ST Series Soft Termination Multilayer Ceramic Chip Capacitors MERITEK RoHS FEATURES • • • • • • • Wide capacitance range in a given size High performance to withstanding 5mm of substrate bending test guarantee Reduction in PCB bend failure Lead free terminations High reliability and stability RoHS compliant HALOGEN compliant APPLICATIONS • • • • • High flexure stress circuit board DC to DC converter High voltage coupling/DC blocking Back-lighting inverters Snubbers in high frequency power convertors PART NUMBER SYSTEM ST 0805 XR 104 K 101 MERITEK Multilayer Ceramic Chip Capacitors supplied in bulk or tape & reel package are ideally suitable for thick-film hybrid circuits and automatic surface mounting on any printed circuit boards, All of MERITEK's MLCC products meet RoHS directive. ST series use a special material between nickel-barrier and ceramic body. It provides excellent performance to against bending stress occurred during process and provide more security for PCB process. The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature. DIMENSION Meritek Series Size 0603 0805 1206 1210 1812 1825 2220 2225 Dielectric Code XR X7R CG COG(NPO) Capacitance Code pF nF uF 8R2 8.2 --- 101 100 0.1 -- 223 22000 22 0.022 104 100000 100 0.1 Tolerance Code B F K Tolerance ±0.1pF ±1% ±10% Code C G M Tolerance ±0.25pF ±2% ±20% Code D J Tolerance ±0.5pF ±5% Rated Voltage – 2 significant digits + number of zeros. Code 101 201 251 501 631 100Vdc 200Vdc 250Vdc 500Vdc 630Vdc Size Inch (mm) 0603(1608) 0805(2012) 1206(3216) 1210(3225) 1812(4532) 1825(4563) 2220(5750) 2225(5763) L(mm) 1.6±0.2 2.1±0.2 3.3±0.3 3.3±0.4 4.5±0.4 4.6±0.3 5.7±0.4 5.7±0.4 W(mm) 0.8±0.15 1.25±0.2 1.6±0.2 2.5±0.4 3.2±0.3 6.3±0.4 5.0±0.4 6.3±0.4 Tmax(mm) 0.95 1.45 1.80 2.90 2.80 2.80 2.80 2.80 MB min (mm) 0.20 0.30 0.30 0.30 0.26 0.26 0.30 0.30 Rev.7 GENERAL ELECTRICAL DATA Item Characteristic Dielectric NPO X7R Size 1206 0603,0805,1206,1210,1808,1812,1825,2 220,2225 1.5pF to 220pF 100pF to 4.7uF Capacitance range* Capacitance tolerance C: ±0.25pF @cap≤5pF D: ±0.5pF @5pF≤cap≤10pF J: ±5%, K: ±10% @cap≥10pF Rated voltage (WVDC) J: ±5%,K: ±10%,M: ±20% 100V, 200V, 250V, 500V, 630V Q ≤ 2.5% Tan δ* Q < 400+20C @cap<30pF Q ≥ 1000 @cap≥30pF Insulation resistance at Ur** ≥10GΩ or RxC ≥100Ω-F whichever is smaller @Ur=100~630V ≥10GΩ @Ur=1000~3000V Operating temperature Capacitance characteristic ≥10GΩ or RxC ≥500Ω-F whichever is smaller -55 to +125°C ±30ppm Termination ±15% Cu(or Ag)/Ni/Sn (lead-free termination) *Measured at the condition of 30%~70% related humidity. NPO: Apply 1.0±0.2Vrms, 1.0MHz±10% for cap ≤ 1000pF and 1.0±0.2Vrms, 1.0kHz±10% for cap>1000pF, 25°C at ambient temperature X7R: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 25°C ambient temperature **Measured at 500VDC for 60sec, for Ur > 500VDC STRUCTURE Meritek ST series is added a special termination material ( Ultra-Buffer or Anti-Bend) between ceramic body and Ni-barrier that can absorb mechanical stress to prevent bending crack occured. 100% Sn External Termination 100% Sn External Termination Ni-Barrier Ultra-Buffer Inner Electrode Cu or Ag Termination Rev.7 ST Series Soft Termination Multilayer Ceramic Chip Capacitors MERITEK RoHS Capacitance CAPACITANCE RANGE DIELECTRIC SIZE RATED VOLTAGE (VDC) 0.5pF (0R5) 1.0pF (1R0) 1.2pF (1R2) 1.5pF (1R5) 1.8pF (1R8) 2.2pF (2R2) 2.7pF (2R7) 3.3pF (3R3) 3.9pF (3R9) 4.7pF (4R7) 5.6pF (5R6) 6.8pF (6R8) 8.2pF (8R2) 10pF (100) 12pF (120) 15pF (150) 18pF (180) 22pF (220) 27pF (270) 33pF (330) 39pF (390) 47pF (470) 56pF (560) 68pF (680) 82pF (820) 100pF (101) 120pF (121) 150pF (151) 180pF (181) 220pF (221) 270pF (271) 330pF (331) 390pF (391) 470pF (471) 560pF (561) 680pF (681) 820pF (821) 1,000pF (102) 1,200pF (122) 1,500pF (152) 1,800pF (182) 2,200pF (222) 2,700pF (272) 3,300pF (332) 3,900pF (392) 4,700pF (472) 5,600pF (562) 6,800pF (682) 8,200pF (822) 100 200 NP0 1206 250 500 630 Rev.7 ST Series Soft Termination Multilayer Ceramic Chip Capacitors MERITEK RoHS DIELECTRIC SIZE RATED VOLTAGE (VDC) 100 100pF (101) 0603 200 250 100 0805 200 250 X7R 500 100 200 1206 250 500 630 100 200 1210 250 500 Capacitance 120pF (121) 150pF (151) 180pF (181) 220pF (221) 270pF (271) 330pF (331) 390pF (391) 470pF (471) 560pF (561) 680pF (681) 820pF (821) 1,000pF (102) 1,200pF 1,500pF 1,800pF 2,200pF 2,700pF 3,300pF 3,900pF 4,700pF 5,600pF 6,800pF 8,200pF 0.010µF (122) (152) (182) (222) (272) (332) (392) (472) (562) (682) (822) (103) 0.012µF 0.015µF 0.018µF 0.022µF 0.027µF 0.033µF 0.039µF 0.047µF 0.056µF 0.068µF 0.082µF 0.10µF (123) (153) (183) (223) (273) (333) (393) (473) (563) (683) (823) (104) 0.12µF 0.15µF 0.18µF 0.22µF 0.27µF 0.33µF 0.39µF 0.47µF 0.56µF 0.68µF 0.82µF 1.00µF 1.20µF 1.50µF 1.80µF 2.20µF (124) (154) (184) (224) (274) (334) (394) (474) (564) (684) (824) (105) (125) (155) (185) (225) Rev.7 630 ST Series Soft Termination Multilayer Ceramic Chip Capacitors MERITEK RoHS 1812 200 250 500 630 100 1825 200 250 500 X7R 630 100 200 2220 250 500 630 100 200 2225 250 500 Capacitance DIELECTRIC SIZE RATED VOLTAGE 100 (VDC) 100pF (101) 120pF (121) 150pF (151) 180pF (181) 220pF (221) 270pF (271) 330pF (331) 390pF (391) 470pF (471) 560pF (561) 680pF (681) 820pF (821) 1,000pF (102) 1,200pF (122) 1,500pF (152) 1,800pF (182) 2,200pF (222) 2,700pF (272) 3,300pF (332) 3,900pF (392) 4,700pF (472) 5,600pF (562) 6,800pF (682) 8,200pF (822) 0.010µF (103) 0.012µF (123) 0.015µF (153) 0.018µF (183) 0.022µF (223) 0.027µF (273) 0.033µF (333) 0.039µF (393) 0.047µF (473) 0.056µF (563) 0.068µF (683) 0.082µF (823) 0.10µF (104) 0.12µF (124) 0.15µF (154) 0.18µF (184) 0.22µF (224) 0.27µF (274) 0.33µF (334) 0.39µF (394) 0.47µF (474) 0.56µF (564) 0.68µF (684) 0.82µF (824) 1.0µF (105) 1.2µF (125) 1.5µF (155) 1.8µF (185) 2.2µF (225) 2.7µF (275) 3.3µF (335) 3.9µF (395) 4.7µF (475) Rev.7 630 ST Series Soft Termination Multilayer Ceramic Chip Capacitors MERITEK RoHS PACKAGE DIMENSION AND QUANTITY Size 0603 (1608) 0805 (2012) 1206 (3216) 1210 (3225) 1812 (4532) 1825 (4563) 2220 (5750) 2225 (5763) Thickness (mm) 0.80+0.15/-0.10 0.80+0.15/-0.10 1.25±0.10 1.25±0.20 0.80±0.10 0.95±0.10 1.25±0.10 1.60±0.20 0.95±0.10 1.25±0.10 1.60±0.20 2.00±0.20 2.50±0.40 1.25±0.10 1.60±0.20 2.00±0.20 2.50±0.30 1.60±0.20 2.00±0.20 2.50±0.30 1.60±0.20 2.00±0.20 2.50±0.30 2.00±0.20 2.50±0.30 7” reel 4k 4k 4k - Paper tape 13” reel 15k 15k 15k - 7” reel 3k 3k 3k 3k 2k 3k 3k 2k 1k 1k 1k 1k 1k 0.5k 1k 1k 0.5k 1k 1k 0.5k 1k 0.5k Plastic tape 13” reel 10k 10k 10k 10k 10k 3k - Unit: pieces Size Reel size C W1 A N 0603, 0805, 1206, 1210 7” 10” 13” 13.0+0.5/-0.2 13.0+0.5/-0.2 13.0+0.5/-0.2 8.4+1.5/-0 8.4+1.5/-0 8.4+1.5/-0 178.0±0.10 250.0±1.0 330.0±1.0 60.0±1.0/-0 100.0±1.0 100±1.0 1812,1825 ,2220 ,2225 7” 13.0+0.5/-0.2 12.4+2.0/-0 178.0±0.10 80.0±1.0 Fig. 4 The dimension of reel Rev.7 ST Series Soft Termination Multilayer Ceramic Chip Capacitors MERITEK RoHS CARDBOARD TAPE DIMESIO16 EMBOSSED TAPE DIMENSIONS Fig. 2 The dimension of paper tape Fig. 3 The dimension of plastic tape Size 0603 0805 Chip 0.80+0.15/-0.10 0.80+0.15/-0.10 Thickness 1206 1210 1.25±0.10 1.25±0.20 0.80±0.10 0.95± ±0.10 1.25± ±0.10 1.60± ±0.20 0.95± ±0.10 1.25± ±0.10 1.60± ±0.20 2.00± ±0.20 2.50± ±0.40 <3.10 A0 1.02+0.05/-0.10 1.50±0.10 <1.65 2.00±0.10 <2.00 <2.00 <3.05 B0 1.80±0.10 2.30±0.10 <2.40 3.50±0.10 <3.60 <3.70 <3.80 <4.00 T 0.97±0.05 0.95±0.05 0.23±0.05 0.95±0.05 0.23±0.05 0.23±0.05 0.23±0.05 0.23±0.05 K0 - - <2.50 - <2.50 <2.50 <2.50 <3.50 W 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 P0 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.100 4.00±0.10 10xP0 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 P1 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 P2 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 D0 1.55±0.05 1.55±0.05 1.50±0.10/-0 1.55±0.05 1.50±0.10/-0 1.50±0.10/-0 1.50±0.10/-0 1.50±0.10/-0 D1 - - 1.00±0.10 - 1.00±0.10 1.00±0.10 1.00±0.10 1.00±0.10 E 1.75±0.05 1.75±0.05 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 1.75±0.10 F 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 3.50±0.05 Size 1812 1825 2220 2225 Chip Thickness 1.25± ±0.10 1.60± ±0.20 2.00± ±0.20 2.50± ±0.30 1.60± ±0.20 2.00± ±0.20 2.50± ±0.30 1.60± ±0.20 2.00± ±0.20 2.50± ±0.30 2.00± ±0.20 2.50± ±0.30 A0 <3.90 <3.90 <6.80 <6.80 <5.80 <5.80 <6.80 <6.80 B0 <5.30 <5.30 <5.30 <5.30 <6.50 <6.50 <6.50 <6.50 T 0.25±0.05 0.25±0.05 0.30±0.10 0.30±0.10 0.30±0.10 0.30±0.10 0.30±0.10 0.30±0.10 K0 <2.50 <3.00 <2.50 <3.10 <2.50 <3.10 <2.50 <3.10 W 12.0±0.20 12.0±0.20 12.0±0.20 12.0±0.20 12.0±0.20 12.0±0.20 12.0±0.20 12.0±0.20 P0 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 4.00±0.10 10xP0 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 40.00±0.20 P1 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 8.00±0.10 P2 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 2.00±0.05 D0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 D1 1.50±0.10 1.50+/-0.10 1.50±0.10 1.50±0.10 1.50±0.10 1.50±0.10 1.50±0.10 1.50±0.10 E 1.75±0.10 1.75+/-0.1 1.75±0.1 1.75±0.10 1.75±0.1 1.75±0.10 1.75±0.10 1.75±0.10 F 5.50±0.05 5.50+/-0.05 5.50±0.05 5.50±0.05 5.50±0.05 5.50±0.05 5.50±0.05 5.50±0.05 Rev.7 ST Series Soft Termination Multilayer Ceramic Chip Capacitors MERITEK RoHS APPLICATION NOTES STORAGE To prevent the damage of solderability of terminations, the following storage conditions are recommended: Indoors under 5 ~ 40℃ and 20% ~ 70% RH. No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine. Packaging should not be opened until the capacitors are required for use. If opened, the pack should be re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might promote deterioration in tape or adhesion performance. The capacitors should be used within 6 months and checked the solderability before use. HANDLING Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination or damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual placement. Tape and reeled packages are suitable for automatic pick and placement machine. PREHEAT In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required. The rate of preheat should not exceed 4℃ per second and the final preheat temperature should be within 100℃ of the soldering temperature for small chips such as 0603, 0805 and 1206, within 50℃ of the soldering temperature for bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc. SOLDERING Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between solder, chips, and substrate. Hand soldering with temperature-controlled iron not exceeding 30 watts and diameter of tip less than 1.2 mm is recommended, tip of iron should not contact the ceramic body directly, and the temperature of iron should be set to not more than 260℃. For bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc. wave soldering and hand soldering are no recommended. Recommended soldering profiles as following: (℃) 200 soldering preheat cooling ΔT 100 COOLING 60 sec. t 120 sec. Soldering Reflow Wave Solder Temp.(T) 235 – 260 ℃ 230 – 260 ℃ Soldering Time (t) < 15 sec. < 5 sec. Chip Size 0603, 0805, 1206 1210, 1808, 1812, 1825, 2220, 2225 ΔT 100 ℃ 50 ℃ After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is recommended to minimize stress in the solder joint. A cooling rate not exceeding 4℃ per second should be used when forced cooling is necessary. CLEANING All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate contamination that could cause electrolytic surface corrosion. Good results can be obtained by using ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove flux residues and contamination from under the chips is very important. Rev.7 ST Series Soft Termination Multilayer Ceramic Chip Capacitors MERITEK RoHS RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. Item 1. Visual and Mechanical Test Condition --- 2. Capacitance Class I: (NP0) Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10% 3. Q/ D.F. (Dissipation Cap>1000pF, 1.0±0.2Vrms, 1KHz±10% Class II: (X7R) Factor) 1.0±0.2Vrms, 1kHz±10% 4. Temperature With no electrical load. T.C. Operating Temp Coefficient NP0 -55~125°C at 25°C -55~125°C at 25°C X7R 5. Insulation Resistance UR=100V: To apply voltage at UR for max. 120 sec. UR>100V: To apply voltage at UR (500V max.) for 60 sec. 6. Dielectric Strength * To apply voltage: 100V =2.5 times of UR 200V/250V =2 times of UR 500V =1.5 times of UR > 500V =1.2 times of UR * Duration: 1 to 5 sec. Requirements * No remarkable defect. * Dimensions to conform to individual specification sheet. * Shall not exceed the limits given in the detailed spec. NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C X7R: ≤2.5% T.C. NPO X7R Capacitance Change Within ±30ppm/°C Within ±15% Class I (NP0) Class II (X7R) : ≥100GΩ or RxC≥1000Ω-F whichever is smaller. : ≥10GΩ or RxC≥500Ω-F whichever is smaller. * No evidence of damage or flashover during test. 7. Solderability * Solder temperature: 235±5°C * Dipping time: 2±0.5 sec. NPO:95% min. coverage of all metalized area. X7R:75% min. coverage of all metalized area. 8. Resistance * Solder temperature: 260±5°C to Soldering * Dipping time: 10±1 sec Heat * Preheating: 120 to 150°C for 1 minute before immerse the capacitor in a eutectic solder. * Before initial measurement : Perform 150+0/-10°C for 1 hr and then set for 48±4 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2hrs (Class I) or 48±4 hrs (Class II) * No remarkable damage. * Cap change: NP0: within ±2.5% or ±0.25pF whichever is larger. * Q/D.F., I.R. and dielectric strength: To meet initial requirements. X7R: within ±15% * 25% max. leaching on each edge. 9. Temperature * Conduct the five cycles according to the Cycle temperatures and time. Step Temp. (°C) Time (min.) 1 Min. operating temp. +0/-3 30±3 2 Room temp. 2~3 3 Max. operating temp. +3/-0 30±3 4 Room temp. 2~3 * Before initial measurement : Perform 150+0/-10°C for 1 hr and then set for 48±4 hrs at room temp. * Measurement to be made after keeping at room temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II) * No remarkable damage. * Cap change： NP0: within ±2.5％ or ±0.25pF whichever is larger. X7R: within ±15% 10. Humidity * Test temp.: 40±2°C (Damp Heat) * Humidity: 90~95% RH Steady State * Test time: 500+24/-0hrs. * Measurement to be made after keeping at room temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II) * No remarkable damage. * Cap change: NP0: within ±5.0% or ±0.5pF whichever is larger. X7R :within ±15% * Q/D.F.: X7R: ≤1.5 × Initial requirement * I.R.≥ 0.25 × initial requirements. Q/D.F Value: NP0: Cap≥30pF, Q≥350; 10pF≤Cap<30pF, Q≥275+2.5C Cap<10pF; Q≥200+10C X7R: ≤7.0% * I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller. Rev.7 ST Series Soft Termination Multilayer Ceramic Chip Capacitors MERITEK RoHS No. 11. Item Test Condition Humidity (Damp Heat) Load * Test temp.: 40±2°C * Humidity: 90~95%RH * Test time: 500+24/-0 hrs. * To apply voltage：rated voltage (Max. 500V) * Measurement to be made after keeping at room temp. for 24±2 hrs. (Class I). 12. Vibration Resistance Requirements * No remarkable damage. * Cap change: NP0: within ±7.5% or ±0.75pF whichever is larger. * Q/D.F. value: NP0: Cap≥30pF, Q≥200; Cap<30pF, Q≥100+10/3C * I.R.: ≥500MΩ or RxC≥25Ω-F whichever is smaller. * Vibration frequency: 10~55 Hz/min. * No remarkable damage. * Total amplitude: 1.5mm * Cap change and Q/D.F.: To meet initial spec. * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) 13. High * Test temp.: Temperature 125±3°C Load * To apply voltage: (Endurance) (1) UR≤ 250V: 200% of rated voltage. Exception item: To apply 150% of rated voltage UR Size Cap. Range 1206 100V > 224 1210 200V / 250V 1210 > 224 1812 > 474 1825 > 105 2220 > 105 2225 > 105 * No remarkable damage. * Cap change: NP0: within ±3.0% or ±0.3pF whichever is larger. X7R :within ±15% * Q/D.F Value: NP0: Cap≥30pF, Q≥350 10pF≤Cap<30pF, Q≥275+2.5C Cap<10pF, Q≥200+10C X7R: ≤7.0% * I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller. (2) 250 < UR ≤500V: 150% of rated voltage. (3) UR > 500V: 120% of rated voltage. * Test time: 1000+24/-0 hrs. * Measurement to be made after keeping at room temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II) 14. Resistance * The middle part of substrate shall be pressurized by * No remarkable damage. to Flexure of means of the pressurizing rod at a rate of about 1mm * Cap change: X7R: within ±10% Substrate per second until the deflection becomes 5mm. 20 (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the R = 230 test.) 50 5mm 45±1 15. Adhesive Strength of Termination 45±1 * Capacitors mounted on a substrate. A force of 10N * No remarkable damage or removal of the terminations. applied perpendicular to the place of substrate and parallel the line joining the center of terminations for 10±1 second. 10N PC Board Capacitor Rev.7