MLX81200 BLDC Motor Controller Features MelexCM DUAL RISC CPU o o o MLX4 communication CPU o LIN transceiver, supporting of LIN 2.0, LIN protocol software provided by Melexis o Software update for J2602 or GM-LAN possible o Wake up by LIN traffic or local sources MLX16 application CPU o 16bit RISC-CPU with 5MIPS o hardware multiplication in one instruction cycle o C-programmable Memories o 2kbyte shared RAM o 30kbyte shared Flash with EEC, programmable through LIN pins 8kbytes for communication CPU, 22kbytes for application CPU o 128bytes emulated EEPROM Motor Control Unit o o o Support of sensor less 3-phase sine and trapezoidal motor control Support of sensor based motor control Pre-driver for 3 all N-FET half bridges (~25Ω Rdson) with several protection features Voltage Regulator o o o o Direct powered from 12V board net with low voltage detection Operating voltage VS = 6V to 18V Internal voltage regulator, possibility to put an external bypass transistor for higher temperature requirements Very low standby current, < 50µA in sleep mode Periphery o o o o o o o o Full duplex SPI: Master/Slave, double buffered, speed programmable from 10kHz to 8MHz 3 independent 16bit timer modules with capture and compare 3 programmable 8bit PWM units with base frequency of 50Hz to 100kHz 10bit ADC converter (5µs conversion time) On chip over-temperature shut-off Digital watchdog on MelexCM and independent analog watchdog on analog IC On chip RC oscillator Switchable supply output for external sensors Additional Features o o In-circuit debug and emulation Jump start and 40V load dump protected Applications Applications All kinds of BLDC motor controllers via external FET transistors like o X-by-wire applications using position sensors MLX81200 Product Abstract o o o Oil, water, fuel pumps Blowers Compressors Page 1 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller Contents 1. FUNCTIONAL DIAGRAM ........................................................................................................................ 3 2. ELECTRICAL CHARACTERISTICS........................................................................................................ 4 2.1 2.2 3. OPERATING CONDITIONS .................................................................................................................... 4 ABSOLUTE MAXIMUM RATINGS ............................................................................................................ 4 APPLICATION EXAMPLES..................................................................................................................... 5 3.1 3.2 3.3 BLDC MOTOR CONTROL .................................................................................................................... 5 BLDC MOTOR CONTROL VIA LIN BUS CONNECTION ............................................................................ 6 BLDC MOTOR CONTROL VIA CAN BUS CONNECTION .......................................................................... 7 4. PIN DESCRIPTION .................................................................................................................................. 8 5. MECHANICAL SPECIFICATION ........................................................................................................... 10 5.1 5.2 QFN 7X7 (48 LEADS)........................................................................................................................ 10 TQFP_EP 7X7 (48 LEADS)............................................................................................................... 11 6. ASSEMBLY INFORMATION.................................................................................................................. 12 7. DISCLAIMER.......................................................................................................................................... 13 MLX81200 Product Abstract Page 2 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 1. Functional Diagram Figure 1 - Block Diagram MLX81200 Product Abstract Page 3 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 2. Electrical Characteristics Characteristics All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum ratings given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposure to limiting values may affect the reliability of the device. Reliable operation of the MLX81200 is only specified within the limits shown in Operating conditions. 2.1 Operating Conditions Parameter Symbol Min Max Unit VS 6 18 V Tamb -40 +125 (+150)[1] °C Battery supply voltage Operating ambient temperature Table 1 - Operating Conditions 2.2 Absolute Maximum Ratings Parameter Battery supply voltage Maximum reverse current into any pin LIN bus voltage Transient supply voltage Transient supply voltage Transient supply voltage Transient LIN bus voltage Transient LIN bus voltage Transient LIN bus voltage DC voltage on CMOS I/O pins ESD capability of pin LIN Symbol T < 1 min T < 500 ms VS IREV VBUS VS.tr1 VS.tr2 VS.tr3 VBUS.tr1 VBUS.tr2 VBUS.tr3 VDC t < 500 ms ISO 7637/1 pulse 1 [2] ISO 7637/1 pulses 2 [2] ISO 7637/1 pulses 3A, 3B ISO 7637/1 pulse 1 [3] ISO 7637/1 pulses 2 [3] ISO 7637/1 pulses 3A, 3B [3] ESDBUSHB ESD capability of any other pins ESDHB Maximum latch–up free current at any Pin Maximum power dissipation [4] Storage temperature Junction temperature [1] ILATCH Ptot Tstg Tvj Condition Human body model, equivalent to discharge 100pF with 1.5kΩ, Human body model, equivalent to discharge 100pF with 1.5kΩ, Min Max -0.3 28 45 +10 40 -10 -20 -150 Unit V -150 -0.3 +100 +150 +5.5 mA V V V V V V V V -4 +4 kV -2 +2 kV -250 +250 0.2 +150 +155 mA W °C °C -150 -150 Tamb = +150 °C [1] -55 +100 +150 Table 2 - Absolute Maximum Ratings [1] Target temperature after qualification. With temperature applications at TA>125°C a reduction of chip internal power dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time, customers mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant. [2] ISO 7637 test pulses are applied to VS via a reverse polarity diode and >1µF blocking capacitor . [3] ISO 7637 test pulses are applied to BUS via a coupling capacitance of 1nF. [4] Simulated value for low conductance board (JEDEC) MLX81200 Product Abstract Page 4 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 3. Application Application Examples 1 The following sections show typical application examples . 3.1 BLDC Motor Control In this sample application the IC can realize the sensor less driving of a BLDC motor via three external power N-FET half bridges. The high side N-FET driving is done with a bootstrap output stage. The motor speed command can be sent to an SW-pin, for example as duty cycle percentage. In this case SW4 can be configured as timer input and the motor speed is a function of the duty cycle of the speed command signal. The rotor position can be estimated based on motor currents at stand-still and very low speeds and by sensing the back EMF voltage during short periods of time when the current through a phase is zero. The motor phases can be driven with sinusoidal or trapezoidal currents. In the principle application schematic of figure 2, the motor star point is not available. Instead it is modelled with external resistors from the motor phases and connected to T input. Motor current is controlled with an external shunt resistor and a fast internal comparator. The comparator threshold is programmable with an 8-bit digital-to-analogue converter. In case of over current the bridge will be switched off. The motor current can also be measured by the 10-bit ADC converter. Reverse polarity protection of the bridge is realized with an external power FET connected to the ground line. VS VBAT CLKO VREF VS VDDR5 VCC VBAT_S1 VS VBAT_S2 VDDV5 CP0 VDDV18 VBAT HS0 CWD U V5EXT SW5 LS0 SW1 SW2 SW3 Speed Command SW4 IO0 IO1 MLX81200 SW0 CP1 VBAT HS1 V SW6 LS1 CP2 VBAT HS2 IO2 IO3 W IO4 SW7 IO5 LS2 U V W TI0 TI1 TO LIN VBAT T Rshunt GND_S1 GND GND GND_S2 GND Figure 2 – Typical BLDC Motor Control Application Example 1 1 The application examples are principal application schematics only. The details need to be worked out for each application schematic separately, depending on the application requirements. MLX81200 Product Abstract Page 5 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 3.2 BLDC Motor Control via LIN Bus Connection In this sample application the IC can realize the sensor less driving of a BLDC motor via three external power N-FET half bridges. Communication to the chip is possible via the LIN bus. Active high side reverse polarity protection can be implemented using a bootstrap stage connected to the CLKO output. For higher temperature requirements, an external regulator transistor can bring the regulator power consumption to outside the chip. Two of the general purpose inputs are used to connect external sensors to the ADC. The sensor supply voltage can be switched off. The motor current measurement and over current protection can be implemented via a shunt resistor in the battery path. VBAT CLKO VBAT_S1 Rshunt VS VBAT_S2 VDDR5 VCC Vprot VREF VDDV5 CP0 VDDV18 Vprot HS0 CWD U V5EXT SW5 LS0 SW1 SW2 SW3 SW4 IO0 IO1 MLX81200 SW0 CP1 Vprot HS1 V SW6 LS1 CP2 Vprot HS2 IO2 IO3 IO4 IO5 TI0 TI1 TO LIN LIN GND GND W SW7 LS2 GND_S1 GND_S2 U V W T GND Figure 3 – Typical LIN Bus Application Example with Active Reverse Polarity Protection2 2 The application examples are principal application schematics only. The details need to be worked out for each application schematic separately, depending on the application requirements. MLX81200 Product Abstract Page 6 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 3.3 BLDC Motor Control via CAN Bus Connection In this sample application the IC can realize the driving of a BLDC motor via three external power N-FET half bridges. Hall sensors are used to determine the rotor position. In case of battery break-down, the IC is still capable to save sensitive data into the EEPROM, with the help of the energy stored in the 5V supply capacitor. The current in both, the supply and ground path can be monitored. The SPI interface is used to connect the IC to the CAN bus. CLKO VBAT VBAT_S1 VBAT Rshunt VS VBAT_S2 VDDR5 Vprot VREF VCC VDDV5 CWD VDDV18 CP0 Vprot HS0 Hall sensor V5EXT U SW0 LS0 SW1 Vprot SW4 SW5 SW7 VCC EN VCC STB CANH CANL Vprot HS1 V LS1 SW6 INH CAN Transceiver (TJA1041) CP1 MLX81200 SW2 SW3 VCC CP2 Vprot HS2 TxD CS RxD CAN Controller (MCP2515) IO0 IO1 SO IO2 SI IO3 CLK IO4 INT IO5 W LS2 TI0 TI1 TO LIN GND GND VBAT GND_S1 Rshunt T GND_S2 GND Figure 4 – Typical CAN Bus Application Example 3 3 The application examples are principal application schematics only. The details need to be worked out for each application schematic separately, depending on the application requirements. MLX81200 Product Abstract Page 7 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 4. Pin Description Table 3 - Pin Description MLX81200 Pin № Name Type Function 1 IO0 IO General purpose input or output 2 V5EXT IO Switchable 5V supply for external sensors 3 IO5 IO General purpose input or output 4 GNDA GND Analog ground 5 GNDLIN GND LIN ground 6 TO O Test output, debug interface 7 IO1 IO General purpose input or output 8 LIN IO Connection to LIN bus 9 IO4 IO General purpose input or output 10 IO2 IO General purpose input or output 11 TI1 I Test input, debug interface 12 IO3 IO General purpose input or output 13 GNDIO O Switches ground 14 TI0 I Test input, debug interface 15 CLKO O 300kHz clock output, switchable 16 SW7 IO HV GPIO, phase W input to BEMF comp and phase integrator 17 SW6 IO HV GPIO, phase V input to BEMF comp and phase integrator 18 SW5 IO HV GPIO, phase U input to BEMF comp and phase integrator 19 SW4 IO HV GPIO 20 SW3 IO HV GPIO 21 SW2 IO HV GPIO 22 SW1 IO HV GPIO 23 SW0 IO HV GPIO 24 W I Motor phase W input to HS2 buffer 25 HS2 O N-FET high side gate driver 2 26 CP2 O High side bootstrap capacitor driver 2 27 LS2 O N-FET low side gate driver 2 28 LS1 O N-FET low side gate driver 1 29 CP1 O High side bootstrap capacitor driver 1 30 HS1 O N-FET high side gate driver 1 31 V I Motor phase V input to HS1 buffer 32 GNDDRV GND Driver ground 33 U I Motor phase U input to HS0 buffer 34 HS0 O N-FET high side gate driver 0 35 CP0 O High side bootstrap capacitor driver 0 36 LS0 O N-FET low side gate driver 0 37 T I Electrical commutation input motor phase T 38 VREF IO Clamped 12V reference voltage for bootstrap 39 VBAT_S1 I VS high side input for current sensing 40 VBAT_S2 I VS low side input for current sensing 41 GND_S1 I GND high side input for current sensing 42 GND_S2 I GND low side input for current sensing MLX81200 Product Abstract Page 8 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 43 VS P HV supply, battery voltage 44 GNDD GND Digital ground 45 VDDV18 P Regulator Output 1.8V, MELEXCM 1.8V supply 46 VDDR5 O Output for external voltage regulation transistor 47 VDDV5 P Regulator Output 5V, MELEXCM 5V supply 48 CWD IO Watchdog capacitor MLX81200 Product Abstract Page 9 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 5. Mechanical Specification L E2 A3 A1 A E2/2 E (Ne-1)xe ref. k 5.1 QFN 7x7 (48 leads) Figure 3 - QFN48 7x7 Drawing Symbol QFN48 A A1 A2 A3 B [4] D D1 D2 E E1 E2 e L 5.30 5.30 0.45 min 0.80 0 0.60 nom 0.85 0.02 0.65 0.20 7.00 6.70 5.40 7.00 6.70 5.40 0.50 0.50 max 0.90 0.05 0.70 12° 5.50 5.50 0.55 N [3] Nd [5] Ne [5] [1] [2] 48 12 12 Table 4 - QFN48 7x7 Package Dimensions [1] [2] [3] [4] [5] Dimensions and tolerances conform to ASME Y14.5M-1994 All dimensions are in millimeters. All angels are in degrees N is the number of terminals Dimension b applies to metallized terminal and is measured between 0.25 and 0.30mm from terminal tip Nd and Ne refer to the number of terminals on each D and E side respectively MLX81200 Product Abstract Page 10 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 5.2 TQFP_EP 7x7 (48 leads) A A1 A2 b b1 Min - 0.05 0.95 0.17 0.17 Nom - - 1.00 0.22 0.20 Max 1.20 0.15 1.05 0.27 0.23 D D1 D2 E E1 E2 e L N 0.45 9.00 7.00 5.00 9.00 7.00 5.00 0.50 0.60 0.75 48 ccc ddd - - - - 0.08 0.08 Notes: 1. All Dimensioning and Tolerances conform to ASME Y14.5M-1994, ∆2. Datum Plane [-|-|-] located at Mould Parting Line and coincident with Lead, where Lead exists, plastic body at bottom of parting line. ∆3. Datum [A-B] and [-D-] to be determined at centreline between leads where leads exist, plastic body at datum plane [-|-|-] ∆4. To be determined at seating plane [-C-] ∆5. Dimensions D1 and E1 do not include Mould protrusion. Dimensions D1 and E1 do not include mould protrusion. Allowable mould protrusion is 0.254 mm on D1 and E1 dimensions. 6. 'N' is the total number of terminals ∆7. These dimensions to be determined at datum plane [-|-|-] 8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. ∆9. Dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition, dam bar can not be located on the lower radius of the foot. 10. Controlling dimension millimetre. 11. maximum allowable die thickness to be assembled in this package family is 0.38mm 12. This outline conforms to JEDEC publication 95 Registration MS-026, Variation ABA, ABC & ABD. ∆13. A1 is defined as the distance from the seating plane to the lowest point of the package body. ∆14. Dimension D2 and E2 represent the size of the exposed pad. The actual dimensions are specified ion the bonding diagram, and are independent from die size. 15. Exposed pad shall be coplanar with bottom of package within 0.05. Exposed pad need best possible contact to ground for exlectrical and thermal reasons Figure 4 – TQFP_EP 7x7 Drawing MLX81200 Product Abstract Page 11 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 6. Assembly Information Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) • • IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • • EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) • EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualification of RoHS compliant products (RoHS = European directive on the Restriction Of the Use of Certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com. MLX81200 Product Abstract Page 12 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller 7. Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © Melexis NV. All rights reserved. MLX81200 Product Abstract Page 13 of 14 23.10.2008 Rev 2.3 MLX81200 BLDC Motor Controller Your Notes For the latest version of this document go to our website at www.melexis.com Or for additional information contact Melexis direct: Europe and Japan: Phone: +32 1367 0495 E-mail: [email protected] All other locations: Phone: +1 603 223 2362 E-mail: [email protected] ISO/TS16949 and ISO14001 Certified MLX81200 Product Abstract Page 14 of 14 23.10.2008 Rev 2.3