Product Reliability Reliability Investigation Results for Product Type TL431BFDT Time period: Q4/2013 to Q3/2014 Test Results AEC-Q100 Test Conditions Duration Quantity Rejects all parts see below 3840 0 # E1 TEST Pre- and Post-Stress Electrical Test Tamb = 25 °C N/A # A1 PC Preconditioning JESD22-A113 Bake Tamb = 125 °C Soak Tamb = 85 °C, RH = 85% Reflow soldering 24 hours 168 hours 3 cycles # A2 THB Temperature Humidity Bias JESD22-A101 Tamb = 85 °C, RH = 85%, Vref = 0 V, VKA = 36 V 1000 hours 960 0 # A3 AC Autoclave JESD22-A102 Tamb = 121 °C, RH = 100 % Pressure = 205 kPa (29.7 psia) 96 hours 960 0 # A4 TC Temperature Cycling JESD22-A104 -65 °C to +150 °C 1000 cycles 960 0 # A5 IOL Intermittent Operating Life MIL-STD-750 Method 1037 ton = toff = 2 minutes, Ptot = 250 mW to insure ΔTj = 100 °C for 15000 cycles 1000 hours 960 0 # B1 HTOL High Temperature Operating Life Tamb = 150 °C, Vref = 0 V, VKA = 36 V 1000 hours 1360 0 RSH Resistance to Solder Heat JESD22-A111 / JESD22-B106 260 °C ± 5 °C 10 s 360 0 SD Solderability JESD22-B102 245 °C ± 5 °C 3s 4800 0 # C3 Calculation of FIT and MTBF Test considered for FIT calculation: High Temperature Operating Life (HTOL, AEC-Q100 Test # B1) Confidence level 60%, derated to 55 °C, activation energy 0.7 eV, test time 168 to 1000 hours Wafer Fab Technology Quantity Rejects Failure Rate MTBF NXP DHAM Bipolar Analog Power 1360 0 3.12 FIT 36534 years www.nxp.com © 2015 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent – or other industrial or intellectual property rights.