MCP131X/2X Voltage Supervisor Features: Package Types SOT-23-5 • Low Supply Current: 1 µA (Typical),10 µA (Max.) • Precision Monitoring Trip Point Options: - 2.9V and 4.6V (Standard Offerings) - 2.0V to 4.7V in 100 mV Increments, (Contact the local Microchip Sales Office) • Resets Microcontroller in a Power-loss Event • Reset Delay Time-Out Option: - 1.4 ms, 30 ms, 200 ms, or 1.6s (Typical) • Watchdog Timer Input Time-Out Options: - 6.3 ms, 102 ms, 1.6s, or 25.6s (Typical) • Manual Reset (MR) Input (Active-low) • Single and Complementary Reset Output(s) • Reset Output Options: - Push-Pull (Active-high or Active-low) - Open-Drain (Internal or External Pull-up) • Temperature Range: - -40°C to +85°C for Trip Points 2.0 to 2.4V and, - -40°C to + 125°C for Trip Points > 2.5V • Voltage Range: 1.0V to 5.5V • Lead Free Packaging MCP1316/16M/20 RST 1 VSS 2 MR 3 MCP1317 VDD 5 4 WDI MCP1318/18M/21 RST 1 VSS 2 RST 3 4 1 VSS 2 MR 3 5 VDD 4 WDI MCP1319/19M/22 VDD 5 RST WDI RST 1 VSS 2 RST 3 5 VDD 4 MR Block Diagram VDD Comparator + RST – Output Driver Reference Voltage RST Description: MR The MCP131X/2X are voltage supervisor devices designed to keep a microcontroller in Reset until the system voltage has reached and stabilized at the proper level for reliable system operation. The table below shows the available features for these devices. Noise Filter VSS WDI Watchdog Note: Features available depend on the device. Device Features Reset Output A Device Type MCP1316 Push-Pull MCP1316M Open-Drain MCP1317 Pull-up Resistor Reset Output B Active Level Type Pull-up Resistor Active Level WDI Input MR Input — Low — — — Yes Yes Internal Low — — — Yes Yes Push-Pull — High — — — Yes Yes MCP1318 Push-Pull — Low Push-Pull — High Yes No MCP1318M Open-Drain Internal Low Push-Pull — High Yes No MCP1319 Push-Pull — Low Push-Pull — High No Yes MCP1319M Open-Drain Internal Low Push-Pull — High No Yes MCP1320 Open-Drain External Low — — — Yes Yes MCP1321 Open-Drain External Low Push-Pull — High Yes No MCP1322 Open-Drain External Low Push-Pull — High No Yes 2005-2012 Microchip Technology Inc. DS21985D-page 1 MCP131X/2X NOTES: DS21985D-page 2 2005-2012 Microchip Technology Inc. MCP131X/2X 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Supply Voltage (VDD to VSS) . . . . . . . . . . . . . . . . . . . . . . 7.0V † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Voltage on all inputs and outputs, except Open-Drain RST (with no internal pull-up resistor), w.r.t. VSS . .-0.6V to (VDD + 1.0V) Voltage on Open-Drain RST (with no internal pull-up resistor) w.r.t. VSS . . -0.6V to 13.5V Storage temperature . . . . . . . . . . . . . . . . . . .-65°C to +150°C Ambient temp. with power applied . . . . . . . .-40°C to +125°C Maximum Junction temp. with power applied . . . . . . . +150°C Power Dissipation (TA +70°C): 5-Pin SOT-23A .......................................................240 mW ESD protection on all pins 4 kV DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Operating Voltage Range VDD 1.0 — 5.5 V Specified VDD Value to VOUT Low VDD 1.0 — — V I RST = 10 µA, V RST < 0.3V Operating Current: IDD — 5 10 µA Watchdog Timer Active — 1 2 µA Watchdog Timer Inactive — 1 2 µA VDD < VTRIP — 5 10 µA Reset Delay Timer Active Note 1: 2: 3: 4: 5: 6: Trip point is ±1.5% from typical value. Trip point is ±2.5% from typical value. Hysteresis is minimum = 1%, maximum = 6% at +25°C. This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request. 2005-2012 Microchip Technology Inc. DS21985D-page 3 MCP131X/2X DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C. Parameters VDD Trip Point Note 1: 2: 3: 4: 5: 6: Sym Min Typ Max Units VTRIP 1.970 2.00 2.030 V TA = +25°C (Note 1) (Note 6) 1.950 2.00 2.050 V TA = -40°C to +85°C (Note 2) MCP13XX-21 2.069 2.10 2.132 V TA = +25°C (Note 1) (Note 6) 2.048 2.10 2.153 V TA = -40°C to +85°C (Note 2) MCP13XX-22 2.167 2.20 2.233 V TA = +25°C (Note 1) (Note 6) 2.145 2.20 2.255 V TA = -40°C to +85°C (Note 2) MCP13XX-23 2.266 2.30 2.335 V TA = +25°C (Note 1) (Note 6) 2.243 2.30 2.358 V TA = -40°C to +85°C (Note 2) MCP13XX-24 2.364 2.40 2.436 V TA = +25°C (Note 1) (Note 6) 2.340 2.40 2.460 V TA = -40°C to +85°C (Note 2) MCP13XX-25 2.463 2.50 2.538 V TA = +25°C (Note 1) (Note 6) 2.438 2.50 2.563 V TA = -40°C to +125°C (Note 2) MCP13XX-26 2.561 2.60 2.639 V TA = +25°C (Note 1) (Note 6) 2.535 2.60 2.665 V TA = -40°C to +125°C (Note 2) MCP13XX-27 2.660 2.70 2.741 V TA = +25°C (Note 1) (Note 6) 2.633 2.70 2.768 V TA = -40°C to +125°C (Note 2) MCP13XX-28 2.758 2.80 2.842 V TA = +25°C (Note 1) (Note 6) 2.730 2.80 2.870 V TA = -40°C to +125°C (Note 2) MCP13XX-29 2.857 2.90 2.944 V TA = +25°C (Note 1) 2.828 2.90 2.973 V TA = -40°C to +125°C (Note 2) MCP13XX-30 2.955 3.00 3.045 V TA = +25°C (Note 1) (Note 6) 2.925 3.00 3.075 V TA = -40°C to +125°C (Note 2) MCP13XX-31 3.054 3.10 3.147 V TA = +25°C (Note 1) (Note 6) 3.023 3.10 3.178 V TA = -40°C to +125°C (Note 2) MCP13XX-32 3.152 3.20 3.248 V TA = +25°C (Note 1) (Note 6) 3.120 3.20 3.280 V TA = -40°C to +125°C (Note 2) MCP13XX-33 3.251 3.30 3.350 V TA = +25°C (Note 1) (Note 6) 3.218 3.30 3.383 V TA = -40°C to +125°C (Note 2) MCP13XX-20 Conditions Trip point is ±1.5% from typical value. Trip point is ±2.5% from typical value. Hysteresis is minimum = 1%, maximum = 6% at +25°C. This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request. DS21985D-page 4 2005-2012 Microchip Technology Inc. MCP131X/2X DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C. Parameters VDD Trip Point (Con’t) Sym Min Typ Max Units VTRIP 3.349 3.40 3.451 V TA = +25°C (Note 1) (Note 6) 3.315 3.40 3.385 V TA = -40°C to +125°C (Note 2) MCP13XX-35 3.448 3.50 3.553 V TA = +25°C (Note 1) (Note 6) 3.413 3.50 3.588 V TA = -40°C to +125°C (Note 2) MCP13XX-36 3.546 3.60 3.654 V TA = +25°C (Note 1) (Note 6) 3.510 3.60 3.690 V TA = -40°C to +125°C (Note 2) MCP13XX-37 3.645 3.70 3.756 V TA = +25°C (Note 1) (Note 6) 3.608 3.70 3.793 V TA = -40°C to +125°C (Note 2) MCP13XX-38 3.743 3.80 3.857 V TA = +25°C (Note 1) (Note 6) 3.705 3.80 3.895 V TA = -40°C to +125°C (Note 2) MCP13XX-39 3.842 3.90 3.959 V TA = +25°C (Note 1) (Note 6) 3.803 3.90 3.998 V TA = -40°C to +125°C (Note 2) MCP13XX-40 3.940 4.00 4.060 V TA = +25°C (Note 1) (Note 6) 3.900 4.00 4.100 V TA = -40°C to +125°C (Note 2) MCP13XX-41 4.039 4.10 4.162 V TA = +25°C (Note 1) (Note 6) 3.998 4.10 4.203 V TA = -40°C to +125°C (Note 2) MCP13XX-42 4.137 4.20 4.263 V TA = +25°C (Note 1) (Note 6) 4.095 4.20 4.305 V TA = -40°C to +125°C (Note 2) MCP13XX-43 4.236 4.30 4.365 V TA = +25°C (Note 1) (Note 6) 4.193 4.30 4.408 V TA = -40°C to +125°C (Note 2) MCP13XX-44 4.334 4.40 4.466 V TA = +25°C (Note 1) (Note 6) 4.290 4.40 4.510 V TA = -40°C to +125°C (Note 2) MCP13XX-45 4.433 4.50 4.568 V TA = +25°C (Note 1) (Note 6) 4.388 4.50 4.613 V TA = -40°C to +125°C (Note 2) MCP13XX-46 4.531 4.60 4.669 V TA = +25°C (Note 1) 4.485 4.60 4.715 V TA = -40°C to +125°C (Note 2) MCP13XX-47 4.630 4.70 4.771 V TA = +25°C (Note 1) (Note 6) 4.583 4.70 4.818 V TA = -40°C to +125°C (Note 2) — ±40 — ppm/°C MCP13XX-34 VDD Trip Point Tempco Note 1: 2: 3: 4: 5: 6: TTPCO Conditions Trip point is ±1.5% from typical value. Trip point is ±2.5% from typical value. Hysteresis is minimum = 1%, maximum = 6% at +25°C. This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request. 2005-2012 Microchip Technology Inc. DS21985D-page 5 MCP131X/2X DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C. Parameters Threshold Hysteresis Note 3) MCP13XX-20 Sym Min Typ Max Units VHYS 0.020 — 0.120 V TA = +25°C (Note 3) V TA = -40°C to +85°C V TA = +25°C (Note 3) V TA = -40°C to +85°C V TA = +25°C (Note 3) V TA = -40°C to +85°C V TA = +25°C (Note 3) V TA = -40°C to +85°C V TA = +25°C (Note 3) V TA = -40°C to +85°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C (Note 6) MCP13XX-21 (Note 6) 0.021 (Note 6) MCP13XX-22 0.022 0.023 0.024 0.025 0.026 0.027 0.144 — 0.150 — 0.156 — 0.162 (Note 6) 0.028 (Note 6) MCP13XX-29 — (Note 6) (Note 6) MCP13XX-28 0.138 (Note 6) (Note 6) MCP13XX-27 — (Note 6) (Note 6) MCP13XX-26 0.132 (Note 6) (Note 6) MCP13XX-25 — (Note 6) (Note 6) MCP13XX-24 0.126 (Note 6) (Note 6) MCP13XX-23 — — 0.168 (Note 6) 0.029 — 0.174 (Note 6) MCP13XX-30 0.030 (Note 6) MCP13XX-31 0.031 (Note 6) Note 1: 2: 3: 4: 5: 6: — 0.186 (Note 6) 0.032 (Note 6) MCP13XX-33 0.180 (Note 6) (Note 6) MCP13XX-32 — — 0.192 (Note 6) 0.033 — (Note 6) 0.198 Conditions Trip point is ±1.5% from typical value. Trip point is ±2.5% from typical value. Hysteresis is minimum = 1%, maximum = 6% at +25°C. This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request. DS21985D-page 6 2005-2012 Microchip Technology Inc. MCP131X/2X DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C. Parameters Threshold Hysteresis MCP13XX-34 (Continued) Note 3) (Note 6) MCP13XX-35 Sym Min Typ Max Units VHYS 0.034 — 0.204 V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 1) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C V TA = +25°C (Note 3) V TA = -40°C to +125°C (Note 6) 0.035 (Note 6) MCP13XX-36 0.036 0.037 0.038 0.039 0.040 0.041 0.042 0.043 0.044 — 0.240 — 0.246 — 0.252 — 0.258 — 0.264 (Note 6) 0.045 (Note 6) MCP13XX-46 0.234 (Note 6) (Note 6) MCP13XX-45 — (Note 6) (Note 6) MCP13XX-44 0.228 (Note 6) (Note 6) MCP13XX-43 — (Note 6) (Note 6) MCP13XX-42 0.222 (Note 6) (Note 6) MCP13XX-41 — (Note 6) (Note 6) MCP13XX-40 0.216 (Note 6) (Note 6) MCP13XX-39 — (Note 6) (Note 6) MCP13XX-38 0.210 (Note 6) (Note 6) MCP13XX-37 — — 0.270 (Note 6) 0.046 — 0.276 (Note 6) MCP13XX-47 (Note 6) Note 1: 2: 3: 4: 5: 6: 0.047 — (Note 6) 0.282 Conditions Trip point is ±1.5% from typical value. Trip point is ±2.5% from typical value. Hysteresis is minimum = 1%, maximum = 6% at +25°C. This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request. 2005-2012 Microchip Technology Inc. DS21985D-page 7 MCP131X/2X DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C. Parameters RST/RST Low-Level Output Voltage RST/RST High-Level Output Voltage Sym Min Typ Max Units Conditions VOL — — 0.3 V IOL = 50 µA, 1.0V VDD 1.5V — — 0.3 V IOL = 100 µA, 1.5V VDD 2.5V — — 0.3 V IOL = 2 mA, 2.5V VDD 4.5V — — 0.3 V IOL = 4 mA, VDD 4.5V VDD – 0.7 — — V IOH = 2.5 mA, VDD 2.5V VDD – 0.7 — — V IOH = 500 µA, VDD 1.5V VOH (Push-Pull Outputs only) Input Low Voltage (MR and WDI pins) VIL VSS — 0.3VDD V Input High Voltage (MR and WDI pins) VIH 0.7 VDD — VDD V V Open-Drain Output pin only, VDD = 3.0V, Time voltage > 5.5V applied 100 s, current into pin limited to 2 mA, +25°C operation recommended (Note 4, Note 5) VSS VPIN VDD VODH — — 13.5 (4) Input Leakage Current (MR and WDI) IIL — — ±1 µA Open-Drain Output Leakage Current (MCP1316M, MCP1318M, MCP1319M, MCP1320, MCP1321, and MCP1322 only) IOD — 0.003 1.0 µA RPU — 52 — k VDD = 5.5V WDI pin — 52 — k VDD = 5.5V RST pin — 4.7 — k VDD = 5.5V, MCP131XM devices only Open-Drain High Voltage on Output (Note 4) Pull-up Resistance MR pin Input Pin Capacitance (MR and WDI) CI — 100 — pF Output Pin Capacitive Loading (RST and RST) CO — — 50 pF Note 1: 2: 3: 4: 5: 6: This is the tester loading to meet the AC timing specifications. Trip point is ±1.5% from typical value. Trip point is ±2.5% from typical value. Hysteresis is minimum = 1%, maximum = 6% at +25°C. This specification allows this device to be used in PIC® microcontroller applications that require the InCircuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). The total time that the RST pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information, refer to Figure 2-35. This parameter is established by characterization and is not 100% tested. Custom ordered voltage trip point; minimum order volume requirement. Information available upon request. DS21985D-page 8 2005-2012 Microchip Technology Inc. MCP131X/2X VTRIPMAX VTRIPAC + VHYS VTRIPMIN VDD tRST 1V tRR tRST tRPD VTRIP RST RST VDD < 1V is outside the device operating specification. The RST (or RST) output state is unknown while VDD < 1V. FIGURE 1-1: TABLE 1-1: Device Voltage and Reset Pin Waveforms. DEVICE VOLTAGE AND RESET PIN TIMINGS Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Falling VDD Trip Point Detected to RST or RST Active tRPD — 650 — µs VDD ramped from VTRIPMAX + 250 mV down to VTRIPMIN – 200 mV, VDD falling @ 5 mV/µs, CL = 50 pF (Note 1) VDD Rise Rate tRR Reset active time (MR Rising Edge, POR/BOR Inactive, or WDT time out) to RST/RST Inactive tRST RST Rise Time after RST Active (Push-Pull Outputs only) tRT RST Rise Time after RST Inactive (Push-Pull Outputs only) RST Fall Time after RST Inactive RST Fall Time after RST Active Note 1: 2: 3: tFT Conditions Note 3 1.0 1.4 2.0 ms Note 2 20 30 40 ms Note 2 140 200 280 ms Standard Time Out 1120 1600 2240 ms Note 2 — 5 — µs For RST 10% to 90% of VDD, CL = 50 pF (Note 1) — 5 — µs For RST 10% to 90% of VDD, CL = 50 pF (Note 1) — 5 — µs For RST 90% to 10% of VDD, CL = 50 pF (Note 1) — 5 — µs For RST 90% to 10% of VDD, CL = 50 pF (Note 1) These parameters are for design guidance only and are not 100% tested. Custom ordered Reset active time; minimum order volume requirement. Designed to be independent of VDD rise rate. Device characterization was done with a rise rate as slow as 0.1 V/s (@ +25°C). 2005-2012 Microchip Technology Inc. DS21985D-page 9 MCP131X/2X tMR MR tRST tNF tMRD RST RST FIGURE 1-2: TABLE 1-2: MR and Reset Pin Waveforms. MR AND RESET PIN TIMINGS Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions MR Pulse Width tMR 1 — — µs MR Active to RST/RST Active tMRD — 235 — ns VDD = 5.0V tNF — 150 — ns VDD = 5.0V MR Input Noise filter Note 1: These parameters are for design guidance only and are not 100% tested. RST RST WDI (Note 1) tRST tWP tWD tWD Note 1: The WDI pin was a weak pull-up resistor which is disabled after the 1st falling edge on the WDI pin. FIGURE 1-3: TABLE 1-3: WDI and Reset Pin Waveforms. WDI AND RESET PIN TIMINGS Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C. Parameters Sym Min Typ Max Units WDI Pulse Width tWP 50 — — ns Watchdog Time-Out Period tWD 4.3 6.3 9.3 ms Note 1 71 102 153 ms Note 1 Note 1: Conditions 1.12 1.6 2.4 sec Standard Time Out 17.9 25.6 38.4 sec Note 1 Custom ordered WatchDog Timer time out; minimum order volume requirement. DS21985D-page 10 2005-2012 Microchip Technology Inc. MCP131X/2X TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316), TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Specified Temperature Range TA -40 — +85 °C MCP13XX-25 (or below) Except MCP13XX-25 (or below) Temperature Ranges Specified Temperature Range TA -40 — +125 °C Maximum Junction Temperature TJ — — +150 °C Storage Temperature Range TA -65 — +150 °C JA — 220.7 — °C/W Package Thermal Resistances Thermal Resistance, 5L-SOT-23 2005-2012 Microchip Technology Inc. DS21985D-page 11 MCP131X/2X NOTES: DS21985D-page 12 2005-2012 Microchip Technology Inc. MCP131X/2X 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40°C to +125°C. 1.2 1.5V 2.0V 3.0V 4.5V 4.8V 5.0V 5.5V 4.3V 0.6 0.4 0.2 4 3 2 1 0 -100 -50 0 50 100 0 -100 150 -50 Temperature (°C) 2.5V 2.7V 3.2V 4.0V 4.5V 5.0V 5.5V 0.6 0.2 1 50 100 0 -100 150 -50 FIGURE 2-2: IDD vs. Temperature (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1319-2.9). 1.8V 2.2V 2.5V 4.0V 4.5V 5.0V 5.5V 0 50 100 150 2.5V 4.0V 4.5V 5.0V 5.5V 7 6 5 IDD (µA) IDD (µA) 1.5V 5.5V FIGURE 2-5: IDD vs. Temperature (Reset Power-up Timer Active) (MCP1319-2.9). 2.2V 1.0V 5.0V Temperature (°C) Temperature (°C) 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -100 4.5V 3 2 0 4.0V 4 0.4 -50 150 5 0.8 0 -100 100 6 IDD (µA) IDD (µA) 3.2V 1.5V 50 FIGURE 2-4: IDD vs. Temperature (Reset Power-up Timer Active) (MCP1318M-4.6). 1.4 1.0V 0 Temperature (°C) FIGURE 2-1: IDD vs. Temperature (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1318M-4.6). 1 5.5V 5 0.8 1.2 5.0V 6 Idd (µA) IDD (µA) 1 4.8V 1.0V 4 3 2 1 -50 0 50 100 150 Temperature (°C) FIGURE 2-3: IDD vs. Temperature (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1316-2.0). 2005-2012 Microchip Technology Inc. 0 -100 -50 0 50 100 150 Temperature (°C) FIGURE 2-6: IDD vs. Temperature (Reset Power-up Timer Active) (MCP1316-2.0). DS21985D-page 13 MCP131X/2X Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40°C to +125°C. 4.8V 5.0V 5.5V 7 6 IDD (µA) 5 4 3 2 1 0 -100 -50 0 50 100 150 Temperature (°C) FIGURE 2-7: IDD vs. Temperature (Watchdog Timer Active) (MCP1318M-4.6). MCP1319 does not have a Watchdog Timer FIGURE 2-8: IDD vs. Temperature (Watchdog Timer Active) (MCP1319-2.9). 2.2V 2.5V 4.0V 4.5V 5.0V 5.5V 7 6 IDD (µA) 5 4 3 2 1 0 -100 -50 0 50 100 150 Temperature (°C) FIGURE 2-9: IDD vs. Temperature (Watchdog Timer Active) (MCP1316-2.0). DS21985D-page 14 2005-2012 Microchip Technology Inc. MCP131X/2X Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40°C to +125°C. -45°C 1.2 1 -45°C 0.4 IDD (µA) IDD (µA) +25°C +90°C +130°C 5 +90°C 0.8 0.6 +25°C 6 +130°C 4 3 2 0.2 1 0 0 0.0 2.0 4.0 6.0 4.6 4.8 5.0 VDD (V) 5.2 5.4 5.6 VDD (V) FIGURE 2-10: IDD vs. VDD (Reset Powerup Timer Inactive and Watchdog Timer Inactive) (MCP1318M-4.6). FIGURE 2-13: IDD vs. VDD (Reset Powerup Timer Active or Watchdog Timer Active) (MCP1318M-4.6). -45°C 1.4 +130°C 6 +90°C 5 +25°C 4 +25°C +90°C +130°C 1.2 0.8 -45°C 0.6 IDD (µA) IDD (µA) 1 3 0.4 2 0.2 1 0 0 0.0 2.0 4.0 6.0 0.0 2.0 VDD (V) FIGURE 2-11: IDD vs. VDD (Reset Powerup Timer Inactive and Watchdog Timer Inactive) (MCP1319-2.9). 6.0 FIGURE 2-14: IDD vs. VDD (Reset Powerup Timer Active or Watchdog Timer Active) (MCP1319-2.9). -45°C 1.8 7 +90°C 6 1.2 +25°C 5 1 -45°C 1.4 0.8 0.6 IDD (µA) +130°C 1.6 IDD (µA) 4.0 VDD (V) +90°C +130°C 4 3 0.4 2 0.2 1 0 +25°C 0 0.0 2.0 4.0 6.0 VDD (V) FIGURE 2-12: IDD vs. VDD (Reset Powerup Timer Inactive and Watchdog Timer Inactive) (MCP1316-2.0). 2005-2012 Microchip Technology Inc. 2.0 3.0 4.0 VDD (V) 5.0 6.0 FIGURE 2-15: IDD vs. VDD (Reset Powerup Timer Active or Watchdog Timer Active) (MCP1316-2.0). DS21985D-page 15 MCP131X/2X Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40°C to +125°C. VTRIP Up VHYST 4.700 4.650 VTRIP Down 4.600 4.550 -50 0 50 100 1V 2V 3V 4.3V 0.1 0.08 0.06 0.02 0 0.00 2.00 4.00 6.00 IOL (mA) FIGURE 2-19: (MCP1318M-4.6). VOL vs. IOL 0.16 3.4 0.14 3.3 2.960 3.3 2.940 3.2 3.2 2.920 VTRIP Down 2.900 2.880 0 50 100 2.7V 0.02 0 0.00 150 2.00 Temperature (°C) FIGURE 2-20: (MCP1319-2.9). 3.0 VTRIP Up VHYST 2.030 2.0 2.020 1.5 2.010 1.0 VTRIP Down 2.000 0.5 1.990 0.0 -50 0 50 100 150 VOL (V) 2.5 VTRIP Hyst (%) VTRIP (V) 2.040 0.02 0.018 0.016 0.014 0.012 0.01 0.008 0.006 0.004 0.002 0 0.00 DS21985D-page 16 5V 5.5V 4.00 6.00 IOL (mA) 8.00 10.00 VOL vs. IOL 1V 1.8V 0.05 0.10 0.15 0.20 0.25 IOL (mA) Temperature (°C) FIGURE 2-18: VTRIP and VHYST vs. Temperature (MCP1316-2.0). 4.5V 0.06 0.04 2.050 4V 0.1 3.1 FIGURE 2-17: VTRIP and VHYST vs. Temperature (MCP1319-2.9). 3.2V 10.00 0.08 3.1 3.0 -50 2.5V 8.00 0.12 VOL (V) VHYST 3.4 VTRIP Hyst (%) VTRIP (V) 1V 3.5 2.980 5.5V 0.04 FIGURE 2-16: VTRIP and VHYST vs. Temperature (MCP1318M-4.6). 3.000 5V 0.12 Temperature (°C) VTRIP Up 4.8V 0.14 150 3.020 4.5V 0.16 VOL (V) VTRIP (V) 4.750 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 VTRIP Hyst (%) 4.800 FIGURE 2-21: (MCP1316-2.0). VOL vs. IOL 2005-2012 Microchip Technology Inc. MCP131X/2X Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40°C to +125°C. 0.12 4 mA 01 0.1 A 3 mA VOH (V) VOLL (V) 0.14 0.08 2 mA 0.06 0.04 1 mA 0.02 0 mA 0 -50 0 50 100 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0.00 4.5V 4.3V 3V 2V 1.5V 2.00 150 FIGURE 2-22: VOL vs. Temperature (MCP1318M-4.6 @ VDD = 4.5V). 4.00 6.00 IOH (mA) FIGURE 2-25: VOH vs. IOH (MCP1318M-4.6 @ +25°C). 6 0.25 5.5V 5V 4.5V 4V 5 4 mA 4 VOH (V) VOLL (V) 0.2 3 mA 0.15 2 mA 0.1 0.05 0 -50 0 50 1 mA 1 0 mA 0 0.00 100 3.2V 2 2.7V 2.5V 1.5V 2.00 150 4.00 6.00 IOH (mA) FIGURE 2-26: VOH vs. IOH (MCP1319-2.9 @ +25°C). FIGURE 2-23: VOL vs. Temperature (MCP1319-2.9 @ VDD = 2.7V). 0.016 6 0.2 mA 0.014 5.5V 5V 4.5V 4V 5 0.012 0.15 mA 0.01 0.1 mA 0.008 0.006 4 VOH (V) VOL (V) 3 3 2 0.004 0.05 mA 0.002 0 mA 0 -50 0 50 100 Temperature (°C) FIGURE 2-24: VOL vs. Temperature (MCP1316-2-0 @ VDD = 1.8V). 2005-2012 Microchip Technology Inc. 150 2.2V 2.5V 1 0 0.00 2.00 4.00 6.00 IOH (mA) FIGURE 2-27: VOH vs. IOH (MCP1316-2.0 @ +25°C). DS21985D-page 17 MCP131X/2X Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40°C to +125°C. 4.8 V 300 5V 250 5.5V 220 150 100 215 210 205 200 50 195 -50 0 50 100 190 -100 150 -50 Temperature (°C) FIGURE 2-28: (MCP1318M-4.6). FIGURE 2-31: (MCP1318M-4.6). tRPD vs. Temperature 4V 4.5V 5V -50 0 50 3.2 V 5.5V 100 150 250 245 240 235 230 225 220 215 210 205 200 -100 2.5V 4.5V 5V FIGURE 2-32: (MCP1319-2.9). 300 tRPU (ms) tRPD (µs) 250 200 150 100 50 -50 0 50 100 150 250 245 240 235 230 225 220 215 210 205 200 -100 -50 Temperature (°C) FIGURE 2-30: (MCP1316-2.0). DS21985D-page 18 150 4V 4.5 V 0 5V 50 5.5 V 100 150 tRPD vs. Temperature tRPU vs. Temperature 2.5 V 5.5V 350 0 -100 100 Temperature (°C) tRPD vs. Temperature 4V 50 tRPU vs. Temperature -50 Temperature (°C) FIGURE 2-29: (MCP1319-2.9). 0 Temperature (°C) tRPU (ms) tRPD (µs) 3.2V 450 400 350 300 250 200 150 100 50 0 -100 5.5 V 225 200 0 -100 5V 230 tRPU (ms) tRPD (µs) 350 4V 4.5 V 0 5V 50 5.5 V 2.2 V 100 150 Temperature (°C) FIGURE 2-33: (MCP1316-2.0). tRPU vs. Temperature 2005-2012 Microchip Technology Inc. MCP131X/2X Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40°C to +125°C. VRST=2.9V 3.2 V VRST=4.6V 350 3000 300 2500 250 tMRD (ns) Transient Duration (µs) VRST=2.0V 3500 2000 1500 2.0V 1000 2.9V 4.5 V 5V 5.5 V 200 150 100 500 50 0 0.001 0.01 0.1 1 0 -100 10 -50 Reset Threshold Overdrive (V) VTRIPMin - VDD FIGURE 2-34: Transient Duration vs. VTRIP (min) – VDD. 2.2 V 2.5 V 4V 4.5 V 5V 5.5 V 2.2 V 0.01 0.006 0.004 0.002 0 -100 -50 0 50 100 Temperature (°C) FIGURE 2-35: Open-Drain Leakage Current vs. Temperature (MCP1320-2.0). 150 50 100 150 FIGURE 2-37: MR Low to Reset Propagation Delay (MCP1319-2.9). 0.012 0.008 0 Temperature (°C) tMRD (ns) Open-Drain Leakage (µA) 4V 450 400 350 300 250 200 150 100 50 0 -100 -50 2.5 V 4V 0 4.5 V 50 5V 100 5.5 V 150 Temperature (°C) FIGURE 2-38: MR Low to Reset Propagation Delay (MCP1316-2.0). MCP1318M does not have an MR pin FIGURE 2-36: MR Low to Reset Propagation Delay (MCP1318M-4.6). 2005-2012 Microchip Technology Inc. DS21985D-page 19 MCP131X/2X 1000 900 800 700 600 500 400 300 200 100 0 -100 Normalized Reset Timeout Period tRPD (µs) Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40°C to +125°C. 5V to 4.5V 5V to 0V -50 0 50 100 0.145 0.14 0.135 0.13 0.125 0.12 0.115 -100 150 MCP1318M-4.6 -50 Temperature (°C) tRPD (µs) Normalized Reset Timeout Period 250 5V to 2.7V VTRIP Typ + 0.3V to VTRIP Min - 0.2V 150 100 50 5V to 0V 0 -100 -50 0 50 100 0.14 MCP1319-2.9 0.135 0.13 -50 tRPD (µs) 150 VTRIP Typ + 0.2V to VTRIP Min - 0.2V 50 5V to 0V 0 50 100 150 Temperature (°C) FIGURE 2-41: VDD Falling to Reset Propagation Delay vs. Temperature (MCP13162.0). DS21985D-page 20 50 100 150 FIGURE 2-43: Normalized Reset Time-Out Period vs. Temperature (MCP1319-2.9). Normalized Reset Timeout Period 5V to 1.8V -50 0 Temperature (°C) 250 0 -100 150 0.145 0.125 -100 150 FIGURE 2-40: VDD Falling to Reset Propagation Delay vs. Temperature (MCP13192.9). 100 100 0.15 Temperature (°C) 200 50 FIGURE 2-42: Normalized Reset Time-Out Period vs. Temperature (MCP1318M-4.6). FIGURE 2-39: VDD Falling to Reset Propagation Delay vs. Temperature (MCP1318M-4.6). 200 0 Temperature (°C) 0.15 0.145 0.14 MCP1316-2.0 0.135 0.13 0.125 -100 -50 0 50 100 150 Temperature (°C) FIGURE 2-44: Normalized Reset Time-Out Period vs. Temperature (MCP1316-2.0). 2005-2012 Microchip Technology Inc. MCP131X/2X Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316; see Figure 4-1), TA = -40°C to +125°C. VRST=2.0V 1.15 1.1 MCP1318M-4.6 1.05 1 ` 0.95 0.9 -100 VRST=2.9V VRST=4.6V 0.1 1 600 1.2 Transient Duration (µS) Normalized Watchdog Timeout Period 1.25 -50 0 50 100 150 500 400 300 200 100 0 0.001 0.01 10 Reset Threshold Overdrive (V) VTRIPMin - VDD Temperature (°C) FIGURE 2-45: Normalized Watchdog TimeOut Period vs. Temperature (MCP1318M-4.6). FIGURE 2-48: Max VDD Transient Duration vs. Reset Threshold Overdrive. MCP1319 does not have a Watchdog Timer Normalized Watchdog Timeout Period FIGURE 2-46: Normalized Watchdog TimeOut Period vs. Temperature (MCP1319-2.9). FIGURE 2-49: “M” Part Number Pull-up Characteristics (MCP1318M-4.6). 1.25 1.2 1.15 1.1 MCP1316-2.0 1.05 1 ` 0.95 0.9 -100 -50 0 50 100 150 Temperature (°C) FIGURE 2-47: Normalized Watchdog TimeOut Period vs. Temperature (MCP1316-2.0). 2005-2012 Microchip Technology Inc. DS21985D-page 21 MCP131X/2X NOTES: DS21985D-page 22 2005-2012 Microchip Technology Inc. MCP131X/2X 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Device Symbol Pin Type MCP1316M (1), MCP1318M (1), MCP1319M (1), MCP1320, MCP1321, MCP1322 RST O SOT23-5 1 Buffer/ Driver Type Function Open-Drain Reset Output (active-low) Goes active (Low) if one of these conditions occurs: 1. If VDD falls below the selected Reset voltage threshold. 2. If the MR pin is forced low. 3. If the WDI pin does not detect an edge transition within the minimum selected time-out period. 4. During power-up. VDD Falling: Open-Drain = VDD > VTRIP L = VDD < VTRIP VDD Rising: Open-Drain = VDD > VTRIP + VHYS L = VDD < VTRIP + VHYS MCP1316, MCP1318, MCP1319 O Push-Pull VDD Falling: H = VDD > VTRIP L = VDD < VTRIP VDD Rising: H = VDD > VTRIP + VHYS L = VDD < VTRIP + VHYS MCP1317 RST O Push-Pull Reset Output (active-high) Goes active (High) if one of these conditions occurs: 1. If VDD falls below the selected Reset voltage threshold. 2. If the MR pin is forced low. 3. If the WDI pin does not detect an edge transition within the minimum selected time-out period. 4. During power-up. VDD Falling: H = VDD < VTRIP L = VDD > VTRIP VDD Rising: H = VDD < VTRIP + VHYS L = VDD > VTRIP + VHYS 2 Note 1: All VSS — P The ground reference for the device. Open-Drain output with internal pull-up resistor. 2005-2012 Microchip Technology Inc. DS21985D-page 23 MCP131X/2X TABLE 3-1: PIN FUNCTION TABLE (CONTINUED) Pin No. Symbol Pin Type Buffer/ Driver Type MCP1316, MCP1316M, MCP1317, MCP1320 MR I ST MCP1318, MCP1318M, MCP1319, MCP1319M, MCP1321, MCP1322 RST O Push-Pull Device SOT23-5 3 Function Manual Reset input for a Reset switch. This input allows a push button switch to be directly connected to the MCP131X/2X MR pin, which can then be used to force a system Reset. This input filters (ignores) noise pulses that occur on the MR pin. L = Switch is depressed (shorted to ground). This forces the RST/RST pins Active. H = Switch is open (internal pull-up resistor pulls signal high). State of the RST/RST pins determined by other system conditions. Reset Output (active-high) Goes active (High) if one of these conditions occurs: 1. If VDD falls below the selected Reset voltage threshold. 2. If the MR pin is forced low. 3. If the WDI pin does not detect an edge transition within the minimum selected time-out period. 4. During power-up. VDD Falling: H = VDD < VTRIP L = VDD > VTRIP VDD Rising: H = VDD < VTRIP + VHYS L = VDD > VTRIP + VHYS 4 MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1320, MCP1321 WDI I ST Watchdog Timer Input The WDT period is specified at the time of device order. The Standard WDT period is 1.6s typical. An edge transition on the WDI pin resets the Watchdog Timer counter (no time out). A Falling Edge is required to start the WDT Timer. MCP1319, MCP1319M, MCP1322 MR I ST Manual Reset input for a Reset switch. This input allows a push button switch to be directly connected to the MCP131X/2X MR pin, which can then be used to force a system Reset. This input filters (ignores) noise pulses that occur on the MR pin. L = Switch is depressed (shorted to ground). This forces the RST/RST pins Active. H = Switch is open (internal pull-up resistor pulls signal high). State of the RST/RST pins determined by other system conditions. VDD — P The positive supply for the device. 5 Note 1: All Open-Drain output with internal pull-up resistor. DS21985D-page 24 2005-2012 Microchip Technology Inc. MCP131X/2X 3.1 Ground Terminal (VSS) VSS provides the negative reference for the analog input voltage. Typically, the circuit ground is used. 3.2 Supply Voltage (VDD) VDD can be used for power supply monitoring or a voltage level that requires monitoring. 3.3 Reset Output (RST and RST) There are four types of Reset output pins. These are: 1. 2. 3. 4. Open-Drain active-low Reset, External pull-up resistor required Open-Drain active-low Reset, Internal pull-up resistor Push-Pull active-low Reset Push-Pull active-high Reset Some devices have both an active-low and active-high Reset output. 3.3.1 ACTIVE-LOW (RST) – OPEN-DRAIN, EXTERNAL PULL-UP RESISTOR The RST open-drain output remains low while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RST pin will float, and an external pull-up resistor is required to bring the output to the high state. 3.3.2 3.4 Manual Reset Input (MR) The Manual Reset (MR) input pin allows a push button switch to easily be connected to the system. When the push button is depressed, it forces a system Reset. This pin has circuitry that filters noise that may be present on the MR signal. The MR pin is active-low and has an internal pull-up resistor. 3.5 Watchdog Input In some systems, it is desirable to have an external Watchdog Timer to monitor the operation of the system. This is done by requiring the embedded controller to “pet” the Watchdog Timer within a predetermined time frame (TWD). If the MCP131X/2X is not “petted” within this time frame, the MCP131X/2X will force the Reset pin(s) active. The embedded controller “pets” the MCP131X/2X by forcing an edge transition on the WDI pin. The WDT Timer is activated by the first falling edge on the WDI pin. The standard offering devices have a typical Watchdog Timer period (TWD) of 1.6 s. Table 1-3 shows the available Watchdog Timer periods. ACTIVE-LOW (RST) – OPEN-DRAIN, INTERNAL PULL-UP RESISTOR The RST open-drain output remains low while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RST pin will be pulled high by an internal pull-up resistor (typically 4.7 k). 3.3.3 ACTIVE-LOW (RST) – PUSH-PULL The RST push-pull output remains low while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RST pin will be driven to the high state. 3.3.4 ACTIVE-HIGH (RST) – PUSH-PULL The RST push-pull output remains high while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RST pin will be driven to the low state. 2005-2012 Microchip Technology Inc. DS21985D-page 25 MCP131X/2X NOTES: DS21985D-page 26 2005-2012 Microchip Technology Inc. MCP131X/2X 4.0 OPERATIONAL DESCRIPTION For many of today’s microcontroller applications, care must be taken to prevent low-power conditions that can cause many different system problems. The most common causes are brown-out conditions, where the system supply drops below the operating level momentarily. The second most common cause is when a slowly decaying power supply causes the microcontroller to begin executing instructions without sufficient voltage to sustain volatile memory (RAM), thus producing indeterminate results. Figure 4-1 shows a typical application circuit. The MCP131X/2X family of voltage supervisor devices are designed to keep a microcontroller in Reset, until the system voltage has reached and stabilized at the proper level for reliable system operation. These devices also operate as protection from brown-out conditions when the system supply voltage drops below a safe operating level. Some MCP131X/2X family members include a Watchdog Timer feature that after being enabled (by a falling edge on the WDI pin), monitors the WDI pin for falling or rising edges. If an edge transition is not detected within the expected time frame, the MCP131X/2X devices will force the Reset pin active. This is useful to ensure that the embedded system’s Host Controller program is operating as expected. Some MCP131X/2X family members include a Manual Reset feature that allow a push button switch to be directly connected to the MCP131X/2X devices (on the MR pin). This allows the system to easily be reset from the external control of the push button switch. A superset block diagram is shown in Figure 4-2, with device specific block diagrams shown in Figure 4-3 through Figure 4-12. VDD 0.1 µF VDD VDD RPU(1) MCP13XX MCLR (Reset input) (active-low) RST RST (2) MR PIC® Microcontroller I/O WDI VSS VSS To system device that requires activehigh resets Push button switch Note 1: Resistor RPU may be required with the MCP1320, MCP1321 or MCP1322 due to the open-drain output. Resistor RPU may not be required with the MCP1316M, MCP1318M or MCP1319M due to the internal pull-up resistor. The MCP1316, MCP1317, MCP1318 and MCP1319 do not require the external pull-up resistor. 2: Not all devices offer the active-high Reset output pin. FIGURE 4-1: Typical Application Circuit. VDD Comparator + – MR WDI RST Reference Voltage Output Driver RST Noise Filter VSS Watchdog Note: Features available depend on the device. FIGURE 4-2: 2005-2012 Microchip Technology Inc. Family Block Diagram. DS21985D-page 27 MCP131X/2X 4.0.1 DEVICE SPECIFIC BLOCK DIAGRAMS VDD VDD Comparator Comparator + + – MR Reference Voltage Output Driver RST – RST Reference Voltage Output Driver RST Noise Filter VSS WDI Watchdog FIGURE 4-3: MCP1316 Block Diagram. VSS WDI Watchdog FIGURE 4-6: VDD VDD Comparator Comparator + + – MR MCP1318 Block Diagram. Reference Voltage Output Driver RST – RST Reference Voltage Output Driver RST Noise Filter VSS WDI Watchdog FIGURE 4-4: MCP1316M Block Diagram. WDI FIGURE 4-7: VSS Watchdog MCP1318M Block Diagram. VDD Comparator + – MR WDI Reference Voltage Output Driver RST Noise Filter VSS Watchdog FIGURE 4-5: DS21985D-page 28 MCP1317 Block Diagram. 2005-2012 Microchip Technology Inc. MCP131X/2X VDD VDD Comparator Comparator + RST – MR + Reference Voltage Output Driver – RST Reference Voltage Output Driver RST RST Noise Filter VSS FIGURE 4-8: MCP1319 Block Diagram. VSS WDI Watchdog FIGURE 4-11: VDD VDD Comparator Comparator + MR + RST – Reference Voltage Output Driver – RST MR Noise Filter Reference Voltage MCP1319M Block Diagram. Output Driver RST RST Noise Filter VSS FIGURE 4-9: MCP1321 Block Diagram. VSS FIGURE 4-12: MCP1322 Block Diagram. . VDD Comparator + – MR WDI Reference Voltage Output Driver RST Noise Filter VSS Watchdog FIGURE 4-10: MCP1320 Block Diagram. 2005-2012 Microchip Technology Inc. DS21985D-page 29 MCP131X/2X 4.1 Reset Voltage Trip Point (VTRIP) Operation The device’s Reset voltage trip point (VTRIP) is selected when the device is ordered. As the voltage on the device’s VDD pin is above or below this selected trip point, the output of the Reset pin (RST/RST) will be forced to either the inactive or active state. For the voltage trip point, there is a minimum trip voltage (VTRIPMIN) and a maximum trip voltage (VTRIPMAX). The voltage that the device “actually” trips at will be referred to as VTRIP. The trip voltage is specified for the falling of the device VDD. The Reset pin (RST or RST) will be forced active if any of the following occur: • • • • The Manual Reset input (MR) goes low The Watchdog Timer times out VDD goes below the threshold During device power-up After the device exits the Reset condition, the delay circuitry will hold the RST and RST pins active until the appropriate Reset delay time (tRST) has elapsed. There is also a hysteresis (VHYS) on the trip point. This is so that noise on the device voltage (VDD) does not cause the Reset pin (RST/RST) to “jitter” (change between driving an active and inactive state). TABLE 4-1: RESET PIN STATES State of RST Pin when: Device MCP1316 State of RST (3) Pin when: Output Driver VDD < VTRIP VDD > VTRIP + VHYS VDD < VTRIP VDD > VTRIP + VHYS L H — — Push-pull — — Open-drain (2) MCP1316M L MCP1317 — — H L Push-pull MCP1318 L H H L Push-pull H L Open-drain (2) MCP1318M L MCP1319 L H (2) H (2) H H L Push-pull (2) H L Open-drain (2) MCP1319M L H MCP1320 L H (1) — — Open-drain (1) MCP1321 L H (1) H L Open-drain (1) MCP1322 L H (1) H L Open-drain (1) Note 1: 2: 3: Requires External Pull-up resistor. Has Internal Pull-up resistor. The RST pin output is always push-pull. DS21985D-page 30 2005-2012 Microchip Technology Inc. MCP131X/2X 4.1.1 POWER-UP/RISING VDD As the device VDD rises, the device’s Reset circuit will remain active until the voltage rises above the “actual” trip point (VTRIP) plus the hysteresis (VHYS). Figure 4-13 shows a power-up sequence and the waveform of the RST and RST pins. As the device powers up, the voltage will start below the valid operating voltage of the device. At this voltage, the Reset output value is not valid. Once the voltage is above the minimum operating voltage (1V) and below the selected VTRIP, the Reset output will be active. Once the device voltage rises above the “actual” trip point (VTRIP) plus the hysteresis (VHYS), the Reset delay timer (tRST) starts. When the Reset delay timer times out, the Reset output (RST/RST) is driven inactive. Note: While the Reset delay timer (tRST) is active, additional system current is consumed. VTRIPMAX VTRIPMIN VDD FIGURE 4-13: Power-up. 4.1.2 POWER-DOWN/BROWN-OUTS As the device powers-down/brown-outs, the voltage (VDD) falls from a voltage above the device’s trip point (VTRIP). The device’s “actual” trip point voltage (VTRIP) will be between the minimum trip point (VTRIPMIN) and the maximum trip point (VTRIPMAX). Once the device voltage (VDD) goes below this voltage, the Reset pin(s) will be forced to the active state. There is a hysteresis on this trip point. This is so noise on the device voltage (VDD) does not cause the Reset pin (RST/RST) to “jitter” (change between driving an active and inactive). Figure 4-14 shows the waveform of the RST pin as determined by the VDD voltage, while Table 4-1 shows the state of the RST pin. 4.1.2.1 Note: VTRIP + VHYS Operation of RST pin with Internal Pull-Up Resistor Only the MCP1316M, MCP1318M and MCP1319M devices have an open-drain RST output pin with an internal pull-up resistor. The internal pull-up resistor has a typical value of 4.7 k. The internal pull-up eliminates the need for an external resistor. tRST 1V Reset Pin Operation on a VTRIP To reduce the current consumption of the device, when the RST pin is driving low, the resistor is disconnected. RST RST VDD VTRIP + VHYS VTRIPMAX VTRIP VTRIPMIN VTRIP 1V RST tRST tRPD FIGURE 4-14: < 1V is outside the device specifications tRPD tRST RST Operation as Determined by the VTRIP and VHYS. 2005-2012 Microchip Technology Inc. DS21985D-page 31 MCP131X/2X Reset Delay Timer (tRST) The Reset delay timer ensures that the MCP131X/2X device will “hold” the embedded system in Reset until the system voltage has stabilized. There are several time-out options to better meet the requirements of different applications. These Reset delay timer timeouts are shown in Table 4-2. The Standard offering time-out is typically 200 ms. The Reset delay timer (tRST) starts after the device voltage rises above the “actual” trip point (VTRIP) plus the hysteresis (VHYS). When the Reset delay timer timesout, the Reset output pin (RST/RST) is driven inactive. Figure 4-15 illustrates when the Reset delay timer (tRST) is active or inactive. VDD VTRIP RST While the Reset delay timer (tRST) is active, additional system current is consumed. Note: TABLE 4-2: See Figures 2-12, 2-10 and 2-11 Units Min Typ Max 1.0 1.4 2.0 ms 20 30 40 ms 140 200 280 ms 1120 1.6 2.24 sec This is the minimum time that the Reset delay timer will “hold” the Reset pin active after VDD rises above VTRIP + VHYS This is the maximum time that the Reset delay timer will “hold” the Reset pin active after VDD rises above VTRIP + VHYS Note 1: Reset Delay Timer Inactive RESET DELAY TIMER TIME OUTS (1) tRST tRST Reset Delay Timer Active 4.2 Reset Delay Timer Inactive See Figures 2-12, 2-10 and 2-11 See Figures 2-15, 2-14 and 2-13 FIGURE 4-15: Waveform. 4.2.1 Reset Power-up Timer EFFECT OF TEMPERATURE ON RESET POWER-UP TIMER (TRPU) The Reset delay timer time-out period (tRST) determines how long the device remains in the Reset condition. This time-out is affected by both the device VDD and temperature. Typical responses for different VDD values and temperatures are shown in Figures 233, 2-32 and 2-31. Shaded rows are custom ordered time outs. DS21985D-page 32 2005-2012 Microchip Technology Inc. MCP131X/2X 4.3 Negative Going VDD Transients 4.4 Manual Reset Input The minimum pulse width (time) required to cause a Reset may be an important criteria in the implementation of a Power-on Reset (POR) circuit. This time is referred to as transient duration. The MCP131X/2X devices are designed to reject a level of negative-going transients (glitches) on the power supply line. The Manual Reset input pin (MR) allows the Reset pins (RST/RST) to be manually forced to their active states. The MR pin has circuitry to filter noise pulses that may be present on the pin. Figure 4-17 shows a block diagram for using the MCP131X/2X with a push-button switch. To minimize the required external components, the MR input has an internal pull-up resistor. Transient duration is the amount of time needed for these supervisory devices to respond to a drop in VDD. The transient duration time (tTRAN) is dependant on the magnitude of VTRIP – VDD (overdrive). Any combination of duration and overdrive that lies under the duration/overdrive curve will not generate a Reset signal. Generally speaking, the transient duration time decreases with, and increases in, the VTRIP – VDD voltage. Combinations of duration and overdrive that lie above the duration/overdrive curve are detected as a brown-out or power-down condition. A mechanical push button or active logic signal can drive the MR input. Once MR has been low for a time, tMRD (the Manual Reset delay time), the Reset output pins are forced active. The Reset output pins will remain in their active states for the Reset delay timer time-out period (tRST). Figure 4-18 shows a waveform for the Manual Reset switch input and the Reset pins output. +5V Figure 4-16 shows a typical transient duration versus Reset comparator overdrive, for which the MCP131X/2X will not generate a Reset pulse. It shows that the farther below the trip point the transient pulse goes, the duration of the pulse required to cause a Reset gets shorter. Figure 4-16 shows the transient response characteristics for the MCP131X/2X. VDD MR Supply Voltage 0V I/O MCP13XX RST PIC® MCU MCLR VSS Transient immunity can be improved by adding a bypass capacitor (typically 0.1 µF) as close as possible to the VDD pin of the MCP131X/2X device. FIGURE 4-17: Watchdog Timer. 5V WDI Push Button Reset and VTRIP(MAX) VTRIP(MIN) VTRIP(MIN) - VDD (Overdrive) tTRANS (Duration) tMR MR VIH VIL Time (µs) FIGURE 4-16: Example of Typical Transient Duration Waveform. tMRD tRST RST RST The MR input typically ignores input pulses of 100 ns. FIGURE 4-18: 4.4.1 MR Input – Push Button. NOISE FILTER The noise filter filters out noise spikes (glitches) on the Manual Reset pin (MR). Noise spikes less than 100 ns (typical) are filtered. 2005-2012 Microchip Technology Inc. DS21985D-page 33 MCP131X/2X 4.5 Watchdog Timer The purpose of the Watchdog Timer (WDT) is to increase system reliability. The Watchdog Timer feature can be used to detect when the Host Controller’s program flow is not as expected. The Watchdog Timer monitors for activity on the Watchdog Input pin (WDI). The WDI pin is expected to be strobed within a given time frame. When this time frame is exceeded, without an edge transition on the WDI pin, the Reset pin is driven active to reset the system. This stops the Host Controller from continuing its erratic behavior (“run-away” code execution). The Watchdog Timer is external to the main portion of the control system and monitors the operation of the system. This feature is enabled by a falling edge on the WDI pin (after device POR). Monitoring is then done by requiring the embedded controller to force an edge transition (falling or rising) on the WDI pin (“pet the Watchdog”) within a predetermined time frame (TWD). If the MCP131X/2X does not detect an edge on the WDI pin within the expected time frame, the MCP131X/2X device will force the Reset pin active. Figure 4-19 shows a block diagram for using the MCP131X/2X with a PIC® microcontroller (MCU) and the Watchdog input. TABLE 4-3: WATCHDOG TIMER PERIODS (1) tWDT Typ Max 4.3 6.3 9.3 The Device Powers up A POR event occurred A WDT event occurred A Manual Reset (MR) event occurred When the Watchdog Timer is in the disabled state, the WDI pin has an internal smart pull-up resistor enabled. This pull-up resistor has a typical value of 52 k. This pull-up resistor holds the WDI signal in the high state, until it is forced to another state. After the embedded controller has initialized, if the Watchdog Timer feature is to be used, then the embedded controller can force the WDI pin low (VIL). This also enables the Watchdog Timer feature and disables the WDI pull-up resistor. Disabling the pull-up resistor reduces the device’s current consumption. The pull-up resistor will remain disconnected until the device has a power-on, a Reset event occurs, or after the WDT time out. Once the Watchdog Timer has been enabled, the Host Controller must force an edge transition (falling or rising) on the WDI pin before the minimum Watchdog Timer time out to ensure that the Watchdog Timer does not force the Reset pins (RST/RST) to the active state. If an edge transition does not occur before the maximum time out occurs, then the MCP131X/2X will force the Reset pins to their active state. The MCP131X/2X supports four time outs. The standard offering devices have a typical Watchdog Timer period (TWDT) of 1.6 s. Table 4-3 shows the available Watchdog Timer periods. The tWDT time-out is a function of the device voltage and temperature. DS21985D-page 34 ms 71 102 153 ms 1.12 1.6 2.4 sec 17.9 25.6 38.4 sec If the time between WDI edges is less than this, it ensures that the MCP131X/2X never forces a Reset If the time between WDI edges is greater than this, it ensures that the MCP131X/2X always forces a Reset The Watchdog Timer is in the disabled state when: • • • • Units Min Note 1: Shaded rows are custom ordered Watchdog Timer Periods (tWDT) time outs. For information on ordering devices with these tWDT time outs, please contact your local Microchip sales office. Minimum purchase volumes are required. +5V MCP13XX 3-Terminal Regulator (example: MCP1700) +5V VCC RST 0.1 µF FIGURE 4-19: WDI GND 10 k MCLR PIC® MCU I/O Watchdog Timer. The software routine that strobes WDI is critical. The code must be in a section of software that is executed frequently enough so the time between edge transitions is less than the Watchdog time-out period. One common technique controls the Host Controllers I/O line from two sections of the program. The software might set the I/O line high while operating in the Foreground mode and set it low while in the Background or Interrupt modes. If both modes do not execute correctly, the Watchdog Timer issues Reset pulses. 2005-2012 Microchip Technology Inc. MCP131X/2X 5.0 APPLICATION INFORMATION Using in PIC® Microcontroller, ICSP™ Applications 5.3 This section shows application-related information that may be useful for your particular design requirements. Note: 5.1 This operation can only be done using the device with the Open-Drain RST pin (MCP1320, MCP1321, and MCP1322). Devices that have the internal pull-up resistor are not recommended due to the current path of the internal pull-up resistor. Supply Monitor Noise Sensitivity The MCP131X/2X devices are optimized for fast response to negative-going changes in VDD. Systems with an inordinate amount of electrical noise on VDD (such as systems using relays) may require a 0.01 µF or 0.1 µF bypass capacitor to reduce detection sensitivity. This capacitor should be installed as close to the MCP131X/2X as possible to keep the capacitor lead length short. 0.1 µF VDD Note: MCP131X/2X WDI MR Figure 5-4 shows the typical application circuit for using the MCP132X for a voltage supervisory function when the PIC® microcontroller will be programmed via the InCircuit Serial Programming™ (ICSP™) feature. Additional information is available in TB087, “Using Voltage Supervisors with PIC® Microcontroller Systems which Implement In-Circuit Serial Programming™” (DS91087). It is recommended that the current into the RST pin be current limited by a 1 k resistor. RST RST VSS VDD/VPP FIGURE 5-1: Typical Application Circuit with Bypass Capacitor. 0.1 µF RPU VDD MCP132X 5.2 Conventional Voltage Monitoring Figure 5-2 and Figure 5-3 show the MCP131X/2X in conventional voltage monitoring applications. + – VDD MCP131X/2X RST BATLOW RST VSS 1 k VDD PIC® Microcontroller MCLR Reset input) (Active-Low) VSS FIGURE 5-4: Typical Application Circuit for PIC® Microcontroller with the ICSP™ Feature. VSS FIGURE 5-2: Battery Voltage Monitor. VDD + Pwr Sply RST MCP131X/2X Power Good – VSS FIGURE 5-3: Power Good Monitor. 2005-2012 Microchip Technology Inc. DS21985D-page 35 MCP131X/2X 5.4 Modifying The Trip Point, VTRIP Although the MCP131X/2X device has a fixed voltage trip point (VTRIP), it is sometimes necessary to make custom adjustments. This can be accomplished by connecting an external resistor divider to the MCP131X/2X VDD pin. This causes the VSOURCE voltage to be at a higher voltage than when the MCP131X/2X input equals its VTRIP voltage (Figure 5-5). 5.5 MOSFET Low-Drive Protection Low operating power and small physical size make the MCP131X/2X series ideal for many voltage detector applications. Figure 5-6 shows a low-voltage gate drive protection circuit that prevents overheating of the logiclevel MOSFET due to insufficient gate voltage. When the input signal is below the threshold of the MCP131X/2X, its output grounds the gate of the MOSFET. To maintain detector accuracy, the bleeder current through the divider should be significantly higher than the 10 µA maximum operating current required by the MCP131X/2X. A reasonable value for this bleeder current is 1 mA (100 times the 10 µA required by the MCP131X/2X). For example, if VTRIP = 2V and the desired trip point is 2.5V, the value of R1 + R2 is 2.5 k (2.5V/1 mA). The value of R1 + R2 can be rounded to the nearest standard value and plugged into the equation of Figure 5-5 to calculate values for R1 and R2. 1% tolerance resistors are recommended. VTRIP 270 VDD MCP131X/2X VDD RL RST MTP3055EL VSS VSOURCE FIGURE 5-6: Protection. MOSFET Low-Drive R2 VDD MCP131X/2X RST or RST R1 VSS R V 1 -------------------SOURCE R +R 1 2 V TRIP 5.6 Low-Power Applications In some low-power applications, the longer the microcontroller (such as a PIC® MCU) can be in the “Sleep mode”, the lower the average system current consumption will be. The WDT feature can be used to “wake-up” the PIC MCU at a regular interval to service the required tasks before returning to sleep. This “wake-up” occurs after the PIC MCU detects a MCLR reset during Sleep mode (for midrange family; POR = 1, BOR = 1, TO = 1, and PD = 1). Where: VSOURCE = Voltage to be monitored VTRIP = Threshold Voltage setting Note: In this example, VSOURCE must be greater than (VTRIP) FIGURE 5-5: Modify Trip-Point using External Resistor Divider. DS21985D-page 36 2005-2012 Microchip Technology Inc. MCP131X/2X 5.7 Controllers and Processors With Bidirectional I/O Pins Some microcontrollers have bidirectional Reset pins. Depending on the current drive capability of the controller pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 k resistor in series with the output of the MCP131X/2X (Figure 5-7). If there are other components in the system that require a Reset signal, they should be buffered so as not to load the Reset line. If the other components are required to follow the Reset I/O of the microcontroller, the buffer should be connected as shown with the solid line. Buffer VDD Buffered Reset To Other System Components PIC® MCU MCP13XX 4.7 k RST GND MCLR GND FIGURE 5-7: Interfacing the MCP131X/2X Push-Pull Outputs to a Bidirectional Reset I/O. 5.8 RESET Signal Integrity During Power-Down The MCP131X/2X Reset output is valid to VDD = 1.0V. Below this 1.0V, the output becomes an "open circuit" and does not sink or source current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in situations where the Reset signal must be maintained valid to VDD = 0V, external circuitry is required. For devices where the Reset signal is active-low, a pulldown resistor must be connected from the MCP131X/2X Reset pin(s) to ground to discharge stray capacitances and hold the output low (Figure 5-8). Similarly, for devices where the Reset signal is activehigh, a pull-up resistor to VDD is required to ensure a valid high Reset signal for VDD below 1.0V. This resistor value, though not critical, should be chosen such that it does not appreciably load the Reset pin(s) under normal operation (100 k will be suitable for most applications). VDD VDD MCP13XX RST GND R1 100 k FIGURE 5-8: Ensuring a Valid Active-low Reset Pin Output State as VDD Approaches 0V. 2005-2012 Microchip Technology Inc. DS21985D-page 37 MCP131X/2X NOTES: DS21985D-page 38 2005-2012 Microchip Technology Inc. MCP131X/2X 6.0 STANDARD DEVICE OFFERINGS 6.1 Custom Configurations Table 6-2 shows the codes that specify the desired Reset time out (tRST) and Watchdog Timer time-out (tWDT) for custom devices. Table 6-1 shows the standard devices that are available and their respective configuration. The configuration includes: The voltage trip point (VTRIP) is specified by the two digits of the desired typical trip point voltage. As an example, if the desired VTRIP selection has a typical VTRIP of 2.7V, the code is 27. • Voltage Trip Point (VTRIP) • Reset Time Out (tRST) • Watchdog Time Out (tWDT) Table 6-1 also shows the order number for that given device configuration. TABLE 6-1: STANDARD VERSIONS Reset Time Out (ms) Reset Threshold (V) Minimum Typical Device Watchdog Time Out (s) Minimum Typical Order Number MCP1316 2.90 140 200 1.12 1.6 MCP1316T-29LE/OT MCP1316 4.60 140 200 1.12 1.6 MCP1316T-46LE/OT MCP1316M 2.90 140 200 1.12 1.6 MCP1316MT-29LE/OT MCP1316M 4.60 140 200 1.12 1.6 MCP1316MT-46LE/OT MCP1317 2.90 140 200 1.12 1.6 MCP1317T-29LE/OT MCP1317 4.60 140 200 1.12 1.6 MCP1317T-46LE/OT MCP1318 2.90 140 200 1.12 1.6 MCP1318T-29LE/OT MCP1318 4.60 140 200 1.12 1.6 MCP1318T-46LE/OT MCP1318M 2.90 140 200 1.12 1.6 MCP1318MT-29LE/OT MCP1318M 4.60 140 200 1.12 1.6 MCP1318MT-46LE/OT MCP1319 2.90 140 200 — — MCP1319T-29LE/OT MCP1319 4.60 140 200 — — MCP1319T-46LE/OT MCP1319M 2.90 140 200 — — MCP1319MT-29LE/OT MCP1319M 4.60 140 200 — — MCP1319MT-46LE/OT MCP1320 2.90 140 200 1.12 1.6 MCP1320T-29LE/OT MCP1320 4.60 140 200 1.12 1.6 MCP1320T-46LE/OT MCP1321 2.90 140 200 1.12 1.6 MCP1321T-29LE/OT MCP1321 4.60 140 200 1.12 1.6 MCP1321T-46LE/OT MCP1322 2.90 140 200 — — MCP1322T-29LE/OT MCP1322 4.60 140 200 — — MCP1322T-46LE/OT TABLE 6-2: Code DELAY TIME-OUT ORDERING CODES Typical Delay Time (ms) Reset WDT Comment Code Typical Delay Time (ms) Reset WDT Comment A B 1.6 1.6 6.3 102.0 Note 1 Note 1 J K 200.0 200.0 6.3 102.0 Note 1 Note 1 C 1.6 1600.0 Note 1 L 200.0 1600.0 D 1.6 25600.0 Note 1 M 200.0 25600.0 Delay timings for standard device offerings Note 1 E F 30.0 30.0 6.3 102.0 Note 1 Note 1 N P 1600.0 1600.0 6.3 102.0 Note 1 Note 1 G H 30.0 30.0 1600.0 25600.0 Note 1 Note 1 Q R 1600.0 1600.0 1600.0 25600.0 Note 1 Note 1 Note 1: This delay timing combination is not the standard offering. For information on ordering devices with these delay times, contact your local Microchip sales office. Minimum purchase volumes are required. 2005-2012 Microchip Technology Inc. DS21985D-page 39 MCP131X/2X NOTES: DS21985D-page 40 2005-2012 Microchip Technology Inc. MCP131X/2X 7.0 DEVELOPMENT TOOLS 7.1 Evaluation/Demonstration Boards The SOT-23-5/6 Evaluation Board (VSUPEV2) can be used to evaluate the characteristics of the MCP131X/2X devices. This blank PCB has footprints for: • • • • Pull-up Resistor Pull-down Resistor Loading Capacitor In-line Resistor There is also a power supply filtering capacitor. For evaluating the MCP131X/2X devices, the selected device should be installed into the Option A footprint. FIGURE 1: SOT-23-5/6 Voltage Supervisor Evaluation Board (VSUPEV2). This board may be purchased directly from the Microchip web site at www.microchip.com. 2005-2012 Microchip Technology Inc. DS21985D-page 41 MCP131X/2X NOTES: DS21985D-page 42 2005-2012 Microchip Technology Inc. MCP131X/2X 8.0 PACKAGING INFORMATION 8.1 Package Marking Information 5-Pin SOT-23 Example: Part Number MCP1316T-29LE/OT Legend: XX...X Y YY WW NNN e3 * Note: SOT-23 QANN MCP1316MT-29LE/OT QBNN MCP1317T-29LE/OT QCNN MCP1318T-29LE/OT QDNN MCP1318MT-29LE/OT QENN MCP1319T-29LE/OT QFNN MCP1319MT-29LE/OT QGNN MCP1320T-29LE/OT QHNN MCP1321T-29LE/OT QJNN MCP1322T-29LE/OT QKNN MCP1316T-46LE/OT QLNN MCP1316MT-46LE/OT QMNN MCP1317T-46LE/OT QPNN MCP1318T-46LE/OT QQNN MCP1318MT-46LE/OT QRNN MCP1319T-46LE/OT QSNN MCP1319MT-46LE/OT QTNN MCP1320T-46LE/OT QUNN MCP1321T-46LE/OT QVNN MCP1322T-46LE/OT QWNN QA25 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2005-2012 Microchip Technology Inc. DS21985D-page 43 MCP131X/2X /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU27>627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± 0ROGHG3DFNDJH7KLFNQHVV $ ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± 0ROGHG3DFNDJH:LGWK ( ± 2YHUDOO/HQJWK ' ± %6& )RRW/HQJWK / ± )RRWSULQW / ± )RRW$QJOH ± /HDG7KLFNQHVV F ± /HDG:LGWK E ± 1RWHV 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS21985D-page 44 2005-2012 Microchip Technology Inc. MCP131X/2X Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2005-2012 Microchip Technology Inc. DS21985D-page 45 MCP131X/2X 8.2 Product Tape and Reel Specifications FIGURE 8-1: EMBOSSED CARRIER DIMENSIONS (8 MM TAPE ONLY) Top Cover Tape A0 W B0 K0 P TABLE 8-1: CARRIER TAPE/CAVITY DIMENSIONS Case Outline OT Carrier Dimensions Package Type SOT-23 FIGURE 8-2: 3L Cavity Dimensions W mm P mm A0 mm B0 mm K0 mm 8 4 3.23 3.17 1.37 Output Quantity Units Reel Diameter in mm 3000 180 5-LEAD SOT-23 DEVICE TAPE AND REEL SPECIFICATIONS Device Marking User Direction of Feed Pin 1 W, Width of Carrier Tape Pin 1 P, Pitch Standard Reel Component Orientation DS21985D-page 46 Reverse Reel Component Orientation 2005-2012 Microchip Technology Inc. MCP131X/2X APPENDIX A: REVISION HISTORY Revision D (August 2012) The following is the list of modifications: 1. Updated Figure 2-22 and Figure 2-23. Revision C (February 2012) The following is the list of modifications: 1. 2. 3. 4. Updated package temperature in the Temperature Characteristics table. Corrected text in Section 4.0, Operational Description. Updated package specification in Section 8.0, Packaging Information to show all drawings available. Other minor typographical corrections. Revision B (October 2007) The following is the list of modifications: 1. Clarified that devices with a Voltage Trip Point 2.4V are tested from -40C to + 85C. Devices with a Voltage Trip Point 2.5V are tested from -40C to +125C. Revision A (November 2005) • Original Release of this Document. 2005-2012 Microchip Technology Inc. DS21985D-page 47 MCP131X/2X NOTES: DS21985D-page 48 2005-2012 Microchip Technology Inc. MCP131X/2X PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X Device Tape/Reel Option Device: X XX X / XX VTRIP Time-Out Temperature Package Options Options MCP1316T: Range MicroPower Voltage Detector (Tape and Reel) MCP1316MT: MicroPower Voltage Detector (Tape and Reel) MCP1317T: MicroPower Voltage Detector (Tape and Reel) MCP1318T: MicroPower Voltage Detector (Tape and Reel) MCP1318MT: MicroPower Voltage Detector (Tape and Reel) MCP1319T: MicroPower Voltage Detector (Tape and Reel) MCP1319MT: MicroPower Voltage Detector (Tape and Reel) MCP1320T: MicroPower Voltage Detector (Tape and Reel) MCP1321T: MicroPower Voltage Detector (Tape and Reel) MCP1322T: MicroPower Voltage Detector (Tape and Reel) VTRIP Options: (Note 1) 29 46 = 2.90V = 4.60V Time-Out Options: (Note 1) L = tRST = 200 ms (typ.), tWDT = 1.6 s (typ.) Temperature Range: I = -40°C to +85°C (Only for trip points 2.0V to 2.4V) = -40°C to +125°C (For trip point 2.5V) E Package: Note 1: Examples: a) b) c) d) MCP1316T-29LE/OT: MCP1316T-46LE/OT: MCP1316MT-29LE/OT: MCP1316MT-46LE/OT: 5-Lead SOT-23-5 5-Lead SOT-23-5 5-Lead SOT-23-5 5-Lead SOT-23-5 a) b) MCP1317T-29LE/OT: MCP1317T-46LE/OT: 5-Lead SOT-23-5 5-Lead SOT-23-5 a) b) c) d) MCP1318T-29LE/OT: MCP1318MT-29LE/OT: MCP1318T-46LE/OT: MCP1318MT-46LE/OT: 5-Lead SOT-23-5 5-Lead SOT-23-5 5-Lead SOT-23-5 5-Lead SOT-23-5 a) b) c) d) MCP1319T-29LE/OT: MCP1318MT-29LE/OT: MCP1319T-46LE/OT: MCP1318MT-46LE/OT: 5-Lead SOT-23-5 5-Lead SOT-23-5 5-Lead SOT-23-5 5-Lead SOT-23-5 a) b) MCP1320T-29LE/OT: MCP1320T-46LE/OT: 5-Lead SOT-23-5 5-Lead SOT-23-5 a) b) MCP1321T-29LE/OT: MCP1321T-46LE/OT: 5-Lead SOT-23-5 5-Lead SOT-23-5 a) b) MCP1322T-29LE/OT: MCP1322T-46LE/OT: 5-Lead SOT-23-5 5-Lead SOT-23-5 OT = SOT-23, 5-lead Custom ordered voltage trip points and time outs available. Please contact your local Microchip sales office for additional information. Minimum purchase volumes are required. 2005-2012 Microchip Technology Inc. DS21985D-page 49 MCP131X/2X NOTES: DS21985D-page 50 2005-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62076-513-5 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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