74LVC1G32

74LVC1G32
SINGLE 2 INPUT POSITIVE OR GATE
Description
Pin Assignments
The 74LVC1G32 is a single 2-input positive OR gate with a standard
push-pull output. The device is designed for operation with a power
supply range of 1.65V to 5.5V. The inputs are tolerant to 5.5V allowing
this device to be used in a mixed voltage environment. The device is
fully specified for partial power down applications using I OFF. The IOFF
( Top View )
A 1
5 Vcc
The gate performs the positive Boolean function:
Y  A  B or Y  A  B
( Top View )
Features


Inputs Accept Up to 5.5V
ESD Protection Tested per JESD 22

Exceeds 200-V Machine Model (A115)

Exceeds 2000-V Human Body Model (A114)

Exceeds 1000-V Charged Device Model (C101)
Latch-Up Exceeds 100mA per JESD 78, Class I
Range of Package Options
Direct Interface with TTL Levels
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
4 Y
SOT553
4 Y
SOT25 / SOT353
Wide Supply Voltage Range from 1.65 to 5.5V
± 24mA Output Drive at 3.3V
CMOS Low Power Consumption
IOFF Supports Partial-Power-Down Mode Operation
5 Vcc
GND 3
GND 3




A 1
B 2
B 2
circuitry disables the output preventing damaging current backflow
when the device is powered down.





( Top View )
A
1
8
Vcc
B
2
5
NC
GND
3
4
Y
X2-DFN1410-6
( Bottom View )
GND 3
B2
A1
4Y
5 NC
(Top View )
A
1
6
B
GND
2
5
Y
X1-DFN1010-6
(Type B)
3
4
(Top View )
Vcc
NC
3
4 Y
X2-DFN1010-6
A
B
GND
1
6
2
5
(Top View)
5 Vcc
A 1
3
GND
6 Vcc
X2-DFN1409-6
Chip Scale
Alternative
Vcc
NC
B 2
4 Y
X2-DFN0808-4
Packages not to scale
Applications




Notes:
Voltage Level Shifting
General Purpose Logic
Power Down Signal Isolation
Wide Array of Products Such as.
 PCs, Networking, Notebooks, Netbooks, PDAs
 Tablet Computers, E-readers
 Computer Peripherals, Hard Drives, CD/DVD ROM
 TV, DVD, DVR, Set Top Box
 Cell Phones, Personal Navigation / GPS
 MP3 Players, Cameras, Video Recorders
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
74LVC1G32
Document number: DS32200 Rev. 10 - 2
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April 2016
© Diodes Incorporated
74LVC1G32
Ordering Information (Note 4)
74 LVC1G 32 XXX -7
Logic Device
74 : Logic Prefix
LVC : 1.65 to 5.5 V
Logic Family
1G : One Gate
Function
2-Input
OR Gate
32 :
Part Number
Package
Code
Package
(Notes 5 & 6)
74LVC1G32W5-7
W5
SOT25
74LVC1G32SE-7
SE
SOT353
74LVC1G32Z-7
Z
SOT553
74LVC1G32FS3-7
FS3
X2-DFN0808-4
74LVC1G32FW5-7
FW5
X1-DFN1010-6 (Type B)
74LVC1G32FW4-7
FW4
X2-DFN1010-6
74LVC1G32FX4-7
FX4
X2-DFN1409-6
(Chip scale alternative)
74LVC1G32FZ4-7
FZ4
X2-DFN1410-6
Notes:
Package
Packing
W5 : SOT25
-7 : 7” Tape & Reel
SE : SOT353
Z : SOT553
FS3 : X2-DFN0808-4
FW5 : X1-DFN1010-6 (Type B)
FW4 : X2-DFN1010-6
FX4 : X2- DFN1409-6
FZ4 : X2- DFN1410-6
Package
Size
3.0mm x 2.8mm x 1.2mm
0.95 mm lead pitch
2.0mm x 2.0mm x 1.1mm
0.65 mm lead pitch
1.6mm x 1.6 mm x 0.62mm
0.5 mm lead pitch
0.8mm x 0.8mm x 0.35mm
0.5 mm pad pitch (diamond)
1.0mm x 1.0mm x 0.5mm
0.35 mm pad pitch
1.0mm x 1.0mm x 0.4mm
0.35 mm pad pitch
1.4mm x 0.9mm x 0.4mm
0.5 mm pad pitch
1.4mm x 1.0mm x 0.4mm
0.5 mm pad pitch
7” Tape and Reel
Quantity
Part Number Suffix
3,000/Tape & Reel
-7
3,000/Tape & Reel
-7
4,000/Tape & Reel
-7
5,000/Tape & Reel
-7
5,000/Tape & Reel
-7
5,000/Tape & Reel
-7
5,000/Tape & Reel
-7
5,000/Tape & Reel
-7
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
5. Pad layout as shown in Diodes Inc. suggested pad layouts, which can be found on our website at see http://www.diodes.com/package-outlines.html.
6. The taping orientation is located on our website at http://www.diodes.com/datasheets/ap02007.pdf.
Pin Descriptions
Logic Diagram
Pin Name
A
B
GND
Y
Description
Data Input
Data Input
Ground
Data Output
VCC
NC
Supply Voltage
No Connection
1
4
2
Function Table
Inputs
A
H
X
L
B
X
H
L
74LVC1G32
Document number: DS32200 Rev. 10 - 2
Output
Y
H
H
L
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74LVC1G32
Absolute Maximum Ratings (Notes 7 & 8) (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD CDM
ESD MM
Description
Human Body Model ESD Protection
Charged Device Model ESD Protection
Machine Model ESD Protection
Rating
2
1
200
Unit
kV
kV
V
Supply Voltage Range
-0.5 to 6.5
V
VI
Input Voltage Range
-0.5 to 6.5
V
VO
Voltage Applied to Output in High Impedance or IOFF State
-0.5 to 6.5
V
VO
Voltage Applied to Output in High or Low State.
-0.5 to VCC +0.5
V
VCC
IIK
Input Clamp Current VI < 0
-50
mA
IOK
Output Clamp Current
-50
mA
IO
Continuous Output Current
±50
mA
Continuous Current Through VCC or GND
±100
mA
Operating Junction Temperature
-40 to +150
°C
Storage Temperature
-65 to +150
°C
ICC, IGND
TJ
TSTG
Notes:
7. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device
operation should be within recommend values.
8. Forcing the maximum allowed voltage could cause a condition exceeding the maximum current or conversely forcing the maximum current could
cause a condition exceeding the maximum voltage. The ratings of both current and voltage must be maintained within the controlled range.
Recommended Operating Conditions (Note 9) (@TA = +25°C, unless otherwise specified.)
Symbol
VCC
Parameter
Operating Voltage
Operating
Data retention only
VCC = 1.65V to 1.95V
VIH
High-Level Input Voltage
VCC = 2.3V to 2.7V
VCC = 3V to 3.6V
Max
Unit
5.5
—
V
V
0.65 x VCC
—
1.7
—
2
—
V
0.7 x VCC
—
VCC = 1.65V to 1.95V
—
0.35 x VCC
VCC = 2.3V to 2.7V
—
0.7
VCC = 3V to 3.6V
—
0.8
VCC = 4.5V to 5.5V
VCC = 4.5V to 5.5V
VIL
Low-Level Input voltage
—
0.3 x VCC
VI
Input Voltage
0
5.5
V
VO
Output Voltage
0
VCC
V
VCC = 1.65V
—
-4
VCC = 2.3V
—
-8
VCC = 2.7V
—
-12
VCC = 3V
—
—
-16
-24
VCC = 4.5V
—
-32
VCC = 1.65V
—
4
VCC = 2.3V
—
8
VCC = 2.7V
—
12
VCC = 3V
—
—
16
24
VCC = 4.5V
—
32
VCC = 1.8V ± 0.15V, 2.5V ± 0.2V
—
20
VCC = 3.3V ± 0.3V
—
10
VCC = 5V ± 0.5V
—
5
—
-40
+125
IOH
IOL
Δt/ΔV
TA
Note:
Min
1.65
1.5
High-Level Output Current
Low-Level Output Current
Input transition Rise or Fall Rate
Operating Free-Air Temperature
V
mA
mA
ns/V
°C
9. Unused inputs should be held at VCC or Ground.
74LVC1G32
Document number: DS32200 Rev. 10 - 2
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74LVC1G32
Electrical Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
Parameter
Test Conditions
VCC
VOH
VCC – 0.1
—
—
VCC – 0.1
—
1.65V
1.2
—
—
0.95
—
IOH = -8mA
2.3V
1.9
—
—
1.7
—
IOL = -12mA
2.7V
2.2
—
—
1.9
—
2.4
—
—
2.2
—
2.3
—
—
2.0
—
—
3.4
—
0.1
3V
IOH = -24mA
Low-Level
Output Voltage
IOH = -32mA
4.5V
3.8
—
IOL = 100μA
Unit
V
1.65V to 5.5V
—
—
0.1
—
IOL = 4mA
1.65V
—
—
0.45
—
0.7
IOL = 8mA
2.3V
—
—
0.3
—
0.45
IOL = 12mA
2.7V
—
—
0.4
—
0.6
—
—
0.4
—
0.6
—
—
0.55
—
0.8
4.5V
—
—
0.55
—
.8
0 to 5.5V
—
± 0.1
±5
—
± 100
μA
0V
—
—
±10
—
±200
μA
5.5V
—
0.1
10
—
200
μA
3V to 5.5V
—
—
500
—
5,000
μA
3.3V
—
5
—
—
—
pF
Unit
IOL = 16mA
3V
IOL = 24mA
IOL = 32mA
II
Input Current
VI = 5.5 V or GND
IOFF
Power Down
Leakage
Current
VI or VO = 5.5V
ICC
Supply Current
VI = 5.5V or GND
IO=0
ΔICC
Additional
Supply Current
One input at VCC –0.6V
Other inputs at VCC or
GND
Input
Capacitance
Vi = VCC – or GND
Ci
-40°C to +125°C
Min
Max
1.65V to 5.5V
IOH = -16mA
VOL
-40°C to +85°C
Typ
Max
IOH = -4mA
IOH = -100μA
High-Level
Output Voltage
Min
V
Package Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
Note:
Parameter
θJA
Thermal Resistance
Junction-to-Ambient
θJC
Thermal Resistance
Junction-to-Case
Test Conditions
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
VCC
(Note 10)
(Note 10)
Min
Typ.
Max
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
204
371
231
400
435
445
470
460
52
143
105
225
250
250
275
265
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
°C/W
°C/W
10. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
74LVC1G32
Document number: DS32200 Rev. 10 - 2
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April 2016
© Diodes Incorporated
74LVC1G32
Switching Characteristics
Figure 1 Typical Values at TA = +25°C and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V.
Parameter
tpd
From
Input
A or B
To
Output
VCC
Y
1.8V ± 0.15V
2.5V ± 0.2V
2.7V
3.3V ± 0.3V
5.0V ± 0.5V
TA = -40°C to +85°C
Min
1.0
0.5
0.5
0.5
0.5
Typ.
3.1
2.1
2.5
2.1
1.7
TA = -40°C to +125°C
Max
8.0
5.5
5.5
4.5
4.0
Min
1.0
0.5
0.5
0.5
0.5
Max
10.5
7.0
7.0
6.0
5.5
Unit
ns
Operating Characteristics
TA = +25°C
Parameter
Cpd
Power Dissipation
Capacitance
74LVC1G32
Document number: DS32200 Rev. 10 - 2
Test
Conditions
VCC = 1.8V
VCC = 2.5V
VCC = 3.3V
VCC = 5V
Typ
Typ
Typ
Typ
f = 10 MHz
20
20
21
22
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Unit
pF
April 2016
© Diodes Incorporated
74LVC1G32
Parameter Measurement Information
From Output
Under Test
C
RL
L
(see Note A)
Inputs
VCC
VM
CL
≤2ns
VCC/2
30pF
1kΩ
≤2ns
VCC/2
30pF
500Ω
VI
tr/tf
1.8V ± 0.15V
VCC
2.5V ± 0.2V
VCC
RL
2.7V
VCC
≤2.5ns
1.5V
50pF
500Ω
3.3V ± 0.3V
3.0V
1.5V
5.0V ± 0.5V
VCC
≤2.5ns
≤2.5ns
50pF
50pF
500Ω
500Ω
VCC/2
tW
Vl
Vl
Input
VM
Input
VM
VM
0V
VM
0V
tPLH
tPHL
VOH
Voltage Waveform Pulse Duration
Output
VM
VM
VOL
tPHL
tPLH
VOH
Output
VM
VM
VOL
Voltage Waveform Propagation Delay Times
Inverting and Non Inverting Outputs
Figure 1 Load Circuit and Voltage Waveforms
Notes:
A. Includes test lead and test apparatus capacitance.
B. All pulses are supplied at pulse repetition rate ≤ 10MHz.
C. Inputs are measured separately one transition per measurement.
D. tPLH and tPHL are the same as tPD.
74LVC1G32
Document number: DS32200 Rev. 10 - 2
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74LVC1G32
Marking Information
(1)
SOT25, SOT353 and SOT553
(Top Views)
2
4
XXYWX
XXYWX
1
5
7
4
7
5
3
2
1
SOT25/353
SOT553
Part Number
74LVC1G32W5-7
74LVC1G32SE-7
74LVC1G32Z-7
(2)
3
XX : Identification Code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week;
z represents 52 and 53 week
X : A~Z : Internal Code
Package
SOT25
SOT353
SOT553
Identification Code
UW
UW
UW
DFN Packages
(Top View)
XX
YWX
Part Number
74LVC1G32FS3-7
74LVC1G32FW5-7
74LVC1G32FW4-7
74LVC1G32FX4-7
74LVC1G32FZ4-7
74LVC1G32
Document number: DS32200 Rev. 10 - 2
XX : Identification Code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week;
z represents 52 and 53 week
X : A~Z : Internal Code
Package
X2-DFN0808-4
X1-DFN1010-6 (Type B)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
7 of 16
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Identification Code
WW
VP
UW
MJ
UW
April 2016
© Diodes Incorporated
74LVC1G32
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT25
A
SOT25
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
N
0.70 0.80 0.75
0°
8°

All Dimensions in mm
B C
H
K
M
N
J
L
D
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT25
C2
Z
C2
Dimensions
Z
G
X
Y
C1
C2
C1
G
Y
Value
3.20
1.60
0.55
0.80
2.40
0.95
X
74LVC1G32
Document number: DS32200 Rev. 10 - 2
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74LVC1G32
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT353
E
E1
SOT353
Dim Min Max
Typ
A1 0.00 0.10
0.05
A2 0.90 1.00
1.00
b
0.10 0.30
0.25
c
0.10 0.22
0.11
D
1.80 2.20
2.15
E
2.00 2.20
2.10
E1 1.15 1.35
1.30
e
0.650 BSC
F
0.40 0.45 0.425
L
0.25 0.40
0.30
a
0°
8°
-All Dimensions in mm
b
F
D
A2
c
e
A1
L
a
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT353
X1
Dimensions
G
Y1
C
C1
G
X
X1
Y
Y1
C1
Y
X
74LVC1G32
Document number: DS32200 Rev. 10 - 2
Value
(in mm)
0.650
1.900
1.300
0.420
1.720
0.600
2.500
C
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74LVC1G32
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT553
D
e1
e
E1/2
E/2
E1
E
L (5x)
b (5x)
F
R0.1 MAX.
TYP.
c
a
7°
A
SOT553
Dim Min Max Typ
A
0.55 0.62 0.60
b
0.15 0.30 0.20
c
0.10 0.18 0.15
D
1.50 1.70 1.60
E
1.55 1.70 1.60
E1 1.10 1.25 1.20
e
0.50 BSC
e1
1.00 BSC
F
0.00 0.10 ––
L
0.10 0.30 0.20
a
6°
8°
7°
All Dimensions in mm
TYP.
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT553
C2
Z
C2
Dimensions
Z
G
X
Y
C1
C2
C1
G
Y
Value
2.2
1.2
0.375
0.5
1.7
0.5
X
74LVC1G32
Document number: DS32200 Rev. 10 - 2
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74LVC1G32
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN0808-4
A3
A1
A
Seating Plane
D
Pin #1 ID
e
R0.05 TYP
k
E
L1
D2
E2
L
Z
Dim
A
A1
A3
b
D
D2
E
E2
e
k
L
L1
z
X2-DFN0808-4
Min
Max
Typ
0.25
0.35
0.30
0
0.04
0.02
0.13
0.17
0.27
0.22
0.75
0.85
0.80
0.15
0.35
0.25
0.75
0.85
0.80
0.15
0.35
0.25
0.48
0.20
0.17
0.27
0.22
0.02
0.12
0.07
0.05
All Dimensions in mm
b
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN0808-4
X3
C
Y2
Y1
X2
Y3
X1
Y
Dimensions
C
X
X1
X2
X3
Y
Y1
Y2
Y3
Value
(in
mm)
0.480
0.320
0.300
0.106
0.800
0.320
0.300
0.106
0.900
X
74LVC1G32
Document number: DS32200 Rev. 10 - 2
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74LVC1G32
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X1-DFN1010-6 (Type B)
A1
A
Seating Plane
D
e
L3a
L3(5x)
e1
E
(Pin #1 ID)
X1-DFN1010-6
(Type B)
Dim Min Max
Typ
A
-
0.50
0.39
A1
0.04
b
0.12 0.20
0.15
D
0.95 1.050 1.00
E
0.95 1.050 1.00
e
0.35 BSC
e1
0.55 BSC
L3 0.27 0.30
0.30
L3a 0.32 0.40
0.35
All Dimensions in mm
b
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X1-DFN1010-6 (Type B)
X1
C
Y(4x)
Y2
Y3
G
Dimensions
C
G
G1
X
X1
Y
Y1
Y2
Y3
G1
Y1
Pin1
74LVC1G32
Document number: DS32200 Rev. 10 - 2
X
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Value
(in mm)
0.350
0.150
0.150
0.200
0.900
0.500
0.525
0.475
1.150
April 2016
© Diodes Incorporated
74LVC1G32
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1010-6
A1
A
X2-DFN1010-6
Dim
Min
Max
Typ
A
––
0.40
0.39
A1
0.00
0.05
0.02
A3
––
––
0.13
b
0.14
0.20
0.17
b1
0.05
0.15
0.10
D
0.95
1.05
1.00
E
0.95
1.05
1.00
e
––
––
0.35
L
0.35
0.45
0.40
K
0.15
––
––
Z
––
––
0.065
All Dimensions in mm
A3
D
(Pin #1 ID)
e
b1
E
K
L(6x)
b(6x)
Z(4x)
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1010-6
X1
C
Y (6x)
Y1
1
G(4x)
74LVC1G32
Document number: DS32200 Rev. 10 - 2
Dimensions
Value
(in mm)
C
0.350
G
0.150
X
0.200
X1
0.900
Y
0.550
Y1
1.250
X(6x)
13 of 16
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April 2016
© Diodes Incorporated
74LVC1G32
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1409-6 CHIP SCALE ALTERNATIVE
A1
A3
A
Seating Plane
D
(Pin #1 ID)
e1
Ø(6x)
e2
E
Z1(4x)
X2-DFN1409-6
Dim Min Max
Typ
A
0.40
0.39
A1
0
0.05
0.02
A3
0.13
Ø
0.20 0.30
0.25
D
1.35 1.45
1.40
E
0.85 0.95
0.90
e1
0.50
e2
0.50
Z1
0.075
Z2
0.075
All Dimensions in mm
Z2(4x)
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1409-6 CHIP SCALE ALTERNATIVE
C
Dimensions
D (6x)
C1
C
C1
D
G
G1
X
Y
Y
G1
Pin1
X
74LVC1G32
Document number: DS32200 Rev. 10 - 2
G
14 of 16
www.diodes.com
Value
(in mm)
1.000
0.500
0.300
0.200
0.200
0.400
0.150
April 2016
© Diodes Incorporated
74LVC1G32
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1410-6
A1
A3
X2-DFN1410-6
Dim
Min
Max
Typ
A
––
0.40
0.39
A1
0.00
0.05
0.02
A3
––
––
0.13
b
0.15
0.25
0.20
D
1.35
1.45
1.40
E
0.95
1.05
1.00
e
––
––
0.50
L
0.25
0.35
0.30
Z
––
––
0.10
Z1
0.045 0.105 0.075
All Dimensions in mm
A
Seating Plane
D
(Pin #1 ID)
e
L(6x)
E
Z1(4x)
Z(4x)
b(6x)
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1410-6
X1
C
Dimensions
Y
C
G
X
X1
Y
Y1
Y1
1
74LVC1G32
Document number: DS32200 Rev. 10 - 2
G
Value
(in mm)
0.500
0.250
0.250
1.250
0.525
1.250
X
15 of 16
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April 2016
© Diodes Incorporated
74LVC1G32
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales
channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or
systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
74LVC1G32
Document number: DS32200 Rev. 10 - 2
16 of 16
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April 2016
© Diodes Incorporated