TEA18363LT
GreenChip SMPS control IC
Rev. 2 — 12 December 2013
Product data sheet
1. General description
The TEA18363LT is a controller IC for low-cost Switched Mode Power Supplies (SMPS).
It is intended for flyback topologies. The built-in green functions provide high efficiency at
all power levels.
At high power levels the flyback operates in Quasi-Resonant (QR) mode. At lower power
levels, the controller switches to Frequency Reduction (FR) or Discontinuous Conduction
Mode (DCM) and limits the peak current to approximately 25 % of the maximum peak
current. Valley switching is used in all operating modes.
At low power levels, when the flyback switching frequency drops below 25 kHz, the
flyback converter switches to burst mode. A special burst mode has been integrated
which reduces the opto current to a minimum level, ensuring high efficiency at low power
and excellent no load power performance. As the switching frequency in this mode has a
minimum value of 25 kHz while the burst frequency is below 800 Hz, the frequencies are
outside the audible range. During the non-switching phase of the burst mode, the internal
IC supply current is minimized for further efficiency optimization.
The TEA18363LT includes an accurate OverPower Protection (OPP). The OPP enables
the controller to operate in overpower situations for a limited amount of time. If the output
is shorted, the system switches to low-power mode where the output power is limited to a
lower level.
The TEA18363LT is manufactured in a high-voltage Silicon-On-Insulator (SOI) process.
The SOI process combines the advantages of a low-voltage process (accuracy,
high-speed protection, functions, and control), while maintaining the high-voltage
capabilities (high-voltage start-up, low standby power, and an integrated X-capacitor
discharge function).
The TEA18363LT enables low-cost, highly efficient and reliable supplies for power
requirements up to 75 W to be designed with a minimum number of external components.
All values mentioned in this data sheet are typical values, unless otherwise specified.
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
2. Features and benefits
2.1 General features
SMPS controller IC for low-cost applications
Large supply voltage range (up to 30 V)
Integrated high-voltage start-up
Continuous VCC regulation during start-up and protection via the HV pin, allowing a
minimum VCC capacitor value
Reduced opto current in burst mode enabling low no load power consumption
Operating frequencies in all operating modes are outside the audible area
Integrated X-capacitor discharge; NXP Semiconductors patented
(Patent reference: 81512184EP01 (Patent pending))
Adjustable soft start
2.2 Green features
Low supply current during normal operation (0.6 mA without load)
Low supply current during non-switching state in burst mode (0.2 mA)
Valley switching for minimum switching losses
Frequency reduction with fixed minimum peak current to maintain high efficiency at
low output power levels
2.3 Protection features
Mains voltage independent OverPower Protection (OPP)
OverTemperature Protection (OTP)
Integrated overpower time-out
Integrated restart timer for system fault conditions
Continuous mode protection using demagnetization detection
Accurate OverVoltage Protection (OVP)
Driver maximum on-time protection
3. Applications
Applications requiring efficient and cost-effective power supply solutions up to 75 W
4. Ordering information
Table 1.
Ordering information
Type number
TEA18363LT/1
TEA18363LT
Product data sheet
Package
Name
Description
Version
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
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Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
2 of 27
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Product data sheet
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GreenChip SMPS control IC
6. Pinning information
6.1 Pinning
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TEA18363LT pinning diagram
6.2 Pin description
Table 2.
Pin
TEA18363LT
Product data sheet
Pin description
Pin number
Description
VCC
1
supply voltage
GND
2
ground
DRIVER
3
gate driver output
ISENSE
4
current sense input
AUX
5
auxiliary winding input for demagnetization timing, valley
detect, overpower correction, and OVP
CTRL
6
control input
n.c.
7
not connected
HV
8
high voltage start-up; active X-capacitor discharge
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Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
4 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
7. Functional description
7.1 General control
Figure 3 shows a typical configuration of the TEA18363LT, including flyback circuit
controller.
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Typical TEA18363LT configuration
7.1.1 Start-up and UnderVoltage LockOut (UVLO)
Initially, the capacitor on the VCC pin is charged from the high-voltage mains using the
HV pin. As long as VCC is below Vstartup, the IC current consumption is minimized to
40 A.
When VCC reaches the Vstartup level, the control logic activates the internal circuitry. The
IC then waits for the CTRL pin to reach Vstartup(CTRL), and the mains voltage to increase to
above the brownin level. When both conditions are met, the soft start capacitor on the
ISENSE pin (CSS in Figure 3) is charged. The system starts switching. In a typical
application, the supply voltage is taken over by the auxiliary winding of the transformer.
During the start-up period, the VCC pin is continuously regulated to the Vstartup level using
the HV charge current until the output voltage is at its regulation level, which is detected
via the CTRL pin. In this way the VCC capacitor value can be limited. Due to the limited
current capability from the HV pin and depending on the mains voltage, the voltage on pin
VCC can still drop slightly during the start-up period.
TEA18363LT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
5 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
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Start-up sequence and normal operation
7.2 Modes of operation
The TEA18363LT operates in quasi-resonant mode, discontinuous conduction mode or
burst mode (see Figure 5). The auxiliary winding of the flyback transformer provides
demagnetization and valley detection.
TEA18363LT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
6 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
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Modes of operation
At high output power the converter operates in quasi-resonant mode. The next converter
cycle starts after demagnetization of the transformer and detection of the valley. In
quasi-resonant mode switching losses are minimized because the external MOSFET is
switched on while the drain-source voltage is minimal.
To prevent high-frequency operation at lower loads, the quasi-resonant operation
switches to Discontinuous Conduction Mode (DCM) operation with valley skipping once
the frequency reaches its maximum. This frequency limit reduces the MOSFET switch-on
losses and conducted EMI.
At medium power levels, the controller enters Frequency Reduction (FR) mode. A Voltage
Controlled Oscillator (VCO) controls the frequency. The minimum frequency in this mode
is reduced to 25 kHz. During FR mode, the primary peak current is kept at an adjustable
minimum level to maintain high efficiency. Valley switching is also active in this mode.
At low power, the converter enters the burst mode. In burst mode, the minimum switching
frequency is 25 kHz.
7.3 Supply management
All internal reference voltages are derived from a temperature compensated on-chip band
gap circuit. Internal reference currents are derived from a trimmed and
temperature-compensated current reference circuit.
TEA18363LT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
7 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
7.4 Mains voltage measuring
In a typical application, the mains input voltage is measured using the HV pin.
Once per ms the mains voltage is measured by pulling down the HV pin to ground and
measuring its current. This current then reflects the input voltage.
The system determines if the mains voltage exceeds the brownin level or it is
disconnected using an analog-to-digital converter and digital control (see Figure 1).
Once the mains is above the brownin level, the system is allowed to start switching
(see Figure 6).
If the mains voltage is continuously below the brownout level for a period of at least
30 ms, a brownout is detected and the system immediately stops switching. This period is
required to avoid that the system stops switching due to the zero crossings of the mains or
during a short mains interruption.
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Mains voltage measuring
When the mains voltage is measured by pulling the HV pin to ground, the digital control
calculates if there is a positive dV/dt at the mains. A positive dV/dt implies that a mains is
connected.
Once a mains is detected, the measuring of the mains input voltage is stopped for a
period of 6 ms to improve efficiency. In burst mode this waiting period is enlarged to 97 ms
to improve efficiency.
A positive dV/dt is measured when succeeding samples cross the brownin level (Ibi(HV)) or
the mains high level (IIH(HV); see Figure 7).
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Detecting mains connection by +dV/dt
TEA18363LT
Product data sheet
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Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
8 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
If the system does not detect a positive dV/dt for 28 ms, it assumes that the mains is
disconnected. In that case the HV pin is continuously pulled to ground, discharging the
external X-capacitor.
7.5 Auxiliary winding
The VCC pin is connected via a diode and a capacitor to the auxiliary winding to efficiently
supply the control IC.
To detect demagnetization, valley, and input and output voltage, the auxiliary winding is
connected to the AUX pin via a resistive divider (see Figure 3). Each switching cycle is
divided in sections. During each section the system knows if the voltage or current out of
the AUX pin reflects the demagnetization, valley, input or output voltage (see Figure 8).
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Fig 8.
AUX pin used for demagnetization, valley, and input and output voltage
measurement
When the external MOSFET is switched on, the voltage at the auxiliary winding reflects
the input voltage. The AUX pin is clamped to 0.7 V. The output current is a measure of
the input voltage. This current value is internally used for an accurate OPP.
The demagnetization, valley and output voltages are measured as a voltage on the AUX
pin. In this way, the input voltage measurement and OVP can be adjusted independently.
7.6 Protection
If a protection is triggered, the controller stops switching. Depending on the protection
triggered and the IC version, the protection causes a restart or latches the converter to an
off state (see Table 3).
To avoid false triggering, some protections have a built-in delay.
TEA18363LT
Product data sheet
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Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
9 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
Table 3.
Protections
Protection
Delay
Action
VCC regulated
AUX open
no
wait until AUX is
connected
no
brownout
30 ms
wait until
Vmains > Vbrownin
yes
maximum on-time
no
safe restart 800 ms
yes
OTP internal
no
latch
yes
OVP via the AUX pin
4 driver pulses
latch
yes
overpower
compensation
no
via AUX;
cycle-by-cycle
-
overpower time-out
40 ms or 200 ms
latch
yes
overpower + UVLO
no
latch
yes
overcurrent protection
blanking time
cycle-by-cycle
no
UVLO
no
Wait until VCC > Vstartup yes
When the system stops switching, the VCC pin is not supplied via the auxiliary winding
anymore. Depending on the protection triggered, the VCC is regulated to Vstartup via the
HV pin (see Table 3).
Releasing the latched protections or shortening the safe restart timer can be achieved by
removing or shorting the mains voltage. This is called a fast latch reset. It is mainly used
to shorten the test time in production (see Section 7.6.7).
7.6.1 OverPower Protection (OPP)
The overpower function is used to realize a maximum output power which is nearly
constant over the full input mains.
The overpower compensation circuit measures the input voltage via the AUX pin and
outputs two reference voltages (see Figure 1). If the measured voltage at the ISENSE pin
exceeds the highest reference voltage (Vopc(ISENSE)) the DRIVER output is pulled low. If
the measured ISENSE voltage exceeds the lower reference voltage (Vopp(ISENSE)), the
OverPower counter starts. Both reference voltages depend on the measured input
voltage. In this way the system allows 150 % overpower over the rated power on a
cycle-by-cycle base. 100 % overpower triggers the overpower counter of 200 ms. Figure 9
shows the overpower protection curves.
TEA18363LT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
10 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
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Fig 9.
Overpower protection curves
During system start-up, the maximum overpower is limited to 100 % and the maximum
time-out period is lowered to 40 ms. Once the output voltage is within its regulation level
(voltage on the CTRL pin is below 5 V), the maximum overpower is switched to 150 %
and the maximum time-out period returns to 200 ms limiting the output power to a
minimum at a shorted output. Lowering the maximum output power and shortening the
overpower timer ensure that the input power of the system is limited to < 5 W at a shorted
output.
Due to the limited output power, the output voltage drops if the load requires more than
150 %. As a result, the VCC voltage drops as well and UVLO can be triggered. To retain
the same response in an overpower situation (whether UVLO is triggered or not) the
system enters the protection mode (latch or safe restart) when overpower + UVLO is
detected. The system entering the protection mode does not depend on the value of the
OP counter.
7.6.2 OverVoltage Protection (OVP)
An accurate output OVP is implemented by measuring the voltage at the AUX pin during
the secondary stroke. As the auxiliary winding voltage is a well-defined replica of the
output voltage, the OVP level can be adjusted by the external resistor divider ratio
RAUX2 / (RAUX1 + RAUX2).
An internal counter of 4 gate pulses prevents false OVP detection which can occur during
ESD or lightning events.
7.6.3 OverTemperature Protection (OTP)
Integrated OTP ensures that the IC stops switching if the junction temperature exceeds
the thermal temperature shutdown limit. OTP is a latched protection.
7.6.4 Maximum on-time
The controller limits the on-time of the external MOSFET to 55 s. When the on-time is
longer, the IC stops switching and enters safe restart mode.
TEA18363LT
Product data sheet
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Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
11 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
7.6.5 Safe restart
If a protection is triggered and the system enters the safe restart mode, the system
restarts after 800 ms. Because the system is not switching, the VCC pin is supplied from
the mains via the HV pin.
After the 800 ms, the control IC measures the mains voltage. if the mains voltage exceeds
the brownin level, the control IC the internal voltage sources connected to the CTRL pin.
Once the voltage on the CTRL pin reaches a minimum level, the soft start capacitor on the
ISENSE pin is charged and the system starts switching again.
The VCC is continuously regulated to the Vstartup level until the output voltage is within the
regulation level again.
7.6.6 Latched protection
If a protection is triggered and the system enters the latched protection mode, the VCC is
continuously regulated to the Vstartup level via the HV current source. As long as the AC
voltage remains, the system does not switch.
Removing the mains for a short time is the only possibility to restart the system.
7.6.7 Fast latch reset
Fast latch reset is a simple and fast method to reset the system when it is in latched
protection mode or safe restart mode. This function is used during production testing.
When the latched protection mode or safe restart mode is triggered, the voltage on pin
VCC is fast discharged by an internal current source (ICC(dch)); see Figure 10). The fast
discharge avoids an additional waiting period if the VCC voltage is high. When shorting
the mains, the waiting period is only the time of the discharge from Vstartup to Vrst.
TEA18363LT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
12 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
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Fig 10. Fast latch reset
Using a 10 F VCC capacitor, the fast latch reset time is below 0.6 s. If the mains is not
shorted but removed, a discharged of the X-cap can cause an additional waiting time.
7.7 Burst mode operation (CTRL pin)
The controller enters the burst mode when a low output power causes the voltage on the
CTRL pin to drop below 0.5 V.
During normal operation, the primary opto current can be calculated with Equation 1:
7 V – V IO CTRL
I opto = -------------------------------------------12 k
(1)
This implies that without any additional measure, the maximum primary opto current in
burst mode is:
7 V – 0 V
I opto = ---------------------------- = 583 A
12 k
(2)
Depending on the optocoupler used , the secondary opto current is even higher.
To achieve minimum no load input power, the internal voltage (7 V) is regulated to a value
that causes the primary opto current value to be 100 A when the system is in burst
mode. The secondary opto current is then automatically also within this lower range. If the
IC detects that the opto current is lower than 80 A, the internal voltage is increased faster
to achieve a small output voltage undershoot at a positive load step. Once the system
enters normal operation mode, the internal voltage is slowly increased to 7 V again.
TEA18363LT
Product data sheet
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Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
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TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
To avoid audible noise, a special digital burst mode is implemented. The minimum
switching frequency in this mode is 25 kHz. The burst mode repetition rate has a target
frequency of 800 Hz (1250 s; see Figure 11).
The amount of pulses at each burst period is defined by the requested output power. At
higher output power, the amount of switching pulses increases. At low load, it decreases.
The digital circuit defines the amount of burst cycles so that the burst frequency is below
the audible range (800 Hz) and the switching frequency exceeds the audible range
(25 kHz). Any audible noise is avoided.
The minimum amount of switching cycles is set to 3 to ensure good efficiency at very low
loads. To regulate the output power at a very low load, the system increases the burst
period (< 800 Hz). The increased burst period is still outside the audible range.
To further improve the no load input power and efficiency at low loads, the current
consumption of the IC is lowered to 235 A during the non-switching period in the burst
mode.
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Fig 11. Burst mode operation
To achieve a good transient response in burst mode, the system starts switching
immediately at an increased output load, allowing a shorter burst period. Eventually, it
regulates to the required burst period by increasing the amount of driver pulses
(see Figure 12).
TEA18363LT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
14 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
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Fig 12. Transient response in burst mode
Due to the discrete number of switching cycles, the new calculated number of pulses must
be 0.5 higher or lower than the existing number before one switching cycle is added or
taken away. For the IC to increase or decrease the amount of switching cycles, a certain
deviation from the target burst repetition frequency (800 Hz) is required because of the
internal algorithm. This deviation becomes smaller when the amount of switching cycles
increases. Figure 13 shows the upper and lower limits of the burst repetition frequency as
a function of the number of pulses.
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Fig 13. Upper and lower limits of burst frequency
When the amount of driver pulses within one burst period exceeds 40, the system
switches to normal mode again.
During the burst period, the voltage on the CTRL pin is clamped to the minimum
Vclamp(CTRL). The current out of the CTRL pin is measured. If the current exceeds
Istop(CTRL), the burst period is terminated regardless of digital control. This feature ensures
a small overshoot at the output voltage when the load in burst mode suddenly reduces.
At the end of each burst period, the CTRL pin is pulled to the ground level for 12.5 s,
unless the current flowing from pin CTRL < 87 A, which usually occurs at a positive load
step.
TEA18363LT
Product data sheet
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Rev. 2 — 12 December 2013
© NXP B.V. 2013. All rights reserved.
15 of 27
TEA18363LT
NXP Semiconductors
GreenChip SMPS control IC
7.8 Soft start-up (ISENSE pin)
To prevent audible noise during start-up or a restart condition, a soft start feature is
implemented. Before the converter starts, the soft start capacitor CSS on the ISENSE pin
is charged. When the converter starts switching, the primary peak current slowly
increases as the soft start capacitor discharges through the soft start resistor RSS
(see Figure 3).
The soft start time constant is set by the external soft start capacitor and the parallel
resistor values.
7.9 Driver (DRIVER pin)
The driver circuit to the gate of the power MOSFET has a current sourcing capability of
300 mA and a current sink capability of 750 mA. These capabilities allow a fast turn-on
and turn-off of the power MOSFET for efficient operation.
The maximum driver output is limited to 10.5 V. The DRIVER output pin can be connected
to the gate of a MOSFET directly or via a resistor.
TEA18363LT
Product data sheet
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8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
0.4
+700
V
continuous
0.4
+30
V
t < 100 ms
Voltages
VIO(HV)
input/output voltage on pin
HV
VCC
supply voltage
-
+35
V
VIO(CTRL)
input/output voltage on pin
CTRL
0.4
+12
V
VI(ISENSE)
input voltage on pin
ISENSE
0.4
+12
V
VIO(AUX)
input/output voltage on pin
AUX
5
+5
V
VO(DRIVER)
output voltage on pin
DRIVER
0.4
+12
V
IIO(AUX)
input/output current on pin
AUX
1.5
+1
mA
IIO(HV)
input/output current on pin
HV
1
+5
mA
IIO(CTRL)
input/output current on pin
CTRL
3
0
mA
IO(DRIVER)
output current on pin
DRIVER
< 10 %
0.4
+1
A
Ptot
total power dissipation
Tamb < 75 C
-
0.82
W
Tstg
storage temperature
55
+150
C
Tj
junction temperature
40
+150
C
1000
+1000
V
2000
+2000
V
500
+500
V
current limited
Currents
General
ESD
VESD
electrostatic discharge
voltage
class 1
human body
model
[1]
pin HV
all other pins
charged device
model
TEA18363LT
Product data sheet
[2]
[1]
Equivalent to discharge a 100 pF capacitor through a 1.5 k series resistor.
[2]
Equivalent to discharge a 200 pF capacitor through a 0.75 H coil and 10 .
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9. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction
to ambient
in free air;
JEDEC test board
91
K/W
Rth(j-c)
thermal resistance from junction
to case
in free air;
JEDEC test board
37.8
K/W
10. Characteristics
Table 6.
Characteristics
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
start-up current on pin
HV
VHV > 10 V
0.8
1.1
1.4
mA
VCC > Vstartup;
HV not sampling
-
-
1
A
clamp voltage
IHV < 2 mA
-
-
680
V
13.4
14.9
16.4
V
9.9
11
12.1
V
9
9.9
10.8
V
Start-up current source (HV pin)
Istartup(HV)
Vclamp
Supply voltage management (VCC pin)
Vstartup
start-up voltage
Vrestart
restart voltage
Vth(UVLO)
undervoltage lockout
threshold voltage
Vrst
reset voltage
ICC(startup)
start-up supply current
burst mode
7.75
8.65
9.55
V
VHV = 0 V
-
40
-
A
VHV > 10 V
1.35
1.05
0.75
mA
ICC(oper)
operating supply current
driver unloaded;
excluding opto current
500
600
700
A
ICC(burst)
burst mode supply
current
non-switching;
excluding opto current
200
235
270
A
ICC(prot)
protection supply current
185
220
255
A
ICC(dch)
discharge supply current latched protection;
VCC > Vstartup
0.9
1.25
1.6
mA
Mains detect (HV pin)
tp(HV)
pulse duration on pin HV measuring mains
voltage
18
20
22
s
fmeas(HV)
measurement frequency measuring mains
on pin HV
voltage
0.9
1.0
1.1
kHz
td(norm)HV
normal mode delay time
on pin HV
5
6
7
ms
td(burst)HV
burst mode delay time on measuring mains
pin HV
voltage
87
97
107
ms
Ibo(HV)
brownout current on pin
HV
552
587
622
A
TEA18363LT
Product data sheet
measuring mains
voltage
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GreenChip SMPS control IC
Table 6.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Ibi(HV)
Conditions
Min
Typ
Max
Unit
brownin current on pin
HV
623
663
703
A
Ibo(hys)HV
hysteresis of brownout
current on pin HV
-
76
-
A
IIH(HV)
HIGH-level input current
on pin HV
1186
1262
1338
A
IIL(HV)
LOW-level input current
on pin HV
1118
1190
1262
A
IHL(hys)HV
HIGH to LOW hysteresis
current on pin HV
-
72
-
A
Iclamp(HV)
clamp current on pin HV
-
-
1.7
mA
Vmeas(HV)
measurement voltage on brownin/brownout
pin HV
-
2.6
-
V
td(dch)
discharge delay time
-
28
-
ms
td(det)bo
brownout detection delay
time
-
30
-
ms
minimum flyback peak
current
2.3
2.5
2.7
V
maximum flyback
current
4.9
5.25
5.6
V
10
12
14
k
VCTRL = 1.5 V
0.58
0.48
0.38
mA
VCTRL = 3.5 V
0.385
0.315
0.245
mA
4.7
5
5.3
V
during measurement
time
X capacitor discharge;
pin HV
Peak current control (pin CTRL)
VIO(CTRL)
input/output voltage on
pin CTRL
Rint(CTRL)
internal resistance on pin
CTRL
IIO(CTRL)
input/output current on
pin CTRL
Vstartup(CTRL)
normal mode
start-up voltage on pin
CTRL
Burst mode (pin CTRL)
Vth(burst)
burst mode threshold
voltage
0.42
0.5
0.58
V
Tburst
burst mode period
-
1250
-
s
fsw(min)
minimum switching
frequency
burst mode
23
25
27
kHz
Iregd(CTRL)
regulated current on pin
CTRL
burst mode
115
100
85
A
Vclamp(CTRL)
clamp voltage on pin
CTRL
burst mode;
system switching
0.44
0.5
0.56
V
Istop(CTRL)
stop current on pin CTRL burst mode;
system switching;
including regulated
output current
820
750
680
A
TEA18363LT
Product data sheet
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NXP Semiconductors
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Table 6.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
tpd(CTRL)
pull-down time on pin
CTRL
Idet(CTRL)
detection current on pin
CTRL
Min
Typ
Max
Unit
10
12.5
15
s
positive load step
65
80
95
A
disable pulling down the
CTRL pin
77
87
97
A
Oscillator
fsw(max)
maximum switching
frequency
125
132.5
140
kHz
fsw(min)
minimum switching
frequency
23
25
27
kHz
Vstart(red)f
frequency reduction start pin CTRL
voltage
2.3
2.5
2.7
V
V/t = 0 V/s;
IAUX = 0 A;
VCTRL = 5.5 V
700
765
830
mV
frequency reduction
mode; V/t = 0 mV/s;
IAUX = 0 A;
190
207
225
mV
Current sense (pin ISENSE)
Vsense(max)
maximum sense voltage
VCTRL = 1.0 V
tPD(sense)
sense propagation delay from the ISENSE pin
reaching Vsense(max) to
driver off;
VISENSE pulse-stepping
100 mV around
Vsense(max)
-
120
-
ns
tleb
leading edge blanking
time
275
325
375
ns
85
75
65
A
-
Vsense(max)
-
V
12
-
-
k
Soft start (pin ISENSE)
Istart(soft)
soft start current
Vstart(soft)
soft start voltage
Rstart(soft)
soft start resistance
enable voltage
Demagnetization and valley control (pin AUX)
Vdet(demag)
demagnetization
detection voltage
20
35
50
mV
Iprot(AUX)
protection current on pin
AUX
-
200
-
nA
tblank(det)demag
demagnetization
detection blanking time
1.8
2.2
2.6
s
(V/t)vrec
valley recognition
positive V/t
voltage change with time negative V/t
td(vrec-swon)
valley recognition to
switch-on delay time
Vclamp(AUX)
clamp voltage on pin
AUX
TEA18363LT
Product data sheet
IAUX = 1 mA
0.25
0.37
0.49
V/s
2.35
1.9
1.45
V/s
-
120
-
ns
4.4
4.8
5.2
V
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GreenChip SMPS control IC
Table 6.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
tsup(xfmr_ring)
transformer ringing
suppression time
Conditions
Min
Typ
Max
Unit
1.9
2.3
2.7
s
45
55
65
s
Maximum on-time (pin DRIVER)
ton(max)
maximum on-time
Driver (pin DRIVER)
Isource(DRIVER)
source current on pin
DRIVER
VDRIVER = 2 V
-
0.3
0.25
A
Isink(DRIVER)
sink current on pin
DRIVER
VDRIVER = 2 V
0.25
0.3
-
A
VDRIVER = 10 V
0.6
0.75
-
A
VO(DRIVER)max
maximum output voltage
on pin DRIVER
9
10.5
12
V
Overpower compensation (pin ISENSE and pin AUX)
Vclamp(AUX)
clamp voltage on pin
AUX
primary stroke;
IAUX = 0.3 mA
0.8
0.7
0.6
V
td(clamp)AUX
clamp delay time on pin
AUX
after rising edge of pin
DRIVER
580
665
750
ns
after falling edge of pin
DRIVER
1.8
2.2
2.6
s
700
765
830
mV
400
450
500
mV
IAUX = 0.3 mA
450
500
550
mV
IAUX = 1.46 mA
265
295
325
mV
start-up mode;
VCTRL > 5 V
36
40
44
ms
normal mode
180
200
220
ms
720
800
820
ms
2.88
3
3.12
V
1.9
2.3
2.7
s
130
140
150
°C
Vopc(ISENSE)
Vopp(ISENSE)
td(opp)
td(restart)
overpower
IAUX = 0.3 mA
compensation voltage on I
AUX = 1.46 mA
pin ISENSE
overpower protection
voltage on pin ISENSE
overpower protection
delay time
counter trigger level
restart delay time
Overvoltage protection (pin AUX)
Vovp(AUX)
overvoltage protection
voltage on pin AUX
tdet(ovp)
overvoltage protection
detection time
in the secondary stroke
Temperature protection
Tpl(IC)
TEA18363LT
Product data sheet
IC protection level
temperature
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NXP Semiconductors
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11. Application information
A power supply with TEA18363LT is a flyback converter operating in QR mode or DCM
(See Figure 3).
Capacitor CVCC buffers the IC supply voltage. The IC supply voltage is powered from the
mains via D1, D2, RHV during start-up. It is powered via the auxiliary winding during
normal operation. RHV defines the current into the HV pin for brownout detection and
mains detection.
Sense resistor Rsense converts the current through MOSFET S1 into a voltage on pin
ISENSE. The value of Rsense defines the maximum primary peak current through
MOSFET S1. Resistor RSS and capacitor CSS define the soft start time.
Resistor RDRIVER is required to limit the current spikes to pin DRIVER because of parasitic
inductance of the current sense resistor Rsense. RDRIVER also dampens possible oscillation
of MOSFET S1. Adding a bead on the gate pin of MOSFET S1 can be required to prevent
local oscillations of the MOSFET.
The resistor RAUX2 determines the compensation for input voltage variation. The ratio of
RAUX1 and RAUX2 determines the overvoltage protection at the AUX pin.
TEA18363LT
Product data sheet
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NXP Semiconductors
GreenChip SMPS control IC
12. Package outline
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Fig 14. Package outline SOT96-1 (SO8)
TEA18363LT
Product data sheet
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GreenChip SMPS control IC
13. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA18363LT v.2
20131212
Product data sheet
-
TEA18363LT v.1
Modifications:
TEA18363LT v.1
TEA18363LT
Product data sheet
•
•
The data sheet status has changed from preliminary to product.
Table 1 “Ordering information” has been updated.
20131204
Preliminary data sheet
-
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Rev. 2 — 12 December 2013
-
© NXP B.V. 2013. All rights reserved.
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NXP Semiconductors
GreenChip SMPS control IC
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA18363LT
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2013
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NXP Semiconductors
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TEA18363LT
Product data sheet
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NXP Semiconductors
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16. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
7.1
7.1.1
7.2
7.3
7.4
7.5
7.6
7.6.1
7.6.2
7.6.3
7.6.4
7.6.5
7.6.6
7.6.7
7.7
7.8
7.9
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
Green features . . . . . . . . . . . . . . . . . . . . . . . . . 2
Protection features . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
General control . . . . . . . . . . . . . . . . . . . . . . . . . 5
Start-up and UnderVoltage LockOut (UVLO) . . 5
Modes of operation . . . . . . . . . . . . . . . . . . . . . . 6
Supply management. . . . . . . . . . . . . . . . . . . . . 7
Mains voltage measuring . . . . . . . . . . . . . . . . . 8
Auxiliary winding . . . . . . . . . . . . . . . . . . . . . . . . 9
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
OverPower Protection (OPP) . . . . . . . . . . . . . 10
OverVoltage Protection (OVP) . . . . . . . . . . . . 11
OverTemperature Protection (OTP) . . . . . . . . 11
Maximum on-time . . . . . . . . . . . . . . . . . . . . . . 11
Safe restart . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Latched protection . . . . . . . . . . . . . . . . . . . . . 12
Fast latch reset . . . . . . . . . . . . . . . . . . . . . . . . 12
Burst mode operation (CTRL pin). . . . . . . . . . 13
Soft start-up (ISENSE pin) . . . . . . . . . . . . . . . 16
Driver (DRIVER pin) . . . . . . . . . . . . . . . . . . . . 16
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17
Thermal characteristics . . . . . . . . . . . . . . . . . 18
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 18
Application information. . . . . . . . . . . . . . . . . . 22
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information. . . . . . . . . . . . . . . . . . . . . 26
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 12 December 2013
Document identifier: TEA18363LT