ETC PMZ760SN

PMZ760SN
µTrenchMOS™ standard level FET
Rev. 01 — 24 February 2003
M3D883
Objective data
BOTTOM VIEW
1. Product profile
1.1 Description
N-channel enhancement mode field-effect transistor in a plastic package using
TrenchMOS™ technology.
Product availability:
PMZ760SN in SOT883.
1.2 Features
■ Profile 55% lower than SOT23
■ Low on-state resistance
■ Footprint 90% smaller than SOT23
■ Fast switching.
1.3 Applications
■ Driver circuits
■ Switching in portable appliances.
1.4 Quick reference data
■ VDS ≤ 60 V
■ Ptot ≤ <tbd> W
■ ID ≤ <tbd> A
■ RDSon ≤ 900 mΩ.
2. Pinning information
Table 1:
Pinning - SOT883, simplified outline and symbol
Pin
Description
1
gate (g)
2
source (s)
3
drain (d)
Simplified outline
Symbol
d
2
3
1
g
bottom view
SOT883
MGX357
MBB076
s
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
3. Limiting values
Table 2:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage (DC)
25 °C ≤ Tj ≤ 150 °C
-
60
V
VDGR
drain-gate voltage (DC)
25 °C ≤ Tj ≤ 150 °C; RGS = 20 kΩ
-
60
V
VGS
gate-source voltage (DC)
ID
drain current (DC)
-
±20
V
Tsp = 25 °C; VGS = 10 V; Figure 2 and 3
-
<tbd>
A
Tsp = 100 °C; VGS = 10 V; Figure 2
-
<tbd>
A
A
IDM
peak drain current
Tsp = 25 °C; pulsed; tp ≤ 10 µs; Figure 3
-
<tbd>
Tsp = 25 °C; Figure 1
Ptot
total power dissipation
-
<tbd>
W
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−55
+150
°C
Source-drain diode
IS
source (diode forward) current (DC) Tsp = 25 °C
-
<tbd>
A
ISM
peak source (diode forward) current Tsp = 25 °C; pulsed; tp ≤ 10 µs
-
<tbd>
A
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Objective data
Rev. 01 — 24 February 2003
2 of 12
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
03aa17
120
03aa25
120
Ider
(%)
Pder
(%)
80
80
40
40
0
0
0
50
100
150
0
200
50
100
150
Tsp (°C)
P tot
P der = ----------------------- × 100%
P
°
200
Tsp (°C)
ID
I der = ------------------- × 100%
I
°
tot ( 25 C )
D ( 25 C )
Fig 1. Normalized total power dissipation as a
function of solder point temperature.
Fig 2. Normalized continuous drain current as a
function of solder point temperature.
03ai41
X
X
X
X
<tbd>
X
X
X
X
X
X
X
X
X
Tsp = 25 °C; IDM is single pulse; VGS = 10 V.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Objective data
Rev. 01 — 24 February 2003
3 of 12
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
4. Thermal characteristics
Table 3:
Thermal characteristics
Symbol Parameter
Conditions
Rth(j-sp)
thermal resistance from junction to solder point Figure 4
Rth(j-a)
thermal resistance from junction to ambient
Min
Typ
Max
-
-
<tbd> K/W
minimum footprint;
mounted on a printed-circuit board
<tbd> -
Unit
K/W
4.1 Transient thermal impedance
03ai41
X
X
X
X
<tbd>
X
X
X
X
X
X
X
X
X
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Objective data
Rev. 01 — 24 February 2003
4 of 12
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
5. Characteristics
Table 4:
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Tj = 25 °C
60
-
-
V
Tj = −55 °C
55
-
-
V
Static characteristics
V(BR)DSS drain-source breakdown voltage
VGS(th)
IDSS
gate-source threshold voltage
drain-source leakage current
ID = 1 µA; VGS = 0 V
ID = 0.25 mA; VDS = VGS; Figure 9
V
Tj = 25 °C
1
2
3
V
Tj = 150 °C
0.5
-
-
V
Tj = −55 °C
-
-
3.4
V
-
0.05
1
µA
VDS = 60 V; VGS = 0 V
Tj = 25 °C
Tj = 100 °C
IGSS
gate-source leakage current
VGS = ±20 V; VDS = 0 V
RDSon
drain-source on-state resistance
VGS = 10 V; ID = 0.3 A; Figure 7 and 8
Tj = 25 °C
Tj = 150 °C
-
-
100
µA
-
10
100
nA
-
760
900
mΩ
-
1255 1665 mΩ
VGS = 4.5 V; ID = 0.075 A; Figure 7
-
960
1200 mΩ
ID = 0.5 A; VDD = 40 V; VGS = 10 V; Figure 13
-
1.2
-
nC
Dynamic characteristics
Qg(tot)
total gate charge
Qgs
gate-source charge
-
0.2
-
nC
Qgd
gate-drain (Miller) charge
-
0.35
-
nC
Ciss
input capacitance
-
3.9
-
pF
Coss
output capacitance
-
6.6
-
pF
Crss
reverse transfer capacitance
td(on)
turn-on delay time
tr
VGS = 0 V; VDS = 30 V; f = 1 MHz; Figure 11
-
33
-
pF
-
2.1
-
ns
rise time
-
2.4
-
ns
td(off)
turn-off delay time
-
6.3
-
ns
tf
fall time
-
3.8
-
ns
-
0.8
1.2
V
VDD = 50 V; ID = 0.2 A; VGS = 10 V; RG = 4.7 Ω
Source-drain diode
VSD
source-drain (diode forward) voltage IS = 0.3 A; VGS = 0 V; Figure 12
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Objective data
Rev. 01 — 24 February 2003
5 of 12
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
03ai39
X
003aaa397
1
ID
(A)
X
X
0.8
<tbd>
X
X
0.6
0.4
25 °C
X
Tj = 150 °C
0.2
X
X
X
X
X
X
X
0
X
1
Tj = 25 °C
3
5
VGS (V)
7
Tj = 25 °C and 150 °C; VDS > ID x RDSon
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values.
Fig 6. Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
03ai39
X
03aa28
2.4
X
a
X
1.8
<tbd>
X
X
1.2
0.6
X
X
X
X
X
X
X
X
X
0
-60
60
120
180
Tj (°C)
Tj = 25 °C
R DSon
a = ---------------------------R DSon ( 25 °C )
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values.
Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Objective data
0
Rev. 01 — 24 February 2003
6 of 12
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
03af65
4
03ai51
10-3
ID
(A)
VGS(th)
(V)
max
3
10-4
typ
min
10-5
typ
2
10-6
min
1
10-7
0
10-8
-60
0
60
120
Tj (°C)
180
0
1
2
VGS (V)
3
Tj = 25 °C; VDS = 5 V
ID = 0.25 mA; VDS = VGS
Fig 9. Gate-source threshold voltage as a function of
junction temperature.
Fig 10. Sub-threshold drain current as a function of
gate-source voltage.
003aaa399
102
C
(pF)
Ciss
10
Coss
Crss
1
10-1
1
102
10
VDS (V)
VGS = 0 V; f = 1 MHz
Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Objective data
Rev. 01 — 24 February 2003
7 of 12
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
003aaa400
2
003aaa401
10
VGS
(V)
8
IS
(A)
1.5
6
1
4
150 °C
Tj = 25 °C
0.5
2
0
0
0.5
1
VSD (V)
1.5
Tj = 25 °C and 150 °C; VGS = 0 V
0
0
0.2
QG (nC)
1.2
ID = 0.5 A; VDD = 40 V
Fig 12. Source (diode forward) current as a function of
source-drain (diode forward) voltage; typical
values.
Fig 13. Gate-source voltage as a function of gate
charge; typical values.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Objective data
0.4
Rev. 01 — 24 February 2003
8 of 12
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
6. Package outline
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
L
SOT883
L1
2
b
3
e
b1
1
e1
Package under
development
Philips Semiconductors reserves the
right to make changes without notice.
A
A1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
A1
max.
b
b1
D
E
e
e1
L
L1
mm
0.50
0.46
0.03
0.20
0.12
0.55
0.47
0.62
0.55
1.02
0.95
0.35
0.65
0.30
0.22
0.30
0.22
Note
1. Including plating thickness
OUTLINE
VERSION
SOT883
REFERENCES
IEC
JEDEC
JEITA
SC-101
EUROPEAN
PROJECTION
ISSUE DATE
03-02-05
Fig 14. SOT883.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Objective data
Rev. 01 — 24 February 2003
9 of 12
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
7. Soldering
1.30
R = 0.05 (12×)
0.30
R = 0.05 (12×)
solder lands
0.35
(2×)
solder resist
0.90 0.20
0.60 0.70 0.80
occupied area
0.25
(2×)
solder paste
0.30
(2×)
0.40
(2×)
0.50
(2×)
0.30
0.40
0.50
MBL873
Dimensions in mm.
Fig 15. Reflow soldering footprint for SOT883.
8. Revision history
Table 5:
Revision history
Rev Date
01
20030224
CPCN
Description
-
Objective data (9397 750 11143)
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Objective data
Rev. 01 — 24 February 2003
10 of 12
PMZ760SN
Philips Semiconductors
µTrenchMOS™ standard level FET
9. Data sheet status
Level
Data sheet status[1]
Product status[2][3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
10. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
12. Trademarks
TrenchMOS — is a trademark of Koninklijke Philips Electronics N.V.
11. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: [email protected].
Objective data
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11143
Rev. 01 — 24 February 2003
11 of 12
Philips Semiconductors
PMZ760SN
µTrenchMOS™ standard level FET
Contents
1
1.1
1.2
1.3
1.4
2
3
4
4.1
5
6
7
8
9
10
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Transient thermal impedance . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
© Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 24 February 2003
Document order number: 9397 750 11143