TL431BMSDT NXP Product Reliability

Reliability Investigation Results, Type: TL431BMSDT
Time period Q4/2012 to Q3/2013
AEC Q100 Test
Conditions
Duration
Quantity
Rejects
all parts
see
below
6720
0
# E1
TEST
Pre- and Post-Stress
Electrical Test
Ta = 25 °C
N/A
# A1
PC
Preconditioning
JESD22-A113
Bake Ta = 125 °C
Soak Ta = 85 °C, RH = 85%
Reflow soldering
24 hours
168 hours
3 cycles
# A2
THB
Temperature Humidity
Bias
JESD22-A101
Ta = 85 °C, RH = 85%
Vref = 0 V, VKA = 36 V
1000 hours
1680
0
# A3
AC
Autoclave
JESD22-A102
Ta = 121 °C, RH = 100%
Pressure = 205 kPa (29.7 psia)
96 hours
1680
0
# A4
TC
Temperature Cycling
JESD22-A104
-65 °C to +150 °C
1000 cycles
1680
0
# A5
IOL
Intermittent Operating Life
MIL-STD-750 Method 1037
ton = toff = 2min
P = 250 mW to insure ΔTj = 100 °C
for 15000 cycles
1000 hours
1680
0
Ta = 150°C, Vref = 0V,
VKA = 36V
1000 hours
1680
0
JESD22-A111 / JESD22 -B106
260 °C ± 5 °C
10 s
630
0
JESD22-B102
245 °C ± 5 °C
3s
5490
0
# B1
# C3
HTOL
High Temperature
Operating Life
RSH
Resistance to Solder Heat
SD
Solderability
Calculation of FIT and MTBF
Test considered for FIT calculation: High Temp. Operating Life (HTOL, AEC Q100 Test # B1)
Confidence level 60%, derated to 55 °C, activation energy 0.7 eV, test time 168-1000 hours
Wafer Fab
Technology
Quantity
Rejects
Failure Rate
MTBF
NXP DHAM
Bipolar Analog Power
1680
0
2.53 FIT
45130 years
© 2014 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and
may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof
does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: Jun 2014