MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 7 March 2016, 12:42 GMT
Diotec Semiconductor AG
DUNS-Nummer: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations Autorisiert durch:
Udo Steinebrunner, Product Manager, -
Deklaration gilt ab: 1 May 2009 [Approved on 7 March 2016, 12:42 GMT]
Materialien und Stoffe
% w/w des
Materials Substances in the material
im Artikel
Verwendung/Andordnung
Material
group
Chip (die)
Other
inorganic
materials
3.00000%
Gold
4.00000%
Die attach
Encapsulation
EP (Epoxy
resin)
68.08000%
CAS
Number
% w/w des
Stoffs im
Artikel
Gold
7440-57-5
8.50000%
ALUMINIUM
7429-90-5
12.00000%
Silicon
7440-21-3
79.50000%
Tin
7440-31-5
20.00000%
Gold
7440-57-5
80.00000%
Carbon black
1333-86-4
0.30000%
ANTIMONY TRIOXIDE
1309-64-4
0.80000%
2,2-Bis(4(2',3'1675-54-3
epoxypropoxy)phenyl)propane
0.99000%
Epoxy resin 89
26335-320
27.61000%
Quartz sand
60676-860
70.30000%
Inner preparation
Gold
0.14000%
Gold
7440-57-5
100.00000%
Leadfinish
Tin
plating
0.68000%
Tin
7440-31-5
100.00000%
Leadframe
Copper
(e.g.
copper
24.10000%
amounts
in cable
harnesses)
Copper
7440-50-8
100.00000%
Beigefügte Artikelliste
Part number
Artikelbezeichnung
Artikelmasse
Artikelmasse
UoM
SOD-323
Diode SMD
0.005
g
Page 1
Report generated: 7 March 2016, 12:42 GMT