The World’s smallest MOSFET; NXP power MOSFETs in SOT88

NXP power MOSFETs
in SOT883
The World’s smallest MOSFET
For portable applications, board real estate is a critical factor and drives the development
of products with ever smaller footprints. However as packages get smaller, the proportion
of footprint area occupied by leads becomes more significant. NXP’s latest power
MOSFETs in the SOT883 package help you reclaim more board space by eliminating
leads altogether and at the same time enhancing thermal performance.
Key benefits
} Ultra small where space is a premium
} Better performance than existing small footprints
- higher power dissipation and lower R DSon,
with higher current density
- reduced heat dissipation can eliminate need
for cooling fan or bulky heat sink
} Occupies only 1.17 mm2, only 30% of SC-75 or SC-89
Key features
} 2.5W power dissipation
} Highly efficient packing
} Environmentally friendly
} Compatible with JEITA standard, SC-101
} Size: 1.0 x 0.6 x 0.5 mm (lwh)
Key applications
} Load switch
- mobile phones
- notebook PCs
- PDAs
- MP3 players
- digital still cameras
} External pass device
- buck converters
- boost converters
Portable products are fuelling the race towards more
sophisticated functionality in smaller form-factors, making
improvements in power density and power dissipation key
design elements. For today’s space-constrained and power
hungry applications, our MOSFETs in SOT883 offer the
perfect solution, delivering superior thermal performance
combined with the ultimate in miniaturization.
Product table
Product
Maximum values
Typical values
Vds
Vgs
V
V
25º
Id (A)
100º
W
Qg
Q gd
C iss
4.5V
2.5V
1.8V
nC
nC
pF
PMZ250UN
20
8
2.28
1.44
PMZ270XN
20
12
2.15
1.36
1.25
250
320
420
0.89
0.18
45
1.25
270
440
0.72
0.18
PMZ350XN
30
12
1.87
34
1.18
1.25
350
520
0.65
0.18
37
PMZ390UN
30
8
PMZ760SN
60
20
1.78
1.13
1.25
390
460
0.89
0.20
43
1.22
0.77
1.25
1.05
0.22
23
L
Pd
RDSon (m0)
10V
760
550
1100
L1
2
b
3
e
b1
1
e1
A
A1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
mm
0.50
0.46
A1
max.
b
b1
D
E
0.03
0.20
0.12
0.55
0.47
0.62
0.55
1.02
0.95
e
0.35
e1
L
L1
0.65
0.30
0.22
0.30
0.22
Note
1. Including plating thickness
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©2008 NXP B.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
Date of release: February 2008
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable
Document order number: 9397 750 16258
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