MLX81200 Abstract old 682 DownloadLink 5500

MLX81200
BLDC Motor Controller
Features
MelexCM DUAL RISC CPU
o
o
o
MLX4 communication CPU
o LIN transceiver, supporting of LIN 2.0, LIN protocol software provided by Melexis
o Software update for J2602 or GM-LAN possible
o Wake up by LIN traffic or local sources
MLX16 application CPU
o 16bit RISC-CPU with 5MIPS
o hardware multiplication in one instruction cycle
o C-programmable
Memories
o 2kbyte shared RAM
o 30kbyte shared Flash with EEC, programmable through LIN pins
8kbytes for communication CPU, 22kbytes for application CPU
o 128bytes emulated EEPROM
Motor Control Unit
o
o
o
Support of sensor less 3-phase sine and trapezoidal motor control
Support of sensor based motor control
Pre-driver for 3 all N-FET half bridges (~25Ω Rdson) with several protection features
Voltage Regulator
o
o
o
o
Direct powered from 12V board net with low voltage detection
Operating voltage VS = 6V to 18V
Internal voltage regulator, possibility to put an external bypass transistor for higher
temperature requirements
Very low standby current, < 50µA in sleep mode
Periphery
o
o
o
o
o
o
o
o
Full duplex SPI: Master/Slave, double buffered, speed programmable from 10kHz to 8MHz
3 independent 16bit timer modules with capture and compare
3 programmable 8bit PWM units with base frequency of 50Hz to 100kHz
10bit ADC converter (5µs conversion time)
On chip over-temperature shut-off
Digital watchdog on MelexCM and independent analog watchdog on analog IC
On chip RC oscillator
Switchable supply output for external sensors
Additional Features
o
o
In-circuit debug and emulation
Jump start and 40V load dump protected
Applications
Applications
All kinds of BLDC motor controllers via external FET transistors like
o
X-by-wire applications using
position sensors
MLX81200 Product Abstract
o
o
o
Oil, water, fuel pumps
Blowers
Compressors
Page 1 of 14
23.10.2008
Rev 2.3
MLX81200
BLDC Motor Controller
Contents
1.
FUNCTIONAL DIAGRAM ........................................................................................................................ 3
2.
ELECTRICAL CHARACTERISTICS........................................................................................................ 4
2.1
2.2
3.
OPERATING CONDITIONS .................................................................................................................... 4
ABSOLUTE MAXIMUM RATINGS ............................................................................................................ 4
APPLICATION EXAMPLES..................................................................................................................... 5
3.1
3.2
3.3
BLDC MOTOR CONTROL .................................................................................................................... 5
BLDC MOTOR CONTROL VIA LIN BUS CONNECTION ............................................................................ 6
BLDC MOTOR CONTROL VIA CAN BUS CONNECTION .......................................................................... 7
4.
PIN DESCRIPTION .................................................................................................................................. 8
5.
MECHANICAL SPECIFICATION ........................................................................................................... 10
5.1
5.2
QFN 7X7 (48 LEADS)........................................................................................................................ 10
TQFP_EP 7X7 (48 LEADS)............................................................................................................... 11
6.
ASSEMBLY INFORMATION.................................................................................................................. 12
7.
DISCLAIMER.......................................................................................................................................... 13
MLX81200 Product Abstract
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Rev 2.3
MLX81200
BLDC Motor Controller
1.
Functional Diagram
Figure 1 - Block Diagram
MLX81200 Product Abstract
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Rev 2.3
MLX81200
BLDC Motor Controller
2.
Electrical Characteristics
Characteristics
All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum
ratings given in the table below are limiting values that do not lead to a permanent damage of the device but
exceeding any of these limits may do so. Long term exposure to limiting values may affect the reliability of
the device. Reliable operation of the MLX81200 is only specified within the limits shown in Operating
conditions.
2.1 Operating Conditions
Parameter
Symbol
Min
Max
Unit
VS
6
18
V
Tamb
-40
+125
(+150)[1]
°C
Battery supply voltage
Operating ambient temperature
Table 1 - Operating Conditions
2.2 Absolute Maximum Ratings
Parameter
Battery supply voltage
Maximum reverse current into any pin
LIN bus voltage
Transient supply voltage
Transient supply voltage
Transient supply voltage
Transient LIN bus voltage
Transient LIN bus voltage
Transient LIN bus voltage
DC voltage on CMOS I/O pins
ESD capability of pin LIN
Symbol
T < 1 min
T < 500 ms
VS
IREV
VBUS
VS.tr1
VS.tr2
VS.tr3
VBUS.tr1
VBUS.tr2
VBUS.tr3
VDC
t < 500 ms
ISO 7637/1 pulse 1 [2]
ISO 7637/1 pulses 2 [2]
ISO 7637/1 pulses 3A, 3B
ISO 7637/1 pulse 1 [3]
ISO 7637/1 pulses 2 [3]
ISO 7637/1 pulses 3A, 3B [3]
ESDBUSHB
ESD capability of any other pins
ESDHB
Maximum latch–up free current at any Pin
Maximum power dissipation [4]
Storage temperature
Junction temperature [1]
ILATCH
Ptot
Tstg
Tvj
Condition
Human body model, equivalent to
discharge 100pF with 1.5kΩ,
Human body model, equivalent to
discharge 100pF with 1.5kΩ,
Min
Max
-0.3
28
45
+10
40
-10
-20
-150
Unit
V
-150
-0.3
+100
+150
+5.5
mA
V
V
V
V
V
V
V
V
-4
+4
kV
-2
+2
kV
-250
+250
0.2
+150
+155
mA
W
°C
°C
-150
-150
Tamb = +150 °C
[1]
-55
+100
+150
Table 2 - Absolute Maximum Ratings
[1]
Target temperature after qualification. With temperature applications at TA>125°C a reduction of chip internal power dissipation with
external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time, customers mission
profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant.
[2]
ISO 7637 test pulses are applied to VS via a reverse polarity diode and >1µF blocking capacitor .
[3]
ISO 7637 test pulses are applied to BUS via a coupling capacitance of 1nF.
[4]
Simulated value for low conductance board (JEDEC)
MLX81200 Product Abstract
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Rev 2.3
MLX81200
BLDC Motor Controller
3.
Application
Application Examples
1
The following sections show typical application examples .
3.1 BLDC Motor Control
In this sample application the IC can realize the sensor less driving of a BLDC motor via three external
power N-FET half bridges. The high side N-FET driving is done with a bootstrap output stage. The motor
speed command can be sent to an SW-pin, for example as duty cycle percentage. In this case SW4 can be
configured as timer input and the motor speed is a function of the duty cycle of the speed command signal.
The rotor position can be estimated based on motor currents at stand-still and very low speeds and by
sensing the back EMF voltage during short periods of time when the current through a phase is zero. The
motor phases can be driven with sinusoidal or trapezoidal currents. In the principle application schematic of
figure 2, the motor star point is not available. Instead it is modelled with external resistors from the motor
phases and connected to T input.
Motor current is controlled with an external shunt resistor and a fast internal comparator. The comparator
threshold is programmable with an 8-bit digital-to-analogue converter. In case of over current the bridge will
be switched off. The motor current can also be measured by the 10-bit ADC converter. Reverse polarity
protection of the bridge is realized with an external power FET connected to the ground line.
VS
VBAT
CLKO
VREF
VS
VDDR5
VCC
VBAT_S1
VS
VBAT_S2
VDDV5
CP0
VDDV18
VBAT
HS0
CWD
U
V5EXT
SW5
LS0
SW1
SW2
SW3
Speed
Command
SW4
IO0
IO1
MLX81200
SW0
CP1
VBAT
HS1
V
SW6
LS1
CP2
VBAT
HS2
IO2
IO3
W
IO4
SW7
IO5
LS2
U V W
TI0
TI1
TO
LIN
VBAT
T
Rshunt
GND_S1
GND
GND
GND_S2
GND
Figure 2 – Typical BLDC Motor Control Application Example 1
1
The application examples are principal application schematics only. The details need to be worked out for
each application schematic separately, depending on the application requirements.
MLX81200 Product Abstract
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Rev 2.3
MLX81200
BLDC Motor Controller
3.2 BLDC Motor Control via LIN Bus Connection
In this sample application the IC can realize the sensor less driving of a BLDC motor via three external
power N-FET half bridges. Communication to the chip is possible via the LIN bus. Active high side reverse
polarity protection can be implemented using a bootstrap stage connected to the CLKO output.
For higher temperature requirements, an external regulator transistor can bring the regulator power
consumption to outside the chip. Two of the general purpose inputs are used to connect external sensors to
the ADC. The sensor supply voltage can be switched off. The motor current measurement and over current
protection can be implemented via a shunt resistor in the battery path.
VBAT
CLKO
VBAT_S1
Rshunt
VS
VBAT_S2
VDDR5
VCC
Vprot
VREF
VDDV5
CP0
VDDV18
Vprot
HS0
CWD
U
V5EXT
SW5
LS0
SW1
SW2
SW3
SW4
IO0
IO1
MLX81200
SW0
CP1
Vprot
HS1
V
SW6
LS1
CP2
Vprot
HS2
IO2
IO3
IO4
IO5
TI0
TI1
TO
LIN
LIN
GND
GND
W
SW7
LS2
GND_S1
GND_S2
U V W
T
GND
Figure 3 – Typical LIN Bus Application Example with Active Reverse Polarity Protection2
2
The application examples are principal application schematics only. The details need to be worked out for
each application schematic separately, depending on the application requirements.
MLX81200 Product Abstract
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Rev 2.3
MLX81200
BLDC Motor Controller
3.3 BLDC Motor Control via CAN Bus Connection
In this sample application the IC can realize the driving of a BLDC motor via three external power N-FET half
bridges. Hall sensors are used to determine the rotor position. In case of battery break-down, the IC is still
capable to save sensitive data into the EEPROM, with the help of the energy stored in the 5V supply
capacitor. The current in both, the supply and ground path can be monitored. The SPI interface is used to
connect the IC to the CAN bus.
CLKO
VBAT
VBAT_S1
VBAT
Rshunt
VS
VBAT_S2
VDDR5
Vprot
VREF
VCC
VDDV5
CWD
VDDV18
CP0
Vprot
HS0
Hall
sensor
V5EXT
U
SW0
LS0
SW1
Vprot
SW4
SW5
SW7
VCC
EN
VCC
STB
CANH
CANL
Vprot
HS1
V
LS1
SW6
INH
CAN
Transceiver
(TJA1041)
CP1
MLX81200
SW2
SW3
VCC
CP2
Vprot
HS2
TxD
CS
RxD
CAN
Controller
(MCP2515)
IO0
IO1
SO
IO2
SI
IO3
CLK
IO4
INT
IO5
W
LS2
TI0
TI1
TO
LIN
GND
GND
VBAT
GND_S1
Rshunt
T
GND_S2
GND
Figure 4 – Typical CAN Bus Application Example
3
3
The application examples are principal application schematics only. The details need to be worked out for
each application schematic separately, depending on the application requirements.
MLX81200 Product Abstract
Page 7 of 14
23.10.2008
Rev 2.3
MLX81200
BLDC Motor Controller
4.
Pin Description
Table 3 - Pin Description MLX81200
Pin №
Name
Type
Function
1
IO0
IO
General purpose input or output
2
V5EXT
IO
Switchable 5V supply for external sensors
3
IO5
IO
General purpose input or output
4
GNDA
GND
Analog ground
5
GNDLIN
GND
LIN ground
6
TO
O
Test output, debug interface
7
IO1
IO
General purpose input or output
8
LIN
IO
Connection to LIN bus
9
IO4
IO
General purpose input or output
10
IO2
IO
General purpose input or output
11
TI1
I
Test input, debug interface
12
IO3
IO
General purpose input or output
13
GNDIO
O
Switches ground
14
TI0
I
Test input, debug interface
15
CLKO
O
300kHz clock output, switchable
16
SW7
IO
HV GPIO, phase W input to BEMF comp and phase integrator
17
SW6
IO
HV GPIO, phase V input to BEMF comp and phase integrator
18
SW5
IO
HV GPIO, phase U input to BEMF comp and phase integrator
19
SW4
IO
HV GPIO
20
SW3
IO
HV GPIO
21
SW2
IO
HV GPIO
22
SW1
IO
HV GPIO
23
SW0
IO
HV GPIO
24
W
I
Motor phase W input to HS2 buffer
25
HS2
O
N-FET high side gate driver 2
26
CP2
O
High side bootstrap capacitor driver 2
27
LS2
O
N-FET low side gate driver 2
28
LS1
O
N-FET low side gate driver 1
29
CP1
O
High side bootstrap capacitor driver 1
30
HS1
O
N-FET high side gate driver 1
31
V
I
Motor phase V input to HS1 buffer
32
GNDDRV
GND
Driver ground
33
U
I
Motor phase U input to HS0 buffer
34
HS0
O
N-FET high side gate driver 0
35
CP0
O
High side bootstrap capacitor driver 0
36
LS0
O
N-FET low side gate driver 0
37
T
I
Electrical commutation input motor phase T
38
VREF
IO
Clamped 12V reference voltage for bootstrap
39
VBAT_S1
I
VS high side input for current sensing
40
VBAT_S2
I
VS low side input for current sensing
41
GND_S1
I
GND high side input for current sensing
42
GND_S2
I
GND low side input for current sensing
MLX81200 Product Abstract
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Rev 2.3
MLX81200
BLDC Motor Controller
43
VS
P
HV supply, battery voltage
44
GNDD
GND
Digital ground
45
VDDV18
P
Regulator Output 1.8V, MELEXCM 1.8V supply
46
VDDR5
O
Output for external voltage regulation transistor
47
VDDV5
P
Regulator Output 5V, MELEXCM 5V supply
48
CWD
IO
Watchdog capacitor
MLX81200 Product Abstract
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Rev 2.3
MLX81200
BLDC Motor Controller
5.
Mechanical Specification
L
E2
A3
A1
A
E2/2
E
(Ne-1)xe ref.
k
5.1 QFN 7x7 (48 leads)
Figure 3 - QFN48 7x7 Drawing
Symbol
QFN48
A
A1
A2
A3 B [4]
D
D1
D2
E
E1
E2
e
L
5.30
5.30
0.45
min 0.80 0 0.60
nom 0.85 0.02 0.65 0.20
7.00 6.70 5.40 7.00 6.70 5.40 0.50 0.50
max
0.90 0.05 0.70
12°
5.50
5.50
0.55
N [3] Nd [5] Ne [5]
[1] [2]
48
12
12
Table 4 - QFN48 7x7 Package Dimensions
[1]
[2]
[3]
[4]
[5]
Dimensions and tolerances conform to ASME Y14.5M-1994
All dimensions are in millimeters. All angels are in degrees
N is the number of terminals
Dimension b applies to metallized terminal and is measured between 0.25 and 0.30mm from terminal tip
Nd and Ne refer to the number of terminals on each D and E side respectively
MLX81200 Product Abstract
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Rev 2.3
MLX81200
BLDC Motor Controller
5.2 TQFP_EP 7x7 (48 leads)
A
A1
A2
b
b1
Min
-
0.05
0.95
0.17
0.17
Nom
-
-
1.00
0.22
0.20
Max
1.20
0.15
1.05
0.27
0.23
D
D1
D2
E
E1
E2
e
L
N
0.45
9.00
7.00
5.00
9.00
7.00
5.00
0.50
0.60
0.75
48
ccc
ddd
-
-
-
-
0.08
0.08
Notes:
1. All Dimensioning and Tolerances conform to ASME Y14.5M-1994,
∆2. Datum Plane [-|-|-] located at Mould Parting Line and coincident with Lead, where Lead exists, plastic body at bottom of parting line.
∆3. Datum [A-B] and [-D-] to be determined at centreline between leads where leads exist, plastic body at datum plane [-|-|-]
∆4. To be determined at seating plane [-C-]
∆5. Dimensions D1 and E1 do not include Mould protrusion. Dimensions D1 and E1 do not include mould protrusion. Allowable mould protrusion is 0.254 mm on D1 and E1 dimensions.
6. 'N' is the total number of terminals
∆7. These dimensions to be determined at datum plane [-|-|-]
8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package.
∆9. Dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition, dam bar can not
be located on the lower radius of the foot.
10. Controlling dimension millimetre.
11. maximum allowable die thickness to be assembled in this package family is 0.38mm
12. This outline conforms to JEDEC publication 95 Registration MS-026, Variation ABA, ABC & ABD.
∆13. A1 is defined as the distance from the seating plane to the lowest point of the package body.
∆14. Dimension D2 and E2 represent the size of the exposed pad. The actual dimensions are specified ion the bonding diagram, and are independent from die size.
15. Exposed pad shall be coplanar with bottom of package within 0.05.
Exposed pad need best
possible contact to ground for
exlectrical and thermal reasons
Figure 4 – TQFP_EP 7x7 Drawing
MLX81200 Product Abstract
Page 11 of 14
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Rev 2.3
MLX81200
BLDC Motor Controller
6.
Assembly Information
Standard information regarding manufacturability of Melexis products with different soldering
processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
•
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualification of RoHS compliant products (RoHS = European directive on the Restriction Of
the Use of Certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com.
MLX81200 Product Abstract
Page 12 of 14
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Rev 2.3
MLX81200
BLDC Motor Controller
7.
Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with Melexis for current information.
This product is intended for use in normal commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional
processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© Melexis NV. All rights reserved.
MLX81200 Product Abstract
Page 13 of 14
23.10.2008
Rev 2.3
MLX81200
BLDC Motor Controller
Your Notes
For the latest version of this document go to our website at
www.melexis.com
Or for additional information contact Melexis direct:
Europe and Japan:
Phone: +32 1367 0495
E-mail: [email protected]
All other locations:
Phone: +1 603 223 2362
E-mail: [email protected]
ISO/TS16949 and ISO14001 Certified
MLX81200 Product Abstract
Page 14 of 14
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Rev 2.3