Specification

CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
1 General Description
Actual size
Features
CMS390 is a new integrated MEMS inertial
‘Combi-Sensors’ from Silicon Sensing, combining high
performance single-axis angular rate and dual-axis
linear acceleration measurement in a small surface
mounted package. It comprises two discrete MEMS
sensing devices with a dedicated control ASIC in a
single ceramic LCC package. Sensor data is output
onto a SPI® digital interface. Dynamic range and
bandwidth of all three channels can be independently
selected by the user for optimal sensitivity. Two
package configurations are available; part numbers
CMS300 (Flat) and CMS390 (Orthogonal).
• Small (10.4 x 6.7 x 2.7mm)
• Proven and robust silicon MEMS vibrating ring gyro
and dual-axis accelerometer
• Excellent bias over temperature (1.75˚/s, 30mg)
• Flat and orthogonal mounting options (CMS300
and CMS390)
The datasheet relates to the CMS390 part. CMS390
provides the in-plane angular rate sensing (Z axis
parallel to the PCBA), and two axes of linear
acceleration where the X axis is parallel (in-plane) to
the PCBA and the Y axis is perpendicular (out-ofplane) to the PCBA.
• User selectable dynamic ranges (150˚/s, 300˚/s, 2.5g
and 10g)
• Digital (SPI®) output mode
Angular rate is accurately measured using Silicon
Sensing’s proven 5th generation VSG5 Silicon
MEMS ring gyroscope with multiple piezoelectric
actuators and transducers. The 3mm ring is driven
into resonance by a pair of primary drive actuators.
Primary pick-off transducers provide closed loop
control of ring amplitude and frequency. Pick-off
transducers detect rate induced motion in the
secondary axis, due to Coriolis force effects,
the amplitude of which is proportional to angular
velocity.
• User selectable bandwidth (Rate; 45, 55, 90 or 110Hz
Acc; 45, 62, 95 or 190Hz)
• Range and bandwidth independently selectable for
each axis
• Low power consumption (8mA) from 3.3V supply
• High shock and vibration rejection
• Temperature range -40 +125˚C
• Hermetically sealed ceramic LCC surface mount
package for temperature and humidity resistance
• Integral temperature sensor
• RoHS compliant
Applications
• Measurement and control
• Navigation and personal navigation
•
•
•
•
Inertial Measurement Units
Inclinometers/tilt sensors
Low cost AHRS and attitude measurement
Levelling
Precise linear acceleration sensing is achieved by a
Silicon MEMS detector forming an orthogonal pair
of sprung masses. Each mass provides the moving
plate of a variable capacitance formed by an array of
interlaced ‘fingers’. This structure also provides critical
damping to prevent resonant gain. Linear acceleration
results in a change of capacitance which is measured
by demodulation of the square wave excitation. The
sensor has high linearity and shock resistance.
ASIC processing includes rate and acceleration bias,
bias temperature sensitivity and scale factor
sensitivity trim for all three sensors allowing sensor
calibration over temperature in production.
• Robotics
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 1
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
X
X Drive
XPO
Demod
XP/O
YPO
Demod
YP/O
2.7 to 3.6V
Y
Y Drive
Vdd
C1
10μF
Vref
0.1μF
Vss
Amplitude
Driver
PPO
O
Z
Vref_cap
Rate O/P
Real
SPO
C3
0.1μF
QUAD
Calibration
Reset
ADC
Trim Sets
POR
BIT
Interface Control
Bit_Out
SS
Dclk
Data_Out
Data_In
Interface
C.G.18434
Figure 1.1 CMS390 Functional Block Diagram
10.40
8x(3.05)
ve
13
1
2
3
4
5
6
14
4x (R0.20)
X + ve
15
7
8
9
10
11
6x0.50
(0.90Px9=8.10)
12
6x(2.30)
16
8x(0.30)
+ ve
Z
6.70
Y
2.7
Pads for factory use only
C.G.18604
All dimensions in millimetres.
Figure 1.2 CMS390 Overall Dimensions
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 2
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
2 Ordering Information
Part
Number
Sense Axes
Description
Measurement Range
°/s
X,Y g
Modes
Overall
Dimensions
Supply
Voltage
mm
V
CMS300
Single-axis (Z) rate and dualaxis (X,Y) MEMS Combi-Sensor.
Z-axis perpendicular
to the host PCBA.
User selectable
±150 & ±300
User selectable
±2.5g & ±10g
Digital SPI®
10.4x6.0x2.2H
2.7 ~ 3.6
CMS390
Single-axis (Z) rate and dualaxis (X,Y) MEMS Combi-Sensor.
Z-axis parallel
to the host PCBA.
User selectable
±150 & ±300
User selectable
±2.5g & ±10g
Digital SPI®
10.4x2.7x
6.7H
2.7 ~ 3.6
CMS300EVB
Evaluation Board for the
CMS300 Combi-Sensor
(includes the sensor). See
Section 9 for more details.
User selectable
±150 & ±300
User selectable
±2.5g & ±10g
Digital SPI®
26.0x20.0x
4.0H
2.7 ~ 3.6
CMS390EVB
Evaluation Board for the
CMS390 Combi-Sensor
(includes the sensor). See
Section 9 for more details.
User selectable
±150 & ±300
User selectable
±2.5g & ±10g
Digital SPI®
26.0x20.0x
8.5H
2.7 ~ 3.6
3 Specification
Unless stated otherwise, the following specification
values assume Vdd = 3.15V to 3.45V and an ambient
temperature of +25°C. ‘Over temperature’ refers to
the temperature range -40°C to +125°C.
Parameter
Minimum
Typical
Maximum
Notes
Rate Channel:
Dynamic Range
±150˚/s, ±300˚/s
User selectable
Resolution
–
0.005˚/s (±150˚/s)
0.01˚/s (±300˚/s)
0.05˚/s
SPI® scaling:
±150˚/s = 204.8 lsb/(˚/s),
±300˚/s =102.4 lsb/(˚/s)
Scale factor variation
over, temperature,
environment and life
–
–
±2.75%
–
Scale factor variation
over temperature
–
<±1%
±2.0%
–
Scale factor
non-linearity error
–
<±0.15°/s (±150°/s)
<±0.3°/s (±300°/s )
<±0.30°/s (±150°/s)
<±0.75°/s (±300°/s )
Bias over
temperature,
environment and life
–
–
±2.75˚/s
Deviation from best
fit straight line over
operating range
–
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 3
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Specification Continued
Parameter
Minimum
Typical
Maximum
Notes
Bias variation
with temperature
–
±1.0°/s
±1.75˚/s
–
Initial bias setting
–
±0.5°/s
±1.75°/s
At constant
temperature (25°C)
Bias switch on
repeatability
–
±0.03°/s
±0.15°/s
At constant ambient
temperature
Bias drift with
time after switch on
–
±0.02°/s
±0.2°/s
At constant ambient
temperature
Bias drift with
temperature ramp
–
±0.01°/s/°C
±0.06°/s/°C
At 5°C/min
Acceleration sensitivity
–
±0.025°/s/g
±0.1°/s/g
–
Noise
–
0.06°/s
0.1°/s
RMS to 45Hz
40Hz
50Hz
80Hz
95Hz
45Hz
55Hz
90Hz
110Hz
50Hz
60Hz
100Hz
125Hz
-3dB, second order
user selectable
Maximum phase delay
–
–
11ms (BW 45Hz)
–
Mechanical resonance
–
22kHz
–
Frequency of operation
Frequency response
Acceleration Channels:
Dynamic range
±2.5g, ±10g
User selectable
SPI® scaling:
±2.5g = 12800lsb/g
±10g =3200lsb/g
Resolution
–
0.079mg (2.5g)
0.313mg (10g)
1mg
Scale factor variation
temperature
environment and life
–
–
±3%
–
Scale factor variation
over temperature
–
±1%
±2.5%
–
Scale factor
non-linearity error
–
3mg (2.5g)
5mg (10g)
12.5mg (2.5g)
50mg (10g)
50mg over range ±8g
NL error is proportional
to acceleration cubed
Orthogonality
–
±0.1°
–
Noise
–
1mg
2mg
RMS in 45Hz
40Hz
55Hz
85Hz
170Hz
45Hz
62Hz
95Hz
190Hz
50Hz
70Hz
105Hz
210Hz
-3dB, second order
user selectable
Maximum phase delay
–
–
10ms (BW 45Hz)
–
Mechanical resonance
–
2.9kHz
–
MEMS resonance
Frequency response
Relative to the other
acceleration sensor
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 4
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Specification Continued
Parameter
Minimum
Typical
Maximum
Notes
Turn on bias
–
–
±30mg
At 25 ±5˚C
(see Note 1)
Bias variation
with temperature
–
–
±30mg
-40˚C to +85˚C
normalised to +25˚C
Bias over temperature,
environment and life
–
–
±75mg
-40˚C to +85˚C
normalised to +25˚C
Bias switch on
repeatability
–
±0.3mg
±1.5mg
At constant
temperature
Bias drift with time
after switch on
–
–
±10mg
During 1 hour at
constant temperature
Bias drift with
temperature ramp
–
±0.3mg/°C
±1.5mg/°C
At 5°C/min
Turn on bias
–
–
±75mg
At 25 ±5˚C
(see Note 1)
Bias variation
with temperature
–
±50mg
±75mg
-40˚C to +85˚C
normalised to +25˚C
Bias over temperature,
environment and life
–
–
±125mg
–
Bias switch on
repeatability
–
±0.3mg
±2.0mg
At constant
temperature
Bias drift with time
after switch on
–
–
±10mg
During 1 hour at
constant temperature
Bias drift with
temperature ramp
–
±0.3mg/°C
±1.5mg/°C
At 5°C/min
10.67lsb/°C
11lsb/°C
11.33lsb/°C
–
Offset
-20°C
–
+20°C
–
Repeatability
-5°C
–
+5°C
–
–
150ms
300ms
–
+54°/s (150°/s)
+90°/s (300°/s)
+64°/s (150°/s)
+107°/s (300°/s)
+74°/s (150°/s)
+125°/s (300°/s)
–
–
<=±0.6°/s (±150°/s)
<=±1.2°/s (±300°/s)
–
-40˚C to +125˚C
normalised to +25˚C
Bias (±2.5g):
Bias (±10g):
Temperature Sensors:
Scale factor
Start Up:
Time to full performance
Self Test (CBIT) Rate Sensor:
At 25°C
Variation with
temperature
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 5
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Specification Continued
Parameter
Minimum
Typical
Maximum
Notes
+1.0g (2.5g)
+4.7g (10g)
+1.25g (2.5g)
+6.2g (10g)
+1.50g (2.5g)
+7.7g (10g)
–
–
<=±0.03g (2.5g)
<=±0.1g (10g)
–
-40˚C to +125˚C
normalised to +25˚C
Mass
–
0.6grams
–
–
Rate Sensor
misalignment
(Cross-axis Sensitivity)
–
–
±3%
Alignment of sensing
element to package
mounting face
Acceleration Sensor
misalignment
(Cross-axis Sensitivity)
–
–
±3%
Alignment of sensor to
package
Temperature
(Operating)
-40°C
–
+125°C
–
Temperature (Storage)
-55°C
–
+150°C
–
Humidity
–
–
90% RH
Non-condensing
Vibration rectification
error
–
0.001°/s/g2rms
0.003°/s/g2rms
8.85grms stimulus, 10Hz
to 5kHz, random
Vibration induced
noise
–
0.06°/srms/g2rms
0.072°/srms/g2rms
8.85grms stimulus, 10Hz
to 5kHz, random
2.7V
3.3V (nom)
3.6V
–
3.15V
3.3V (nom)
3.45V
Full specification
Current consumption
(inrush - during start-up)
–
–
8.0mA
Excluding charging
decoupling capacitors
Current consumption
(operating - after start-up)
–
–
8.0mA
–
1Hz
1kHz
10kHz
–
100kHz
1MHz
7MHz
–
Self Test (CBIT) Acceleration Sensors:
At 25°C
Variation with
temperature
Physical:
Environmental:
Electrical:
Supply voltage
Interface:
SPI® message rate
SPI® clock rate
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 6
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
4 Absolute Minimum/Maximum Ratings
Minimum
Maximum
Powered (saturated)
–
150,000°/s
Unpowered
–
150,000°/s
–
>10,000°/s 2
Powered
–
1,000g 1ms 1/2 sine
Unpowered
–
10,000g 0.5ms
Operating
–
95g 6ms 1/2 sine
-0.3V
+4.0V
ESD protection
–
2kV HBM
250V CDM
EMC radiated
–
200V/m 14 kHz to 1.8GHz
Duration of short circuit
on any pin (except Vdd)
–
100 seconds
Operating
-40°C
+125°C
Max storage (survival)
-55°C
+150°C
–
90% RH non-condensing
15 years
–
12,000 hours
–
Angular Velocity:
Angular Acceleration:
Powered (saturated)
Linear Acceleration (any axis):
Electrical:
Vdd
Temperature:
Humidity
Life:
Unpowered
Powered
Notes:
1. Turn on bias is specified at 25 ±5˚C and at a power
supply voltage of 3.3V. At other power supply voltages,
a bias change of typically 40mg/V can be expected.
2. Exposure to the Absolute Maximum Ratings for
extended periods may affect performance and
reliability.
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
5 Typical Performance Characteristics
Graphs showing typical performance characteristics for CMS390 are shown below:
Note: Typical data is with the device powered from a 3.3V supply.
Rate Channel
Figure 5.1 Bias vs Temperature
(±300°/s)
Figure 5.2 Bias vs Temperature
(±150°/s)
Figure 5.3 SF Error vs Temperature
(±300°/s)
Figure 5.4 SF Error vs Temperature
(±150°/s)
Figure 5.5 Non-linearity vs Temperature
(±300°/s)
Figure 5.6 Non-linearity vs Temperature
(±150°/s)
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 8
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Typical Performance Characteristics Continued
Rate Channel
Figure 5.7 Non-linearity vs Applied Rate (at 25°C)
Figure 5.8 Micro-linearity vs Applied Rate (at 25°C)
Rate and Acceleration CBIT
Figure 5.9 CBIT °/s vs Temperature
(±300°/s)
Figure 5.10 CBIT °/s vs Temperature
(±150°/s)
Figure 5.11 CBIT g vs Temperature
(±10g)
Figure 5.12 CBIT g vs Temperature
(±2.5g)
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 9
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Typical Performance Characteristics Continued
Acceleration Channels
Figure 5.13 Acceleration Bias at 25°C (±10g)
Figure 5.14 Acceleration Bias at 25°C (±2.5g)
Figure 5.15 Accelerometer Y Bias vs Temperature
(±10g)
Figure 5.16 Accelerometer Y Bias vs Temperature
(±2.5g)
Figure 5.17 Accelerometer X Bias vs Temperature
(±10g)
Figure 5.18 Accelerometer X Bias vs Temperature
(±2.5g)
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 10
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Typical Performance Characteristics Continued
Acceleration Channels
Figure 5.19 Accelerometer Y SF Error vs
Temperature (±10g)
Figure 5.20 Accelerometer Y SF Error vs
Temperature (±2.5g)
Figure 5.21 Accelerometer X SF Error vs
Temperature (±10g)
Figure 5.22 Accelerometer X SF Error vs
Temperature (±2.5g)
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 11
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
6 Glossary of Terms
ADC
Analogue to Digital Converter
ARW
Angular Random Walk
ASIC
Application Specific Integrated Circuit
BIT
Built-In Test
BW
Bandwidth
CBIT
Commanded Built-In Test
CDM
Charge Device Model
DAC
Digital to Analogue Converter
DRIE
Deep Reactive Ion Etch
DSBSC
Double Side-Band Suppressed Carrier
Signal
EMC
Electro-Magnetic Compatibility
ESD
Electro-Static Damage
HBM
Human Body Model
IPC
Institute of Printed Circuits
LCC
Leadless Chip Carrier
LSB
Least Significant Bit
MEMS
Micro-Electro Mechanical Systems
NEC
Not Electrically Connected
PCBA
Printed Circuit Board Assembly
POR
Power On Reset
PPO
Primary Pick-Off
SF
Scale Factor
SMT
Surface Mount Technology
SOG
Silicon On Glass
SPI®
Serial Peripheral Interface
A registered trademark of
Motorola, Inc.
SPO
Secondary Pick-Off
T.B.A.
To Be Announced
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 12
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
7 Interface
Physical and electrical inter-connect and SPI®
message information.
4
5
6
14 Pad
NEC
3
C3
100nF
6
Slave Select
DIO
12
Vdd
RESET
SS
Data_In
Dclk
5
4
3
NEC
NEC
2
C1
10μF
16
13
ACC_Vdd_Cap
2
C2
100nF
NEC
NEC
11
Vss_ACC
15 Pad
Vss
7
Vref_Cap
1
8
Vss
13 Pad
9
Bit_Out
NEC
11 10
Vss_ACC
12
NEC
16 Pad
ACC_Vdd_Cap
NEC
Vdd (3.15V to 3.45V)
CMS390
NEC
Vref_Cap
14
NEC
10
Bit_Out
15
9
8
Data_Out
Data_Out
Dclk
SS
Data_In
Vdd
RESET
7
MOSI
MISO
7.1 Physical and Electrical Interface,
Pad Layout and Pinouts
SPI Clock Out
HOST SYSTEM
1
C4
100nF
10k
C.G. 18570
Figure 7.3 Peripheral Circuit
NOTE: Pins 13, 14, 15 & 16 are
for mechanical fixing purposes
and should be soldered to a pad
with NO electrical connection
C.G.18572
Figure 7.1 Pinout (Top View)
4 - 0.35
12 - 0.6
16
12
11
10
9
8
7
15
13
1
2
3
4
5
6
14
3.3
4 - 1.3
12 - 1.3
4 - 2.6
Note: The CMS390 accelerometers are capacitive
sensors. The routing of signal tracks beneath
the package (including power supply signals
connecting to starpoints) may cause an offset
in accelerometer bias. If such routing is
unavoidable, the resulting offset can be removed
by compensation at the higher assembly level.
0.9P x 5 = 4.5
11
C.G. 18571
All dimensions in millimetres.
Figure 7.2 Recommended Pad Layout
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 13
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Pin Number
Pin Name
Signal
Direction
Pin Function
1
Acc_Vdd_Cap
–
Used to smooth supply to ACC MEMS.
A 100nF X7R dielectric ceramic capacitor(C4) is recommended.
2
NEC
–
Not Electrically Connected.
3
Vss_Acc
–
Return connection for ACC applied power (0V)
4
BIT_Out
Output
BIT result, logical low indicates fault
5
Vss
–
Return connection for applied power (0V)
6
Vref_Cap
–
Used to decouple the internal voltage reference via an external capacitor. A
100nF X7R dielectric ceramic capacitor (C3) is recommended.
7
Data_Out
Output
SPI® Data Output line from CMS390. Only enabled when SS is low.
Tri-stated when SS is high.
8
Dclk
Input
SPI® Clock Output line from the Host System. Internal Pull-up
9
Data_In
Input
Data Input line from the Host System. Internal Pull-up
10
SS
Input
SPI_SELECT. Internal Pull-up
11
RESET
Input
Used to reset the sensor, this will reload the internal calibration data. Active
Low. Internal Pull-up
12
Vdd
–
Positive power supply to the sensor. Range from 2.7 to 3.6V. Should be
decoupled with a 100nF X7R dielectric ceramic capacitor (C2),
a bulk storage capacitor of 10μF should be nearby (C1).
Centre and
Side Pads
(13,14,15 &
16)
NEC
–
Not Electrically Connected. These pins provide additional
mechanical fixing to the Host System and should be
soldered to an unconnected pad.
Table 7.1 Input/Output Pin Definitions
Parameter
Minimum
Maximum
Units
Supply
Supply voltage (functional)
2.7
3.6
V
Supply voltage (full specification)
3.15
3.45
V
Supply voltage limits
-0.3
4.0
V
–
8
mA
Supply current
Discretes
Input voltage low
-0.5
0.3xVdd
V
Input voltage high
0.7xVdd
Vdd+0.5
V
Output voltage low
–
0.4
V
Output voltage high
0.8xVdd
–
V
Table 7.2 Electrical Characteristics
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 14
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
7.2 SPI® Digital Interface
This section defines the SPI® interface timing and the
message types and formats to and from the CMS390
sensor. It also defines the memory maps of the internal
functional memory.
The SPI® interface, when selected, will be a 4-wire
interface with the following signals:
Dclk
Data_In
Data_Out
SS
SPI® clock
Message data input to sensor (MOSI)
Message data output by sensor (MISO)
Select sensor
Signal electrical characteristics are defined in Table 7.3.
Parameter
Minimum
Maximum
Units
Input voltage low
-0.5
0.3xVdd
V
Input voltage high
0.7xVdd
Vdd+0.5
V
Output voltage low
–
0.4
V
Output voltage high
0.8xVdd
–
V
Output current
2.0
2.4
mA
Leakage current
-2
2
μA
Pull up current
10
50
μA
Table 7.3 SPI® Electrical Characteristics
The interface will transfer 4 bytes (32 bits) in each message. The message rate will be 1kHz (nom), (1Hz-min,
10kHz-max) with a SPI® clock frequency of 1MHz (nom), (100kHz-min, 7MHz-max).
The sensor will be a slave on the interface. All accesses shall use SPI® Mode 0.
Figure 7.4 below specifies the interface timing for correct operation.
Inter- Message Delay
Slave
_ Select
850ns (min)
143ns (min)
SPI® Clock Out
MOSI
MISO
D31
D31
D0
D0
Figure 7.4 Timing Diagram
Note: The inter-message delay varies dependent on the command message type see section 7.2.1
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
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CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
7.2.1 Messages to Sensor (MOSI)
Table 7.4 outlines the command message types available from the host to the CMS390 sensor:
Message Type
Mode
Operation
Rate
Data Monitor
Request axis rate value in next message
Acceleration Y
Data Monitor
Request Y axis acceleration value in next message
Acceleration X
Data Monitor
Request X axis acceleration value in next message
Temperature
Data Monitor
Request Temperature value in next message
Global
Request Status of device configuration e.g. BW, Range, Sense
Direction etc in next message
Device Configuration Set
Global
This once only command will set the device configuration e.g.
BW, Range, Sense Direction. This data will override the NVM
selection and will remain set until a POR or Reset occurs.
(see section 7.2.5)
BIT Status Request
Global
Request status of internal BIT flags in next message
NVM Read (including serial number)
Global
Output NVM data in next message. For user locations no
access limitations. For serial number locations only read
access is allowed
NVM write data
Global
Load write data into ASIC write data store (needs to be written
before block write or any other write)
NVM Write
Global
Load Address selected with write data from above.
Restricted access - see section 8.1 for NVM memory map
NVM Erase
Global
Erases Address selected.
Restricted access - see section 8.1 for NVM memory map
REV
Global
Device revision state
INV REV
Global
Inverse of device revision state
Device Configuration Status Request
Table 7.4 Command Message Types
Table 7.5 details the command bit format for messages to the CMS390 sensor:
CRC D3:0
Note 2
Inter
Message
Delay
Notes
0
CRC
5.0μs(min)
-
0
0
CRC
5.0μs(min)
Refer to Fig 1.2
for axis and sense
definition
0
0
0
CRC
5.0μs(min)
Refer to Fig 1.2
for axis and sense
definition
CBIT_en
0
0
0
CRC
5.0μs(min)
-
00000
CBIT_en
0
0
0
CRC
5.0μs(min)
-
00010
CBIT_en
0
0
0
CRC
6.5μs(min)
See Section 8 for
operation
Data Content
D31:16
Mode
D15:13
Address
D12:8
D7
Note 1
Rate
Not Used (set all to’0’)
101
00000
CBIT_en
0
0
Acceleration Y
Not Used (set all to’0’)
101
00001
CBIT_en
0
Acceleration X
Not Used (set all to’0’)
101
00010
CBIT_en
Temperature
Not Used (set all to’0’)
101
00011
Device Configuration
Status Request
Not Used (set all to’0’)
000
Device Configuration
Set
D31:16 Data to be written
(16-bits)
000
Operation
D6 D5 D4
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Specification subject to change without notice.
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CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
CRC D3:0
Note 2
Inter
Message
Delay
Notes
0
CRC
5.0μs(min)
-
0
0
CRC
9.5μs(min)
See Section 8
for NVM memory
map and access
0
0
0
CRC
5.0μs(min)
Stored data for
write ops
CBIT_en
0
0
0
CRC
6.1ms(min)
See Section 8
for NVM memory
map and access
00111
CBIT_en
0
0
0
CRC
6.1ms(min)
See Section 8
for NVM memory
map and access
000
10000
1
1
1
0
CRC
5.0μs(min)
-
000
00001
0
0
0
1
CRC
5.0μs(min)
-
Data Content
D31:16
Mode
D15:13
Address
D12:8
D7
Note 1
Not Used (set all to’0’)
000
00011
CBIT_en
0
0
D31:21 Not Used (set all to’0’)
D20:16 NVM address
000
00100
CBIT_en
0
D31:16 Data to be written
(16-bits)
000
00101
CBIT_en
NVM Write
D31:21 Not Used (set all to’0’)
D20:16 NVM address
000
00110
NVM Erase
D31:21 Not Used (set all to’0’)
D20:16 NVM address
000
REV
D31:16 = 0xFFFF
INV REV
D31:16 = 0x0000
Operation
BIT Status Request
NVM Read
NVM Write Data
D6 D5 D4
Table 7.5 Command Message Format
NOTE 1: CBIT_en: 0 = inactive, 1= active. See section 7.2.6 for CBIT behaviour.
NOTE 2: In all messages to and from the sensor a 4-bit CRC (data bits D3:0) shall be added. The CRC polynomial
used shall be x4+1. A seed value of “1010” shall be used with a calculation order MSB to LSB. The CRC
shall be checked for all I/P messages. If the CRC fails then the message shall be ignored and a SPI® error
message output in the next message.
7.2.2 Messages from Sensor (MISO)
Table 7.6 outlines the status message types available from the CMS390 sensor to the host:
Message Type
Mode
Operation
Rate
Data Monitor
Rate value (16-bit 2’s compliment)
Acceleration Y
Data Monitor
Axis Y acceleration value (16-bit 2’s compliment)
Acceleration X
Data Monitor
Axis X acceleration value (16-bit 2’s compliment)
Temperature
Data Monitor
Temperature value (16-bit)
Configuration Status
Global
Request Status of device configuration e.g. BW, Range,
Sense Direction etc
BIT Status
Global
Status of internal BIT flags
NVM Read (including serial number)
Global
Read of requested NVM location (16-bit data)
See Section 8 for memory map
REV
Global
Revision status
INV REV
Global
Inverse revision status
NVM ECC Error
Global
NVM Parity error detected
SPI® Error
Global
SPI® clock error detected
Invalid Command
Global
SPI® request invalid
Table 7.6 Status Message Types
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
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CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Table 7.7 details the bit format for messages from the CMS390 sensor:
D31:16
Data Content
D15:13
Mode
Note 2
D12:8
Address
D7
CBIT
Note 1
D6
Note 3
D3:0
CRC
Note 8
Comments
Rate
Rate Data
16-bit 2’s compliment
101
00000
CBIT
0
KACT
Note 4
CRC
Scale Factor: see Note 9
Acceleration Y
Acceleration Y Data
16-bit 2’s compliment
101
00001
CBIT
ACC Bit
KACT
Note 4
CRC
Scale Factor: see Note 10
Acceleration X
Acceleration X Data
16-bit 2’s compliment
101
00010
CBIT
ACC Bit
KACT
Note 4
CRC
Scale Factor: see Note 10
Temperature
Temperature 1 Data
16-bit
101
00011
CBIT
0
KACT
Note 4
CRC
Scale Factor and Offset:
see Note 11
Configuration
Status
Configuration Data
16-bit
000
00000
CBIT
0
0
0
CRC
See Section 7.2.5 for format
BIT Status
BIT Flag Status 16-bit
000
00010
CBIT
0
0
0
CRC
See Section 7.2.3 for format
NVM Normal
Read
16-bit NVM Location
Data
000
00011
CBIT
0
0
0
CRC
See Section 8 for memory
map of NVM
NVM ECC Error
D31:16 = 0x0000
000
01000
0
0
0
0
CRC
Sent if NVM error detected
SPI® Error
D31:16 = 0x0000
000
01001
CBIT
0
0
0
CRC
Sent if Wrong No clocks or
CRC failed for I/P message
Note 7
Invalid SPI®
Command
D31:16 = 0x0000
000
01010
CBIT
0
0
0
CRC
Sent if an invalid command
was received (inc illegal NVM
command Note 7
REV
16-bit data
000
10000
1
1
1
0
CRC
See Section 7.2.4 for format
INV REV
16-bit data
000
00001
0
0
0
1
CRC
See Section 7.2.4 for format
Message Type
Note 5, 6 & 7
D5
D4
Table 7.7 Status Message Format
NOTE 1: CBIT = 1 if CBIT is Active, 0 if CBIT is inactive. See section 7.2.6 for CBIT behaviour.
NOTE 2: If D15:14 = “01” then a fault condition has been detected.
NOTE 3: Acc Bit will be set to fail (1) if a fault with the accelerometer channels is detected. If it indicates a
pass (0) then the acc channels are still operational even if bits D15:14 indicate a fault.
NOTE 4: KACT = Keep alive count; a 2 bit count that increments every data monitor message and rolls over at “11”.
NOTE 5: On POR or from Reset the first message type from the sensor shall be the configuration status, for any
command message.
NOTE 6: On receipt of one of the following command message types in SPI® exchange (N) the response sent in the
next SPI® exchange (N+1) will be that output in SPI exchange (N-1).
NVM Write Data
NVM Write
NVM Erase
NOTE 7: If an invalid command message or a SPI® error message is sent by the ASIC then this message will be
held until a valid status message request has been requested i.e. a message listed in section 7.2.2.
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
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Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
NOTE 8: In all messages to and from the ASIC a 4-bit CRC (data bits D3:0) shall be added. The CRC polynomial
used shall be x4+1. A seed value of “1010” shall be used with a calculation order MSB to LSB. The CRC
shall be checked for all I/P messages. If the CRC fails then the message shall be ignored and a SPI® error
message output in the next message.
NOTE 9: The rate data shall be a 16 bit 2’s complement number, where a rate O/P of 0000h = 0°/s. Scale factor
204.8 lsb/(°/s) – Low Range, 102.4 lsb/(°/s) – High Range.
NOTE 10: The acceleration data shall be a 16 bit 2’s complement number, where acc output of 0000h = 0g.
Scale factor 12800 lsb/g (low range), 3200 lsb/g (high range).
NOTE 11: The temperature data shall be a 16 bit number which can be converted to temperature as follows;
Temperature (°C) = CMS390 Temp10/11 - 193.2. For example, if the CMS390 output is = 0960h (240010),
Temperature (°C) = 2400/11 - 193.2 = 24.98 °C.
7.2.3 BIT Flag Format
7.2.4 REV and INREV Format
The BIT status message data word is enclosed
as defined in table 7.8.
The REV and INV REV messages can be decoded as
follows:
BIT No.
The Device ID and revision numbers will be stored in
the NVM.
BIT Flag
Operation
D31
Trim Data Store Data
0 = OK 1 = FAIL
D30
AGC Level BIT
0 = OK 1 = FAIL
D29
QUAD Level BIT
0 = OK 1 = FAIL
BIT No.
D28
DAC BIT
0 = OK 1 = FAIL
D31:25
“1111111”
D27
QUAD Channel BIT
0 = OK 1 = FAIL
D24:22
Device ID (2:0)
D26
RATE Channel BIT
0 = OK 1 = FAIL
D25
AGC Low BIT
0 = OK 1 = FAIL
D24
AGC High BIT
0 = OK 1 = FAIL
D23
NONINT (sine drive switch)
0 = OK 1 = FAIL
D22
ACC Y Channel BIT
0 = OK 1 = FAIL
D21
ACC X Channel BIT
0 = OK 1 = FAIL
D20
Vref Cap Check
0 = OK 1 = FAIL
D19
ACC Vdd Filter Cap BIT
0 = OK 1 = FAIL
BIT No.
INV REV
D18
Trim Check NVM Read Error
0 = OK 1 = FAIL
D31:25
“0000000”
D17
MEMS Ref Bit
0 = OK 1 = FAIL
D24:22
Inverse of Device ID (2:0)
REV contains devices ID and revision. The message is
encoded as defined in table 7-9.
D21
“1”
D20:16
Device Revision (4:0)
D15:4
“000100001110”
D3:0
CRC
Table 7.9 REV Message Format
INV REV contains devices ID and revision.
The message is encoded as defined in table 7-10.
D21
Table 7.8 BIT Status Format
REV
“0”
D20:16
Inverse of Device Revision (4:0)
D15:4
“000000010001”
D3:0
CRC
Table 7.10 INV REV Message Format
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
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CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
7.2.5 Device Configuration
7.2.6 CBIT
The default device configuration is stored in location
00 of the NVM (see section 8.2). To change the
default device configuration see section 8.3.
This data is loaded on power-up or reset. This data
can be over-ridden by a SPI® Device Configuration
Set message with the following data format. A SPI®
configuration selection is latched and cannot be
overwritten by any further Device Configuration
messages. A power or reset cycle will be required to
clear the SPI® selection and reload the default NVM
selection.
A CBIT function can be used to check the operation
of the internal control loops.
A device configuration status request will output the
configuration currently in use within the device. The
status format is defined in table 7-11.
BIT No.
Parameter
Decode
D31:28
Spare
Set to “0000”
D27:26
Gyro Bandwidth
“11” = 45Hz
“10” = 55Hz
“01” = 90Hz
“00” = 110Hz
ACC Y Bandwidth
“11” = 45Hz
“10” = 62Hz
“01” = 95Hz
“00” = 190Hz
D23:22
ACC X Bandwidth
“11” = 45Hz
“10” = 62Hz
“01” = 95Hz
“00” = 190Hz
D21
Gyro Rate Range
(rate_range(0))
“1” = 150°/s
“0” = 300°/s
D20
ACC Y Range
“1” = 2.5g
“0” = 10g
D19
ACC X Range
“1” = 2.5g
“0” = 10g
D18
ACC Y Sense Direction
(see note 1)
“0” = Pos
“1” = Neg
D17
ACC X Sense Direction
(see note 1)
“0” = Pos
“1” = Neg
D16
Gyro Sense Direction
(see note 1)
“0” = +ve Rate is CW
“1” = +ve Rate is ACW
D25:24
When enabled, via a SPI® message CBIT will add a
fixed offset to the Rate and both Acceleration outputs,
BIT_Out will be set to the fault condition and the sensor
message will show a fault. The offset applied depends
on the range selected. See page 5 and 6 for details.
8 NVM Memory
The NVM will be an EEPROM block with 32 locations
of 16 bit data plus 6 bit ECC parity. The ECC parity
bits will be able to correct single bit errors. The
EEPROM block will generate two error bits; one if a
single bit error is detected the other if multiple error
bits are detected.
The memory will be split into two areas of 13 and 19
locations of 16 bit words.
The first area (address 00 to 0C) allows unlimited
read, write or erase access by the User. The first
location (address 00) is used to configure the device
(e.g. Bandwidth, Range selection – see section 8.2).
The remaining locations have no limitations on data
content.
The second area (address 0D to 1F) is used to
store calibration, setup and serial number data. The
User will only be allowed read access of the serial
number data (locations 0D to 10). Access to all other
locations in this area are not allowed.
Section 8.3 details the sequence of messages
required for each operation.
Note 1: See figure 1.2 for definition of positive sense direction.
Table 7.11 Configuration Status Message
Format
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Specification subject to change without notice.
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Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
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8.1 NVM Memory Map
8.2 Configuration Word Format
Table 8.1 details the content and accesses allowed
for each location in the NVM.
The device configuration data stored in location
00(hex) of the NVM shall have the format defined
in table 8.2. Factory default settings 0FF8 (h).
Access
Configuration
User Data
Calibration
Data
Address Access Modes
(hex)
(see note)
Content
BIT No.
Parameter
Decode
Bits 15:12
Spare
Set to “0000”
Gyro Bandwidth
“11” = 45Hz
“10” = 55Hz
“01” = 90Hz
“00” = 110Hz
ACC Y Bandwidth
“11” = 45Hz
“10” = 62Hz
“01” = 95Hz
“00” = 190Hz
Bits 7:6
ACC X Bandwidth
“11” = 45Hz
“10” = 62Hz
“01” = 95Hz
“00” = 190Hz
Bit 5
Gyro Rate Range
“1” = 150°/s
“0” = 300°/s
Bit 4
ACC Y Range
“1” = 2.5g
“0” = 10g
Bit 3
ACC X Range
“1” = 2.5g
“0” = 10g
Bit 2
ACC Y Sense Direction
(see note 1)
“0” = Pos
“1” = Neg
Bit 1
ACC X Sense Direction
(see note 1)
“0” = Pos
“1” = Neg
Bit 0
Gyro Sense Direction
(see note 1)
“0” = +ve Rate is CW
“1” = +ve Rate is ACW
00
R,W,E
16 bits Configuration,
see section 8.2
01
R,W,E
User Location 16-bit data
02
R,W,E
User Location 16-bit data
03
R,W,E
User Location 16-bit data
04
R,W,E
User Location 16-bit data
05
R,W,E
User Location 16-bit data
06
R,W,E
User Location 16-bit data
07
R,W,E
SSSL Use Only
08
R,W,E
SSSL Use Only
09
R,W,E
SSSL Use Only
0A
R,W,E
SSSL Use Only
0B
R,W,E
SSSL Use Only
0C
R,W,E
SSSL Use Only
0D
R
Bits 15:0 Serial Number 1
0E
R
Bits 15:0 Serial Number 2
0F
R
Bits 15:0 Serial Number 3
10
R
Bits 15:0 Serial Number 4
11
-
SSSL Use Only
12
-
SSSL Use Only
13
-
SSSL Use Only
14
-
SSSL Use Only
15
-
SSSL Use Only
16
-
SSSL Use Only
17
-
SSSL Use Only
18
-
SSSL Use Only
Bits 11:10
Bits 9:8
Note 1: See figure 1.2 for definition of positive sense direction.
Table 8.2 Configuration Format in NVM
19
-
SSSL Use Only
8.3 NVM Operations
1A
-
SSSL Use Only
1B
-
SSSL Use Only
This section defines the steps required for NVM
access operations.
1C
-
SSSL Use Only
1D
-
SSSL Use Only
1E
-
SSSL Use Only
1F
-
SSSL Use Only
Note: Access codes: R, W, E - Unlimited Read, Write or Erase.
Table 8.1 NVM Memory Map
Read from User NVM location:
Reads from the user area of the NVM or the serial
number locations.
1. NVM Read SPI® message requesting data from
NVM address specified in message.
Write to User NVM location:
The for correct storage of required data the location
must be erased before writing new data.
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
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CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
1. NVM Write Data message containing the 16-bit
data to be written.
2. NVM Write command containing the 5 bit NVM
address to be written to.
Erase of User NVM location:
1. NVM Erase message containing the 5 bit NVM
address to be erased.
9 Design Tools and Resources Available
Item
Description of Resource
Part Number
Order/Download
CMS300 Brochure: A one page sales brochure describing
the key features of the OrionTM Combi ensor.
CMS300-00-0100-131
Download
(www.siliconsensing.com)
CMS300 Datasheet: Full technical information on all
CMS300 Combi Sensor part number options. Specification
and other essential information for assembling and interfacing
to CMS300 Combi Sensors, and getting the most out of them.
CMS300-00-0100-132
Download
(www.siliconsensing.com)
CMS390 Datasheet: Full technical information on all
CMS390 Combi Sensor part number options. Specification
and other essential information for assembling and interfacing
to CMS390 Combi Sensors, and getting the most out of them.
CMS390-00-0100-132
Download
(www.siliconsensing.com)
CMS300 Presentation: A useful presentation describing the
features, construction, principles of operation and applications
for the CMS300 Combi Sensor.
CMS300_Presentation
Download
(www.siliconsensing.com)
CMS300-EVB
Order
CMS390-EVB
Order
Evaluation boards (CMS300 & CMS390 options):
Single CMS300 or CMS390 fitted to a small PCBA for easy
customer evaluation and test purposes. Supplied with
connector and flying lead.
Solid Model CAD files for CMS300 & CMS390
Combi Sensors:
Available in .STP and .IGS file format
CMS300-00-0100-408
Download
(www.siliconsensing.com)
CMS390-00-0100-408
Library Parts:
Useful library component files of CMS390 Combi Sensors:
DxDesigner Schematic Symbols.
PADS Decal (Footprint)
PADS Part Type File.
T.B.A.
Reference Circuit: A useful reference circuit design gerber
files for the CMS390 Combi Sensor for use in host systems.
T.B.A.
Download
(www.siliconsensing.com)
Download
(www.siliconsensing.com)
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 22
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CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Design Tools and Resources Available Continued
Item
Description of Resource
Part Number
Order/Download
Interface: Off-the-peg pseudo code and a simple flowchart
with message handling instructions for use as a customer aid
to developing their own interface directly to a CMS390 Combi
Sensor via the SPI®.
—
Download
(www.siliconsensing.com)
Questions and Answers: Some useful questions asked
by customers and how we’ve answered them. This is an
informal (uncontrolled) document intended purely as additional
information.
FQAs
View at
(www.siliconsensing.com)
RoHS compliance statement for CMS390 : CMS390 is
fully compliant with RoHS. For details of the materials used in
the manufacture please refer to the MDS Report.
—
Download
(www.siliconsensing.com)
MDS Reports for CMS390 : Material declaration required
for automotive applications.
—
Download
(www.siliconsensing.com)
10 Cleaning
12 Part Markings
Due to the natural resonant frequency and
amplification factor (‘Q’) of the sensor, ultrasonic
cleaning should NOT be used to clean the CMS390
Combi Sensor.
11 Soldering Information
Temp (°C)
Silicon Sensing
Company Logo
2D Data Matrix Code
Containing the
Production Number
Part Number
390
C M S MLLLLRDD
n
PYYM
Assembly Lot
(See Table 12.2)
P
Max 40sec
Production Number
(See Table 12.1)
Indicates Location
of Pin 1
260°C
Country of Origin of Final
Assembly and Test
255°C
Max 180sec
Mad
XXXX
LLLL_
YYMM
apa
e In J
C.G. 18595
Figure 12.1 Part Marking
217°C
Item
200°C
150°C
Max 120sec
Code
Range
Year number
YY
00 - 99
Month number
MM
01-12
Lot number
LLLL
0000 -9999
(Space)
Serial number
–
–
XXXX
0001 - 9999
Table 12.1 Production Number Code
Time (sec)
Code
Range
Configuration
Item
PP
11 - 99
Year number
YY
00-99
Month number
MM
01-12
Lot number
LLLL
0000 -9999
C.G. 18384
Figure 11.1 Recommended Reflow
Solder Profile
Measurement times
Serial split
R
0-2
DD
00,01,--
Table 12.2 Assembly Lot Code
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 23
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
13 Packaging Information
Reel Information
110
Type
Quantity
Tape and Reel
Max. 600 pcs/
1 Reel
9±0.5
89
270
80±1
330±2
30
5±
0.5
22
0.2
0.4
Cardboard Box
Inner Bag x 1/Inner
Box
0.6
1 Reel/Bag
0.8
B
Aluminium
Damp-proof Bag
152
30
W2±1.0
0.5
5±
172
Inner Box
10
0.5
Inner Bag
W1±1.0
3±
CMS390
3±
0.5
55
Layer
3 B
3 B
Frame for label
7±0.5
EIAJ.RRM.24.D
Outer Box
Cardboard Box
Inner Box/Outer
Box
Centre details
Reel width
2±0.5
21±
0.8
13±0.2
Reel width
mm
8
12
W1
9.5
13.5
W2
13.5
17.5
R1
Table 13.1 Packaging Information
Item
Dimension
Quantity
Material
Reel
DR23324C
1 Reel
PS
16
17.5
21.5
24
32
44
25.5
33.5
45.5
29.5
37.5
49.5
C.G. 18547
Centre Shape
Emboss Tape Carrier Information
Cover Tape
ALS-ATA
21.5mm
1 Roll
PET, PE, PS
Label for
Reel
40mm x
80mm
1 label/Reel
Paper
Desiccant
FA 10g
1 Inner Bag
–
Inner Bag
0.101mm
x 450mm x
530mm
1 Reel/Inner
Bag
MB4800
Tray
451mm x
429mm x
55mm
2 Tray/Outer
Box
Pad
451mm x
429mm x
20mm
3 Pad/Outer
Box
Inner Box
413mm x
391mm x
52mm
2 Inner Box/
Outer Box
Cardboard
Outer Box
462mm x
440mm x
208mm
1 Box
Cardboard
Label for
Outer Box
105mm x
127mm
1 label/Outer
Box
Paper
A
A
B B VIEW
3±0.3
B
7±0.1
6.4±0.3
2.5±0.3
10.7±0.1
PS
0.4±0.05
24±0.3
1 Roll
11.5±0.1
le
Ho
TE2412110930-1
(Tolerance between
each hole is ±0.2)
13.9±0.3
±0.1
Emboss
Tape
2±0.1
B
(Tolerance between
each hole is ±0.2)
1.5
4±0.1
1.75±0.1
12±0.1
1.5+0.1
0
3.2±0.1
A A VIEW
–
C.G.18597
Tape Information
Drawing direction
–
400mm ~ 700mm
Empty
Sensor packing
400mm
Empty
2000mm
Cover tape
Table 13.2 Packaging Specification
Reel label position
C.G. 18409
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 24
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Label for Reel Information
Outer Box Packing Information
Part Number
CMS390
Pad
Number
Quantity
No. S3011002001
1002
C.G. 18596
Inner Box
Inner Bag Packing Information
Tray
Desiccant
Pad
Inner Bag
Inner Box
Tray
Pad
Box
Reel
Craft Tape
C.G. 18392
2
1
Inner Box Packing Information
Maximum of two Reels per Outer Box.
If 1 Reel is contained in Outer Box, label is
pasted in position 1.
If 2 Reels are contained in Outer Box, labels
are pasted in positions 1 and 2.
Each label shows packaged reel information.
C.G. 18390
Inner Bag
Inner Box
C.G. 18389
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 25
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
14 Internal Construction and Theory
of Operation
Construction
CMS300 and CMS390 are available in two basic
package configurations:
Part Number CMS300 (flat): Relative to the plane of the
host PCBA, this part measures angular velocity about
a single perpendicular axis (Z) and linear acceleration
about two parallel axes (X,Y).
Part Number CMS390 (orthogonal): Relative to the
plane of the host PCBA, this part measures angular
velocity about a single parallel axis (Z) and linear
acceleration about one parallel axis (X) and one
perpendicular axis (Y).
CMS300 and CMS390 are supplied as a PCBA surface
mountable LCC ceramic packaged device.
It comprises six main components; Silicon MEMS
Single-Axis Angular Rate Sensor, Silicon On Glass
(SOG) Dual-Axis MEMS Accelerometer, Silicon
Pedestal, ASIC and the Package Base and Lid.
The MEMS Sensors, ASIC and Pedestal are housed
in a hermetically sealed package cavity with a
nitrogen back-filled partial vacuum, this has particular
advantages over sensors supplied in plastic packages
which have Moisture Sensitivity Level limitations.
A exploded drawing of CMS300 showing the main
components is given in Figure 14.1 below. The
principles of construction for CMS390 are the same
as CMS300.
CM
PPY S300
Y
Mad MMLLL
e In
JapaLRDD
n
Seal Ring
Lid
YYM
MLL
LL_X
XXX
Vacuum Cavity
Bond Wires
MEMS Ring
Pedestal
Dual-Axis Accelerometer
ASIC
Package Base
C.G. 18542
Figure 14.1 CMS300 Main Components
Figure 13.2 CMS300 (Lid Removed)
Silicon MEMS Ring Sensor (Gyro)
The 3mm diameter by 65μm thick silicon MEMS ring
is fabricated by Silicon Sensing using a DRIE (Deep
Reactive Ion Etch) bulk silicon process. The annular
ring is supported in free-space by eight pairs of
‘dog-leg’ shaped symmetrical spokes which radiate
from a central 1mm diameter solid hub.
The bulk silicon etch process and unique patented
ring design enable close tolerance geometrical
properties for precise balance and thermal stability
and, unlike other MEMS gyros, there are no small gaps
to create problems of interference and stiction.
These features contribute significantly to CMS390’s
bias and scale factor stability over temperature, and
vibration and shock immunity. Another advantage
of the design is its inherent immunity to acceleration
induced rate error, or ‘g-sensitivity’.
Piezoelectric (strain) film actuators/transducers are
attached to the upper surface of the silicon ring
perimeter and are electrically connected to bond
pads on the ring hub via tracks on the spokes.
These actuate or ‘drive’ the ring into its Cos2 mode
of vibration at a frequency of 22kHz or detect radial
motion of the ring perimeter either caused by the
primary drive actuator or by the coriolis force effect
when the gyro is rotating about its sensing axis. There
is a single pair of primary drive actuators and a single
pair of primary pick-off transducers, and two pairs of
secondary pick-off transducers.
The combination of transducer technology and eight
secondary pick-off transducers improves CMS390’s
signal-to-noise ratio, the benefit of which is a very
low-noise device with excellent bias over temperature
performance.
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 26
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Silicon MEMS Dual-Axis Accelerometer
ASIC
The CMS390 dual-axis open loop accelerometer
is a one-piece resonating silicon MEMS structure
anodically bonded to top and bottom glass substrates
to form a hermetically sealed Silicon on Glass (SOG)
wafer sub-assembly. The same DRIE bulk silicon
process as used to create the gyro in CMS390 is
used to create two orthogonal finger-like spring/
seismic proof mass structures, each measuring
1.8mm square, and with a resonant frequency of
2.9kHz. Figure 14.3 shows a schematic cross section
through the SOG wafer.
The ASIC is a 5.52mm x 3.33mm device fabricated
using 0.35μm CMOS process. ASIC and MEMS are
physically separate and are connected electrically
by using gold bond wires and thus the ASIC has
no MEMS-to-ASIC internal tracking, meaning
there is reduced noise pick-up and excellent EMC
performance. Gold bond wires also connect the ASIC
to the internal bond pads on the Package Base.
Capacitive drive and pick-off signals are transmitted
by wire bond interconnections, in through-glass vias,
between the metallised transducer plates on the
MEMS proof mass and the CMS390 ASIC.
Multiple inter-digitated fingers create increased
capacitance thus enabling a high signal-to-noise
ratio. The fingers are tapered to increase the resonant
frequency and also have a high aspect ratio to provide
highly stable performance. The differential gaps
between the static electrode fingers and those of the
proof mass provide an air squeeze film with nearcritical damping.
Control of the accelerometer is handled by the CMS390
ASIC.
Support flexure
Glass Substrates
Seismic proof mass
Through-glass via
Cavity
Silicon
C.G. 18538
Figure 14.3 Schematic Section of the Silicon
On Glass Accelerometer MEMS Wafer
Sub-Assembly
Pedestal
The hub of the MEMS ring is supported above the
ASIC on a 1mm diameter cylindrical silicon pedestal,
which is bonded to the ring and ASIC using an epoxy
resin.
Package Base and Lid
The LCC ceramic Package Base is a multi-layer
aluminium oxide construction with internal bond
wire pads connected through the Package Base via
integral multi-level tungsten interconnects to a series
of external solder pads. Similar integral interconnects
in the ceramic layers connect the Lid to Vss, thus
the sensitive elements are inside a Faraday shield
for excellent EMC. Internal and external pads are
electroplated gold on electroplated nickel.
The Package Base incorporates a seal ring on the
upper layer onto which a Kovar ® metal Lid is seam
welded using a rolling resistance electrode, thus
creating a totally hermetic seal. Unlike other MEMS
gyro packages available on the market, CMS390
has a specially developed seam weld process which
eliminates the potential for internal weld spatter.
Inferior designs can cause dislodged weld spatter
which affects gyro reliability due to interference with
the vibratory MEMS element, especially where the
MEMS structure has small gaps, unlike CMS390
with its large gaps as described above.
Theory of Operation (Gyro)
CMS390 rate sensor is a solid-state device and thus
has no moving parts other than the deflection of the
ring itself. It detects the magnitude and direction of
angular velocity by using the ‘coriolis force’ effect.
As the gyro is rotated coriolis forces acting on
the silicon ring cause radial movement at the ring
perimeter.
There are eight actuators/transducers distributed
evenly around the perimeter of the silicon MEMS ring.
Located about its primary axes (0° and 90°) are a
single pair of ‘primary drive’ actuators and a single
pair of ‘primary pick-off’ transducers. Located about
its secondary axes (45° and 135°) are two pairs of
‘secondary pick-off’ transducers.
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 27
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
The ‘primary drive’ actuators and ‘primary pick-off’
transducers act together in a closed-loop system to
excite and control the ring primary operating vibration
amplitude and frequency (22kHz). Secondary ‘pick-off’
transducers detect radial movement at the secondary
axes, the magnitude of which is proportional to the
angular speed of rotation and from which the gyro
derives angular rate. The transducers produce a
double sideband, suppressed carrier signal, which
is demodulated back to a baseband. This gives the
user complete flexibility over in system performance,
and makes the transduction completely independent
of DC or low frequency parametric conditions of the
electronics.
Referring to Figures 14.4(a) to 14.4(d)
Figure 14.4(a) shows the structure of the silicon MEMS
ring. Figure 14.4(b) shows the ring diagrammatically,
the spokes, actuators and transducers removed for
clarity, indicating the Primary Drive actuators (single
pair), Primary Pick-Off transducers (single pair) and
Secondary Pick-Off transducers (two pairs).
In Figure 14.4(b) the annular ring is circular and is
representative of the gyro when unpowered.
When powered-up the ring is excited along its primary
axes using the Primary Drive actuators and Primary
Pick-Off transducers acting in a closed-loop control
system within the ASIC. The circular ring is deformed
into a ‘Cos2θ’ mode which is elliptical in form and
has a natural frequency of 22kHz. This is depicted in
Figure 14.4(c). In Figure 14.4(c) the gyro is powered-up
but still not rotating. At the four Secondary Pick-Off
nodes located at 45° to the primary axes on the ring
perimeter there is effectively no radial motion.
If the gyro is now subjected to applied angular rate,
as indicated in Figure 14.4(d), then this causes the ring
to be subjected to coriolis forces acting at a tangent
to the ring perimeter on the primary axes. These
forces in turn deform the ring causing radial motion
at the Secondary Pick-Off transducers. It is the motion
detected at the Secondary Pick-off transducers which
is proportional to the applied angular rate.
The DSBSC signal is demodulated with respect to
the primary motion, which results in a low frequency
component which is proportional to angular rate.
All of the gyro control circuitry is hosted in the ASIC.
A block diagram of the ASIC functions is given in
Figure 1.1 in Section 1.
www.siliconsensing.com
PPO+
SPOSPO+
SPOSPO+
PD+
PDPD+
PDSPO+
SPO-
SPO+
SPOPPO+
C.G 18398
Figure 14.4(a)
PPO
SPO
SPO
PD
PD
SPO
SPO
PPO
C.G 18399
Figure 14.4(b)
ν
Zero Radial
Motion
SPO
ν
Cos2θ
Vibration
Mode at
22kHz
ν
ν
C.G 18400
Figure 14.4(c)
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 28
CMS390-00-0100-132 Rev 7
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
ν
Sensing axis
Fc
Fixed support
Resultant
Radial Motion
Fc = Coriolis Force
ν
Fixed Electrode 1
ν
Fixed Electrode 2
Applied Rate
Fc
Fc
Proof mass
(includes fingers)
ν
C.G. 18613
C.G 18400
Figure 14.4(d)
Figure 14.5(a) Schematic of Accelerometer
Structure
Theory of Operation (Accelerometer)
The accelerometer contains a seismic ‘proof mass’
with multiple fingers suspended via a ‘spring’, all of
which is formed in the silicon MEMS structure.
The proof mass is anodically bonded to the top and
bottom glass substrates and thereby fi xed to the
CMS390 Package Base.
When the CMS390 sensor is subjected to a linear
acceleration along its sensitive axis the proof
mass tends to resist motion due to its own inertia,
therefore the mass and it’s fingers becomes
displaced with respect to the interdigitated fi xed
electrode fingers. Air between the fingers provides
a damping effect. This displacement induces a
differential capacitance between the moving and
fi xed silicon fingers which is proportional to the
applied acceleration.
Capacitor plate groups are electrically connected in
pairs at the top and bottom of the proof mass.
In-phase and anti-phase waveforms are applied by
the CMS390 ASIC separately to the ‘left’ and ‘right’
finger groups. The demodulated waveforms provide
a signal output proportional to linear acceleration.
Figures 14.5(a) and 14.5(b) provide schematics
of the accelerometer structure and control loop
respectively.
88kHz reference
Signal proportional
to movement of
proof mass
Electrode 2
Out of Phase Square Wave
at 88kHz on Electrode 2
Sensing axis
Demodulator
Amplifier
Low pass
filter
Electrode 1
In Phase Square Wave
at 88kHz on Electrode 1
Output signal
C.G. 18540
Figure 14.5(b) Schematic of Accelerometer
Control Loop
15 Patent Applications
The following patent applications have been filed for
the CMS390 Combi Sensors:
Patent Application
Status
US5226321
Granted
US5419194
Granted
US6698271
Granted
WO2009/119205
Patent Pending
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
CMS390-00-0100-132 Rev 7
Page 29
CMS390 Technical Datasheet
Angular Rate and Dual-Axis
Linear Acceleration Combi-Sensor
www.siliconsensing.com
Notes
Silicon Sensing Systems Limited
Clittaford Road Southway
Plymouth Devon
PL6 6DE United Kingdom
Silicon Sensing Systems Japan Limited
1-10 Fuso-Cho
Amagasaki
Hyogo 6600891 Japan
T:
F:
E:
W:
T:
F:
E:
W:
+44 (0)1752 723330
+44 (0)1752 723331
[email protected]
siliconsensing.com
+81 (0)6 6489 5868
+81 (0)6 6489 5919
[email protected]
siliconsensing.com
Specification subject to change without notice.
© Copyright 2015
Silicon Sensing Systems Limited
All rights reserved.
Printed in England 07/2015
Date 29/07/2015
CMS390-00-0100-132 Rev 7
DCR No. 710009302
© Copyright 2015 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.
Specification subject to change without notice.
Page 30
CMS390-00-0100-132 Rev 7