HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 1. PART NO. EXPRESSION : V8N101J-J-10 (a) (b) (c) (d) (e) (f) (a) Chip Size (d) Tolerance code (b) Temp. Coefficient : N ( 30ppm/°C ) (e) Voltage code : J = 1000Vdc ( Temp. range : -55°C to +125°C ) (f) 10 : Lead Free (c) Capacitance code : 101 = 100pF 2. CONFIGURATION & DIMENSIONS : A D L H G B C PCB Pattern Unit:m/m A B C D 5.70±0.40 5.00±0.40 3.00 Max. G H L 0.30 Min. 4.00 - 4.60 3.50 - 4.80 2.00 - 2.20 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) (a) Body : Ceramic (b) Termination : Ag/Ni/Sn Sn(100%)-3.0um(min.) 5. GENERAL SPECIFICATION : a) Storage temp. : +5°C to +40°C b) Operating temp. : -55°C to +125°C c) Resistance to solder heat : 260°C.10secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 6. ELECTRICAL CHARACTERISTICS : ( Rated Voltage : 1KVdc ) Capacitance Part Number ( pF ) Part Number Capacitance ( pF ) V8N101 -J-10 100 V8N392 -J-10 3900 V8N121 -J-10 120 V8N472 -J-10 4700 V8N151 -J-10 150 V8N562 -J-10 5600 V8N181 -J-10 180 V8N682 -J-10 6800 V8N221 -J-10 220 V8N822 -J-10 8200 V8N271 -J-10 270 V8N103 -J-10 10000 V8N331 -J-10 330 V8N123 -J-10 12000 V8N391 -J-10 390 V8N153 -J-10 15000 V8N471 -J-10 470 V8N183 -J-10 18000 V8N561 -J-10 560 V8N681 -J-10 680 V8N821 -J-10 820 V8N102 -J-10 1000 V8N122 -J-10 1200 V8N152 -J-10 1500 V8N182 -J-10 1800 V8N222 -J-10 2200 V8N272 -J-10 2700 V8N332 -J-10 3300 Tolerance code : : C : ±0.25pF D : ±0.50pF J : ±5% K : ±10% M : ±20% NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 6. ELECTRICAL CHARACTERISTICS : ( Rated Voltage : 5KVdc ) Capacitance Part Number ( pF ) Part Number Capacitance ( pF ) V8N2R0 -R-10 2.0 V8N121 -R-10 120 V8N3R3 -R-10 3.3 V8N151 -R-10 150 V8N3R9 -R-10 3.9 V8N5R0 -R-10 5.0 V8N8R0 -R-10 8.0 V8N8R2 -R-10 8.2 V8N100 -R-10 10 V8N120 -R-10 12 V8N150 -R-10 15 V8N180 -R-10 18 V8N220 -R-10 22 V8N270 -R-10 27 V8N330 -R-10 33 V8N390 -R-10 39 V8N470 -R-10 47 V8N560 -R-10 56 V8N680 -R-10 68 V8N820 -R-10 82 V8N101 -R-10 100 Tolerance code : : C : ±0.25pF D : ±0.50pF J : ±5% K : ±10% M : ±20% NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 7. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Visual No abnormal exterior appearance Visual inspection Insulation Resistance 10,000Mȍ or 500/Cȍ product whichever is smaller V < 500V, Rated Voltage V > 500V, Applied 500Vdc Charge Time: 60sec is applied less than 50mA current Within the specified tolerance Capacitance Class I : C < 100pF : Freq. = 1MHz±10%, Voltage = 1.0±0.2Vrms C > 100pF : Freq. = 1KHz±10% [Class I (N) & Class II] Class II : X : Freq. = 1KHz±10%, Voltage = 1.0±0.2Vrms Z/E : Freq. = 1KHz±10%, Voltage = 1.0±0.2Vrms Perform a heat temp. at 150±5°C for 30min. then place room temp. for 24±2hr Class I (N) : Q More than 30pF : Q > 1000 30pF & below : Q > 400+20C (C: Capacitance, pF) Tan į Class II (X) : 2.5% maximum Class II (Z/E) : 4.0% maximum Withstanding Voltage No dielectric breakdown or mechanical breakdown 200V < V < 500V : 200% rated voltage 500V < V < 1000V : 150% rated voltage 1000 < V : 120% rated voltage for 1-5sec. Current is limited to less than 50mA. * Withstanding voltage testing requires immersion of the element in a isolation fluid prevent arching on the chip surface, at voltage over 1000Vdc. Temperature Capacitance Coefficient Class I : [C2-C1/C1(T2-T1)] x 100% Class I : Char. N Temp. Range Cap. Change (%) -55°C ~ +125°C ±30ppm/°C Class II : Char. Adhesive Strength of Termination Temp. Range Cap. Change (%) X -55°C ~ +125°C ±15% E -30°C ~ +85°C +22% ~ -56% Z +10°C ~ +85°C +22% ~ -56% No indication of peeling shall occur on the terminal electrode Class II : (C2-C1)/C1 x 100% T1 : Standard temperature (25°C) T2 : Test temperature C1 : Capacitance at standard temperature (25°C) C2 : Capacitance at test temperature (T2) A 5N f pull force shall be applied for 10±1second 5N f Resistance to Flexure of Substrate Appearance : No mechanical damage shall be occur Bending shall be applied to the 1.0mm with 1.0mm/sec R230 N : < ±5.0% X : < ±12.5% E/Z : < ±30.0% C Meter 45±1mm 45±1mm Bending Limit C-Meter : Capacitance Change NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 7. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Solderability More than 90% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve Solder Temp. : 245±5°C Dip Time : 5±0.5sec Immersing Speed : 25±10% mm/s Solder : H63A Flux : Rosin Preheat : At 80~120°C for 10~30sec Resistance to Soldering Heat Appearance : No mechanical damage shall be occur Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Preheat : At 150±10°C for 60~120sec Dip : Solder Temp. of 260±5°C Dip Time : 10±1sec Immersing speed : 25±10% mm/s Solder : H63A Flux : Rosin Class I : Char. N Capacitance change Within ±2.5% or ±0.25pF whichever is larger of initial value Class II : Char. Capacitance change X Within ±10% Z/E Within ±20% Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Q(Class I), Tan į(Class II), Insulation Resistance & Withstand Voltage : To satisfy the specified initial value Temperature Cycle Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within ±2.5% or ±0.25pF whichever is larger of initial value Humidity Step Temp. (°C) Time (min) 1 Min. rated temp. +0/-3 30 2 3 4 Class II : Char. Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Capacitance change X/B Within ±7.5% Y/Z/E Within ±20% 25 Min. rated temp. +3/-0 25 3 30 3 Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Q(Class I), Tan į(Class II) & Insulation Resistance : To satisfy the specified initial value Solder the capacitor on P.C. board before testing Appearance : No mechanical damage shall be occur Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Temperature : 40±2°C Relative Humidity : 90~95% RH Test Time : 500 +12/-0 hr Class I : Char. N Capacitance change Within ±5.0% or ±0.5pF whichever is larger of initial value Class II : Char. Capacitance change X Within ±15% Z/E Within ±30% Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Solder the capacitor on P.C. board before testing NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 7. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE Q(Class I) : More than 30pF : Q > 350 30pF & below : Q > 275 +2.5xC Humidity Tan į (Class II) : Char. Maximum X 5.0% Z/E 5.0% Insulation Resistance : 1,000Mȍ or 50/C ȍ whichever is smaller. High Temperature Load Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within ±3.0% or ±0.3pF whichever is larger of initial value Class II : Char. Capacitance change X Within ±15% Z/E Within ±30% Q(Class I) : More than 30pF : Q > 350 30pF & below : Q > 275 +2.5xC Tan į (Class II) : Char. Maximum X 5.0% Z/E 5.0% TEST CONDITION Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Temperature : 40±2°C Relative Humidity : 90~95% RH Test Time : 500 +12/-0 hr Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Solder the capacitor on P.C. board before testing Class II capacitors applied DC voltage (following table) is applied for 1 hr at max. operation temp. ±3°C then shall be set for 48±4 hrs at room temp. and the initial measurement shall be conducted. Applied Voltage : Rated Voltage Applied Voltage V < 250Vdc 150% rated voltage Less than 1KVdc 120% rated voltage More than 1KVdc (include 1KV) 100% rated voltage Temp. : Max. operation temperature Test Time : 1000 +12/-0 hr Current Applied : 50mA max. Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Insulation Resistance : 1,000Mȍ or 50/C ȍ whichever is smaller. (C in Farad) Vibration Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within ±2.5% or ±0.25pF whichever is larger of initial value Solder the capacitor on P.C. board before testing Vibrate the capacitor with amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55 Hz and back to 10Hz in about 1min. Repeat this for 2 hrs each in 3 perpendicular directions Class II : Char. Capacitance change X Within ±7.5% Z/E Within ±20% Q(Class I), Tan į(Class II) & Insulation Resistance : To satisfy the specified initial value NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 8. SOLDERIND AND MOUNTING : 8-1 Re-flow Soldering : Preheat and gradual increase in temp. to the reflow temp. is recommended to decrease the potential of the thermal crack on the components. The recommended heating rate depends on the size of the component, however it should not exceed 3°C/sec. 8-2 Wave Soldering : Most of the components are wave soldered with solder at 230~250°C. Adequate care must be taken to prevent the potential of thermal cracks on the ceramic capacitors. Refer to Figure 2 for optimum soldering benefits. 8-3 Hand Soldering : Sudden temp. change in components, results in a temp. gradient, and therefore may cause internal thermal cracks in the components. In general a hand soldering method is not recommend unless proper preheating and handling practices have been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder iron. How to solder repair by solder iron : 1) Selection of soldering iron tip The required temp. of solder iron for any type of repair depends on the type of the tip, the substrate material, and the solder land size 2) recommended solder iron condition a) Preheat substrate to (60°C~120°C). b) 350°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt (max.) soldering iron with tip diameter of 3.0mm f) Limit soldering time to 5 secs. Preheating Soldering Natural cooling TEMPERATURE °C TEMPERATURE °C Cooling condition : Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temp. difference between the solvent and the chips must be less than 100°C. 260 217 Over 1min. Over 1min. Preheating 300 Natural cooling 250 230 200 Gradual Cooling Over 2mins. Over 1min 2-3secs. 70-90secs Figure 1. Re-flow Soldering TEMPERATURE °C Soldering Figure 2. Wave Soldering Preheating 350 Soldering Natural cooling 250 200 Within 5secs. Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 9. PACKAGING INFORMATION : 9-1. Reel Dimension W A C B E D TYPE A(mm) B(mm) C(mm) D(mm) E(mm) W(mm) V2 382 Max. 50 Min. 13±0.5 21±0.8 2.0±0.5 10±0.15 V3 382 Max. 50 Min. 13±0.5 21±0.8 2.0±0.5 10±0.15 V4 382 Max. 50 Min. 13±0.5 21±0.8 2.0±0.5 10±0.15 V5 382 Max. 50 Min. 13±0.5 21±0.8 2.0±0.5 10±0.15 V6 178±0.2 60±0.2 13±0.5 21±0.8 2.0±0.5 13±0.3 V7 178±0.2 60±0.2 13±0.5 21±0.8 2.0±0.5 13±0.3 V8 178±0.2 60±0.2 13±0.5 21±0.8 2.0±0.5 13±0.3 9-2. Tape Dimension 4.0±0.1 Ao(mm) Bo(mm) Ko(mm) P(mm) V2 1.1±0.2 1.9±0.2 1.1 MAX. 4.0±0.1 V3 1.5±0.2 2.3±0.2 1.1 MAX. 4.0±0.1 V4 1.9±0.2 3.5±0.2 1.1 MAX. 4.0±0.1 V5 2.9±0.2 3.6±0.2 1.1 MAX. 4.0±0.1 Ko Section A-A 4.0±0.1 Ø1.5 +0.1 -0 Ao TYPE Bo 8.0±0.3 P A 2.0±0.05 t A 1.5±0.1 P Ao Bo 12.0±0.3 A 5.5±0.05 1.75±0.1 2.0±0.05 A 3.5±0.05 1.75±0.1 Ø1.5 +0.1 -0 Ko TYPE Ao(mm) Bo(mm) Ko(mm) P(mm) t(mm) V6 2.5±0.2 4.9±0.2 4.0 MAX. 4.0±0.1 0.3 MAX. V7 3.6±0.2 4.9±0.2 4.0 MAX. 4.0±0.1 0.3 MAX. V8 5.4±0.2 6.1±0.2 4.0 MAX. 4.0±0.1 0.3 MAX. Section A-A NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 9-3. Packaging Quantity V2 / V3 V4 Tape Mat'l T<0.90mm T>0.90mm T<0.90mm 0.90mm<T<1.25mm T>1.25mm Paper 4000pcs/reel - 4000pcs/reel - - Plastic - 3000pcs/reel - 3000pcs/reel 2000pcs/reel V7 / V8 V5 / V6 Tape Mat'l T<1.25mm T>1.25mm T<2.20mm T>2.20mm Paper - - - - Plastic 3000pcs/reel 2000pcs/reel 1000pcs/reel 700pcs/reel T : Chip Thickness 9-4. Tearing Off Force F 165° to 180° Top cover tape The force for tearing off cover tape is 5 to 70 grams in the arrow direction under the following conditions. Base tape Storage Store the capacitors where the temp. and relative humidity do not exceed 40°C and 70%RH. Capacitors are recommended to be used within 6 months from the date of manufacturing. Store the products in the original package and do not open the outer wrapped, polyethylene bag, till just before usage. If is open, seal it as soon as possible or keep it in a desiccant with a desiccation agent. NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9