MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 8 March 2016, 08:32 GMT
Diotec Semiconductor AG
DUNS-Nummer: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations Autorisiert durch:
Udo Steinebrunner, Product Manager, -
Deklaration gilt ab: 1 May 2009 [Approved on 8 March 2016, 08:30 GMT]
Materialien und Stoffe
Verwendung/Andordnung
Material
group
Chip (die)
Other
inorganic
materials
Encapsulation
EP (Epoxy
resin)
% w/w
des
Materials
im Artikel
0.25000%
69.02000%
Substances in the material
CAS
Number
% w/w des
Stoffs im
Artikel
Gold
7440-57-5
8.50000%
ALUMINIUM
7429-90-5
12.00000%
Silicon
7440-21-3
79.50000%
Carbon black
1333-86-4
0.30000%
ANTIMONY TRIOXIDE
1309-64-4
0.80000%
2,2-Bis(4(2',3'1675-54-3
epoxypropoxy)phenyl)propane
0.99000%
Epoxy resin 89
26335-320
27.61000%
Quartz sand
60676-860
70.30000%
Inner preparation
Gold
0.17000%
Gold
7440-57-5
100.00000%
Leadfinish
Tin
plating
1.60000%
Tin
7440-31-5
100.00000%
Leadframe
Copper
(e.g.
copper
28.96000%
amounts
in cable
harnesses)
Copper
7440-50-8
100.00000%
Beigefügte Artikelliste
Part number
Artikelbezeichnung
Artikelmasse
Artikelmasse
UoM
SOT-323
Diode/Transistor SMD
0.01
g
Page 1
Report generated: 8 March 2016, 08:32 GMT