = -10 V; VDS = 30 V; Tj = 25 °C - 110 - nC PHP54N06T_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 5 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 03nc63 ID 200 (A) 180 160 VGS (V) = 20 14 12 11 140 10 120 RDSon (mΩ) 25 9.0 8.5 100 20 8.0 7.5 7.0 80 60 6.5 40 15 6.0 5.5 5.0 4.5 20 0 0 2 4 6 8 10 10 5 VDS (V) Fig 5. 03nc62 30 Fig 6. 03aa35 20 25 Drain-source on-state resistance as a function of drain current; typical values 03nc60 25 gfs (S) ID (A) min 10−2 typ max 20 10−3 15 10−4 10 10−5 5 10−6 0 0 2 4 0 6 Sub-threshold drain current as a function of gate-source voltage Fig 8. 40 60 80 Forward transconductance as a function of drain current; typical values PHP54N06T_2 Product data sheet 20 ID (A) VGS (V) Fig 7. 15 VGS (V) Output characteristics: drain current as a function of drain-source voltage; typical values 10−1 10 © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 6 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 03nc61 120 ID (A) 100 03aa32 5 VGS(th) (V) 4 max 80 3 Tj = 25 °C typ 60 Tj = 175 °C 2 min 40 1 20 0 Fig 9. 0 4 2 6 8 0 −60 10 VGS (V) Transfer characteristics: drain current as a function of gate-source voltage; typical values 5.5 40 6 6.5 7 8 VGS (V) = 10 60 120 180 Tj (°C) Fig 10. Gate-source threshold voltage as a function of junction temperature 03nc64 45 RDSon (mΩ) 0 03aa28 2.4 a 1.8 35 30 1.2 25 0.6 20 15 0 50 100 ID (A) 150 Fig 11. Drain-source on-state resistance as a function of drain current; typical values 0 −60 60 120 180 Tj (°C) Fig 12. Normalized drain-source on-state resistance factor as a function of junction temperature PHP54N06T_2 Product data sheet 0 © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 7 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 003aaa068 10 VGS (V) VDD = 11 V 8 03nc65 Ciss, 2500 Coss, Ciss Crss (pF) 2000 Coss 6 1500 VDD = 44 V Crss 4 1000 2 500 0 10−2 0 0 5 10 15 20 25 30 35 40 QG (nC) 10−1 1 102 10 VDS (V) Fig 13. Gate-source voltage as a function of gate charge; typical values Fig 14. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values 03nc58 120 IS (A) 100 80 Tj = 175 °C 60 Tj = 25 °C 40 20 0 0.0 0.5 1.0 VSD (V) 1.5 Fig 15. Reverse diode current as a function of reverse diode voltage; typical values PHP54N06T_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 8 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 7. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 E A A1 p q mounting base D1 D L1(1) L2(1) Q L b1(2) (3×) b2(2) (2×) 1 2 3 b(3×) c e e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1(2) b2(2) c D D1 E e L L1(1) L2(1) max. p q Q mm 4.7 4.1 1.40 1.25 0.9 0.6 1.6 1.0 1.3 1.0 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 2.54 15.0 12.8 3.30 2.79 3.0 3.8 3.5 3.0 2.7 2.6 2.2 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. OUTLINE VERSION SOT78 REFERENCES IEC JEDEC JEITA 3-lead TO-220AB SC-46 EUROPEAN PROJECTION ISSUE DATE 08-04-23 08-06-13 Fig 16. Package outline SOT78 (TO-220AB) PHP54N06T_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 9 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes PHP54N06T_2 20091214 Product data sheet - PHP54N06T-01 Modifications: PHP54N06T-01 (9397 750 08022) • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 20010214 Product specification - PHP54N06T_2 Product data sheet - © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 10 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 9.2 Definitions Draft— The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet— A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 9.3 Disclaimers General— Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes— NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use— NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications— Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data— The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values— Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale— NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published athttp://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license— Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control— This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS— is a trademark of NXP B.V. 10. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:[email protected] PHP54N06T_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 14 December 2009 11 of 12 PHP54N06T NXP Semiconductors N-channel TrenchMOS standard level FET 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 14 December 2009 Document identifier: PHP54N06T_2