TL431BFDT NXP Product Reliability

Product Reliability
Reliability Investigation Results for Product Type TL431BFDT
Time period:
Q4/2013 to Q3/2014
Test Results
AEC-Q100 Test
Conditions
Duration
Quantity
Rejects
all parts
see below
3840
0
# E1
TEST
Pre- and Post-Stress
Electrical Test
Tamb = 25 °C
N/A
# A1
PC
Preconditioning
JESD22-A113
Bake Tamb = 125 °C
Soak Tamb = 85 °C, RH = 85%
Reflow soldering
24 hours
168 hours
3 cycles
# A2
THB
Temperature Humidity Bias
JESD22-A101
Tamb = 85 °C, RH = 85%, Vref = 0 V,
VKA = 36 V
1000 hours
960
0
# A3
AC
Autoclave
JESD22-A102
Tamb = 121 °C, RH = 100 %
Pressure = 205 kPa (29.7 psia)
96 hours
960
0
# A4
TC
Temperature Cycling
JESD22-A104
-65 °C to +150 °C
1000 cycles
960
0
# A5
IOL
Intermittent Operating Life
MIL-STD-750 Method 1037
ton = toff = 2 minutes, Ptot = 250 mW to
insure ΔTj = 100 °C for 15000 cycles
1000 hours
960
0
# B1
HTOL
High Temperature
Operating Life
Tamb = 150 °C, Vref = 0 V, VKA = 36 V
1000 hours
1360
0
RSH
Resistance to Solder Heat
JESD22-A111 / JESD22-B106
260 °C ± 5 °C
10 s
360
0
SD
Solderability
JESD22-B102
245 °C ± 5 °C
3s
4800
0
# C3
Calculation of FIT and MTBF
Test considered for FIT calculation: High Temperature Operating Life (HTOL, AEC-Q100 Test # B1)
Confidence level 60%, derated to 55 °C, activation energy 0.7 eV, test time 168 to 1000 hours
Wafer Fab
Technology
Quantity
Rejects
Failure Rate
MTBF
NXP DHAM
Bipolar Analog Power
1360
0
3.12 FIT
36534 years
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