MLX81100 LIN Slave for FET Control Features CPU o o MelexCM CPU o Dual RISC CPU MLX4/16 – 5MIPS o 4-bit LIN protocol controller o 16-bit application CPU Internal RC-Oscillator Memories o o 2kbyte RAM, 32kbyte Flash, 128 byte EEPROM Flash for series production Periphery o o o o o o o o o Three 16-bit timer with capture and compare Full duplex SPI interface 100-kBaud UART 2 high and 2 low side FET driver with protection o Over temperature control o Short circuit protection o Current control 8-bit PWM control with programmable base frequency of 100Hz to 100kHz 8 high voltage I/Os 16-channel 10-bit ADC with high voltage option Independent analog watchdog Temperature sensor Voltage Regulator o o o o o Direct powered from 12V boardnet with low voltage detection Operating voltage VS = 7V to 18V Internal voltage regulator with external load capability of 20mA External Load transistor for higher 5V loads possible Very low standby current, < 50µA in sleep mode Bus Interface o o o o LIN transceiver Supporting of LIN 2.0 and SAE J2602 LIN protocol software provided by Melexis Wake up by LIN traffic or local sources Additional Features o o On-chip CPU debugger Jump start and 40V load dump protected Applications LIN slaves for all kind of high current DC Motor control like o Seat heating control o Wiper control o Seat climatisation o Valve control MLX81100 – Product Abstract Page 1 of 17 o o Seat movement I-Drive April 2007 Rev 014 MLX81100 LIN Slave for FET Control Contents 1. FUNCTIONAL DIAGRAM ........................................................................................................................ 3 2. ELECTRICAL CHARACTERISTICS........................................................................................................ 4 2.1 2.2 3. OPERATING CONDITIONS .................................................................................................................... 4 ABSOLUTE MAXIMUM RATINGS ............................................................................................................ 4 APPLICATION CIRCUITRY ..................................................................................................................... 5 3.1 3.2 3.3 3.4 3.5 3.6 3.7 SINGLE DC-MOTOR DRIVE .................................................................................................................. 5 HIGHER VCC LOADS AND HIGHER AMBIENT TEMPERATURES ................................................................ 6 HIGH SIDE REVERSE POLARITY PROTECTION ....................................................................................... 6 CONNECTION TO EXTERNAL CAN CONTROLLER................................................................................... 7 DUAL DC-MOTOR DRIVE .................................................................................................................... 8 HUMAN INTERFACE DEVICE WITH DC-MOTOR ...................................................................................... 9 SEAT HEATING AND CLIMATISATION ................................................................................................... 10 4. PIN DESCRIPTION ................................................................................................................................ 11 5. MECHANICAL SPECIFICATION ........................................................................................................... 13 5.1 6. MLF 6X6 40 LEADS .......................................................................................................................... 13 TAPE AND REEL SPECIFICATION ...................................................................................................... 14 6.1 6.2 TAPE SPECIFICATION ........................................................................................................................ 14 REEL SPECIFICATION ........................................................................................................................ 15 7. ASSEMBLY INFORMATION.................................................................................................................. 16 8. DISCLAIMER.......................................................................................................................................... 16 MLX81100 – Product Abstract Page 2 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 1. Functional Diagram RTG VS V1V8 PS CLKO VDD5V POR 300kHz Voltage Monitor fRC Aux. Supply SW2 SHNT_L SW0 BRMID1 Diff. Amp SW1 BRMID2 Diff. Amp Temp Diff. Amp Reset Analog Watchdog CWD Ref. Mux VS/2 BRMID1 GND GND GND RC-OSC. 5V/1.8V Supply 12V Ref 10 bit ADC VDRV VS/2 BRMID2 MUX VS/2 SW6 SW0 … SW7 VS/2 SW7 I/O Register SW0 Pre-driver Control Internal Communication Interface CP Predriver High Side 1 Internal Communication Interface SW1 MelexCM SW2 SW4 SW5 SW6 50Hz...100kHz DualCompare Compare Dual Dual Compare fPLL Multi Purpose I/O SW3 PWM Control Compareon/off on/off Compare Compare on/off Predriver High Side 2 OSC 8bit bitCounter Counter 88with bit Period Counter register DualCapture Capture Dual Dual Capture Watchdog withPeriod Periodregister register with Clock Clock Clock devider devider devider fPLL RAM 2kbyte Appl. CPU MLX16 M M U Flash 32kbyte with ECC Comm. CPU MLX4 LIN LIN-SBI (1.3 and 2.0) GND IO1 IO2 UART HSBC2 HS2 BRMID2 Predriver Low Side 1 LS1 Predriver Low Side 2 LS2 SPI EEPROM 128byte fPLL PLL 30MHz fOSC fRC IO3 IO4 Test controller MultiCPU debugger External Communication Interface IO0 BRMID1 CP 16bit bitTIMER TIMER 16 16 bit TIMER fOSC,f fOSC/16 /16, fOSC, OSC fOSC /256, /256 f fOSC/256 Interrrupt Controller LINPHY HS1 PWMO Prescaler Prescaler Prescaler fOSC, fOSC/16, SW7 HSBC1 IO5 GND TI0 TI1 TO Figure 1- Block diagram MLX81100 – Product Abstract Page 3 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 2. Electrical Characteristics All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum ratings given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposure to limiting values may affect the reliability of the device. Reliable operation of the MLX81100 is only specified within the limits shown in ”Operating conditions”. 2.1 Operating Conditions Parameter Symbol Min Max Unit VS 7 18 V Tamb -40 +135 [1] °C Battery supply voltage Operating ambient temperature Table 1 - Operating Conditions 2.2 Absolute Maximum Ratings Parameter Battery supply voltage BUS voltage Transient supply voltage Transient supply voltage Transient supply voltage Transient bus voltage Transient bus voltage Transient bus voltage DC voltage on CMOS I/O pins ESD capability of pin LIN Symbol VS VBUS VS.tr1 VS.tr2 VS.tr3 VBUS.tr1 VBUS.tr2 VBUS.tr3 VDC ESDBUSHB ESD capability of any other pins ESDHB Maximum latch–up free current at any Pin ILATCH Maximum power dissipation [4] Ptot Thermal impedance [3] ΘJA Tstg Tvj Storage temperature Junction temperature Condition t < 5 min t < 500 ms t < 500 ms ISO 7637/1 pulse 1 [2] ISO 7637/1 pulses 2 [2] ISO 7637/1 pulses 3A, 3B ISO 7637/1 pulse 1 [3] ISO 7637/1 pulses 2 [3] ISO 7637/1 pulses 3A, 3B [3] Min Max -1.0 30 40 40 V -150 -0.3 +100 +150 +7 V V V V V V V V -4 +4 kV -2 +2 kV -500 mA Tamb = +105 °C Tamb = + 85 °C +500 t.b.d. t.b.d. in free air t.b.d. K/W +150 +150 °C °C Human body model, equivalent to discharge 100pF with 1.5kΩ, Human body model, equivalent to discharge 100pF with 1.5kΩ, -20 -150 Unit -150 -150 -55 -40 +100 +150 W Table 2 - Absolute Maximum Ratings [1] Target Value in case of external bipolar regulator transistor is used. ISO 7637 test pulses are applied to VS via a reverse polarity diode and >1µF blocking capacitor . [3] ISO 7637 test pulses are applied to BUS via a coupling capacitance of 1nF. [4] Simulated value for low conductance board (JEDEC) [2] MLX81100 – Product Abstract Page 4 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 3. Application Circuitry 3.1 Single DC-Motor Drive In this sample application the IC can realize the driving of a DC-motor via an external power N-FET bridge. The high side N-FET driving is done with a bootstrap output stage. The current control of the motor is done via shunt measurement and the reverse polarity protection of the bridge must be realized with an external power FET connected to the ground line. Short circuits of the bridge will be detected from fast comparators and in this case the bridge will be switched off. Weak short circuits are monitored with an external temperature sensor. The actual position can be read with hall sensors, which are connected to the timer capture inputs. The hall sensors are switched off during standby mode via a switchable battery voltage output. Optional it is possible to connect an external serial EEPROM via a SPI interface, if it isn’t allowed to use the integrated EEPROM because of security reasons. 100nF VBAT 4.7…10uF VS VDRV RTG CLKO VDD5V 100nF HSBC2 100nF 47uF HS2 100n V1V8 1uF BRMID2 VBAT 100n PS VCC HSBC1 IO4 IO5 VCC SW0 SW1 SW3 SW4 SW5 SW6 SW7 Temperature sensor HS1 MLX81100 VCC Hall sensor 100nF M BRMID1 LS1 LS2 SW2 GND Shunt SPI Interface IO0 IO1 IO2 IO3 MLX 90316 10 LIN LIN 180p GND GND VBAT Reverse Polarity Protection SHNT_L CWD TI0 TI1 TO CWD GND GND Figure 2 - Application circuitry for single DC-motor control MLX81100 – Product Abstract Page 5 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 3.2 Higher VCC Loads and higher Ambient Temperatures If it is necessary to supply higher currents to external 5V loads it is possible to connect to the RTG pin an external load transistor. This external load transistor decreases also the internal power dissipation which makes it possible to use this IC also for higher ambient temperatures. VBAT 100nF VS 100nF RTG 4.7...10uF VDD5V 47uF 100n V1V8 1uF 100n Figure 3 - Application for higher VCC loads and higher ambient temperatures 3.3 High Side Reverse Polarity Protection With this IC it is also possible to realise a high side reverse polarity protection for the bridge Power-FET with a normal power N-FET. VBAT Reverse Polarity Protection CLKO VDRV 100nF HSBC2 100nF HS2 BRMID2 Figure 4 - High side N-FET reverse polarity protection MLX81100 – Product Abstract Page 6 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 3.4 Connection to External CAN Controller If the application requires a connection to the CAN network it can be realized with the help of an external CAN communication CPU. The following circuitry shows a sample how to implement this together with our MLX81100. The communication between MLX8100 and external CAN controller is done via the SPI interface of the MelexCM. A bus wake-up will be signalised at the INH pin of the CAN transceiver. This signal will be used from a normal HV-IO pin to wake-up the MLX81100. VCC LIN INH CAN Transceiver ( TJA 1050 ) SW7 SW4 VCC TxD CANH CS_1 RxD CANL CAN Controller ( MCP 2515) SO SI CLK INT_1 IO0 IO1 IO2 IO3 IO4 IO5 Figure 5 - Connection to external CAN controller MLX81100 – Product Abstract Page 7 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 3.5 Dual DC-Motor Drive In this sample application the IC can realize the driving of two DC-motors via an external power N-FET bridge. The high side N-FET driving is done with a bootstrap output stage. The current control of the motor is done via shunt measurement and the reverse polarity protection of the bridge must be realized with an external power FET connected to the ground line. Short circuits of the bridge will be detected from fast comparators and in this case the bridge will be switched off. Weak short circuits are monitored with an external temperature sensor. The actual position can be read with hall sensors, which are connected to the timer capture inputs. The hall sensors are switched off during standby mode via a switchable battery voltage output. If it is necessary to synchronize the motor movement via longer distances it can be done via the UART interface connected to an external high speed can transceiver. Via this interface together with a proprietary protocol it is possible that both motor-driver exchange real-time position information. Optional it is possible to connect an external serial EEPROM via a SPI interface, if it isn’t allowed to use the integrated EEPROM because of security reasons. 100nF 100nF VDRV VS CLKO RTG VBAT VBAT 4.7 ..10uF 4.7 ..10uF VDD5V HSBC2 VCC M BRMID1 LS1 LS2 Hall sensor Temperature sensor IO5 SW3 SW4 SW5 VBAT VCC STB RxD SW0 SW1 High speed comunication Interface with propietary protocol SW4 SW5 SW6 VCC VBAT INH TxD GND HS1 IO5 Temperature sensor SW3 SW6 SW7 HSBC1 IO4 VCC Hall sensor SW2 Shunt PS VCC VCC MLX81100 100nF VBAT 100nF VCC IO4 HS1 BRMID2 1uF VCC HSBC1 VBAT 100nF HS2 V1V8 100nF PS 100nF HSBC2 100nF 1uF VBAT CLKO 47uF 100nF V1V8 BRMID2 VDRV RTG VDD5V 47uF HS2 100nF VS HS-CAN Transceiver (TJA1041) CANH CANH CANL CANL STB HS-CAN Transceiver (TJA1041) SW7 MLX81100 100nF 100nF M BRMID1 LS1 LS2 RxD SW2 TxD SW0 SW1 EN GND Shunt VCC SHNT_L Reverse Polarity Protection CWD CWD TI0 TI1 TO IO0 IO1 IO2 IO3 VBAT CS VCC Optional serial EEPROM if needed for security reason SCLK Serial EEPROM SDOUT SDIN LIN IO0 IO1 IO2 IO3 10 LIN LIN SHNT_L Reverse Polarity Protection CWD TI0 TI1 TO CWD 180p GND GND GND GND GND GND GND GND Application example for Dual DC motor driver Figure 6 - Application circuitry for a dual DC-motor system MLX81100 – Product Abstract Page 8 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 3.6 Human Interface Device with DC-Motor In this sample application the IC can realize the driving of a feedback DC-motor via an external power N-FET bridge. The high side N-FET driving is done with a bootstrap output stage. The current control of the motor is done via shunt measurement and the reverse polarity protection of the bridge must be realized with an external power FET connected to the ground line. Short circuits of the bridge will be detected from fast comparators and in this case the bridge will be switched off. Weak short circuits are monitored with an external temperature sensor. The reading of the direction and positions of a rotating encoder can be easy done via the timer capture inputs. With SW0 to SW5 and IO0 to IO3 it is possible to implement a switch matrix or to connect single switches. 100nF VBAT 4.7 ..10uF VS VDRV RTG CLKO VDD5V 100nF HSBC2 100nF 47uF HS2 100nF BRMID2 V1V8 VBAT 1uF 100nF PS SW0 SW1 HSBC1 SW3 SW5 MLX81100 SW4 HS1 100nF M BRMID1 LS1 SW6 SW7 VCC LS2 Temperature sensor SW2 VCC VCC Rotationencoder LIN IO0 IO1 IO2 IO3 IO4 IO5 10 LIN GND Shunt VBAT SHNT_L Reverse Polarity Protection CWD TI0 TI1 TO CWD 180p GND GND GND GND Figure 7 - Application circuitry for human interface device with DC-motor MLX81100 – Product Abstract Page 9 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 3.7 Seat Heating and Climatisation In this sample application is implemented the driving of two heat elements via the high side and two DCmotors via the low side N-FET drivers. The high side N-FET driving is done with a bootstrap output stage. The current control of the high side FETs will be done via shunt measurement and the shunt voltage is amplified with a differential amplifier connected to the ADC. The reverse polarity protection of the low side FETs is implemented with an external power FET connected to the ground line. Short circuits of the single FETs will be detected from fast comparators and in this case the FETs will be switched off. Weak short circuits are monitored with an external temperature sensor. 100nF 100nF VBAT 4.7 ..10uF VBAT VS VDRV RTG CLKO VBAT HSBC2 VDD5V 47uF 100nF HS2 BRMID2 100nF Fan 1 V1V8 1uF Shunt 100nF M PS SW6 SW1 Heater 2 LS1 Fan 2 SW2 SW3 M SW7 MLX81100 VBAT VBAT HSBC1 100nF HS1 BRMID1 LS2 VCC Shunt SW4 SW5 SW0 VBAT IO4 IO5 Heater 1 GND IO0 IO1 IO2 IO3 LIN 10 SHNT_L CWD CWD TI0 TI1 TO LIN 180p GND GND GND GND Figure 8 - Application circuitry for seat heating and seat climatisation MLX81100 – Product Abstract Page 10 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 4. Pin Description Table 3 – Pin Description MLX81100 MLF 6x6 40 Name VS Function I/O Type HV supply, battery voltage P Internal regulated voltage supply, 5V supply output P V1V8 Internal regulated voltage supply, 1.8V supply output P GND Ground P Switchable battery supply P Ground P Low shunt input for differential ADC measurement I VDD5V PS GND SHNT_L GND Ground SW1 HV in- or output, ADC-input IO SW2 HV in- or output, ADC-input IO SW3 HV in- or output, ADC-input IO SW4 HV in- or output, ADC-input IO SW5 HV in- or output, ADC-input IO SW6 HV in- or output, ADC-input IO SW7 HV in- or output, ADC-input IO SW8 HV in- or output, ADC-input IO LIN Connection to LIN bus IO GND Ground CWD Watchdog capacitor IO VDRV Clamped 12V reference voltage for bootstrap P HSBC1 High side bootstrap capacitor driver 1 O N-FET high side gate driver 1 O BRMID1 Source connection of HS1 I HSBC2 High side bootstrap capacitor driver 2 O N-FET high side gate driver 2 O Source connection of HS2 I LS1 N-FET low side gate driver 1 O LS2 N-FET low side gate driver 2 O GND Ground HS1 HS2 BRMID2 MLX81100 – Product Abstract GND GND GND Page 11 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control Name Function I/O Type IO0 General purpose in- or output, SPI, UART IO IO1 General purpose in- or output, SPI, UART IO IO2 General purpose in- or output, SPI, UART IO IO3 General purpose in- or output, SPI, UART IO IO4 Timer capture input 1, general purpose in- or output IO IO5 Timer capture input 2, general purpose in- or output IO TI0 Test input, debug interface I TI1 Test input, debug interface I TO Test output, debug interface O RTG Output for external voltage regulation transistor O CLKO Clock Output O MLX81100 – Product Abstract Page 12 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 5. Mechanical Specification 5.1 MLF 6x6 40 leads D A D/2 A2 4x P D1 b A1 D2 D1/2 A3 PIN1 ID 0.20 R E2/2 (Ne-1)xe ref. 1 2 3 E2 0.45 + E E1 E/2 E1/2 1 2 3 4x P D2/2 L 0.25 min. B e 0.25min (Nd-1)xe ref. Top View Bottom View Side View Figure 9 – MLF 6x6 40 Drawing Table 4 – MLF40 Package Dimensions Symbol A A1 A2 min MLF40 nom max - 0 - 0.85 0.01 0.65 0.90 0.05 0.70 P N [3] Nd [5] Symbol min MLF40 nom max [1] [2] [3] [4] [5] A3 D D1 D2 E E1 3.95 0.20 6.00 5.75 12° 4.10 4.25 E2 e 3.95 6.00 5.75 4.10 4.25 L 0.30 0.50 0.40 [1] [2] 0.50 Ne [5] 0.24 0.42 B [4] [1] 40 10 10 [2] 0.60 Dimensions and tolerances conform to ASME Y14.5M-1994 All dimensions are in millimeters. All angels are in degrees N is the number of terminals Dimension b applies to metallized terminal and is measured between 0.25 and 0.30mm from terminal tip Nd and Ne refer to the number of terminals on each D and E side respectively MLX81100 – Product Abstract Page 13 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 6. Tape and Reel Specification 6.1 Tape Specification T2 P0 D0 P2 T E G1 < A0 > F K0 W B0 B1 S1 G2 P1 D1 T1 Cover Tape Abwickelrichtung Standard Reel with diameter of 13“ Package Parts per Reel Width Pitch 2250 16 mm 8 mm MLF6x6 40 D0 E P0 P2 Tmax S1min T1 max G1 min MLF 6x6 40 1.5 + 0.1 1.75 ±0.1 4.0 ±0.1 2.0 ±0.1 0.6 0.6 0.1 G2 B1 max D1 min F P1 7.5 ±0.1 4 -12 ±0.1 Rmin T2 max W min 0.75 0.75 12.1 1.5 30 8.0 16.0 ±0.3 All Dimensions in mm A0, B0, K0 can be calculated with package specification. MLX81100 – Product Abstract Page 14 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 6.2 Reel Specification W2 W1 B* D* C A N Amax B* C D*min 330 2.0 ±0.5 13.0 +0.5/-0,2 20.2 Width of half reel Nmin W1 W2 max 8 mm 100 8.4 11.1 16 mm 100 16.4 19.1 All Dimensions in mm MLX81100 – Product Abstract Page 15 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 7. Assembly Information Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) • • IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • • EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) • EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) • EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.asp MLX81100 – Product Abstract Page 16 of 17 April 2007 Rev 014 MLX81100 LIN Slave for FET Control 8. Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2005 Melexis NV. All rights reserved. For the latest version of this document. Go to our website at www.melexis.com Or for additional information contact Melexis direct: Europe and Japan: Phone: +32 1367 0495 E-mail: [email protected] All other locations: Phone: +1 603 223 2362 E-mail: [email protected] ISO/TS16949 and ISO14001 Certified MLX81100 – Product Abstract Page 17 of 17 April 2007 Rev 014