Data Sheet

Freescale Semiconductor
Technical Data
Document Number: MPC8568EEC
Rev. 1, 10/2010
MPC8568E/MPC8567E
PowerQUICC III
Integrated Processor
Hardware Specifications
Due to feature similarities, this document covers both the
MPC8568E and MPC8567E features. For simplicity,
MPC8568 may only be mentioned throughout the document.
The MPC8567E feature differences are as follows:
• The MPC8567E PCI-Express supports x1/x2/x4, but
does not have x8 support.
• Does not have eTSEC1, eTSEC2, or TLU
Note that both the MPC8568E and MPC8567E have their
own pin assignment tables.
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© 2010 Freescale Semiconductor, Inc. All rights reserved.
Contents
MPC8568E Overview . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 10
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14
Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 18
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 18
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Ethernet Interface and MII Management . . . . . . . . . . 26
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
I 2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . . 61
PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Serial RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
PIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
UTOPIA/POS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
HDLC, BISYNC, Transparent and
Synchronous UART . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Package and Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
System Design Information . . . . . . . . . . . . . . . . . . . 130
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 136
Document Revision History . . . . . . . . . . . . . . . . . . 138
MPC8568E Overview
1
MPC8568E Overview
This section provides a high-level overview of MPC8568E features. Figure 1 shows the major functional
units within the MPC8568E.
DDR
SDRAM
512-Kbyte
L2 Cache/
SRAM
DDR/DDR2/
Memory Controller
Flash
SDRAM
ZBT RAM
Local Bus Controller
e500
Coherency
Module
MPC8568
e500 Core
Core Complex
Bus
32-Kbyte
L1 Data
Cache
32-Kbyte L1
Instruction
Cache
Table Lookup Unit
Programmable Interrupt
Controller (PIC)
DUART
I2C
I2C Controller
I2C
I2C Controller
QUICC Engine™
eTSEC
10/100/1Gb
eTSEC
Multi-User
RAM
Accelerators
Baud Rate
Generators
Dual 32-bit RISC CP
10/100/1Gb
Serial DMA
&
2 Virtual
DMAs
XOR
Engine
SPI2
SPI1
UCC8
UCC7
UCC6
UCC5
Security
Engine
UCC4
Parallel I/O
UCC3
MII, GMII, TBI,
RTBI, RGMII,
RMII
PCI 32-bit
66 MHz
4-Channel DMA
Controller
UCC2
MII, GMII, TBI,
RTBI, RGMII,
RMII
4x/1x RapidIO and/or
x4/x2/x1 PCI Express
or x8 PCI Express
32-bit PCI Bus Interface
UCC1
Serial
Serial RapidIO
and/or
PCI Express
OceaN
Switch
Fabric
MCC
IRQs
Time Slot Assigner
Serial Interface
8 TDM Ports
8 MII/
RMII
3 GMII/
2 RGMII/TBI/RTBI
2 UL2/POS
Figure 1. MPC8568E Block Diagram
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MPC8568E Overview
1.1
•
•
•
•
•
•
•
•
•
•
•
MPCP8568E Key Features
High-performance, Power Architecture® e500v2 core with 36-bit physical addressing
512 Kbytes of level-2 cache
QUICC Engine (QE)
Integrated security engine with XOR acceleration
Two integrated 10/100/1Gb enhanced three-speed Ethernet controllers (eTSECs) with TCP/IP
acceleration and classification capabilities
DDR/DDR2 memory controller
Table lookup unit (TLU) to access application-defined routing topology and control tables
32-bit PCI controller
A 1x/4x Serial RapidIO® and/or x1/x2/x4 PCI Express interface. If x8 PCI Express is needed, then
RapidIO is not available due to the limitation of the pin multiplexing.
Programmable interrupt controller (PIC)
Four-channel DMA controller, two I2C controllers, DUART, and local bus controller (LBC)
NOTE
The MPC8568E and MPC8567E are also available without a security
engine in a configuration known as the MPC8568 and MPC8567. All
specifications other than those relating to security apply to the MPC8568
and MPC8567 exactly as described in this document.
1.2
1.2.1
MPC8568E Architecture Overview
e500 Core and Memory Unit
The MPC8568E contains a high-performance, 32-bit, Book E–enhanced e500v2 Power Architecture core.
In addition to 36-bit physical addressing, this version of the e500 core includes the following:
• Double-precision floating-point APU—Provides an instruction set for double-precision (64-bit)
floating-point instructions that use the 64-bit GPRs
• Embedded vector and scalar single-precision floating-point APUs—Provide an instruction set for
single-precision (32-bit) floating-point instructions
The MPC8568E also contains 512 Kbytes of L2 cache/SRAM, as follows:
• Eight-way set-associative cache organization with 32-byte cache lines
• Flexible configuration (can be configured as part cache, part SRAM)
• External masters can force data to be allocated into the cache through programmed memory ranges
or special transaction types (stashing).
• SRAM features include the following:
— I/O devices access SRAM regions by marking transactions as snoopable (global).
— Regions can reside at any aligned location in the memory map.
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MPC8568E Overview
— Byte-accessible ECC uses read-modify-write transaction accesses for smaller-than-cache-line
accesses.
1.2.2
e500 Coherency Module (ECM) and Address Map
The e500 coherency module (ECM) provides a mechanism for I/O-initiated transactions to snoop the bus
between the e500 core and the integrated L2 cache in order to maintain coherency across local cacheable
memory. It also provides a flexible switch-type structure for core- and I/O-initiated transactions to be
routed or dispatched to target modules on the device.
The MPC8568E supports a flexible 36-bit physical address map. Conceptually, the address map consists of
local space and external address space. The local address map is supported by eight local access windows
that define mapping within the local 36-bit (64-Gbyte) address space.
The MPC8568E can be made part of a larger system address space through the mapping of translation
windows. This functionality is included in the address translation and mapping units (ATMUs). Both
inbound and outbound translation windows are provided. The ATMUs allows the MPC8568E to be part of
larger address maps such as the PCI or PCI Express 64-bit address environment and the RapidIO
environment.
1.2.3
•
•
•
QUICC Engine
Integrated 8-port L2 Ethernet switch
— 8 connection ports of 10/100 Mbps MII/RMII & one CPU internal port
— Each port supports four priority levels
— Priority levels used with VLAN tags or IP TOS field to implement QoS
— QoS types of traffic, such as voice, video, and data
Includes support for the following protocols:
— ATM SAR up to 622 Mbps (OC-12) full duplex, with ATM traffic shaping (ATF TM4.1) for
up to 64K ATM connections
— ATM AAL1 structured and unstructured Circuit Emulation Service (CES 2.0)
— IMA and ATM Transmission convergence sub-layer
— ATM OAM handling features compatible with ITU-T I.610
— PPP, Multi-Link (ML-PPP), Multi-Class (MC-PPP) and PPP mux in accordance with the
following RFCs: 1661, 1662, 1990, 2686 and 3153
— IP termination support for IPv4 and IPv6 packets including TOS, TTL and header checksum
processing
— ATM (AAL2/AAL5) to Ethernet (IP) interworking
— Extensive support for ATM statistics and Ethernet RMON/MIB statistics.
— 256 channels of HDLC/Transparent or 128 channels of SS#7
Includes support for the following serial interfaces:
— Two UL2/POS-PHY interfaces with 124 Multi-PHY addresses on UTOPIA interface each or
31 Multi-PHY addresses on the POS interface each.
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MPC8568E Overview
— Three 1-Gbps Ethernet interfaces using three GMII, two RGMII/TBI/RTBI
— Up to eight 10/100-Mbps Ethernet interfaces using MII or RMII
— Up to eight T1/E1/J1/E3 or DS-3 serial interfaces
1.2.4
Integrated Security Engine (SEC)
The SEC is a modular and scalable security core optimized to process all the algorithms associated with
IPSec, IKE, WTLS/WAP, SSL/TLS, and 3GPP. Although it is not a protocol processor, the SEC is
designed to perform multi-algorithmic operations (for example, 3DES-HMAC-SHA-1) in a single pass of
the data. The version of the SEC used in the MPC8568E is specifically capable of performing single-pass
security cryptographic processing for SSL 3.0, SSL 3.1/TLS 1.0, IPSec, SRTP, and 802.11i.
• Optimized to process all the algorithms associated with IPSec, IKE, WTLS/WAP, SSL/TLS, and
3GPP
• Compatible with code written for the Freescale MPC8541E and MPC8555E devices
• XOR engine for parity checking in RAID storage applications.
• Four crypto-channels, each supporting multi-command descriptor chains
• Cryptographic execution units:
— PKEU—public key execution unit
— DEU—Data Encryption Standard execution unit
— AESU—Advanced Encryption Standard unit
— AFEU—ARC four execution unit
— MDEU—message digest execution unit
— KEU—Kasumi execution unit
— RNG—Random number generator
1.2.5
Enhanced Three-Speed Ethernet Controllers
The MPC8568E has two on-chip enhanced three-speed Ethernet controllers (eTSECs). The eTSECs
incorporate a media access control (MAC) sublayer that supports 10- and 100-Mbps and 1-Gbps
Ethernet/802.3 networks with MII, RMII, GMII, RGMII, TBI, and RTBI physical interfaces. The eTSECs
include 2-Kbyte receive and 10-Kbyte transmit FIFOs and DMA functions.
The MPC8568E eTSECs support programmable CRC generation and checking, RMON statistics, and
jumbo frames of up to 9.6 Kbytes. Frame headers and buffer descriptors can be forced into the L2 cache
to speed classification or other frame processing. They are IEEE Std 802.3™, IEEE 802.3u, IEEE 802.3x,
IEEE 802.3z, IEEE 802.3ac, IEEE 802.3ab-compatible.
The buffer descriptors are based on the MPC8260 and MPC860T 10/100 Ethernet programming models.
Each eTSEC can emulate a PowerQUICC III TSEC, allowing existing driver software to be re-used with
minimal change.
Some of the key features of these controllers include:
• Flexible configuration for multiple PHY interface configurations. Table 1 lists available
configurations.
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MPC8568E Overview
Table 1. Supported eTSEC1 and eTSEC2 Configurations1
Mode Option
eTSEC1
eTSEC2
Ethernet standard interfaces
TBI, GMII, or MII
TBI, GMII, or MII
Ethernet reduced interfaces
RTBI, RGMII, or RMII
RTBI, RGMII, or RMII
FIFO and mixed interfaces
8-bit FIFO
TBI, GMII, MII, RTBI, RGMII, RMII,
or 8-bit FIFO
TBI, GMII, MII, RTBI, RGMII, RMII,
or 8-bit FIFO
8-bit FIFO
16-bit FIFO
Not used/not available
1
Both interfaces must use the same voltage (2.5 or 3.3 V).
•
TCP/IP acceleration and QoS features:
— IP v4 and IP v6 header recognition on receive
— IP v4 header checksum verification and generation
— TCP and UDP checksum verification and generation
— Per-packet configurable acceleration
— Recognition of VLAN, stacked (queue in queue) VLAN, 802.2, PPPoE session, MPLS stacks,
and ESP/AH IP-security headers
— Supported in all FIFO modes
— Transmission from up to eight physical queues
— Reception to up to eight physical queues
•
Full- and half-duplex Ethernet support (1000 Mbps supports only full duplex):
— IEEE 802.3 full-duplex flow control (automatic PAUSE frame generation or
software-programmed PAUSE frame generation and recognition)
IEEE Std 802.1™ virtual local area network (VLAN) tags and priority
VLAN insertion and deletion
– Per-frame VLAN control word or default VLAN for each eTSEC
– Extracted VLAN control word passed to software separately
Programmable Ethernet preamble insertion and extraction of up to 7 bytes
MAC address recognition
Ability to force allocation of header information and buffer descriptors into L2 cache
•
•
•
•
•
1.2.6
DDR SDRAM Controller
The MPC8568E supports DDR SDRAM and DDR2 SDRAM. The memory interface controls main
memory accesses and provides for a maximum of 16 Gbytes of main memory.
The MPC8568E supports a variety of SDRAM configurations. SDRAM banks can be built using DIMMs
or directly-attached memory devices. Sixteen multiplexed address signals provide for device densities of
64 Mbits, 128 Mbits, 256 Mbits, 512 Mbits, 1 Gbits, 2 Gbits and 4 Gbits. Four chip select signals support
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MPC8568E Overview
up to four banks of memory. The MPC8568E supports bank sizes from 64 Mbytes to 4 Gbytes. Nine
column address strobes (MDM[0:8]) are used to provide byte selection for memory bank writes.
The MPC8568E can be configured to retain the currently active SDRAM page for pipelined burst accesses.
Page mode support of up to 16 simultaneously open pages (32 for DDR2) can dramatically reduce access
latencies for page hits. Depending on the memory system design and timing parameters, using page mode
can save 3 to 4 clock cycles from subsequent burst accesses that hit in an active page.
Using ECC, the MPC8568E detects and corrects all single-bit errors and detects all double-bit errors and
all errors within a nibble.
The MPC8568E can invoke a level of system power management by asserting the MCKE SDRAM signal
on-the-fly to put the memory into a low-power sleep mode.
1.2.7
Table Lookup Unit (TLU)
The table lookup unit (TLU) provides access to application-defined routing topology and control tables in
external memory. It accesses an external memory array attached to the local bus controller (LBC).
Communication between the CPU and the TLU occurs via messages passed through the TLU’s
memory-mapped configuration and status registers.
The TLU provides resources for efficient generation of table entry addresses in memory, hash generation
of addresses, and binary table searching algorithms for both exact-match and longest-prefix-match
strategies.It supports the following TLU complex table types:
• Hash-Trie-Key table for hash-based exact-match algorithms
• Chained-Hash table for partially indexed and hashed exact-match algorithms
• Longest-prefix-match algorithm
• Flat-Data table for retrieving search results and simple indexed algorithms
1.2.8
PCI Controller
The MPC8568E supports one 32-bit PCI controller, which supports speeds of up to 66 MHz. Other features
include:
• Compatible with the PCI Local Bus Specification, Revision 2.2, supporting 32- and 64-bit
addressing
• Can function as host or agent bridge interface
• As a master, supports read and write operations to PCI memory space, PCI I/O space, and PCI
configuration space
• Can generate PCI special-cycle and interrupt-acknowledge commands. As a target, it supports read
and write operations to system memory as well as configuration accesses.
• Supports PCI-to-memory and memory-to-PCI streaming, memory prefetching of PCI read
accesses, and posting of processor-to-PCI and PCI-to-memory writes
• PCI 3.3-V compatible with selectable hardware-enforced coherency
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MPC8568E Overview
1.2.9
High Speed I/O Interfaces
The MPC8568E supports two high-speed I/O interface standards: serial RapidIO and PCI Express. It can
be configured as x1/x4 SRIO and 1x/2x/4x PCI Express simultaneously with the following limitation:
• Both SRIO and PCI-Express are limited to use the same clock and are limited to 2.5G.
• Spread spectrum clocking can not be used because SRIO doesn't support this (PCI-Express does
support it).
If x8 PCI Express is needed, then SRIO is not available due to the pin multiplex limitation.
1.2.10 Serial RapidIO
The serial RapidIO interface is based on the RapidIO Interconnect Specification, Revision 1.2. RapidIO is
a high-performance, point-to-point, low-pin-count, packet-switched system-level interconnect that can be
used in a variety of applications as an open standard. The RapidIO architecture has a rich variety of
features including high data bandwidth, low-latency capability, and support for high-performance I/O
devices, as well as support for message-passing and software-managed programming models. Key features
of the serial RapidIO interface unit include:
• Support for RapidIO Interconnect Specification, Revision 1.2 (all transaction flows and priorities)
• Both 1x and 4x LP-serial link interfaces, with transmission rates of 1.25, 2.5, and 3.125 Gbaud
(data rates of 1.0, 2.0, and 2.5 Gbps) per lane
• Auto detection of 1x or 4x mode operation during port initialization
• 34-bit addressing and up to 256-byte data payload
• Receiver-controlled flow control
• Support for RapidIO error injection
The RapidIO messaging unit supports two inbox/outbox mailboxes (queues) for data and one doorbell
message structure. Both chaining and direct modes are provided for the outbox, and messages can hold up
to 16 packets of 256 bytes, or a total of 4 Kbytes.
1.2.11 PCI Express Interface
The MPC8568E supports a PCI Express interface compatible with the PCI Express Base Specification
Revision 1.0a. It is configurable at boot time to act as either root complex or endpoint.The physical layer
of the PCI Express interface operates at a 2.5-Gbaud data rate per lane.
Other features of the PCI Express interface include:
• x8, x4, x2, and x1 link widths supported
• Selectable operation as root complex or endpoint
• Both 32- and 64-bit addressing and 256-byte maximum payload size
• Full 64-bit decode with 32-bit wide windows
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MPC8568E Overview
1.2.12
Programmable Interrupt Controller (PIC)
The MPC8568E PIC implements the logic and programming structures of the OpenPIC architecture,
providing for external interrupts (with fully nested interrupt delivery), message interrupts, internal-logic
driven interrupts, and global high-resolution timers. Up to 16 programmable interrupt priority levels are
supported.
The PIC can be bypassed to allow use of an external interrupt controller.
1.2.13
DMA Controller, I2C, DUART, and Local Bus Controller
The MPC8568E provides an integrated four-channel DMA controller, which can transfer data between any
of its I/O or memory ports or between two devices or locations on the same port. The DMA controller also:
• Allows chaining (both extended and direct) through local memory-mapped chain descriptors.
• Scattering, gathering, and misaligned transfers are supported. In addition, stride transfers and
complex transaction chaining are supported.
• Local attributes such as snoop and L2 write stashing can be specified.
There are two I2C controllers. These synchronous, multimaster buses can be connected to additional
devices for expansion and system development.
The DUART supports full-duplex operation and is compatible with the PC16450 and PC16550
programming models. 16-byte FIFOs are supported for both the transmitter and the receiver.
The MPC8568E local bus controller (LBC) port allows connections with a wide variety of external
memories, DSPs, and ASICs. Three separate state machines share the same external pins and can be
programmed separately to access different types of devices. The general-purpose chip select machine
(GPCM) controls accesses to asynchronous devices using a simple handshake protocol. The user
programmable machine (UPM) can be programmed to interface to synchronous devices or custom ASIC
interfaces. The SDRAM controller provides access to standard SDRAM. Each chip select can be configured
so that the associated chip interface can be controlled by the GPCM, UPM, or SDRAM controller. All may
exist in the same system. The local bus controller supports the following features:
• Multiplexed 32-bit address and data bus operating at up to 133 MHz
• Eight chip selects support eight external slaves
• Up to eight-beat burst transfers
• 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
• Three protocol engines available on a per-chip-select basis
• Parity support
• Default boot ROM chip select with configurable bus width (8, 16, or 32 bits)
• Supports zero-bus-turnaround (ZBT) RAM
1.2.14
Power Management
In addition to low-voltage operation and dynamic power management, which automatically minimizes
power consumption of blocks when they are idle, four power consumption modes are supported: full on,
doze, nap, and sleep.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Electrical Characteristics
1.2.15
System Performance Monitor
The performance monitor facility supports eight 32-bit counters that can count up to 512 counter-specific
events. It supports duration and quantity threshold counting and a burstiness feature that permits counting
of burst events with a programmable time between bursts.
2
Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8568E. This device is currently targeted to these specifications. Some of these specifications are
independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer
design specifications.
2.1
Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
2.1.1
Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings 1
Characteristic
Symbol
Max Value
Unit Notes
Core supply voltage
VDD
–0.3 to 1.21
V
—
PLL supply voltage
AVDD_PLAT,
AVDD_CORE,
AV DD_CE,
AVDD_PCI,
AV DD_LBIU,
AVDD_SRDS
–0.3 to 1.21
V
—
Core power supply for SerDes transceiver
SCOREVDD
–0.3 to 1.21
V
—
Pad power supply for SerDes transceiver
XVDD
–0.3 to 1.21
V
—
DDR and DDR2 DRAM I/O voltage
GVDD
–0.3 to 2.75
–0.3 to 1.98
V
—
eTSEC1, eTSEC2 I/O Voltage
LVDD
–0.3 to 3.63
–0.3 to 2.75
V
—
QE UCC1/UCC2 Ethernet Interface I/O Voltage
TVDD
–0.3 to 3.63
–0.3 to 2.75
V
—
PCI, DUART, system control and power management, I2C, and JTAG
I/O voltage
OVDD
–0.3 to 3.63
V
3
Local bus I/O voltage
BVDD
–0.3 to 3.63
–0.3 to 2.75
V
3
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Electrical Characteristics
Table 2. Absolute Maximum Ratings 1 (continued)
Characteristic
Input voltage
Symbol
Max Value
MVIN
–0.3 to (GVDD + 0.3)
V
2, 5
DDR/DDR2 DRAM reference
MVREF
–0.3 to (GVDD + 0.3)
V
2, 5
Three-speed Ethernet signals
LVIN
TVIN
–0.3 to (LVDD + 0.3)
–0.3 to (TVDD + 0.3)
V
4, 5
Local bus signals
BVIN
–0.3 to (BVDD + 0.3)
DUART, SYSCLK, system control and power
management, I2C, and JTAG signals
OVIN
–0.3 to (OVDD + 0.3)
V
5
PCI
OVIN
–0.3 to (OVDD + 0.3)
V
6
TSTG
–55 to 150
•C
C
—
DDR/DDR2 DRAM signals
Storage temperature range
Unit Notes
—
Notes:
1. Functional and tested operating conditions are given in Table 3. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
3. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
4. Caution: L/TVIN must not exceed L/TVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
5. (M,L,O)VIN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.
6. OVIN on the PCI interface may overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as
shown in Figure 2.
2.1.2
Recommended Operating Conditions
Table 3 provides the recommended operating conditions for this device. Note that the values in Table 3 are
the recommended and tested operating conditions. Proper device operation outside these conditions is not
guaranteed.
Table 3. Recommended Operating Conditions
Symbol
Recommended
Value
Core supply voltage
VDD
1.1 V ± 55 mV
V
—
PLL supply voltage
AVDD_PLAT,
AV DD_CORE,
AVDD_CE,
AVDD_PCI,
AVDD_LBIU,
AVDD_SRDS
1.1 V ± 55 mV
V
—
Core power supply for SerDes transceiver
SCOREVDD
1.1 V ± 55 mV
V
—
Pad power supply for SerDes transceiver
XVDD
1.1 V ± 55 mV
V
—
DDR and DDR2 DRAM I/O voltage
GVDD
2.5 V ± 125 mV
1.8 V ± 90 mV
V
—
Characteristic
Unit Notes
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
11
Electrical Characteristics
Table 3. Recommended Operating Conditions (continued)
Symbol
Recommended
Value
Three-speed Ethernet I/O voltage
LV DD
TV DD
3.3 V ± 165 mV
2.5 V ± 125 mV
V
—
PCI, DUART, system control and power management, I2C, and JTAG I/O
voltage
OVDD
3.3 V ± 165 mV
V
—
Local bus I/O voltage
BVDD
3.3 V ± 165 mV
2.5 V ± 125 mV
V
—
MVIN
GND to GVDD
V
—
MVREF
GND to GVDD/2
V
—
Three-speed Ethernet signals
LVIN
TVIN
GND to LVDD
GND to TVDD
V
—
Local bus signals
BVIN
GND to BVDD
V
—
PCI, DUART, SYSCLK, system control and power
management, I2C, and JTAG signals
OVIN
GND to OV DD
V
—
Tj
0 to105
oC
—
Characteristic
Input voltage
DDR and DDR2 DRAM signals
DDR and DDR2 DRAM reference
Junction temperature range
Unit Notes
Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8568E.
B/G/L/T/OVDD + 20%
B/G/L/T/OVDD + 5%
B/G/L/T/OVDD
VIH
GND
GND – 0.3 V
VIL
GND – 0.7 V
Not to Exceed 10%
of tCLOCK1
Note:
1. Note that tCLOCK refers to the clock period associated with the respective interface
For I2C and JTAG, tCLOCK references SYSCLK.
For DDR, tCLOCK references MCLK.
For eTSEC, tCLOCK references EC_GTX_CLK125.
For LBIU, tCLOCK references LCLK.
For PCI, tCLOCK references PCI_CLK or SYSCLK.
For SerDes, tCLOCK references SD_REF_CLK.
2. Note that with the PCI overshoot allowed (as specified above), the device
does not fully comply with the maximum AC ratings and device protection guideline
outlined in the PCI rev. 2.2 standard (section 4.2.2.3)
Figure 2. Overshoot/Undershoot Voltage for BVDD/GVDD/LVDD/TVDD/OVDD
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
12
Freescale Semiconductor
Electrical Characteristics
The core voltage must always be provided at nominal 1.1V. (See Table 3 for actual recommended core
voltage). Voltage to the processor interface I/Os are provided through separate sets of supply pins and must
be provided at the voltages shown in Table 3. The input voltage threshold scales with respect to the
associated I/O supply voltage. OVDD and LVDD based receivers are simple CMOS I/O circuits and satisfy
appropriate LVCMOS type specifications. The DDR SDRAM interface uses a single-ended differential
receiver referenced the externally supplied MVREF signal (nominally set to GVDD/2) as is appropriate for
the SSTL2 electrical signaling standard.
2.1.3
Output Driver Characteristics
Table 4 provides information on the characteristics of the output driver strengths. The values are
preliminary estimates.
Table 4. Output Drive Capability
Driver Type
Programmable
Output Impedance
(Ω)
Supply
Voltage
25
25
BVDD = 3.3 V
BVDD = 2.5 V
45(default)
45(default)
BVDD = 3.3 V
BVDD = 2.5 V
25
OVDD = 3.3 V
2
Local bus interface utilities signals
PCI signals
Notes
1
42 (default)
DDR signal
20
GVDD = 2.5 V
—
DDR2 signal
16
32 (half strength mode)
GVDD = 1.8 V
—
eTSEC 10/100/1000 signals
42
L/TVDD = 2.5/3.3 V
—
DUART, system control, JTAG
42
OVDD = 3.3 V
—
I2C
150
OVDD = 3.3 V
—
Notes:
1. The drive strength of the local bus interface is determined by the configuration of the appropriate bits in PORIMPSCR.
2. The drive strength of the PCI interface is determined by the setting of the PCI_GNT[1] signal at reset.
2.2
Power Sequencing
The MPC8568E requires its power rails to be applied in specific sequence in order to ensure proper device
operation. These requirements are as follows for power up:
1. VDD, AVDD_n, BVDD, SCOREVDD, LVDD, TVDD, XVDD, OVDD
2. GVDD
All supplies must be at their stable values within 50 ms.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
13
Power Characteristics
NOTE
Items on the same line have no ordering requirement with respect to one
another. Items on separate lines must be ordered sequentially such that
voltage rails on a previous step must reach 90% of their value before the
voltage rails on the current step reach 10% of theirs.
In order to guarantee MCKE low during power-up, the above sequencing for
GVDD is required. If there is no concern about any of the DDR signals
being in an indeterminate state during power-up, then the sequencing for
GVDD is not required.
3
Power Characteristics
The power dissipation of VDD for various core complex bus (CCB) versus the core and QE frequency for
MPC8568E is shown in Table 5. Note that this is based on the design estimate only. More accurate power
number will be available after we have done the measurement on the silicon.
Table 5. MPC8568E Power Dissipation
CCB Frequency
Core Frequency
QE Frequency
Typical 65°C Typical 105°C
Maximum
Unit
400
800
400
8.7
12.0
13.0
W
400
1000
400
8.9
12.3
13.6
W
400
1200
400
11.3
15.7
16.9
W
533
1333
533
12.4
17.2
18.7
W
Notes:
1. CCB Frequency is the SoC platform frequency which corresponds to DDR data rate.
2. Typical 65 °C based on VDD=1.1V, Tj=65.
3. Typical 105 °C based on VDD=1.1V, Tj=105.
4. Maximum based on VDD=1.1V, Tj=105.
Table 6. Typical MPC8568E I/O Power Dissipation
Interface
Parameters
Local Bus
PCI
BVDD
OV DD
LV DD
3.3 V
2.5 V
TVDD
3.3 V
XVDD
Unit
Comment
2.5 V
1.8 V 3.3 V 2.5 V
0.76
0.50
W
400 MHz
0.56
W
533 MHz
0.68
W
Data rate
64-bit with
ECC
60% utilization
333 MHz
DDR/DDR2
GVDD
2.5 V
33 MHz, 32b
0.07
0.04
W
—
66 MHz, 32b
0.13
0.07
W
—
133 MHz, 32b
0.24
0.14
W
—
33 MHz
0.04
W
—
66 MHz
0.07
W
—
SRIO
4x, 3.125G
0.49
W
—
PCI Express
8x, 2.5G
0.71
W
—
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
14
Freescale Semiconductor
Input Clocks
Table 6. Typical MPC8568E I/O Power Dissipation (continued)
GVDD
Interface
2.5 V
eTSEC
Ethernet
BVDD
LV DD
Parameters
1.8 V 3.3 V 2.5 V
OV DD
3.3 V
QE UCC
2.5 V
3.3 V
2.5 V
XVDD
Unit
Comment
Multiply with
number of the
interfaces
MII
0.01
W
GMII/TBI
0.07
W
RGMII/RTBI
eTSEC
FIFO I/O
TVDD
0.04
W
16b, 200 MHz
0.20
W
16b, 155 MHz
0.16
W
8b, 200 MHz
0.11
W
8b, 155 MHz
0.08
W
MII/RMII
0.01
W
GMII/TBI
0.07
W
RGMII/RTBI
0.04
Multiply with
number of the
interfaces
Multiply with
number of the
interfaces
W
If UCC is
programmed
for other
protocols,
scale Ethernet
power
dissipation to
the number of
signals and the
clock rate
Note: This is the power for each individual interface. The power must be calculated for each interface being utilized.
4
Input Clocks
4.1
System Clock Timing
Table 7 provides the system clock (SYSCLK) AC timing specifications for the MPC8568E.
Table 7. SYSCLK AC Timing Specifications
At recommended operating conditions (see Table 3) with OVDD = 3.3 V ± 165 mV.
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
SYSCLK frequency
fSYSCLK
—
—
166
MHz
1
SYSCLK cycle time
tSYSCLK
6.0
—
—
ns
—
SYSCLK rise and fall time
tKH, tKL
0.6
1.0
2.3
ns
2
tKHK/tSYSCLK
40
—
60
%
3
SYSCLK duty cycle
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
15
Input Clocks
Table 7. SYSCLK AC Timing Specifications (continued)
At recommended operating conditions (see Table 3) with OVDD = 3.3 V ± 165 mV.
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
—
—
—
+/– 150
ps
4, 5
SYSCLK jitter
Notes:
1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the
resulting SYSCLK frequency, e500 core frequency, and CCB clock frequency do not exceed their respective
maximum or minimum operating frequencies. Refer to Section 23.2, “CCB/SYSCLK PLL Ratio and Section 23.3,
“e500 Core PLL Ratio,” for ratio settings.
2. Rise and fall times for SYSCLK are measured at 0.4 V and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. The SYSCLK driver’s closed loop jitter bandwidth should be <500 kHz at -20 dB. The bandwidth must be set low to
allow cascade-connected PLL-based devices to track SYSCLK drivers with the specified jitter.
4.2
PCI Clock Timing
Table 8 provides the PCI clock (PCI_CLK) AC timing specifications for the MPC8568E.
Table 8. PCI_CLK AC Timing Specifications
At recommended operating conditions (see Table 3) with OVDD = 3.3 V ± 165 mV.
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
PCI_CLK frequency
fPCI_CLK
—
—
66.7
MHz
—
PCI_CLK cycle time
tPCI_CLK
15
—
—
ns
—
PCI_CLK rise and fall time
tKH, tKL
0.6
1.0
2.3
ns
1
tKHK/tPCI_CLK
40
—
60
%
2
—
—
—
+/– 150
ps
3,4
PCI_CLK duty cycle
PCI_CLK jitter
Notes:
1. Rise and fall times for PCI_CLK are measured at 0.4 V and 2.7 V.
2. Timing is guaranteed by design and characterization.
3. This represents the total input jitter—short term and long term—and is guaranteed by design.
4. The SYSCLK driver’s closed loop jitter bandwidth should be <500 kHz at -20 dB. The bandwidth must be set low to allow
cascade-connected PLL-based devices to track SYSCLK drivers with the specified jitter.
4.3
Real Time Clock Timing
The RTC input is sampled by the platform clock (CCB clock). The output of the sampling latch is then
used as an input to the counters of the PIC and the Time Base unit of the e500. There is no need for jitter
specification. The minimum pulse width of the RTC signal should be greater than 2x the period of the CCB
clock. That is, minimum clock high time is 2 × tCCB, and minimum clock low time is 2 × tCCB. There is
no minimum RTC frequency. RTC may be grounded if not needed.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
16
Freescale Semiconductor
Input Clocks
4.4
eTSEC Gigabit Reference Clock Timing
Table 9 provides the eTSEC gigabit reference clocks (EC_GTX_CLK125) AC timing specifications for
the MPC8568E.
Table 9. EC_GTX_CLK125 AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
EC_GTX_CLK125 frequency
fG125
—
125
—
MHz
—
EC_GTX_CLK125 cycle time
tG125
—
8
—
ns
—
ns
—
—
—
—
—
0.75
1.0
%
1, 2
EC_GTX_CLK125 rise and fall time
L/TVDD = 2.5 V
L/TVDD = 3.3 V
EC_GTX_CLK125 duty cycle
tG125R, tG125F
—
tG125H/tG125
GMII, TBI
1000Base-T for RGMII, RTBI
45
47
55
53
Notes:
1. Timing is guaranteed by design and characterization.
2. EC_GTX_CLK125 is used to generate the GTX clock for the eTSEC transmitter with 2% degradation.
EC_GTX_CLK125 duty cycle can be loosened from 47/53% as long as the PHY device can tolerate the duty cycle
generated by the eTSEC GTX_CLK. See Section 8.2.6, “RGMII and RTBI AC Timing Specifications,” for duty cycle
for 10Base-T and 100Base-T reference clock.
3. Rise and fall times for EC_GTX_CLK125 are measured from 0.5 and 2.0 V for L/TVDD = 2.5 V, and from 0.6 and 2.7
V for L/TVDD = 3.3 V.
4.5
FIFO Clock Speed Restrictions
Note the following FIFO maximum speed restrictions based on the platform speed.
For FIFO GMII mode:
FIFO TX/RX clock frequency <= platform clock frequency / 4.2
For example, if the platform frequency is 533 MHz, the FIFO TX/RX clock frequency should be no higher
than 127 MHz.
For FIFO encoded mode:
FIFO TX/RX clock frequency <= platform clock frequency / 3.2
For example, if the platform frequency is 533 MHz, the FIFO TX/RX clock frequency should be no higher
than 167 MHz
4.6
Other Input Clocks
For information on the input clocks of other functional blocks of the platform such as SerDes, and eTSEC,
see the specific section of this document.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
17
RESET Initialization
5
RESET Initialization
This section describes the AC electrical specifications for the RESET initialization timing requirements of
the MPC8568E. Table 10 provides the RESET initialization AC timing specifications for the DDR
SDRAM component(s).
Table 10. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HRESET
100
—
μs
—
Minimum assertion time for SRESET
3
—
SYSCLKs
1
100
—
μs
—
Input setup time for POR configs (other than PLL config) with respect to
negation of HRESET
4
—
SYSCLKs
1
Input hold time for all POR configs (including PLL config) with respect to
negation of HRESET
2
—
SYSCLKs
1
Maximum valid-to-high impedance time for actively driven POR configs with
respect to negation of HRESET
—
5
SYSCLKs
1
Min
Max
Unit
Notes
Platform PLL lock times
—
100
μs
—
QE PLL lock times
—
100
μs
—
CPU PLL lock times
—
100
μs
—
PCI PLL lock times
—
100
μs
—
Local bus PLL
—
100
μs
—
PLL input setup time with stable SYSCLK before HRESET negation
Notes:
1. SYSCLK is the primary clock input for the MPC8568E.
Table 11 provides the PLL lock times.
Table 11. PLL Lock Times
Parameter/Condition
6
DDR and DDR2 SDRAM
This section describes the DC and AC electrical specifications for the DDR SDRAM interface of the
MPC8568E. Note that DDR SDRAM is GVDD(typ) = 2.5 V and DDR2 SDRAM is GVDD(typ) = 1.8 V.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
18
Freescale Semiconductor
DDR and DDR2 SDRAM
6.1
DDR SDRAM DC Electrical Characteristics
Table 12 provides the recommended operating conditions for the DDR2 SDRAM component(s) of the
MPC8568E when GVDD(typ) = 1.8 V.
Table 12. DDR2 SDRAM DC Electrical Characteristics for GVDD(typ) = 1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
I/O supply voltage
GVDD
1.7
1.9
V
1
I/O reference voltage
MVREF
0.49 × GVDD
0.51 × GVDD
V
2
I/O termination voltage
VTT
MVREF – 0.04
MV REF + 0.04
V
3
Input high voltage
VIH
MV REF+ 0.125
GVDD + 0.3
V
—
Input low voltage
VIL
–0.3
MVREF – 0.125
V
—
Output leakage current
IOZ
–10
10
μA
4
Output high current (VOUT = 1.420 V)
IOH
–13.4
—
mA
—
Output low current (VOUT = 0.280 V)
IOL
13.4
—
mA
—
Notes:
1. GVDD is expected to be within 50 mV of the DRAM GV DD at all times.
2. MVREF is expected to be equal to 0.5 × GV DD, and to track GVDD DC variations as measured at the receiver.
Peak-to-peak noise on MVREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREF. This rail should track variations in the DC level of MVREF.
4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD.
Table 13 provides the DDR capacitance when GVDD(typ) = 1.8 V.
Table 13. DDR2 SDRAM Capacitance for GVDD(typ)=1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS, DQS
CIO
6
8
pF
1
Delta input/output capacitance: DQ, DQS, DQS
CDIO
—
0.5
pF
1
Note:
1. This parameter is sampled. GVDD = 1.8 V ± 0.090 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT
(peak-to-peak) = 0.2 V.
Table 14 provides the recommended operating conditions for the DDR SDRAM component(s) when
GVDD(typ) = 2.5 V.
Table 14. DDR SDRAM DC Electrical Characteristics for GVDD (typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
I/O supply voltage
GVDD
2.3
2.7
V
1
I/O reference voltage
MVREF
0.49 × GVDD
0.51 × GVDD
V
2
I/O termination voltage
VTT
MVREF – 0.04
MVREF + 0.04
V
3
Input high voltage
VIH
MV REF + 0.15
GVDD + 0.3
V
—
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
19
DDR and DDR2 SDRAM
Table 14. DDR SDRAM DC Electrical Characteristics for GVDD (typ) = 2.5 V (continued)
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input low voltage
VIL
–0.3
MVREF– 0.15
V
—
Output leakage current
IOZ
–10
10
μA
4
Output high current (VOUT = 1.95 V)
IOH
–16.2
—
mA
—
Output low current (VOUT = 0.35 V)
IOL
16.2
—
mA
—
Notes:
1. GVDD is expected to be within 50 mV of the DRAM GV DD at all times.
2. MVREF is expected to be equal to 0.5 × GV DD, and to track GVDD DC variations as measured at the receiver.
Peak-to-peak noise on MVREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MV REF. This rail should track variations in the DC level of MVREF.
4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD.
Table 15 provides the DDR capacitance when GVDD (typ)=2.5 V.
Table 15. DDR SDRAM Capacitance for GVDD (typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS
CIO
6
8
pF
1
Delta input/output capacitance: DQ, DQS
CDIO
—
0.5
pF
1
Note:
1. This parameter is sampled. GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2,
VOUT (peak-to-peak) = 0.2 V.
Table 16 provides the current draw characteristics for MVREF.
Table 16. Current Draw Characteristics for MVREF
Parameter / Condition
Current draw for MVREF
Symbol
Min
Max
Unit
Note
IMVREF
—
500
μA
1
1. The voltage regulator for MVREF must be able to supply up to 500 μA current.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
20
Freescale Semiconductor
DDR and DDR2 SDRAM
6.2
DDR SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR SDRAM interface.
6.2.1
DDR SDRAM Input AC Timing Specifications
Table 17 provides the input AC timing specifications for the DDR2 SDRAM when GVDD(typ)=1.8 V.
Table 17. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
VIL
—
MVREF – 0.25
V
—
AC input high voltage
VIH
MVREF + 0.25
—
V
—
Table 18 provides the input AC timing specifications for the DDR SDRAM when GVDD(typ)=2.5 V.
Table 18. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface
At recommended operating conditions.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
VIL
—
MVREF – 0.31
V
—
AC input high voltage
VIH
MVREF + 0.31
—
V
—
Unit
Notes
ps
1, 2
Table 19 provides the input AC timing specifications for the DDR SDRAM interface.
Table 19. DDR SDRAM Input AC Timing Specifications
At recommended operating conditions.
Parameter
Symbol
Controller Skew for
MDQS—MDQ/MECC/MDM
Min
Max
tCISKEW
533 MHz
–300
300
3
400 MHz
–365
365
—
333 MHz
–390
390
—
Note:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding
bit that will be captured with MDQS[n]. This should be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW.This can be
determined by the following equation: tDISKEW =+/-(T/4 – abs(tCISKEW)) where T is the clock period and abs(tCISKEW)
is the absolute value of tCISKEW.
3. Maximum DDR1 frequency is 400 MHz.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
21
DDR and DDR2 SDRAM
Figure 3 provides the input timing diagram for the DDR SDRAM interface. tDISKEW can be calculated
from tCISKEW. See Table 19 footnote 2.
MCK[n]
MCK[n]
tMCK
MDQS[n]
MDQ[x]
D0
D1
tDISKEW
tDISKEW
Figure 3. DDR SDRAM Input Timing Diagram
6.2.2
DDR SDRAM Output AC Timing Specifications
Table 20. DDR SDRAM Output AC Timing Specifications
At recommended operating conditions.
Parameter
MCK[n] cycle time, MCK[n]/MCK[n] crossing
ADDR/CMD output setup with respect to MCK
Symbol 1
Min
Max
Unit
Notes
tMCK
3.75
10
ns
2
ns
3
tDDKHAS
533 MHz
1.48
—
400 MHz
1.95
—
333 MHz
2.40
—
ADDR/CMD output hold with respect to MCK
tDDKHAX
ns
533 MHz
1.48
—
400 MHz
1.95
—
333 MHz
2.40
—
MCS[n] output setup with respect to MCK
7
tDDKHCS
7
ns
533 MHz
1.48
—
400 MHz
1.95
—
333 MHz
2.40
—
3
3
7
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
22
Freescale Semiconductor
DDR and DDR2 SDRAM
Table 20. DDR SDRAM Output AC Timing Specifications (continued)
At recommended operating conditions.
Symbol 1
Parameter
MCS[n] output hold with respect to MCK
Min
Max
tDDKHCX
533 MHz
1.48
—
400 MHz
1.95
—
333 MHz
2.40
—
–0.6
0.6
MCK to MDQS Skew
tDDKHMH
MDQ/MECC/MDM output setup with respect to
MDQS
tDDKHDS,
tDDKLDS
533 MHz
538
—
400 MHz
700
—
333 MHz
900
—
MDQ/MECC/MDM output hold with respect to
MDQS
tDDKHDX,
tDDKLDX
Unit
Notes
ns
3
7
ns
4
ps
5
7
ps
533 MHz
538
—
400 MHz
700
—
333 MHz
900
—
5
7
MDQS preamble start
tDDKHMP
–0.5 × tMCK – 0.6
–0.5 × tMCK +0.6
ns
6
MDQS epilogue end
tDDKHME
–0.6
0.6
ns
6
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until
outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock
reference (K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS.
4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing
(DD) from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through
control of the DQSS override bits in the TIMING_CFG_2 register. This will typically be set to the same delay as the clock
adjust in the CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set
to the same adjustment value. See the MPC8568E Integrated Communications Processor Reference Manual for a
description and understanding of the timing modifications enabled by use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
(MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that tDDKHMP follows the
symbol conventions described in note 1.
7. Maximum DDR1 frequency is 400 MHz
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
23
DDR and DDR2 SDRAM
NOTE
For the ADDR/CMD setup and hold specifications in Table 20, it is
assumed that the Clock Control register is set to adjust the memory clocks
by 1/2 applied cycle.
Figure 4 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH).
MCK[n]
MCK[n]
tMCK
tDDKHMHmax) = 0.6 ns
MDQS
tDDKHMH(min) = –0.6 ns
MDQS
Figure 4. Timing Diagram for tDDKHMH
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
24
Freescale Semiconductor
DUART
Figure 5 shows the DDR SDRAM output timing diagram.
MCK[n]
MCK[n]
tMCK
tDDKHAS ,tDDKHCS
tDDKHAX ,tDDKHCX
ADDR/CMD
Write A0
NOOP
tDDKHMP
tDDKHMH
MDQS[n]
tDDKHME
tDDKHDS
tDDKLDS
MDQ[x]
D0
D1
tDDKLDX
tDDKHDX
Figure 5. DDR SDRAM Output Timing Diagram
Figure 6 provides the AC test load for the DDR bus.
Z0 = 50 Ω
Output
RL = 50 Ω
GVDD/2
Figure 6. DDR AC Test Load
7
DUART
This section describes the DC and AC electrical specifications for the DUART interface of the
MPC8568E.
7.1
DUART DC Electrical Characteristics
Table 21 provides the DC electrical characteristics for the DUART interface.
Table 21. DUART DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
– 0.3
0.8
V
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
25
Ethernet Interface and MII Management
Table 21. DUART DC Electrical Characteristics (continued)
Parameter
Symbol
Min
Max
Unit
IIN
—
±10
μA
High-level output voltage
(OVDD = min, IOH = –100 μA)
VOH
OVDD – 0.2
—
V
Low-level output voltage
(OVDD = min, IOL = 100 μA)
VOL
—
0.2
V
Input current
(VIN 1 = 0 V or VIN = VDD)
Note:
1. Note that the symbol V IN, in this case, represents the OVIN symbol referenced in Table 2 and Table 3.
7.2
DUART AC Electrical Specifications
Table 22 provides the AC timing parameters for the DUART interface.
Table 22. DUART AC Timing Specifications
Parameter
Value
Unit
Notes
Minimum baud rate
CCB clock/1,048,576
baud
1,2
Maximum baud rate
CCB clock/16
baud
1,3
16
—
1,4
Oversample rate
Notes:
1. Guaranteed by design
2. CCB clock refers to the platform clock.
3. Actual attainable baud rate will be limited by the latency of interrupt processing.
4. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are
sampled each 16th sample.
8
Ethernet Interface and MII Management
This section provides the AC and DC electrical characteristics for eTSEC, MII management and Ethernet
interface inside QUICC Engine. Note that eTSEC and QE Ethernet have the same DC/AC characteristics.
8.1
GMII/MII/TBI/RGMII/RTBI/RMII Electrical Characteristics
The electrical characteristics specified here apply to all gigabit media independent interface (GMII), media
independent interface (MII), ten-bit interface (TBI), reduced gigabit media independent interface
(RGMII), reduced ten-bit interface (RTBI), and reduced media independent interface (RMII) signals
except management data input/output (MDIO) and management data clock (MDC). The RGMII and RTBI
interfaces are defined for 2.5 V, while the GMII and TBI interfaces can be operated at 3.3 or 2.5 V. Whether
the GMII, MII, or TBI interface is operated at 3.3 or 2.5 V, the timing is compatible with the IEEE 802.3
standard. The RGMII and RTBI interfaces follow the Reduced Gigabit Media-Independent Interface
(RGMII) Specification Version 1.3 (12/10/2000). The RMII interface follows the RMII Consortium RMII
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
26
Freescale Semiconductor
Ethernet Interface and MII Management
Specification Version 1.2 (3/20/1998). The electrical characteristics for MDIO and MDC are specified in
Section 8, “Ethernet Interface and MII Management.”
8.1.1
Ethernet Interface DC Electrical Characteristics
All GMII, MII, TBI, RGMII, RMII and RTBI drivers and receivers comply with the DC parametric
attributes specified in Table 23 and Table 24. The potential applied to the input of a GMII, MII, TBI,
RGMII, RMII or RTBI receiver may exceed the potential of the receiver’s power supply (that is, a GMII
driver powered from a 3.6-V supply driving VOH into a GMII receiver powered from a 2.5-V supply).
Tolerance for dissimilar GMII driver and receiver supply potentials is implicit in these specifications. The
RGMII and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC
EIA/JESD8-5.
Table 23. GMII, MII, RMII, and TBI DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
Notes
Supply voltage 3.3 V
LVDD
TVDD
3.135
3.465
V
1, 2
Output high voltage
(LVDD/TVDD = Min, IOH = –4.0 mA)
VOH
2.40
LVDD/TVDD + 0.3
V
—
Output low voltage
(LVDD/TVDD = Min, IOL = 4.0 mA)
VOL
GND
0.50
V
—
Input high voltage
VIH
2.0
LVDD/TVDD + 0.3
V
—
Input low voltage
VIL
–0.3
0.90
V
—
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
27
Ethernet Interface and MII Management
Table 23. GMII, MII, RMII, and TBI DC Electrical Characteristics (continued)
Parameter
Symbol
Min
Max
Unit
Notes
Input high current
(V IN = LVDD, VIN = TVDD)
IIH
—
40
μA
1, 2, 3
Input low current
(V IN = GND)
IIL
–600
—
μA
3
Notes:
1. LV DD supports eTSECs 1 and 2.
2. TVDD supports QE UCC1 and UCC2 ethernet ports.
3. The symbol VIN, in this case, represents the LV IN and TVIN symbols referenced in Table 2 and Table 3.
Table 24. GMII, MII, RMII, RGMII, RTBI, TBI and FIFO DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
Notes
LVDD/TVDD
2.37
2.63
V
1, 2
Output high voltage
(LVDD/TVDD = Min, IOH = –1.0 mA)
VOH
2.00
LVDD/TVDD + 0.3
V
—
Output low voltage
(LVDD/TVDD = Min, IOL = 1.0 mA)
VOL
GND – 0.3
0.40
V
—
Input high voltage
VIH
1.70
LVDD/TVDD + 0.3
V
—
Input low voltage
VIL
–0.3
0.70
V
—
Input high current
(VIN = LVDD, VIN = TVDD)
IIH
—
10
μA
1, 2, 3
Input low current
(VIN = GND)
IIL
–15
—
μA
3
Supply voltage 2.5 V
Note:
1. LVDD supports eTSECs 1 and 2.
2. TVDD supports QE UCC1 and UCC2 ethernet ports.
3. Note that the symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 2 and Table 3.
8.2
FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI AC Timing
Specifications
The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII and RTBI are presented in this
section.
8.2.1
FIFO AC Specifications
The basis for the AC specifications for the eTSEC’s FIFO modes is the double data rate RGMII and RTBI
specifications, since they have similar performance and are described in a source-synchronous fashion like
FIFO modes. However, the FIFO interface provides deliberate skew between the transmitted data and
source clock in GMII fashion.
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Freescale Semiconductor
Ethernet Interface and MII Management
When the eTSEC is configured for FIFO modes, all clocks are supplied from external sources to the
relevant eTSEC interface. That is, the transmit clock must be applied to the eTSECn’s TSECn_TX_CLK,
while the receive clock must be applied to pin TSECn_RX_CLK. The eTSEC internally uses the transmit
clock to synchronously generate transmit data and outputs an echoed copy of the transmit clock back out
onto the TSECn_GTX_CLK pin (while transmit data appears on TSECn_TXD[7:0], for example). It is
intended that external receivers capture eTSEC transmit data using the clock on TSECn_GTX_CLK as a
source- synchronous timing reference. Typically, the clock edge that launched the data can be used, since
the clock is delayed by the eTSEC to allow acceptable set-up margin at the receiver. Note that there is
relationship between the maximum FIFO speed and the platform speed. For more information see Section
4.4, “Platform to FIFO restrictions.
A summary of the FIFO AC specifications appears in Table 25 and Table 26.
Table 25. FIFO Mode Transmit AC Timing Specification
Parameter/Condition
Symbol
Min
Typ
Max
Unit
TX_CLK, GTX_CLK clock period
tFIT
5.0
8.0
100
ns
TX_CLK, GTX_CLK duty cycle
tFITH
45
50
55
%
TX_CLK, GTX_CLK peak-to-peak jitter
tFITJ
—
—
250
ps
Rise time TX_CLK (20%–80%)
tFITR
—
0.75
1.5
ns
Fall time TX_CLK (80%–20%)
tFITF
—
0.75
1.5
ns
FIFO data TXD[7:0], TX_ER, TX_EN setup time to GTX_CLK
tFITDV
2.0
—
—
ns
GTX_CLK to FIFO data TXD[7:0], TX_ER, TX_EN hold time
tFITDX
0.5 1
—
3.0
ns
Table 26. FIFO Mode Receive AC Timing Specification
Parameter/Condition
Symbol
Min
Typ
Max
Unit
tFIR
5.0
8.0
100
ns
tFIRH/tFIRH
45
50
55
%
RX_CLK peak-to-peak jitter
tFIRJ
—
—
250
ps
Rise time RX_CLK (20%–80%)
tFIRR
—
0.75
1.5
ns
Fall time RX_CLK (80%–20%)
tFIRF
—
0.75
1.5
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tFIRDV
1.5
—
—
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tFIRDX
0.5
—
—
ns
RX_CLK clock period
RX_CLK duty cycle
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
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Ethernet Interface and MII Management
Timing diagrams for FIFO appear in Figure 7 and Figure 8.
.
tFITF
tFITR
tFIT
GTX_CLK
tFITH
tFITDV
tFITDX
TXD[7:0]
TX_EN
TX_ER
Figure 7. FIFO Transmit AC Timing Diagram
tFIRR
tFIR
RX_CLK
tFIRH
tFIRF
RXD[7:0]
RX_DV
RX_ER
valid data
tFIRDV
tFIRDX
Figure 8. FIFO Receive AC Timing Diagram
8.2.2
GMII AC Timing Specifications
This section describes the GMII transmit and receive AC timing specifications.
8.2.2.1
GMII Transmit AC Timing Specifications
Table 27 provides the GMII transmit AC timing specifications.
Table 27. GMII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
tGTX
—
8.0
—
ns
tGTXH/tGTX
45
—
55
%
GMII data TXD[7:0], TX_ER, TX_EN setup time
tGTKHDV
2.5
—
—
ns
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
tGTKHDX
0.5
—
5.0
ns
GTX_CLK data clock rise time (20%-80%)
tGTXR2
—
1.0
2.0
ns
GTX_CLK data clock fall time (80%-20%)
tGTXF2
—
1.0
2.0
ns
EC_GTX_CLK125 clock rise time (20%-80%)
tG125R
—
1.0
2.0
ns
EC_GTX_CLK125 clock fall time (80%-20%)
tG125F
—
1.0
2.0
ns
Parameter/Condition
GTX_CLK clock period
GTX_CLK duty cycle
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Ethernet Interface and MII Management
Table 27. GMII Transmit AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Parameter/Condition
EC_GTX_CLK125 duty cycle
Symbol 1
Min
tG125H/tG125
45
Typ
Max
Unit
55
ns
Notes:
1. The symbols used for timing specifications herein follow the pattern t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII
transmit timing (GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input
signals (D) reaching the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect
to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold
time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a
particular functional. For example, the subscript of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times,
the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design
Figure 9 shows the GMII transmit AC timing diagram.
tGTXR
tGTX
GTX_CLK
tGTXH
tGTXF
TXD[7:0]
TX_EN
TX_ER
tGTKHDX
tGTKHDV
Figure 9. GMII Transmit AC Timing Diagram
8.2.2.2
GMII Receive AC Timing Specifications
Table 28 provides the GMII receive AC timing specifications.
Table 28. GMII Receive AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
tGRX
—
8.0
—
ns
tGRXH/tGRX
40
—
60
ns
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
—
—
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.5
—
—
ns
—
1.0
2.0
ns
RX_CLK clock period
RX_CLK duty cycle
RX_CLK clock rise (20%-80%)
tGRXR
2
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
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Ethernet Interface and MII Management
Table 28. GMII Receive AC Timing Specifications (continued)
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Parameter/Condition
RX_CLK clock fall time (80%-20%)
Symbol 1
Min
Typ
Max
Unit
tGRXF2
—
1.0
2.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII
receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock
reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to
the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time.
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular
functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design
Figure 10 provides the AC test load for eTSEC.
Z0 = 50 Ω
Output
RL = 50 Ω
LVDD/2
Figure 10. eTSEC AC Test Load
Figure 11 shows the GMII receive AC timing diagram.
tGRXR
tGRX
RX_CLK
tGRXH
tGRXF
RXD[7:0]
RX_DV
RX_ER
tGRDXKH
tGRDVKH
Figure 11. GMII Receive AC Timing Diagram
8.2.3
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Ethernet Interface and MII Management
8.2.3.1
MII Transmit AC Timing Specifications
Table 29 provides the MII transmit AC timing specifications.
Table 29. MII Transmit AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX2
—
400
—
ns
TX_CLK clock period 100 Mbps
tMTX
—
40
—
ns
tMTXH/tMTX
35
—
65
%
tMTKHDX
Parameter/Condition
TX_CLK duty cycle
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
1
5
15
ns
TX_CLK data clock rise (20%-80%)
tMTXR
2
1.0
—
4.0
ns
TX_CLK data clock fall (80%-20%)
tMTXF2
1.0
—
4.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII
transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in
general, the clock reference symbol representation is based on two to three letters representing the clock of a particular
functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
Figure 12 shows the MII transmit AC timing diagram.
tMTX
tMTXR
TX_CLK
tMTXH
tMTXF
TXD[3:0]
TX_EN
TX_ER
tMTKHDX
Figure 12. MII Transmit AC Timing Diagram
8.2.3.2
MII Receive AC Timing Specifications
Table 30 provides the MII receive AC timing specifications.
Table 30. MII Receive AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
RX_CLK clock period 10 Mbps
tMRX2
—
400
—
ns
RX_CLK clock period 100 Mbps
tMRX
—
40
—
ns
tMRXH/tMRX
35
—
65
%
Parameter/Condition
RX_CLK duty cycle
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
33
Ethernet Interface and MII Management
Table 30. MII Receive AC Timing Specifications (continued)
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
—
—
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
—
—
ns
tMRXR2
1.0
—
4.0
ns
2
1.0
—
4.0
ns
Parameter/Condition
RX_CLK clock rise (20%-80%)
RX_CLK clock fall time (80%-20%)
tMRXF
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive
timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K)
going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input
signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general,
the clock reference symbol representation is based on three letters representing the clock of a particular functional. For
example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used
with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
Figure 13 provides the AC test load for eTSEC.
Z0 = 50 Ω
Output
RL = 50 Ω
LVDD/2
Figure 13. eTSEC AC Test Load
Figure 14 shows the MII receive AC timing diagram.
tMRX
tMRXR
RX_CLK
tMRXF
tMRXH
RXD[3:0]
RX_DV
RX_ER
Valid Data
tMRDVKH
tMRDXKL
Figure 14. MII Receive AC Timing Diagram
8.2.4
TBI AC Timing Specifications
This section describes the TBI transmit and receive AC timing specifications.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Ethernet Interface and MII Management
8.2.4.1
TBI Transmit AC Timing Specifications
Table 31 provides the TBI transmit AC timing specifications.
Table 31. TBI Transmit AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
tTTX
—
8.0
—
ns
tTTXH/tTTX
47
—
53
%
TCG[9:0] setup time GTX_CLK going high
tTTKHDV
2.0
—
—
ns
TCG[9:0] hold time from GTX_CLK going high
tTTKHDX3
1.0
—
—
ns
GTX_CLK rise (20%–80%)
tTTXR2
—
1.0
2.0
ns
GTX_CLK fall time (80%–20%)
tTTXF2
—
1.0
2.0
ns
EC_GTX_CLK125 clock rise time (20%-80%)
tG125R
—
1.0
2.0
ns
EC_GTX_CLK125 clock fall time (80%-20%)
tG125F
—
1.0
2.0
ns
tG125H/tG125
45
—
55
ns
Parameter/Condition
GTX_CLK clock period
GTX_CLK duty cycle
EC_GTX_CLK125 duty cycle
Notes:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state
)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tTTKHDV symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until the
referenced data signals (D) reach the valid state (V) or setup time. Also, tTTKHDX symbolizes the TBI transmit timing
(TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the invalid state
(X) or hold time. Note that, in general, the clock reference symbol representation is based on three letters
representing the clock of a particular functional. For example, the subscript of tTTX represents the TBI (T) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
Figure 15 shows the TBI transmit AC timing diagram.
tTTXR
tTTX
GTX_CLK
tTTXH
tTTXF
tTTXF
TCG[9:0]
tTTKHDV
tTTXR
tTTKHDX
Figure 15. TBI Transmit AC Timing Diagram
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
35
Ethernet Interface and MII Management
8.2.4.2
TBI Receive AC Timing Specifications
Table 32 provides the TBI receive AC timing specifications.
Table 32. TBI Receive AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
tTRX
—
16.0
—
ns
tSKTRX
7.5
—
8.5
ns
tTRXH/tTRX
40
—
60
%
RCG[9:0] setup time to rising PMA_RX_CLK
tTRDVKH
2.5
—
—
ns
RCG[9:0] hold time to rising PMA_RX_CLK
tTRDXKH
1.5
—
—
ns
PMA_RX_CLK[0:1] clock rise time (20%-80%)
tTRXR2
0.7
—
2.4
ns
PMA_RX_CLK[0:1] clock fall time (80%-20%)
tTRXF2
0.7
—
2.4
ns
Parameter/Condition
PMA_RX_CLK[0:1] clock period
PMA_RX_CLK[0:1] skew
PMA_RX_CLK[0:1] duty cycle
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tTRDVKH symbolizes TBI receive timing (TR) with respect to the time data input signals (D) reach the valid state (V)
relative to the tTRX clock reference (K) going to the high (H) state or setup time. Also, tTRDXKH symbolizes TBI
receive timing (TR) with respect to the time data input signals (D) went invalid (X) relative to the tTRX clock reference
(K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three
letters representing the clock of a particular functional. For example, the subscript of tTRX represents the TBI (T)
receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
For symbols representing skews, the subscript is skew (SK) followed by the clock that is being skewed (TRX).
2. Guaranteed by design.
Figure 16 shows the TBI receive AC timing diagram.
tTRXR
tTRX
PMA_RX_CLK1
tTRXH
tTRXF
Valid Data
RCG[9:0]
Valid Data
tTRDVKH
tSKTRX
tTRDXKH
PMA_RX_CLK0
tTRDXKH
tTRXH
tTRDVKH
Figure 16. TBI Receive AC Timing Diagram
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Ethernet Interface and MII Management
8.2.5
TBI Single-Clock Mode AC Specifications
When the eTSEC is configured for TBI modes, all clocks are supplied from external sources to the relevant
eTSEC interface. In single-clock TBI mode, when TBICON[CLKSEL] = 1 a 125-MHz TBI receive clock
is supplied on TSECn TSECn_RX_CLK pin (no receive clock is used on TSECn_TX_CLK in this mode,
whereas for the dual-clock mode this is the PMA1 receive clock). The 125-MHz transmit clock is applied
on the TSEC_GTX_CLK125 pin in all TBI modes.
A summary of the single-clock TBI mode AC specifications for receive appears in Table 33.
Table 33. TBI single-clock Mode Receive AC Timing Specification
Parameter/Condition
Symbol
Min
Typ
Max
Unit
RX_CLK clock period
tTRR
7.5
8.0
8.5
ns
RX_CLK duty cycle
tTRRH
40
50
60
%
RX_CLK peak-to-peak jitter
tTRRJ
—
—
250
ps
Rise time RX_CLK (20%–80%)
tTRRR
—
1.0
2.0
ns
Fall time RX_CLK (80%–20%)
tTRRF
—
1.0
2.0
ns
RCG[9:0] setup time to RX_CLK rising edge
tTRRDV
2.0
—
—
ns
RCG[9:0] hold time to RX_CLK rising edge
tTRRDX
1.0
—
—
ns
A timing diagram for TBI receive appears in Figure 17.
.
tTRRR
tTRR
RX_CLK
tTRRH
tTRRF
RCG[9:0]
valid data
tTRRDV
tTRRDX
Figure 17. TBI Single-Clock Mode Receive AC Timing Diagram
8.2.6
RGMII and RTBI AC Timing Specifications
Table 34 presents the RGMII and RTBI AC timing specifications.
Table 34. RGMII and RTBI AC Timing Specifications
At recommended operating conditions with LVDD of 2.5 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
Data to clock output skew (at transmitter)
tSKRGT5
–5006
0
5006
ps
Data to clock input skew (at receiver) 2
tSKRGT
1.0
—
2.8
ns
tRGT5
7.2
8.0
8.8
ns
Parameter/Condition
Clock period duration 3
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
37
Ethernet Interface and MII Management
Table 34. RGMII and RTBI AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 2.5 V ± 5%.
Duty cycle for 10BASE-T and 100BASE-TX 3, 4
tRGTH/tRGT5
40
50
60
%
Rise time (20%–80%)
tRGTR5
—
0.75
1.5
ns
Fall time (20%–80%)
tRGTF5
—
0.75
1.5
ns
EC_GTX_CLK125 clock rise time (20%-80%)
tG125R
—
0.75
1.5
ns
EC_GTX_CLK125 clock fall time (80%-20%)
tG125F
—
0.75
1.5
ns
tG125H/tG125
47
53
ns
EC_GTX_CLK125 duty cycle6
Notes:
1. Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to
represent RGMII and RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Note
also that the notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols
representing skews, the subscript is skew (SK) followed by the clock that is being skewed (RGT).
2. This implies that PC board design will require clocks to be routed such that an additional trace delay of greater than
1.5 ns will be added to the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains
as long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed
transitioned between.
5. Guaranteed by characterization
6. EC_GTX_CLK125 is used to generate GTX_CLK for the eTSEC transmitter with 2% degradation. EC_GTX_CLK125
duty cycle can be loosen from 47/53% as long as the PHY device can tolerate the duty cycle generated by the eTSEC
GTX_CLK.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Ethernet Interface and MII Management
Figure 18 shows the RGMII and RTBI AC timing and multiplexing diagrams.
tRGT
tRGTH
GTX_CLK
(At Transmitter)
tSKRGT
TXD[8:5][3:0]
TXD[7:4][3:0]
TXD[8:5]
TXD[3:0] TXD[7:4]
TXD[4]
TXEN
TX_CTL
TXD[9]
TXERR
tSKRGT
TX_CLK
(At PHY)
RXD[8:5][3:0]
RXD[7:4][3:0]
RXD[8:5]
RXD[3:0] RXD[7:4]
tSKRGT
RXD[4]
RXDV
RX_CTL
RXD[9]
RXERR
tSKRGT
RX_CLK
(At PHY)
Figure 18. RGMII and RTBI AC Timing and Multiplexing Diagrams
8.2.7
RMII AC Timing Specifications
This section describes the RMII transmit and receive AC timing specifications.
8.2.7.1
RMII Transmit AC Timing Specifications
The RMII transmit AC timing specifications are in Table 35.
Table 35. RMII Transmit AC Timing Specifications
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
REF_CLK clock period
tRMT
15.0
20.0
25.0
ns
REF_CLK duty cycle
tRMTH
35
50
65
%
REF_CLK peak-to-peak jitter
tRMTJ
—
—
250
ps
Rise time REF_CLK (20%–80%)
tRMTR
1.0
—
2.0
ns
Fall time REF_CLK (80%–20%)
tRMTF
1.0
—
2.0
ns
Parameter/Condition
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
39
Ethernet Interface and MII Management
Table 35. RMII Transmit AC Timing Specifications (continued)
At recommended operating conditions with LVDD of 3.3 V ± 5%.
Parameter/Condition
REF_CLK to RMII data TXD[1:0], TX_EN delay
Symbol 1
Min
Typ
Max
Unit
tRMTDX
1.0
—
10.0
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs
(D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters
representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
Figure 19 shows the RMII transmit AC timing diagram.
tRMT
tRMTR
REF_CLK
tRMTH
tRMTF
TXD[1:0]
TX_EN
TX_ER
tRMTDX
Figure 19. RMII Transmit AC Timing Diagram
8.2.7.2
RMII Receive AC Timing Specifications
Table 36. RMII Receive AC Timing Specifications
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Symbol 1
Min
Typ
Max
Unit
REF_CLK clock period
tRMR
15.0
20.0
25.0
ns
REF_CLK duty cycle
tRMRH
35
50
65
%
REF_CLK peak-to-peak jitter
tRMRJ
—
—
250
ps
Rise time REF_CLK (20%–80%)
tRMRR
1.0
—
2.0
ns
Fall time REF_CLK (80%–20%)
tRMRF
1.0
—
2.0
ns
RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK
rising edge
tRMRDV
4.0
—
—
ns
Parameter/Condition
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Ethernet Interface and MII Management
Table 36. RMII Receive AC Timing Specifications (continued)
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.
Parameter/Condition
RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK
rising edge
Symbol 1
Min
Typ
Max
Unit
tRMRDX
2.0
—
—
ns
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V)
relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII
receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference
(K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based
on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the
MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise)
or F (fall).
Figure 20 provides the AC test load for eTSEC.
Z0 = 50 Ω
Output
RL = 50 Ω
LVDD/2
Figure 20. eTSEC AC Test Load
Figure 21 shows the RMII receive AC timing diagram.
tRMRR
tRMR
REF_CLK
tRMRH
RXD[1:0]
CRS_DV
RX_ER
tRMRF
Valid Data
tRMRDV
tRMRDX
Figure 21. RMII Receive AC Timing Diagram
8.3
Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to MII management interface signals MDIO
(management data input/output) and MDC (management data clock).
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
41
Ethernet Interface and MII Management
8.3.1
MII Management DC Electrical Characteristics
The MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics
for MDIO and MDC are provided in Table 37.
Table 37. MII Management DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
OV DD
3.13
3.47
V
Output high voltage
(OVDD = Min, IOH = –1.0 mA)
VOH
2.10
OVDD + 0.3
V
Output low voltage
(OVDD = Min, IOL = 1.0 mA)
VOL
GND
0.50
V
Input high voltage
VIH
2.0
—
V
Input low voltage
VIL
—
0.90
V
Input high current
(OVDD= Max, VIN 1= 2.1 V)
IIH
—
40
μA
Input low current
(OVDD= Max, VIN 1= 0.5 V)
IIL
–600
—
μA
Supply voltage 3.3 V
Note:
1. The symbol VIN, in this case, represents the OVIN symbols referenced in Table 2 and Table 3.
8.3.2
MII Management AC Electrical Characteristics
Table 38 provides the MII management AC timing specifications.
Table 38. MII management AC timing specifications
Parameters
MDC frequency
Symbol
Min
Max
Unit
Notes
fMDC
—
2.5
MHz
2
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Ethernet Interface and MII Management
Table 38. MII management AC timing specifications (continued)
Parameters
Symbol
Min
Max
Unit
Notes
MDC period
tMDC
400
—
ns
2
MDC clock pulse width high
tMDCH
32
—
ns
—
MDC to MDIO delay
tMDKHDX
(16*tplb_clk)-3
(16*tplb_clk)+3
ns
3, 5
MDIO to MDC setup time
tMDDVKH
5
—
ns
—
MDIO to MDC hold time
tMDDXKH
0
—
ns
—
MDC rise time
tMDCR
—
10
ns
4
MDC fall time
tMDCF
—
10
ns
4
Note:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tMDKHDX symbolizes management data timing (MD) for the time tMDC from clock reference (K) high (H) until data
outputs (D) are invalid (X) or data hold time. Also, tMDDVKH symbolizes management data timing (MD) with respect
to the time data input signals (D) reach the valid state (V) relative to the tMDC clock reference (K) going to the high
(H) state or setup time. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F
(fall).
2. IEEE 802.3 standard specifies that the max MDC frequency to be 2.5MHz. The frequency is programmed through
MIIMCFG[MgmtClk].
3. This parameter is dependent on the platform clock speed. The delay is equal to 16 platform clock periods +/-3ns. With a
platform clock of 333MHz, the min/max delay is 48ns +/- 3ns.
4. Guaranteed by design
5. tplb_clk is the platform (CCB) clock period.
6. MDC to MDIO data valid tMDKHDV is a function of clock period and max delay time (tMDKHDX). (Min Setup time = Cycle
time – Max delay).
Figure 22 shows the MII management AC timing diagram.
Figure 22. MII Management Interface Timing Diagram
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
43
Local Bus
9
Local Bus
This section describes the DC and AC electrical specifications for the local bus interface of the MPC8568.
9.1
Local Bus DC Electrical Characteristics
Table 39 provides the DC electrical characteristics for the local bus interface operating at BVDD = 3.3 V
DC.
Table 39. Local Bus DC Electrical Characteristics (3.3 V DC)
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
BVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
Input current
(VIN 1 = 0 V or VIN = BVDD)
IIN
—
±5
μA
High-level output voltage
(BVDD = min, IOH = –2 mA)
VOH
2.4
—
V
Low-level output voltage
(BVDD = min, IOL = 2 mA)
VOL
—
0.4
V
Note:
1. The symbol V IN, in this case, represents the BVIN symbol referenced in Table 2 and Table 3.
Table 40 provides the DC electrical characteristics for the local bus interface operating at BVDD = 2.5 V
DC.
Table 40. Local Bus DC Electrical Characteristics (2.5 V DC)
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
1.70
BVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.7
V
Input current
(VIN 1 = 0 V or VIN = BVDD)
IIH
—
10
μA
High-level output voltage
(BVDD = min, IOH = –1 mA)
VOH
2.0
—
V
Low-level output voltage
(BVDD = min, IOL = 1 mA)
VOL
—
0.4
V
IIL
–15
Note:
1. The symbol VIN, in this case, represents the BVIN symbol referenced in Table 2 and Table 3.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
44
Freescale Semiconductor
Local Bus
9.2
Local Bus AC Electrical Specifications
Table 41 describes the timing parameters of the local bus interface at BVDD = 3.3 V. For information about
the frequency range of local bus see Section 23.1, “Clock Ranges.”
Table 41. Local Bus Timing Parameters (BVDD = 3.3 V)—PLL Enabled
Symbol 1
Min
Max
Local bus cycle time
tLBK
7.5
12
ns
2
Local bus duty cycle
tLBKH/tLBK
43
57
%
—
LCLK[n] skew to LCLK[m] or LSYNC_OUT
tLBKSKEW
—
150
ps
7, 8
Input setup to local bus clock (except LGTA/LUPWAIT)
tLBIVKH1
1.8
—
ns
3, 4
LGTA/LUPWAIT input setup to local bus clock
tLBIVKH2
1.7
—
ns
3, 4
Input hold from local bus clock (except LGTA/LUPWAIT)
tLBIXKH1
1.0
—
ns
3, 4
LGTA/LUPWAIT input hold from local bus clock
tLBIXKH2
1.0
—
ns
3, 4
LALE output transition to LAD/LDP output transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
Local bus clock to output valid (except LAD/LDP and LALE)
tLBKHOV1
—
3.0
ns
—
Local bus clock to data valid for LAD/LDP
tLBKHOV2
—
3.2
ns
3
Local bus clock to address valid for LAD
tLBKHOV3
—
3.2
ns
3
Local bus clock to LALE assertion
tLBKHOV4
—
3.2
ns
3
Output hold from local bus clock (except LAD/LDP and LALE)
tLBKHOX1
0.7
—
ns
3
Output hold from local bus clock for LAD/LDP
tLBKHOX2
0.7
—
ns
3
Local bus clock to output high Impedance (except LAD/LDP and LALE)
tLBKHOZ1
—
2.5
ns
5
Local bus clock to output high impedance for LAD/LDP
tLBKHOZ2
—
2.5
ns
5
Parameter
Unit Notes
Note:
1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus
timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for
clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the
output (O) going invalid (X) or output hold time.
2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode.
3. All signals are measured from BV DD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus clock for PLL
bypass mode to 0.4 × BVDD of the signal in question for 3.3-V signaling levels.
4. Input timings are measured at the pin.
5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT is
programmed with the LBCR[AHD] parameter.
7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
complementary signals at BVDD/2.
8. Guaranteed by design.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
45
Local Bus
Table 42 describes the timing parameters of the local bus interface at BVDD = 2.5 V.
Table 42. Local Bus Timing Parameters (BVDD = 2.5 V)—PLL Enabled
Symbol 1
Min
Max
Unit
Notes
Local bus cycle time
tLBK
7.5
12
ns
2
Local bus duty cycle
tLBKH/tLBK
43
57
%
—
LCLK[n] skew to LCLK[m] or LSYNC_OUT
tLBKSKEW
—
150
ps
7, 8
Input setup to local bus clock (except
LGTA/UPWAIT)
tLBIVKH1
1.9
—
ns
3, 4
LGTA/LUPWAIT input setup to local bus clock
tLBIVKH2
1.8
—
ns
3, 4
Input hold from local bus clock (except
LGTA/LUPWAIT)
tLBIXKH1
1.1
—
ns
3, 4
LGTA/LUPWAIT input hold from local bus clock
tLBIXKH2
1.1
—
ns
3, 4
LALE output transition to LAD/LDP output
transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
Local bus clock to output valid (except
LAD/LDP and LALE)
tLBKHOV1
—
3.0
ns
—
Local bus clock to data valid for LAD/LDP
tLBKHOV2
—
3.2
ns
3
Local bus clock to address valid for LAD
tLBKHOV3
—
3.2
ns
3
Local bus clock to LALE assertion
tLBKHOV4
—
3.2
ns
3
Output hold from local bus clock (except
LAD/LDP and LALE)
tLBKHOX1
0.8
—
ns
3
Output hold from local bus clock for LAD/LDP
tLBKHOX2
0.8
—
ns
3
Local bus clock to output high Impedance
(except LAD/LDP and LALE)
tLBKHOZ1
—
2.6
ns
5
Local bus clock to output high impedance for
LAD/LDP
tLBKHOZ2
—
2.6
ns
5
Parameter
Note:
1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus
timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for
clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the
output (O) going invalid (X) or output hold time.
2. All timings are in reference to LSYNC_IN for PLL enabled and internal local bus clock for PLL bypass mode.
3. All signals are measured from BVDD/2 of the rising edge of LSYNC_IN for PLL enabled or internal local bus clock for PLL
bypass mode to 0.4 × BVDD of the signal in question for 3.3-V signaling levels.
4. Input timings are measured at the pin.
5. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through
the component pin is less than or equal to the leakage current specification.
6. tLBOTOT is a measurement of the minimum time between the negation of LALE and any change in LAD. tLBOTOT is programmed
with the LBCR[AHD] parameter.
7. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
complementary signals at BVDD/2.
8. Guaranteed by design.
Figure 23 provides the AC test load for the local bus.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
46
Freescale Semiconductor
Local Bus
Z0 = 50 Ω
Output
BVDD/2
RL = 50 Ω
Figure 23. Local Bus AC Test Load
NOTE
PLL bypass mode is required when LBIU frequency is at or below 83 MHz.
When LBIU operates above 83 MHz, LBIU PLL is recommended to be
enabled.
Figure 24 to Figure 29 show the local bus signals.
LSYNC_IN
tLBIXKH1
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH2
tLBIVKH2
Input Signal:
LGTA
LUPWAIT
Output Signals:
LA[27:31]/LBCTL/LBCKE/LOE/
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
tLBKHOV1
tLBKHOZ1
tLBKHOX1
tLBKHOV2
tLBKHOZ2
tLBKHOX2
Output (Data) Signals:
LAD[0:31]/LDP[0:3]
tLBKHOV3
tLBKHOZ2
tLBKHOX2
Output (Address) Signal:
LAD[0:31]
tLBOTOT
tLBKHOV4
LALE
Figure 24. Local Bus Signals (PLL Enabled)
Table 43 describes the timing parameters of the local bus interface at BVDD = 3.3 V with PLL disabled.
Table 43. Local Bus Timing Parameters—PLL Bypassed
Symbol 1
Min
Max
Local bus cycle time
tLBK
12
—
ns
2
Local bus duty cycle
tLBKH/tLBK
43
57
%
—
Parameter
Unit Notes
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
47
Local Bus
Table 43. Local Bus Timing Parameters—PLL Bypassed (continued)
Symbol 1
Min
Max
Internal launch/capture clock to LCLK delay
tLBKHKT
2.3
4.4
ns
8
Input setup to local bus clock (except LGTA/LUPWAIT)
tLBIVKH1
6.2
—
ns
4, 5
LGTA/LUPWAIT input setup to local bus clock
tLBIVKL2
6.1
—
ns
4, 5
Input hold from local bus clock (except LGTA/LUPWAIT)
tLBIXKH1
–1.8
—
ns
4, 5
LGTA/LUPWAIT input hold from local bus clock
tLBIXKL2
–1.3
—
ns
4, 5
LALE output transition to LAD/LDP output transition (LATCH hold time)
tLBOTOT
1.5
—
ns
6
Local bus clock to output valid (except LAD/LDP and LALE)
tLBKLOV1
—
-0.3
ns
—
Local bus clock to data valid for LAD/LDP
tLBKLOV2
—
-0.1
ns
4
Local bus clock to address valid for LAD
tLBKLOV3
—
0
ns
4
Local bus clock to LALE assertion
tLBKLOV4
—
0
ns
4
Output hold from local bus clock (except LAD/LDP and LALE)
tLBKLOX1
–3.7
—
ns
4
Output hold from local bus clock for LAD/LDP
tLBKLOX2
–3.7
—
ns
4
Local bus clock to output high Impedance (except LAD/LDP and LALE)
tLBKLOZ1
—
0.2
ns
7
Local bus clock to output high impedance for LAD/LDP
tLBKLOZ2
—
0.2
ns
7
Parameter
Unit Notes
Notes:
1. The symbols used for timing specifications herein follow the pattern of t(First two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(First two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus
timing (LB) for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for
clock one(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the
output (O) going invalid (X) or output hold time.
2. All timings are in reference to local bus clock for PLL bypass mode. Timings may be negative with respect to the local bus
clock because the actual launch and capture of signals is done with the internal launch/capture clock, which precedes LCLK
by tLBKHKT.
3. Maximum possible clock skew between a clock LCLK[m] and a relative clock LCLK[n]. Skew measured between
complementary signals at BVDD/2.
4. All signals are measured from BVDD/2 of the rising edge of local bus clock for PLL bypass mode to 0.4 x BVDD of the signal
in question for 3.3-V signaling levels.
5. Input timings are measured at the pin.
6. The value of tLBOTOT is the measurement of the minimum time between the negation of LALE and any change in LAD
7. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through
the component pin is less than or equal to the leakage current specification.
8. Guaranteed by characterization.
9. Guaranteed by design.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
48
Freescale Semiconductor
Local Bus
Internal launch/capture clock
tLBKHKT
LCLK[n]
tLBIVKH1
tLBIXKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIVKL2
Input Signal:
LGTA
tLBIXKL2
LUPWAIT
tLBKLOV1
tLBKLOX1
Output Signals:
LA[27:31]/LBCTL/LBCKE/LOE/
LSDA10/LSDWE/LSDRAS/
LSDCAS/LSDDQM[0:3]
tLBKLOZ1
tLBKLOZ2
tLBKLOV2
Output (Data) Signals:
LAD[0:31]/LDP[0:3]
tLBKLOX2
tLBKLOV3
Output (Address) Signal:
LAD[0:31]
tLBKLOV4
tLBOTOT
LALE
Figure 25. Local Bus Signals (PLL Bypass Mode)
NOTE
In PLL bypass mode, LCLK[n] is the inverted version of the internal clock
with the delay of tLBKHKT. In this mode, signals are launched at the rising edge
of the internal clock and are captured at falling edge of the internal clock
with the exception of LGTA/LUPWAIT (which is captured on the rising
edge of the internal clock).
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
49
Local Bus
LSYNC_IN
T1
T3
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBKHOV1
tLBKHOZ1
GPCM Mode Input Signal:
LGTA
tLBIVKH2
tLBIXKH2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
tLBKHOV1
tLBKHOZ1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 26. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (PLL Enabled)
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
50
Freescale Semiconductor
Local Bus
Internal launch/capture clock
T1
T3
LCLK
tLBKLOX1
tLBKLOV1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBKLOZ1
GPCM Mode Input Signal:
LGTA
tLBIVKL2
tLBIXKL2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 27. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (PLL Bypass Mode)
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
51
Local Bus
LSYNC_IN
T1
T2
T3
T4
tLBKHOV1
tLBKHOZ1
GPCM Mode Output Signals:
LCS[0:7]/LWE
GPCM Mode Input Signal:
LGTA
tLBIVKH2
tLBIXKH2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
tLBKHOV1
tLBKHOZ1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 28. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 8 or 16 (PLL Enabled)
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
52
Freescale Semiconductor
Local Bus
Internal launch/capture clock
T1
T2
T3
T4
LCLK
tLBKLOX1
tLBKLOV1
GPCM Mode Output Signals:
LCS[0:7]/LWE
tLBKLOZ1
GPCM Mode Input Signal:
LGTA
tLBIVKL2
tLBIXKL2
UPM Mode Input Signal:
LUPWAIT
tLBIVKH1
Input Signals:
LAD[0:31]/LDP[0:3]
tLBIXKH1
UPM Mode Output Signals:
LCS[0:7]/LBS[0:3]/LGPL[0:5]
Figure 29. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 8 or 16 (PLL Bypass Mode)
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
53
JTAG
10 JTAG
This section describes the DC and AC electrical specifications for the IEEE Std 1149.1™ (JTAG) interface
of the MPC8568E.
10.1
JTAG DC Electrical Characteristics
Table provides the DC electrical specifications for the IEEE 1149.1 (JTAG) interface of the MPC8568E.
Table 44. JTAG DC Electrical Characteristics
Parameter
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = -6.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.5
OVDD + 0.3
V
Input low voltage
VIL
—
-0.3
0.8
V
Input current
IIN
0 < VIN < OVDD
—
±10
uA
10.2
JTAG AC Electrical Characteristics
Table 45 provides the JTAG AC timing specifications as defined in Figure 31 through Figure 33.
Table 45. JTAG AC Timing Specifications (Independent of SYSCLK) 1
At recommended operating conditions (see Table 3).
Symbol 2
Min
Max
Unit
Notes
JTAG external clock frequency of operation
fJTG
0
33.3
MHz
—
JTAG external clock cycle time
t JTG
30
—
ns
—
tJTKHKL
15
—
ns
—
tJTGR & tJTGF
0
2
ns
6
tTRST
25
—
ns
3
Boundary-scan data
TMS, TDI
tJTDVKH
tJTIVKH
4
0
—
—
Boundary-scan data
TMS, TDI
tJTDXKH
tJTIXKH
20
25
—
—
Boundary-scan data
TDO
tJTKLDV
tJTKLOV
4
4
20
25
Boundary-scan data
TDO
tJTKLDX
tJTKLOX
30
30
—
—
Parameter
JTAG external clock pulse width measured at 1.4 V
JTAG external clock rise and fall times
TRST assert time
ns
Input setup times:
Input hold times:
4
ns
Valid times:
4
ns
Output hold times:
5
ns
5
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
54
Freescale Semiconductor
JTAG
Table 45. JTAG AC Timing Specifications (Independent of SYSCLK) 1 (continued)
At recommended operating conditions (see Table 3).
Parameter
Symbol 2
Min
Max
JTAG external clock to output high impedance:
Boundary-scan data
TDO
tJTKLDZ
tJTKLOZ
3
3
19
9
Unit
Notes
ns
5, 6
Notes:
1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question.
The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load (see Figure 30).
Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG
device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference
(K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input
signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock
reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall
times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
4. Non-JTAG signal input timing with respect to tTCLK.
5. Non-JTAG signal output timing with respect to tTCLK.
6. Guaranteed by design
Figure 30 provides the AC test load for TDO and the boundary-scan outputs.
Z0 = 50 Ω
Output
R L = 50 Ω
OVDD/2
Figure 30. AC Test Load for the JTAG Interface
Figure 31 provides the JTAG clock input timing diagram.
JTAG
External Clock
VM
VM
VM
tJTGR
tJTKHKL
tJTGF
tJTG
VM = Midpoint Voltage (OVDD/2)
Figure 31. JTAG Clock Input Timing Diagram
Figure 32 provides the TRST timing diagram.
TRST
VM
VM
tTRST
VM = Midpoint Voltage (OVDD /2)
Figure 32. TRST Timing Diagram
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
55
I2C
Figure 33 provides the boundary-scan timing diagram.
JTAG
External Clock
VM
VM
tJTDVKH
tJTDXKH
Boundary
Data Inputs
Input
Data Valid
tJTKLDV
tJTKLDX
Boundary
Data Outputs
Output Data Valid
tJTKLDZ
Boundary
Data Outputs
Output Data Valid
VM = Midpoint Voltage (OV DD/2)
Figure 33. Boundary-Scan Timing Diagram
11 I2C
This section describes the DC and AC electrical characteristics for the I2C interfaces of the MPC8568E.
Note that I2C2 is multiplexed with QE Port C.
11.1
PC[18]
IIC2_SCL
PC[19]
IIC2_SDA
I2C DC Electrical Characteristics
Table 46 provides the DC electrical characteristics for the I2C interfaces.
Table 46. I2C DC Electrical Characteristics
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Parameter
Symbol
Min
Max
Input high voltage level
VIH
0.7 × OVDD
OV DD + 0.3
V
—
Input low voltage level
VIL
–0.3
0.3 × OVDD
V
—
Low level output voltage
VOL
0
0.4
V
1
tI2KHKL
0
50
ns
2
II
–10
10
μA
3
Pulse width of spikes which must be suppressed by the input filter
Input current each I/O pin (input voltage is between 0.1 × OV DD and
0.9 × OVDD(max)
Unit Notes
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
56
Freescale Semiconductor
I2C
Table 46. I2C DC Electrical Characteristics (continued)
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Parameter
Capacitance for each I/O pin
Symbol
Min
Max
CI
—
10
Unit Notes
pF
—
Notes:
1. Output voltage (open drain or open collector) condition = 3 mA sink current.
2. Refer to the MPC8568E PowerQUICC III Integrated Communications Processor Reference Manual for information on the
digital filter used.
3. I/O pins will obstruct the SDA and SCL lines if OVDD is switched off.
11.2
I2C AC Electrical Specifications
Table 47 provides the AC timing parameters for the I2C interfaces.
Table 47. I2C AC Electrical Specifications
At recommended operating conditions with OVDD of 3.3V ± 5%. All values refer to VIH (min) and VIL (max) levels (see Table 46).
Symbol 1
Min
Max
Unit
SCL clock frequency
fI2C
0
400
kHz
Low period of the SCL clock
tI2CL
1.3
—
μs
High period of the SCL clock
tI2CH
0.6
—
μs
Setup time for a repeated START condition
tI2SVKH
0.6
—
μs
Hold time (repeated) START condition (after this period, the first clock
pulse is generated)
tI2SXKL
0.6
—
μs
Data setup time
tI2DVKH
100
—
ns
Data input hold time:
tI2DXKL
—
02
—
—
Parameter
CBUS compatible masters
I2C bus devices
μs
Data output delay time
tI2OVKL
—
0.9 3
μs
Set-up time for STOP condition
tI2PVKH
0.6
—
μs
Bus free time between a STOP and START condition
tI2KHDX
1.3
—
μs
Noise margin at the LOW level for each connected device (including
hysteresis)
VNL
0.1 × OVDD
—
V
Noise margin at the HIGH level for each connected device (including
hysteresis)
VNH
0.2 × OVDD
—
V
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
57
I2C
Table 47. I2C AC Electrical Specifications (continued)
At recommended operating conditions with OVDD of 3.3V ± 5%. All values refer to VIH (min) and VIL (max) levels (see Table 46).
Parameter
Capacitive load for each bus line
Symbol 1
Min
Max
Unit
Cb
—
400
pF
Note:
1.The symbols used for timing specifications herein follow the pattern t(first two letters of functional block)(signal)(state) (reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2)
with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high
(H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the START condition
(S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C
timing (I2) for the time that the data with respect to the STOP condition (P) reaching the valid state (V) relative to the tI2C
clock reference (K) going to the high (H) state or setup time.
2. As a transmitter, the MPC8568 provides a delay time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL
signal) to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP condition.
When the MPC8568 acts as the I2C bus master while transmitting, the MPC8568 drives both SCL and SDA. As long as the
load on SCL and SDA are balanced, the MPC8568 would not cause unintended generation of START or STOP condition.
Therefore, the 300 ns SDA output delay time is not a concern. If, under some rare condition, the 300 ns SDA output delay
time is required for the MPC8568 as transmitter, application note AN2919 referred to in note 4 below is recommended.
3. The maximum tI2DXKL has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal.
4.The requirements for I2C frequency calculation must be followed. Refer to Freescale application note AN2919, Determining
the I2C Frequency Divider Ratio for SCL
Figure 30 provides the AC test load for the I2C.
Z0 = 50 Ω
Output
RL = 50 Ω
OVDD/2
Figure 34. I2C AC Test Load
Figure 35 shows the AC timing diagram for the I2C bus.
SDA
tI2DVKH
tI2KHKL
tI2SXKL
tI2CL
SCL
tI2CH
tI2SXKL
S
tI2DXKL
tI2SVKH
Sr
tI2PVKH
P
S
Figure 35. I2C Bus AC Timing Diagram
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
PCI
12 PCI
This section describes the DC and AC electrical specifications for the PCI bus of the MPC8568E.
12.1
PCI DC Electrical Characteristics
Table 48 provides the DC electrical characteristics for the PCI interface.
Table 48. PCI DC Electrical Characteristics 1
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
0.5*OVDD
OVDD + 0.3
V
Low-level input voltage
VIL
–0.5
0.3*OVDD
V
Input current
(VIN 1= 0 V or V IN = VDD)
IIN
—
±10
μA
High-level output voltage
(OVDD = min, IOH = –500 μA)
VOH
0.9*OVDD
—
V
Low-level output voltage
(OVDD = max, IOL = 1500 μA)
VOL
—
0.1*OVDD
V
Notes:
1. The symbol VIN, in this case, represents the OVIN symbol referenced in Table 2 and Table 3.
12.2
PCI AC Electrical Specifications
This section describes the general AC timing parameters of the PCI bus. Note that the SYSCLK signal is
used as the PCI input clock. Table 49 provides the PCI AC timing specifications at 66 MHz.
Table 49. PCI AC Timing Specifications at 66 MHz
Symbol 1
Min
Max
Unit
Notes
SYSCLK to output valid
tPCKHOV
—
6.0
ns
2, 3
Output hold from SYSCLK
tPCKHOX
2.0
—
ns
2, 10
SYSCLK to output high impedance
tPCKHOZ
—
14
ns
2, 4, 11
Input setup to SYSCLK
tPCIVKH
3.0
—
ns
2, 5, 10
Input hold from SYSCLK
tPCIXKH
0
—
ns
2, 5, 10
Parameter
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
59
PCI
Table 49. PCI AC Timing Specifications at 66 MHz (continued)
Parameter
HRESET high to first FRAME assertion
Symbol 1
Min
Max
Unit
Notes
tPCRHFV
10
—
clocks
8, 11
Notes:
1. Note that the symbols used for timing specifications herein follow the pattern of t(first two letters of functional
block)(signal)(state) (reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For
example, tPCIVKH symbolizes PCI timing (PC) with respect to the time the input signals (I) reach the valid state (V)
relative to the SYSCLK clock, tSYS, reference (K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes
PCI timing (PC) with respect to the time hard reset (R) went high (H) relative to the frame signal (F) going to the
valid (V) state.
2. See the timing measurement conditions in the PCI 2.2 Local Bus Specifications.
3. All PCI signals are measured from OVDD/2 of the rising edge of PCI_CLK to 0.4 × OV DD of the signal in question
for 3.3-V PCI signaling levels.
4. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current
delivered through the component pin is less than or equal to the leakage current specification.
5. Input timings are measured at the pin.
6. The timing parameter tSYS indicates the minimum and maximum CLK cycle times for the various specified
frequencies. The system clock period must be kept within the minimum and maximum defined ranges. For values
see Section 23, “Clocking.”
7. The setup and hold time is with respect to the rising edge of HRESET.
8. The timing parameter tPCRHFV is a minimum of 10 clocks rather than the minimum of 5 clocks in the PCI 2.2 Local
Bus Specifications.
9. The reset assertion timing requirement for HRESET is 100 μs.
10.Guaranteed by characterization
11.Guaranteed by design
Figure 30 provides the AC test load for PCI.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 36. PCI AC Test Load
Figure 37 shows the PCI input AC timing conditions.
CLK
tPCIVKH
tPCIXKH
Input
Figure 37. PCI Input AC Timing Measurement Conditions
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
60
Freescale Semiconductor
High-Speed Serial Interfaces (HSSI)
Figure 38 shows the PCI output AC timing conditions.
CLK
tPCKHOV
Output Delay
tPCKHOZ
High-Impedance
Output
Figure 38. PCI Output AC Timing Measurement Condition
13 High-Speed Serial Interfaces (HSSI)
The MPC8568E features one Serializer/Deserializer (SerDes) interfaces to be used for high-speed serial
interconnect applications. It can be used for PCI Express and/or Serial RapidIO data transfers.
This section describes the common portion of SerDes DC electrical specifications, which is the DC
requirement for SerDes Reference Clocks. The SerDes data lane’s transmitter and receiver reference
circuits are also shown.
13.1
Signal Terms Definition
The SerDes utilizes differential signaling to transfer data across the serial link. This section defines terms
used in the description and specification of differential signals.
Figure 39 shows how the signals are defined. For illustration purpose, only one SerDes lane is used for
description. The figure shows waveform for either a transmitter output (SD_TX and SD_TX) or a receiver
input (SD_RX and SD_RX). Each signal swings between A Volts and B Volts where A > B.
Using this waveform, the definitions are as follows. To simplify illustration, the following definitions
assume that the SerDes transmitter and receiver operate in a fully symmetrical differential signaling
environment.
1. Single-Ended Swing
The transmitter output signals and the receiver input signals SD_TX, SD_TX, SD_RX and SD_RX
each have a peak-to-peak swing of A – B Volts. This is also referred as each signal wire’s
Single-Ended Swing.
2. Differential Output Voltage, VOD (or Differential Output Swing):
The Differential Output Voltage (or Swing) of the transmitter, VOD, is defined as the difference of
the two complimentary output voltages: VSD_TX – VSD_TX. The VOD value can be either positive
or negative.
3. Differential Input Voltage, VID (or Differential Input Swing):
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The Differential Input Voltage (or Swing) of the receiver, VID, is defined as the difference of the
two complimentary input voltages: VSD_RX – VSD_RX. The VID value can be either positive or
negative.
4. Differential Peak Voltage, VDIFFp
The peak value of the differential transmitter output signal or the differential receiver input signal
is defined as Differential Peak Voltage, VDIFFp = |A – B| Volts.
5. Differential Peak-to-Peak, VDIFFp-p
Since the differential output signal of the transmitter and the differential input signal of the receiver
each range from A – B to –(A – B) Volts, the peak-to-peak value of the differential transmitter
output signal or the differential receiver input signal is defined as Differential Peak-to-Peak
Voltage, VDIFFp-p = 2*VDIFFp = 2 * |(A – B)| Volts, which is twice of differential swing in
amplitude, or twice of the differential peak. For example, the output differential peak-peak voltage
can also be calculated as VTX-DIFFp-p = 2*|VOD|.
6. Common Mode Voltage, Vcm
The Common Mode Voltage is equal to one half of the sum of the voltages between each conductor
of a balanced interchange circuit and ground. In this example, for SerDes output, Vcm_out = VSD_TX
+ VSD_TX = (A + B) / 2, which is the arithmetic mean of the two complimentary output voltages
within a differential pair. In a system, the common mode voltage may often differ from one
component’s output to the other’s input. Sometimes, it may be even different between the receiver
input and driver output circuits within the same component. It is also referred as the DC offset in
some occasion.
SD_TX or
SD_RX
A Volts
Vcm = (A + B) / 2
SD_TX or
SD_RX
B Volts
Differential Swing, VID or VOD = A – B
Differential Peak Voltage, VDIFFp = |A – B|
Differential Peak-Peak Voltage, VDIFFpp = 2*VDIFFp (not shown)
Figure 39. Differential Voltage Definitions for Transmitter or Receiver
To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic)
transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing
that goes between 2.5 V and 2.0 V. Using these values, the peak-to-peak voltage swing of each signal (TD
or TD) is 500 mV p-p, which is referred as the single-ended swing for each signal. In this example, since
the differential signaling environment is fully symmetrical, the transmitter output’s differential swing
(VOD) has the same amplitude as each signal’s single-ended swing. The differential output signal ranges
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between 500 mV and –500 mV, in other words, VOD is 500 mV in one phase and –500 mV in the other
phase. The peak differential voltage (VDIFFp) is 500 mV. The peak-to-peak differential voltage (VDIFFp-p)
is 1000 mV p-p.
13.2
SerDes Reference Clocks
The SerDes reference clock inputs are applied to an internal PLL whose output creates the clock used by
the corresponding SerDes lanes. The SerDes reference clocks inputs are SD_REF_CLK and
SD_REF_CLK.
The following sections describe the SerDes reference clock requirements and some application
information.
13.2.1
SerDes Reference Clock Receiver Characteristics
Figure 40 shows a receiver reference diagram of the SerDes reference clocks.
• The supply voltage requirements for SCOREVDD and XVDD are specified in Table 2 and Table 3.
• SerDes Reference Clock Receiver Reference Circuit Structure
— The SD_REF_CLK and SD_REF_CLK are internally AC-coupled differential inputs as shown
in Figure 40. Each differential clock input (SD_REF_CLK or SD_REF_CLK) has a 50-Ω
termination to SCOREGND followed by on-chip AC-coupling.
— The external reference clock driver must be able to drive this termination.
— The SerDes reference clock input can be either differential or single-ended. Refer to the
Differential Mode and Single-ended Mode description below for further detailed requirements.
• The maximum average current requirement that also determines the common mode voltage range
— When the SerDes reference clock differential inputs are DC coupled externally with the clock
driver chip, the maximum average current allowed for each input pin is 8mA. In this case, the
exact common mode input voltage is not critical as long as it is within the range allowed by the
maximum average current of 8 mA (refer to the following bullet for more detail), since the
input is AC-coupled on-chip.
— This current limitation sets the maximum common mode input voltage to be less than 0.4V
(0.4V/50 = 8mA) while the minimum common mode input level is 0.1V above SCOREGND.
For example, a clock with a 50/50 duty cycle can be produced by a clock driver with output
driven by its current source from 0mA to 16mA (0-0.8V), such that each phase of the
differential input has a single-ended swing from 0V to 800mV with the common mode voltage
at 400mV.
— If the device driving the SD_REF_CLK and SD_REF_CLK inputs cannot drive 50 ohms to
SCOREGND DC, or it exceeds the maximum input current limitations, then it must be
AC-coupled off-chip.
• The input amplitude requirement
— This requirement is described in detail in the following sections.
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50 Ω
SD_REF_CLK
Input
Amp
SD_REF_CLK
50 Ω
Figure 40. Receiver of SerDes Reference Clocks
13.2.2
DC Level Requirement for SerDes Reference Clocks
The DC level requirement for the MPC8568E SerDes reference clock inputs is different depending on the
signaling mode used to connect the clock driver chip and SerDes reference clock inputs as described
below.
• Differential Mode
— The input amplitude of the differential clock must be between 400mV and 1600mV differential
peak-peak (or between 200mV and 800mV differential peak). In other words, each signal wire
of the differential pair must have a single-ended swing less than 800mV and greater than
200mV. This requirement is the same for both external DC-coupled or AC-coupled connection.
— For external DC-coupled connection, as described in section 13.2.1, the maximum average
current requirements sets the requirement for average voltage (common mode voltage) to be
between 100 mV and 400 mV. Figure 41 shows the SerDes reference clock input requirement
for DC-coupled connection scheme.
— For external AC-coupled connection, there is no common mode voltage requirement for the
clock driver. Since the external AC-coupling capacitor blocks the DC level, the clock driver
and the SerDes reference clock receiver operate in different command mode voltages. The
SerDes reference clock receiver in this connection scheme has its common mode voltage set to
SCOREGND. Each signal wire of the differential inputs is allowed to swing below and above
the command mode voltage (SCOREGND). Figure 42 shows the SerDes reference clock input
requirement for AC-coupled connection scheme.
• Single-ended Mode
— The reference clock can also be single-ended. The SD_REF_CLK input amplitude
(single-ended swing) must be between 400mV and 800mV peak-peak (from Vmin to Vmax)
with SD_REF_CLK either left unconnected or tied to ground.
— The SD_REF_CLK input average voltage must be between 200 and 400 mV. Figure 43 shows
the SerDes reference clock input requirement for single-ended signaling mode.
— To meet the input amplitude requirement, the reference clock inputs might need to be DC or
AC-coupled externally. For the best noise performance, the reference of the clock could be DC
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or AC-coupled into the unused phase (SD_REF_CLK) through the same source impedance as
the clock input (SD_REF_CLK) in use.
200 mV
SD_REF_CLK
< Input Amplitude or Differential Peak < 800 mV
Vmax < 800 mV
100 mV
< Vcm < 400 mV
Vmin
SD_REF_CLK
>0V
Figure 41. Differential Reference Clock Input DC Requirements (External DC-Coupled)
200 mV
< Input Amplitude or Differential Peak < 800 mV
SD_REF_CLK
Vmax < Vcm
+ 400 mV
Vcm
Vmin
SD_REF_CLK
> Vcm − 400 mV
Figure 42. Differential Reference Clock Input DC Requirements (External AC-Coupled)
400 mV
< SD_REF_CLK Input Amplitude < 800 mV
SD_REF_CLK
0V
SD_REF_CLK
Figure 43. Single-Ended Reference Clock Input DC Requirements
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13.2.3
•
•
•
Interfacing With Other Differential Signaling Levels
With on-chip termination to SCOREGND, the differential reference clocks inputs are HCSL
(High-Speed Current Steering Logic) compatible DC-coupled.
Many other low voltage differential type outputs like LVDS (Low Voltage Differential Signaling)
can be used but may need to be AC-coupled due to the limited common mode input range allowed
(100 to 400 mV) for DC-coupled connection.
LVPECL outputs can produce signal with too large amplitude and may need to be DC-biased at
clock driver output first, then followed with series attenuation resistor to reduce the amplitude, in
addition to AC-coupling.
NOTE
Figure 44 to Figure 47 below are for conceptual reference only. Due to the
fact that clock driver chip's internal structure, output impedance and
termination requirements are different between various clock driver chip
manufacturers, it is very possible that the clock circuit reference designs
provided by clock driver chip vendor are different from what is shown
below. They might also vary from one vendor to the other. Therefore,
Freescale Semiconductor can neither provide the optimal clock driver
reference circuits, nor guarantee the correctness of the following clock
driver connection reference circuits. The system designer is recommended
to contact the selected clock driver chip vendor for the optimal reference
circuits with the MPC8568 SerDes reference clock receiver requirement
provided in this document.
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Figure 44 shows the SerDes reference clock connection reference circuits for HCSL type clock driver. It
assumes that the DC levels of the clock driver chip is compatible with MPC8568 SerDes reference clock
input’s DC requirement.
MPC8568E
HCSL CLK Driver Chip
CLK_Out
33 Ω
SD_REF_CLK
50 Ω
SerDes Refer.
CLK Receiver
100 Ω differential PWB trace
Clock Driver
33 Ω
SD_REF_CLK
CLK_Out
Total 50 Ω. Assume clock driver’s
output impedance is about 16 Ω.
50 Ω
Clock driver vendor dependent
source termination resistor
Figure 44. DC-Coupled Differential Connection with HCSL Clock Driver (Reference Only)
Figure 45 shows the SerDes reference clock connection reference circuits for LVDS type clock driver.
Since LVDS clock driver’s common mode voltage is higher than the MPC8568 SerDes reference clock
input’s allowed range (100 to 400mV), AC-coupled connection scheme must be used. It assumes the
LVDS output driver features 50-Ω termination resistor. It also assumes that the LVDS transmitter
establishes its own common mode level without relying on the receiver or other external component.
MPC8568E
LVDS CLK Driver Chip
CLK_Out
10 nF
50 Ω
SerDes Refer.
CLK Receiver
100 Ω differential PWB trace
Clock Driver
CLK_Out
SD_REF_CLK
10 nF
SD_REF_CLK
50 Ω
Figure 45. AC-Coupled Differential Connection with LVDS Clock Driver (Reference Only)
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Figure 46 shows the SerDes reference clock connection reference circuits for LVPECL type clock driver.
Since LVPECL driver’s DC levels (both common mode voltages and output swing) are incompatible with
MPC8568 SerDes reference clock input’s DC requirement, AC-coupling has to be used. Figure 46
assumes that the LVPECL clock driver’s output impedance is 50Ω. R1 is used to DC-bias the LVPECL
outputs prior to AC-coupling. Its value could be ranged from 140Ω to 240Ω depending on clock driver
vendor’s requirement. R2 is used together with the SerDes reference clock receiver’s 50-Ω termination
resistor to attenuate the LVPECL output’s differential peak level such that it meets the MPC8568 SerDes
reference clock’s differential input amplitude requirement (between 200mV and 800mV differential peak).
For example, if the LVPECL output’s differential peak is 900mV and the desired SerDes reference clock
input amplitude is selected as 600mV, the attenuation factor is 0.67, which requires R2 = 25Ω. Consult
clock driver chip manufacturer to verify whether this connection scheme is compatible with a particular
clock driver chip.
LVPECL CLK
Driver Chip
MPC8568E
CLK_Out
Clock Driver
R2
R1
10 nF
SD_REF_CLK
SerDes Refer.
CLK Receiver
100 Ω differential PWB trace
R2
10 nF
SD_REF_CLK
CLK_Out
R1
50 Ω
50 Ω
Figure 46. AC-Coupled Differential Connection with LVPECL Clock Driver (Reference Only)
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Figure 47 shows the SerDes reference clock connection reference circuits for a single-ended clock driver.
It assumes the DC levels of the clock driver are compatible with MPC8568E SerDes reference clock
input’s DC requirement.
Single-Ended
CLK Driver Chip
MPC8568E
Total 50 Ω. Assume clock driver’s
output impedance is about 16 Ω.
Clock Driver
CLK_Out
50 Ω
SD_REF_CLK
33 Ω
SerDes Refer.
CLK Receiver
100 Ω differential PWB trace
50 Ω
SD_REF_CLK
50 Ω
Figure 47. Single-Ended Connection (Reference Only)
13.2.4
AC Requirements for SerDes Reference Clocks
The clock driver selected should provide a high quality reference clock with low phase noise and
cycle-to-cycle jitter. Phase noise less than 100 kHz can be tracked by the PLL and data recovery loops and
is less of a problem. Phase noise above 15 MHz is filtered by the PLL. The most problematic phase noise
occurs in the 1–15 MHz range. The source impedance of the clock driver should be 50 Ω to match the
transmission line and reduce reflections which are a source of noise to the system.
The detailed AC requirements of the SerDes Reference Clocks is defined by each interface protocol based
on application usage. Refer to the following sections for detailed information:
• Section 14.2, “AC Requirements for PCI Express SerDes Clocks”
• Section 15.2, “AC Requirements for Serial RapidIO SD_REF_CLK and SD_REF_CLK”
13.2.4.1
Spread Spectrum Clock
SD_REF_CLK/SD_REF_CLK were designed to work with a spread spectrum clock (+0 to –0.5%
spreading at 30–33 kHz rate is allowed), assuming both ends have same reference clock. For better results,
a source without significant unintended modulation should be used.
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13.3
SerDes Transmitter and Receiver Reference Circuits
Figure 48 shows the reference circuits for SerDes data lane’s transmitter and receiver.
SD_TXn
SD_RXn
50 Ω
50 Ω
Transmitter
Receiver
50 Ω
SD_TXn
SD_RXn
50 Ω
Figure 48. SerDes Transmitter and Receiver Reference Circuits
The DC and AC specification of SerDes data lanes are defined in each interface protocol section below
(PCI Express, Serial Rapid IO or SGMII) in this document based on the application usage:
• Section 14, “PCI Express”
• Section 15, “Serial RapidIO”
Note that external AC Coupling capacitor is required for the above three serial transmission protocols with
the capacitor value defined in specification of each protocol section.
14 PCI Express
This section describes the DC and AC electrical specifications for the PCI Express bus of the MPC8568E.
14.1
DC Requirements for PCI Express SD_REF_CLK and
SD_REF_CLK
For more information, see Section 13, “High-Speed Serial Interfaces (HSSI).”
14.2
AC Requirements for PCI Express SerDes Clocks
Table 50 lists AC requirements.
Table 50. SD_REF_CLK and SD_REF_CLK AC Requirements
Symbol
tREF
tREFCJ
Parameter Description
Min
Typical
Max
Units
Notes
REFCLK cycle time
—
10
—
ns
1
REFCLK cycle-to-cycle jitter. Difference in the period of any two
adjacent REFCLK cycles
—
—
100
ps
—
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Table 50. SD_REF_CLK and SD_REF_CLK AC Requirements
Symbol
tREFPJ
Parameter Description
Phase jitter. Deviation in edge location with respect to mean
edge location
Min
Typical
Max
Units
Notes
–50
—
50
ps
—
Notes:
1. Typical based on PCI Express Specification 2.0.
14.3
Clocking Dependencies
The ports on the two ends of a link must transmit data at a rate that is within 600 parts per million (ppm)
of each other at all times. This is specified to allow bit rate clock sources with a +/– 300 ppm tolerance.
14.4
Physical Layer Specifications
The following is a summary of the specifications for the physical layer of PCI Express on this device. For
further details as well as the specifications of the Transport and Data Link layer please use the PCI
EXPRESS Base Specification. REV. 1.0a document.
14.4.1
Differential Transmitter (TX) Output
Table 51 defines the specifications for the differential output at all transmitters (TXs). The parameters are
specified at the component pins.
Table 51. Differential Transmitter (TX) Output Specifications
Symbol
Parameter
Min
Nom
Max
Units
Comments
399.88
400
400.12
ps
Each UI is 400 ps ± 300 ppm. UI does not account for
Spread Spectrum Clock dictated variations. See Note 1.
UI
Unit Interval
VTX-DIFFp-p
Differential
Peak-to-Peak
Output Voltage
0.8
—
1.2
V
VTX-DIFFp-p = 2*|VTX-D+ – VTX-D-| See Note 2.
VTX-DE-RATIO
De- Emphasized
Differential
Output Voltage
(Ratio)
–3.0
–3.5
–4.0
dB
Ratio of the VTX-DIFFp-p of the second and following bits
after a transition divided by the VTX-DIFFp-p of the first bit
after a transition. See Note 2.
TTX-EYE
Minimum TX Eye
Width
0.70
—
—
UI
The maximum Transmitter jitter can be derived as
TTX-MAX-JITTER = 1 – TTX-EYE= 0.3 UI.
See Notes 2 and 3.
TTX-EYE-MEDIAN-to-
Maximum time
between the jitter
median and
maximum
deviation from
the median.
—
—
0.15
UI
Jitter is defined as the measurement variation of the
crossing points (V TX-DIFFp-p = 0 V) in relation to a
recovered TX UI. A recovered TX UI is calculated over
3500 consecutive unit intervals of sample data. Jitter is
measured using all edges of the 250 consecutive UI in
the center of the 3500 UI used for calculating the TX UI.
See Notes 2 and 3.
—
—
UI
See Notes 2 and 5
MAX-JITTER
TTX-RISE, T TX-FALL
D+/D- TX Output 0.125
Rise/Fall Time
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Table 51. Differential Transmitter (TX) Output Specifications (continued)
Symbol
Parameter
Min
Nom
Max
Units
Comments
VTX-CM-ACp
RMS AC Peak
Common Mode
Output Voltage
—
—
20
mV
VTX-CM-ACp = RMS(|VTXD+ + VTXD-|/2 – V TX-CM-DC)
VTX-CM-DC = DC (avg) of |VTX-D+ + VTX-D-|/2
See Note 2
VTX-CM-DC-ACTIVE-
Absolute Delta of
DC Common
Mode Voltage
During L0 and
Electrical Idle
0
—
100
mV
|V TX-CM-DC (during L0) – VTX-CM-Idle-DC (During Electrical
Idle)|<=100 mV
VTX-CM-DC = DC (avg) of |VTX-D+ + VTX-D-|/2 [L0]
VTX-CM-Idle-DC = DC (avg) of |VTX-D+ + VTX-D-|/2 [Electrical
Idle]
See Note 2.
VTX-CM-DC-LINE-DELTA Absolute Delta of
DC Common
Mode between
D+ and D–
0
—
25
mV
|V TX-CM-DC-D+ – VTX-CM-DC-D-| <= 25 mV
VTX-CM-DC-D+ = DC (avg) of |VTX-D+|
VTX-CM-DC-D- = DC(avg) of |V TX-D-|
See Note 2.
IDLE-DELTA
VTX-IDLE-DIFFp
Electrical Idle
differential Peak
Output Voltage
0
—
20
mV
VTX-IDLE-DIFFp = |VTX-IDLE-D+ -VTX-IDLE-D-| <= 20 mV
See Note 2.
VTX-RCV-DETECT
The amount of
voltage change
allowed during
Receiver
Detection
—
—
600
mV
The total amount of voltage change that a transmitter
can apply to sense whether a low impedance Receiver
is present. See Note 6.
VTX-DC-CM
The TX DC
Common Mode
Voltage
0
—
3.6
V
The allowed DC Common Mode voltage under any
conditions. See Note 6.
ITX-SHORT
TX Short Circuit
Current Limit
—
—
90
mA
The total current the Transmitter can provide when
shorted to its ground
TTX-IDLE-MIN
Minimum time
spent in
Electrical Idle
50
—
—
UI
Minimum time a Transmitter must be in Electrical Idle
Utilized by the Receiver to start looking for an Electrical
Idle Exit after successfully receiving an Electrical Idle
ordered set
TTX-IDLE-SET-TO-IDLE
Maximum time to
transition to a
valid Electrical
idle after sending
an Electrical Idle
ordered set
—
—
20
UI
After sending an Electrical Idle ordered set, the
Transmitter must meet all Electrical Idle Specifications
within this time. This is considered a debounce time for
the Transmitter to meet Electrical Idle after transitioning
from L0.
TTX-IDLE-TO-DIFF-DATA Maximum time to
transition to valid
TX specifications
after leaving an
Electrical idle
condition
—
—
20
UI
Maximum time to meet all TX specifications when
transitioning from Electrical Idle to sending differential
data. This is considered a debounce time for the TX to
meet all TX specifications after leaving Electrical Idle
RLTX-DIFF
10
—
—
dB
Measured over 50 MHz to 1.25 GHz. See Note 4
Differential
Return Loss
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Table 51. Differential Transmitter (TX) Output Specifications (continued)
Symbol
Parameter
Min
Nom
Max
Units
Comments
RLTX-CM
Common Mode
Return Loss
6
—
—
dB
Measured over 50 MHz to 1.25 GHz. See Note 4
ZTX-DIFF-DC
DC Differential
TX Impedance
80
100
120
Ω
TX DC Differential mode Low Impedance
ZTX-DC
Transmitter DC
Impedance
40
—
—
Ω
Required TX D+ as well as D- DC Impedance during all
states
LTX-SKEW
Lane-to-Lane
Output Skew
—
—
500 +
2 UI
ps
Static skew between any two Transmitter Lanes within a
single Link
CTX
AC Coupling
Capacitor
75
—
200
nF
All Transmitters shall be AC coupled. The AC coupling is
required either within the media or within the
transmitting component itself. See note 8.
Tcrosslink
Crosslink
Random
Timeout
0
—
1
ms
This random timeout helps resolve conflicts in crosslink
configuration by eventually resulting in only one
Downstream and one Upstream Port. See Note 7.
Notes:
1. No test load is necessarily associated with this value.
2. Specified at the measurement point into a timing and voltage compliance test load as shown in Figure 51 and measured over
any 250 consecutive TX UIs. (Also refer to the transmitter compliance eye diagram shown in Figure 49)
3. A TTX-EYE = 0.70 UI provides for a total sum of deterministic and random jitter budget of T TX-JITTER-MAX = 0.30 UI for the
Transmitter collected over any 250 consecutive TX UIs. The TTX-EYE-MEDIAN-to-MAX-JITTER median is less than half of the total
TX jitter budget collected over any 250 consecutive TX UIs. It should be noted that the median is not the same as the mean.
The jitter median describes the point in time where the number of jitter points on either side is approximately equal as opposed
to the averaged time value.
4. The Transmitter input impedance shall result in a differential return loss greater than or equal to 12 dB and a common mode
return loss greater than or equal to 6 dB over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement
applies to all valid input levels. The reference impedance for return loss measurements is 50 Ω to ground for both the D+ and
D- line (that is, as measured by a Vector Network Analyzer with 50 ohm probes—see Figure 51). Note that the series capacitors
CTX is optional for the return loss measurement.
5. Measured between 20-80% at transmitter package pins into a test load as shown in Figure 51 for both VTX-D+ and VTX-D-.
6. See Section 4.3.1.8 of the PCI Express Base Specifications Rev 1.0a
7. See Section 4.2.6.3 of the PCI Express Base Specifications Rev 1.0a
8. MPC8568E SerDes transmitter does not have C TX built-in. An external AC Coupling capacitor is required.
14.4.2
Transmitter Compliance Eye Diagrams
The TX eye diagram in Figure 49 is specified using the passive compliance/test measurement load (see
Figure 51) in place of any real PCI Express interconnect + RX component.
There are two eye diagrams that must be met for the transmitter. Both eye diagrams must be aligned in
time using the jitter median to locate the center of the eye diagram. The different eye diagrams will differ
in voltage depending whether it is a transition bit or a de-emphasized bit. The exact reduced voltage level
of the de-emphasized bit will always be relative to the transition bit.
The eye diagram must be valid for any 250 consecutive UIs.
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A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is
created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX
UI.
NOTE
It is recommended that the recovered TX UI is calculated using all edges in
the 3500 consecutive UI interval with a fit algorithm using a minimization
merit function (that is, least squares and median deviation fits).
Figure 49. Minimum Transmitter Timing and Voltage Output Compliance Specifications
14.4.3
Differential Receiver (RX) Input Specifications
Table 52 defines the specifications for the differential input at all receivers (RXs). The parameters are
specified at the component pins.
Table 52. Differential Receiver (RX) Input Specifications
Symbol
Parameter
Min
Nom
Max
Units
Comments
UI
Unit Interval
399.8
8
400
400.12
ps
Each UI is 400 ps ± 300 ppm. UI does not
account for Spread Spectrum Clock dictated
variations. See Note 1.
VRX-DIFFp-p
Differential
Peak-to-Peak
Output Voltage
0.175
—
1.200
V
VRX-DIFFp-p = 2*|VRX-D+ – VRX-D-|
See Note 2.
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Table 52. Differential Receiver (RX) Input Specifications (continued)
Symbol
Min
Nom
Max
Units
Comments
0.4
—
—
UI
The maximum interconnect media and
Transmitter jitter that can be tolerated by the
Receiver can be derived as TRX-MAX-JITTER =
1 – TRX-EYE= 0.6 UI.
See Notes 2 and 3.
TRX-EYE-MEDIAN-to-MAX Maximum time
between the jitter
-JITTER
median and
maximum
deviation from
the median.
—
—
0.3
UI
Jitter is defined as the measurement variation
of the crossing points (VRX-DIFFp-p = 0 V) in
relation to a recovered TX UI. A recovered TX
UI is calculated over 3500 consecutive unit
intervals of sample data. Jitter is measured
using all edges of the 250 consecutive UI in
the center of the 3500 UI used for calculating
the TX UI. See Notes 2, 3 and 7.
VRX-CM-ACp
AC Peak
Common Mode
Input Voltage
—
—
150
mV
VRX-CM-ACp = |VRXD+ + VRXD-|/2 – VRX-CM-DC
VRX-CM-DC = DC(avg) of |VRX-D+ + VRX-D-|/2
See Note 2
RLRX-DIFF
Differential
Return Loss
10
—
—
dB
Measured over 50 MHz to 1.25 GHz with the
D+ and D- lines biased at +300 mV and -300
mV, respectively.
See Note 4
RLRX-CM
Common Mode
Return Loss
6
—
—
dB
Measured over 50 MHz to 1.25 GHz with the
D+ and D- lines biased at 0 V. See Note 4
ZRX-DIFF-DC
DC Differential
Input Impedance
80
100
120
Ω
RX DC Differential mode impedance. See
Note 5
ZRX-DC
DC Input
Impedance
40
50
60
Ω
Required RX D+ as well as D- DC Impedance
(50 ± 20% tolerance). See Notes 2 and 5.
ZRX-HIGH-IMP-DC
Powered Down
DC Input
Impedance
200 k
—
—
Ω
Required RX D+ as well as D- DC Impedance
when the Receiver terminations do not have
power. See Note 6.
VRX-IDLE-DET-DIFFp-p
Electrical Idle
Detect Threshold
65
—
175
mV
VRX-IDLE-DET-DIFFp-p = 2*|VRX-D+ -VRX-D-|
Measured at the package pins of the Receiver
TRX-IDLE-DET-DIFF-
Unexpected
Electrical Idle
Enter Detect
Threshold
Integration Time
—
—
10
ms
An unexpected Electrical Idle (V RX-DIFFp-p <
VRX-IDLE-DET-DIFFp-p) must be recognized no
longer than TRX-IDLE-DET-DIFF-ENTERING to
signal an unexpected idle condition.
TRX-EYE
ENTERTIME
Parameter
Minimum
Receiver Eye
Width
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PCI Express
Table 52. Differential Receiver (RX) Input Specifications (continued)
Symbol
LTX-SKEW
Parameter
Total Skew
Min
Nom
Max
Units
Comments
—
—
20
ns
Skew across all lanes on a Link. This includes
variation in the length of SKP ordered set (for
example, COM and one to five Symbols) at
the RX as well as any delay differences
arising from the interconnect itself.
Notes:
1. No test load is necessarily associated with this value.
2. Specified at the measurement point and measured over any 250 consecutive UIs. The test load in Figure 51 should be used
as the RX device when taking measurements (also refer to the Receiver compliance eye diagram shown in Figure 50). If the
clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must
be used as a reference for the eye diagram.
3. A TRX-EYE = 0.40 UI provides for a total sum of 0.60 UI deterministic and random jitter budget for the Transmitter and
interconnect collected any 250 consecutive UIs. The TRX-EYE-MEDIAN-to-MAX-JITTER specification ensures a jitter distribution in
which the median and the maximum deviation from the median is less than half of the total. UI jitter budget collected over any
250 consecutive TX UIs. It should be noted that the median is not the same as the mean. The jitter median describes the point
in time where the number of jitter points on either side is approximately equal as opposed to the averaged time value. If the
clocks to the RX and TX are not derived from the same reference clock, the TX UI recovered from 3500 consecutive UI must
be used as the reference for the eye diagram.
4. The Receiver input impedance shall result in a differential return loss greater than or equal to 15 dB with the D+ line biased to
300 mV and the D- line biased to -300 mV and a common mode return loss greater than or equal to 6 dB (no bias required)
over a frequency range of 50 MHz to 1.25 GHz. This input impedance requirement applies to all valid input levels. The
reference impedance for return loss measurements for is 50 ohms to ground for both the D+ and D- line (that is, as measured
by a Vector Network Analyzer with 50 ohm probes—see Figure 51). Note: that the series capacitors CTX is optional for the
return loss measurement.
5. Impedance during all LTSSM states. When transitioning from a Fundamental Reset to Detect (the initial state of the LTSSM)
there is a 5 ms transition time before Receiver termination values must be met on all un-configured Lanes of a Port.
6. The RX DC Common Mode Impedance that exists when no power is present or Fundamental Reset is asserted. This helps
ensure that the Receiver Detect circuit will not falsely assume a Receiver is powered on when it is not. This term must be
measured at 300 mV above the RX ground.
7. It is recommended that the recovered TX UI is calculated using all edges in the 3500 consecutive UI interval with a fit algorithm
using a minimization merit function. Least squares and median deviation fits have worked well with experimental and simulated
data.
14.5
Receiver Compliance Eye Diagrams
The RX eye diagram in Figure 50 is specified using the passive compliance/test measurement load (see
Figure 51) in place of any real PCI Express RX component.
Note: In general, the minimum Receiver eye diagram measured with the compliance/test measurement
load (see Figure 51) will be larger than the minimum Receiver eye diagram measured over a range of
systems at the input Receiver of any real PCI Express component. The degraded eye diagram at the input
Receiver is due to traces internal to the package as well as silicon parasitic characteristics which cause the
real PCI Express component to vary in impedance from the compliance/test measurement load. The input
Receiver eye diagram is implementation specific and is not specified. RX component designer should
provide additional margin to adequately compensate for the degraded minimum Receiver eye diagram
(shown in Figure 50) expected at the input Receiver based on some adequate combination of system
simulations and the Return Loss measured looking into the RX package and silicon. The RX eye diagram
must be aligned in time using the jitter median to locate the center of the eye diagram.
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The eye diagram must be valid for any 250 consecutive UIs.
A recovered TX UI is calculated over 3500 consecutive unit intervals of sample data. The eye diagram is
created using all edges of the 250 consecutive UI in the center of the 3500 UI used for calculating the TX
UI.
NOTE
The reference impedance for return loss measurements is 50. to ground for
both the D+ and D- line (that is, as measured by a Vector Network Analyzer
with 50. probes—see Figure 51). Note that the series capacitors, CTX, are
optional for the return loss measurement.
Figure 50. Minimum Receiver Eye Timing and Voltage Compliance Specification
14.5.1
Compliance Test and Measurement Load
The AC timing and voltage parameters must be verified at the measurement point, as specified within 0.2
inches of the package pins, into a test/measurement load shown in Figure 51.
NOTE
The allowance of the measurement point to be within 0.2 inches of the
package pins is meant to acknowledge that package/board routing may
benefit from D+ and D– not being exactly matched in length at the package
pin boundary.
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Serial RapidIO
Figure 51. Compliance Test/Measurement Load
15 Serial RapidIO
This section describes the DC and AC electrical specifications for the RapidIO interface of the
MPC8568E, for the LP-Serial physical layer. The electrical specifications cover both single and
multiple-lane links. Two transmitters (short run and long run) and a single receiver are specified for each
of three baud rates, 1.25, 2.50, and 3.125 GBaud.
Two transmitter specifications allow for solutions ranging from simple board-to-board interconnect to
driving two connectors across a backplane. A single receiver specification is given that will accept signals
from both the short run and long run transmitter specifications.
The short run transmitter should be used mainly for chip-to-chip connections on either the same printed
circuit board or across a single connector. This covers the case where connections are made to a mezzanine
(daughter) card. The minimum swings of the short run specification reduce the overall power used by the
transceivers.
The long run transmitter specifications use larger voltage swings that are capable of driving signals across
backplanes. This allows a user to drive signals across two connectors and a backplane. The specifications
allow a distance of at least 50 cm at all baud rates.
All unit intervals are specified with a tolerance of +/– 100 ppm. The worst case frequency difference
between any transmit and receive clock will be 200 ppm.
To ensure interoperability between drivers and receivers of different vendors and technologies, AC
coupling at the receiver input must be used.
15.1
DC Requirements for Serial RapidIO SD_REF_CLK and
SD_REF_CLK
For more information, see Section 13.2, “SerDes Reference Clocks.”
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15.2
AC Requirements for Serial RapidIO SD_REF_CLK and
SD_REF_CLK
Table 50 lists AC requirements.
Table 53. SD_REF_CLK and SD_REF_CLK AC Requirements
Symbol
Parameter Description
Min
Typical Max Units
Comments
REFCLK cycle time
—
10(8)
—
ns
tREFCJ
REFCLK cycle-to-cycle jitter. Difference in the
period of any two adjacent REFCLK cycles
—
—
80
ps
—
tREFPJ
Phase jitter. Deviation in edge location with
respect to mean edge location
–40
—
40
ps
—
tREF
15.3
8 ns applies only to serial RapidIO
with 125-MHz reference clock
Signal Definitions
LP-Serial links use differential signaling. This section defines terms used in the description and
specification of differential signals. Figure 52 shows how the signals are defined. The figures show
waveforms for either a transmitter output (TD and TD) or a receiver input (RD and RD). Each signal
swings between A Volts and B Volts where A > B. Using these waveforms, the definitions are as follows:
7. The transmitter output signals and the receiver input signals TD, TD, RD and RD each have a
peak-to-peak swing of A – B Volts
8. The differential output signal of the transmitter, VOD, is defined as VTD–VTD
9. The differential input signal of the receiver, VID, is defined as VRD-VRD
10. The differential output signal of the transmitter and the differential input signal of the receiver
each range from A – B to –(A – B) Volts
11. The peak value of the differential transmitter output signal and the differential receiver input
signal is A – B Volts
12. The peak-to-peak value of the differential transmitter output signal and the differential receiver
input signal is 2 * (A – B) Volts
TD or RD
A Volts
TD or RD
B Volts
Differential Peak-Peak = 2 * (A-B)
Figure 52. Differential Peak-Peak Voltage of Transmitter or Receiver
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Serial RapidIO
To illustrate these definitions using real values, consider the case of a CML (Current Mode Logic)
transmitter that has a common mode voltage of 2.25 V and each of its outputs, TD and TD, has a swing
that goes between 2.5 V and 2.0 V. Using these values, the peak-to-peak voltage swing of the signals TD
and TD is 500 mV p-p. The differential output signal ranges between 500 mV and –500 mV. The peak
differential voltage is 500 mV. The peak-to-peak differential voltage is 1000 mV p-p.
15.4
Equalization
With the use of high speed serial links, the interconnect media will cause degradation of the signal at the
receiver. Effects such as Inter-Symbol Interference (ISI) or data dependent jitter are produced. This loss
can be large enough to degrade the eye opening at the receiver beyond what is allowed in the specification.
To negate a portion of these effects, equalization can be used. The most common equalization techniques
that can be used are:
• A passive high pass filter network placed at the receiver. This is often referred to as passive
equalization.
• The use of active circuits in the receiver. This is often referred to as adaptive equalization.
15.5
Explanatory Note on Transmitter and Receiver Specifications
AC electrical specifications are given for transmitter and receiver. Long run and short run interfaces at
three baud rates (a total of six cases) are described.
The parameters for the AC electrical specifications are guided by the XAUI electrical interface specified
in Clause 47 of IEEE 802.3ae-2002.
XAUI has similar application goals to serial RapidIO, as described in Section 8.1. The goal of this standard
is that electrical designs for serial RapidIO can reuse electrical designs for XAUI, suitably modified for
applications at the baud intervals and reaches described herein.
15.6
Transmitter Specifications
LP-Serial transmitter electrical and timing specifications are stated in the text and tables of this section.
The differential return loss, S11, of the transmitter in each case shall be better than
• –10 dB for (Baud Frequency)/10 < Freq(f) < 625 MHz, and
• –10 dB + 10log(f/625 MHz) dB for 625 MHz ≤ Freq(f) ≤ Baud Frequency
The reference impedance for the differential return loss measurements is 100 Ohm resistive. Differential
return loss includes contributions from on-chip circuitry, chip packaging and any off-chip components
related to the driver. The output impedance requirement applies to all valid output levels.
It is recommended that the 20%-80% rise/fall time of the transmitter, as measured at the transmitter output,
in each case have a minimum value 60 ps.
It is recommended that the timing skew at the output of an LP-Serial transmitter between the two signals
that comprise a differential pair not exceed 25 ps at 1.25 GB, 20 ps at 2.50 GB and 15 ps at 3.125 GB.
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Table 54. Short Run Transmitter AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
–0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
500
1000
mV p-p
—
Deterministic Jitter
JD
—
0.17
UI p-p
—
Total Jitter
JT
—
0.35
UI p-p
—
Multiple output skew
SMO
—
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
800
ps
+/– 100 ppm
800
Voltage relative to COMMON
of either signal comprising a
differential pair
Table 55. Short Run Transmitter AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
–0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
500
1000
mV p-p
—
Deterministic Jitter
JD
—
0.17
UI p-p
—
Total Jitter
JT
—
0.35
UI p-p
—
Multiple Output skew
SMO
—
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
400
ps
+/– 100 ppm
400
Voltage relative to COMMON
of either signal comprising a
differential pair
Table 56. Short Run Transmitter AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
–0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
500
1000
mV p-p
—
Deterministic Jitter
JD
—
0.17
UI p-p
—
Total Jitter
JT
—
0.35
UI p-p
—
Voltage relative to COMMON
of either signal comprising a
differential pair
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Table 56. Short Run Transmitter AC Timing Specifications—3.125 GBaud (continued)
Range
Characteristic
Symbol
Unit
Min
Multiple output skew
SMO
Unit Interval
UI
—
320
Notes
Max
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
320
ps
+/– 100 ppm
Table 57. Long Run Transmitter AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
–0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
800
1600
mV p-p
—
Deterministic Jitter
JD
—
0.17
UI p-p
—
Total Jitter
JT
—
0.35
UI p-p
—
Multiple output skew
SMO
—
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
800
ps
+/–100 ppm
800
Voltage relative to COMMON
of either signal comprising a
differential pair
Table 58. Long Run Transmitter AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
–0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
800
1600
mV p-p
—
Deterministic Jitter
JD
—
0.17
UI p-p
—
Total Jitter
JT
—
0.35
UI p-p
—
Multiple output skew
SMO
—
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
400
ps
+/– 100 ppm
400
Voltage relative to COMMON
of either signal comprising a
differential pair
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Table 59. Long Run Transmitter AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Output Voltage,
VO
–0.40
2.30
Volts
Differential Output Voltage
VDIFFPP
800
1600
mV p-p
—
Deterministic Jitter
JD
—
0.17
UI p-p
—
Total Jitter
JT
—
0.35
UI p-p
—
Multiple output skew
SMO
—
1000
ps
Skew at the transmitter output
between lanes of a multilane
link
Unit Interval
UI
320
ps
+/– 100 ppm
320
Voltage relative to COMMON
of either signal comprising a
differential pair
Transmitter Differential Output Voltage
For each baud rate at which an LP-Serial transmitter is specified to operate, the output eye pattern of the
transmitter shall fall entirely within the unshaded portion of the Transmitter Output Compliance Mask
shown in Figure 53 with the parameters specified in Table 60 when measured at the output pins of the
device and the device is driving a 100 Ohm +/–5% differential resistive load. The output eye pattern of an
LP-Serial transmitter that implements pre-emphasis (to equalize the link and reduce inter-symbol
interference) need only comply with the Transmitter Output Compliance Mask when pre-emphasis is
disabled or minimized.
VDIFF max
VDIFF min
0
-VDIFF min
-VDIFF max
0
A
B
1-B
1-A
1
Time in UI
Figure 53. Transmitter Output Compliance Mask
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Table 60. Transmitter Differential Output Eye Diagram Parameters
VDIFFmin
(mV)
VDIFFmax
(mV)
A (UI)
B (UI)
1.25 GBaud short range
250
500
0.175
0.39
1.25 GBaud long range
400
800
0.175
0.39
2.5 GBaud short range
250
500
0.175
0.39
2.5 GBaud long range
400
800
0.175
0.39
3.125 GBaud short range
250
500
0.175
0.39
3.125 GBaud long range
400
800
0.175
0.39
Transmitter Type
15.7
Receiver Specifications
LP-Serial receiver electrical and timing specifications are stated in the text and tables of this section.
Receiver input impedance shall result in a differential return loss better that 10 dB and a common mode
return loss better than 6 dB from 100 MHz to (0.8)*(Baud Frequency). This includes contributions from
on-chip circuitry, the chip package and any off-chip components related to the receiver. AC coupling
components are included in this requirement. The reference impedance for return loss measurements is
100 Ω resistive for differential return loss and 25 Ω resistive for common mode.
Table 61. Receiver AC Timing Specifications—1.25 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Differential Input Voltage
VIN
200
mV p-p
Measured at receiver
Deterministic Jitter Tolerance
JD
0.37
—
UI p-p
Measured at receiver
Combined Deterministic and Random
Jitter Tolerance
JDR
0.55
—
UI p-p
Measured at receiver
Total Jitter Tolerance1
JT
0.65
—
UI p-p
Measured at receiver
Multiple Input Skew
SMI
—
24
ns
Skew at the receiver input
between lanes of a multilane
link
Bit Error Rate
BER
—
10–12
Unit Interval
UI
800
1600
800
—
ps
—
+/– 100 ppm
Note:
1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The
sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 54. The sinusoidal jitter component
is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.
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Table 62. Receiver AC Timing Specifications—2.5 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Differential Input Voltage
VIN
200
Deterministic Jitter Tolerance
JD
0.37
Combined Deterministic and Random
Jitter Tolerance
JDR
Total Jitter Tolerance1
JT
Multiple Input Skew
SMI
—
24
Bit Error Rate
BER
—
10–12
Unit Interval
UI
1600
mV p-p
Measured at receiver
—
UI p-p
Measured at receiver
0.55
—
UI p-p
Measured at receiver
0.65
—
UI p-p
Measured at receiver
ns
Skew at the receiver input
between lanes of a multilane
link
400
400
—
ps
—
+/– 100 ppm
Note:
1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The
sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 54. The sinusoidal jitter component
is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.
Table 63. Receiver AC Timing Specifications—3.125 GBaud
Range
Characteristic
Symbol
Unit
Min
Notes
Max
Differential Input Voltage
VIN
200
Deterministic Jitter Tolerance
JD
0.37
Combined Deterministic and Random
Jitter Tolerance
JDR
Total Jitter Tolerance1
JT
Multiple Input Skew
SMI
—
22
Bit Error Rate
BER
—
10-12
Unit Interval
UI
mV p-p
Measured at receiver
—
UI p-p
Measured at receiver
0.55
—
UI p-p
Measured at receiver
0.65
—
UI p-p
Measured at receiver
ns
Skew at the receiver input
between lanes of a multilane
link
320
1600
320
—
ps
—
+/- 100 ppm
Note:
1. Total jitter is composed of three components, deterministic jitter, random jitter and single frequency sinusoidal jitter. The
sinusoidal jitter may have any amplitude and frequency in the unshaded region of Figure 54. The sinusoidal jitter component
is included to ensure margin for low frequency jitter, wander, noise, crosstalk and other variable system effects.
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8.5 UI p-p
Sinusoidal
Jitter
Amplitude
0.10 UI p-p
22.1 kHz
Frequency
1.875 MHz
20 MHz
Figure 54. Single Frequency Sinusoidal Jitter Limits
15.8
Receiver Eye Diagrams
For each baud rate at which an LP-Serial receiver is specified to operate, the receiver shall meet the
corresponding Bit Error Rate specification (Table 61, Table 62, Table 63) when the eye pattern of the
receiver test signal (exclusive of sinusoidal jitter) falls entirely within the unshaded portion of the Receiver
Input Compliance Mask shown in Figure 55 with the parameters specified in Table . The eye pattern of the
receiver test signal is measured at the input pins of the receiving device with the device replaced with a
100 Ω +/– 5% differential resistive load.
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Receiver Differential Input Voltage
VDIFF max
VDIFF min
0
-V DIFF min
-V DIFF max
0
A
B
1-B
1-A
1
Time (UI)
Figure 55. Receiver Input Compliance Mask
Table 64. Receiver Input Compliance Mask Parameters Exclusive of Sinusoidal Jitter
Receiver Type
15.9
VDIFFmin (mV)
VDIFFmax (mV)
A (UI)
B (UI)
1.25 GBaud
100
800
0.275
0.400
2.5 GBaud
100
800
0.275
0.400
3.125 GBaud
100
800
0.275
0.400
Measurement and Test Requirements
Since the LP-Serial electrical specification are guided by the XAUI electrical interface specified in Clause
47 of IEEE 802.3ae-2002, the measurement and test requirements defined here are similarly guided by
Clause 47. In addition, the CJPAT test pattern defined in Annex 48A of IEEE 802.3ae-2002 is specified as
the test pattern for use in eye pattern and jitter measurements. Annex 48B of IEEE 802.3ae-2002 is
recommended as a reference for additional information on jitter test methods.
15.9.1
Eye Template Measurements
For the purpose of eye template measurements, the effects of a single-pole high pass filter with a 3 dB point
at (Baud Frequency)/1667 is applied to the jitter. The data pattern for template measurements is the
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87
Serial RapidIO
Continuous Jitter Test Pattern (CJPAT) defined in Annex 48A of IEEE 802.3ae. All lanes of the LP-Serial
link shall be active in both the transmit and receive directions, and opposite ends of the links shall use
asynchronous clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane
implementations shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. The
amount of data represented in the eye shall be adequate to ensure that the bit error ratio is less than 10-12.
The eye pattern shall be measured with AC coupling and the compliance template centered at 0 Volts
differential. The left and right edges of the template shall be aligned with the mean zero crossing points of
the measured data eye. The load for this test shall be 100 Ohms resistive +/– 5% differential to 2.5 GHz.
15.9.2
Jitter Test Measurements
For the purpose of jitter measurement, the effects of a single-pole high pass filter with a 3 dB point at (Baud
Frequency)/1667 is applied to the jitter. The data pattern for jitter measurements is the Continuous Jitter
Test Pattern (CJPAT) pattern defined in Annex 48A of IEEE 802.3ae. All lanes of the LP-Serial link shall
be active in both the transmit and receive directions, and opposite ends of the links shall use asynchronous
clocks. Four lane implementations shall use CJPAT as defined in Annex 48A. Single lane implementations
shall use the CJPAT sequence specified in Annex 48A for transmission on lane 0. Jitter shall be measured
with AC coupling and at 0 Volts differential. Jitter measurement for the transmitter (or for calibration of a
jitter tolerance setup) shall be performed with a test procedure resulting in a BER curve such as that
described in Annex 48B of IEEE 802.3ae.
15.9.3
Transmit Jitter
Transmit jitter is measured at the driver output when terminated into a load of 100 Ohms resistive +/– 5%
differential to 2.5 GHz.
15.9.4
Jitter Tolerance
Jitter tolerance is measured at the receiver using a jitter tolerance test signal. This signal is obtained by first
producing the sum of deterministic and random jitter defined in and then adjusting the signal amplitude
until the data eye contacts the 6 points of the minimum eye opening of the receive template shown in and
. Note that for this to occur, the test signal must have vertical waveform symmetry about the average value
and have horizontal symmetry (including jitter) about the mean zero crossing. Eye template measurement
requirements are as defined above. Random jitter is calibrated using a high pass filter with a low frequency
corner at 20 MHz and a 20 dB/decade roll-off below this. The required sinusoidal jitter specified in is then
added to the signal and the test load is replaced by the receiver being tested.
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Timers
16 Timers
This section describes the DC and AC electrical specifications for the timers of the MPC8568E.
16.1
Timers DC Electrical Characteristics
Table 65 provides the DC electrical characteristics for the MPC8568E timers pins, including TIN, TOUT,
TGATE and RTC_CLK.
Table 65. Timers DC Electrical Characteristics
Characteristic
16.2
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –6.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.0
OV DD+0.3
V
Input low voltage
VIL
—
-0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
± 10
μA
Timers AC Timing Specifications
Table 66 provides the timers input and output AC timing specifications.
Table 66. Timers Input AC Timing Specifications 1
Characteristic
Symbol 2
Typ
Unit
tTIWID
20
ns
Timers inputs—minimum pulse width
Notes:
1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN.
Timings are measured at the pin.
2. Timers inputs and outputs are asynchronous to any visible clock. Timers outputs should be synchronized before use
by any external synchronous logic. Timers inputs are required to be valid for at least tTIWID ns to ensure proper
operation
Figure 56 provides the AC test load for the timers.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 56. Timers AC Test Load
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PIC
17 PIC
This section describes the DC and AC electrical specifications for the external interrupt pins of the
MPC8568E.
17.1
PIC DC Electrical Characteristics
Table 67 provides the DC electrical characteristics for the external interrupt pins of the MPC8568E.
Table 67. PIC DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Input high voltage
VIH
—
2.0
OV DD+0.3
V
Input low voltage
VIL
—
-0.3
0.8
V
Input current
IIN
—
±10
μA
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Notes:
1. This table applies for pins IRQ[0:7], IRQ_OUT, MCP_OUT, and CE ports Interrupts.
2. IRQ_OUT and MCP_OUT are open drain pins, thus VOH is not relevant for those pins.
17.2
PIC AC Timing Specifications
Table 68 provides the PIC input and output AC timing specifications.
Table 68. PIC Input AC Timing Specifications 1
Characteristic
IPIC inputs—minimum pulse width
Symbol 2
Min
Unit
tPIWID
20
ns
Notes:
1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN.
Timings are measured at the pin.
2. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by
any external synchronous logic. IPIC inputs are required to be valid for at least tPIWID ns to ensure proper operation
when working in edge triggered mode.
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SPI
18 SPI
This section describes the DC and AC electrical specifications for the SPI of the MPC8568E.
18.1
SPI DC Electrical Characteristics
Table 69 provides the DC electrical characteristics for the MPC8568E SPI.
Table 69. SPI DC Electrical Characteristics
Characteristic
18.2
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –6.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.0
OV DD+0.3
V
Input low voltage
VIL
—
-0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
± 10
μA
SPI AC Timing Specifications
Table 70 and provide the SPI input and output AC timing specifications.
Table 70. SPI AC Timing Specifications 1
Symbol 2
Min
Max
Unit
SPI outputs—Master mode (internal clock) delay
tNIKHOV
0
6
ns
SPI outputs—Slave mode (external clock) delay
tNEKHOV
2
8
ns
SPI inputs—Master mode (internal clock) input setup time
tNIIVKH
4
—
ns
SPI inputs—Master mode (internal clock) input hold time
tNIIXKH
0
—
ns
SPI inputs—Slave mode (external clock) input setup time
tNEIVKH
4
—
ns
SPI inputs—Slave mode (external clock) input hold time
tNEIXKH
2
—
ns
Characteristic
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tNIKHOV symbolizes the NMSI outputs internal timing (NI) for the time tSPI memory clock reference (K) goes from
the high state (H) until outputs (O) are valid (V).
Figure 57 provides the AC test load for the SPI.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 57. SPI AC Test Load
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TDM/SI
Figure 58 through Figure 59 represent the AC timing from Table 72. Note that although the specifications
generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge
is the active edge.
Figure 58 shows the SPI timing in Slave mode (external clock).
SPICLK (input)
Input Signals:
SPIMOSI
(See Note)
tNEIXKH
tNEIVKH
tNEKHOV
Output Signals:
SPIMISO
(See Note)
Note: The clock edge is selectable on SPI.
Figure 58. SPI AC Timing in Slave mode (External Clock) Diagram
Figure 59 shows the SPI timing in Master mode (internal clock).
SPICLK (output)
tNIIXKH
tNIIVKH
Input Signals:
SPIMISO
(See Note)
tNIKHOV
Output Signals:
SPIMOSI
(See Note)
Note: The clock edge is selectable on SPI.
Figure 59. SPI AC Timing in Master mode (Internal Clock) Diagram
19 TDM/SI
This section describes the DC and AC electrical specifications for the time-division-multiplexed and serial
interface of the MPC8568E.
19.1
TDM/SI DC Electrical Characteristics
Table 71 provides the DC electrical characteristics for the MPC8568E TDM/SI.
Table 71. TDM/SI DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –2.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.5
V
Input high voltage
VIH
—
2.0
OV DD+0.3
V
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TDM/SI
Table 71. TDM/SI DC Electrical Characteristics (continued)
Characteristic
19.2
Symbol
Condition
Min
Max
Unit
Input low voltage
VIL
—
-0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
± 10
μA
TDM/SI AC Timing Specifications
Table 72 provides the TDM/SI input and output AC timing specifications.
Table 72. TDM/SI AC Timing Specifications 1
Symbol 2
Min
Max
Unit
TDM/SI outputs—External clock delay
tSEKHOV
2
11
ns
TDM/SI outputs—External clock High Impedance
tSEKHOX
2
10
ns
TDM/SI inputs—External clock input setup time
tSEIVKH
5
—
ns
TDM/SI inputs—External clock input hold time
tSEIXKH
2
—
ns
Characteristic
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tSEKHOX symbolizes the TDM/SI outputs external timing (SE) for the time tTDM/SI memory clock reference (K) goes
from the high state (H) until outputs (O) are invalid (X).
Figure 60 provides the AC test load for the TDM/SI.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 60. TDM/SI AC Test Load
Figure 61 represents the AC timing from Table 72. Note that although the specifications generally
reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the
active edge.
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UTOPIA/POS
Figure 61 shows the TDM/SI timing with external clock.
TDM/SICLK (input)
Input Signals:
TDM/SI
(See Note)
tSEIXKH
tSEIVKH
tSEKHOV
Output Signals:
TDM/SI
(See Note)
tSEKHOX
Note: The clock edge is selectable on TDM/SI
Figure 61. TDM/SI AC Timing (External Clock) Diagram
20
UTOPIA/POS
This section describes the DC and AC electrical specifications for the UTOPIA-packet over sonnet of the
MPC8568E.
20.1
UTOPIA/POS DC Electrical Characteristics
Table 73 provides the DC electrical characteristics for the MPC8568E UTOPIA.
Table 73. Utopia DC Electrical Characteristics
Characteristic
20.2
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Input high voltage
VIH
—
2.0
OV DD+0.3
V
Input low voltage
VIL
—
-0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
± 10
μA
Utopia/POS AC Timing Specifications
Table 74 provides the UTOPIA input and output AC timing specifications.
Table 74. Utopia AC Timing Specifications 1
Symbol 2
Min
Max
Unit
Utopia outputs—Internal clock delay
tUIKHOV
0
8.0
ns
Utopia outputs—External clock delay
tUEKHOV
1
10.0
ns
Utopia outputs—Internal clock High Impedance
tUIKHOX
0
8.0
ns
Utopia outputs—External clock High Impedance
tUEKHOX
1
10.0
ns
Characteristic
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UTOPIA/POS
Table 74. Utopia AC Timing Specifications 1 (continued)
Symbol 2
Min
Max
Unit
Utopia inputs—Internal clock input setup time
tUIIVKH
6
—
ns
Utopia inputs—External clock input setup time
tUEIVKH
4
—
ns
Utopia inputs—Internal clock input Hold time
tUIIXKH
0
—
ns
Utopia inputs—External clock input hold time
tUEIXKH
1
—
ns
Characteristic
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tUIKHOX symbolizes the Utopia outputs internal timing (UI) for the time tUtopia memory clock reference (K) goes
from the high state (H) until outputs (O) are invalid (X).
Figure 62 provides the AC test load for the Utopia.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 62. Utopia AC Test Load
Figure 63 through Figure 64 represent the AC timing from Table 74. Note that although the specifications
generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge
is the active edge.
Figure 63 shows the Utopia timing with external clock.
UtopiaCLK (input)
Input Signals:
Utopia
Output Signals:
Utopia
tUEIVKH
tUEIXKH
tUEKHOV
tUEKHOX
Figure 63. Utopia AC Timing (External Clock) Diagram
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HDLC, BISYNC, Transparent and Synchronous UART
Figure 64 shows the Utopia timing with internal clock.
UtopiaCLK (output)
tUIIXKH
tUIIVKH
Input Signals:
Utopia
tUIKHOV
Output Signals:
Utopia
tUIKHOX
Figure 64. Utopia AC Timing (Internal Clock) Diagram
21 HDLC, BISYNC, Transparent and Synchronous UART
This section describes the DC and AC electrical specifications for the high level data link control (HDLC),
BISYNC, transparent and synchronous UART of the MPC8568E.
21.1 HDLC, BISYNC, Transparent and Synchronous UART DC Electrical
Characteristics
Table 75 provides the DC electrical characteristics for the MPC8568E HDLC, BISYNC, Transparent and
Synchronous UART protocols.
Table 75. HDLC, BiSync, Transparent and Synchronous UART DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –2.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.5
V
Input high voltage
VIH
—
2.0
OV DD+0.3
V
Input low voltage
VIL
—
-0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
± 10
μA
21.2 HDLC, BISYNC, Transparent and Synchronous UART AC Timing
Specifications
Table 76 provides the input and output AC timing specifications for HDLC, BiSync, Transparent and
Synchronous UART protocols.
Table 76. HDLC, BiSync, Transparent AC Timing Specifications 1
Symbol 2
Min
Max
Unit
Outputs—Internal clock delay
tHIKHOV
0
6.5
ns
Outputs—External clock delay
tHEKHOV
1
8
ns
Characteristic
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HDLC, BISYNC, Transparent and Synchronous UART
Table 76. HDLC, BiSync, Transparent AC Timing Specifications 1 (continued)
Symbol 2
Min
Max
Unit
Outputs—Internal clock High Impedance
tHIKHOX
0
5.5
ns
Outputs—External clock High Impedance
tHEKHOX
1
8
ns
Inputs—Internal clock input setup time
tHIIVKH
6
—
ns
Inputs—External clock input setup time
tHEIVKH
4
—
ns
Inputs—Internal clock input Hold time
tHIIXKH
0
—
ns
Inputs—External clock input hold time
tHEIXKH
1
—
ns
Characteristic
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tHIKHOX symbolizes the outputs internal timing (HI) for the time tserial memory clock reference (K) goes from the
high state (H) until outputs (O) are invalid (X).
Table 77. Synchronous UART AC Timing Specifications
Symbol 2
Min
Max
Unit
Outputs—Internal clock delay
tHIKHOV
0
11
ns
Outputs—External clock delay
tHEKHOV
1
14
ns
Outputs—Internal clock High Impedance
tHIKHOX
0
11
ns
Outputs—External clock High Impedance
tHEKHOX
1
14
ns
Inputs—Internal clock input setup time
tHIIVKH
6
—
ns
Inputs—External clock input setup time
tHEIVKH
8
—
ns
Inputs—Internal clock input Hold time
tHIIXKH
0
—
ns
Inputs—External clock input hold time
tHEIXKH
1
—
ns
Characteristic
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tHIKHOX symbolizes the outputs internal timing (HI) for the time tserial memory clock reference (K) goes from the
high state (H) until outputs (O) are invalid (X).
Figure 65 provides the AC test load.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 65. AC Test Load
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HDLC, BISYNC, Transparent and Synchronous UART
Figure 66 through Figure 67 represent the AC timing from Table 76. Note that although the specifications
generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge
is the active edge.
Figure 66 shows the timing with external clock.
Serial CLK (input)
Input Signals:
tHEIXKH
tHEIVKH
(See Note)
tHEKHOV
Output Signals:
(See Note)
tHEKHOX
Note: The clock edge is selectable
Figure 66. AC Timing (External Clock) Diagram
Figure 67 shows the timing with internal clock.
Serial CLK (output)
Input Signals:
tHIIVKH
tHIIXKH
(See Note)
tHIKHOV
Output Signals:
(See Note)
tHIKHOX
Note: The clock edge is selectable
Figure 67. AC Timing (Internal Clock) Diagram
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Package and Pinout
22 Package and Pinout
This section details package parameters, pin assignments, and dimensions.
22.1
Package Parameters for the MPC8568E FC-PBGA
The package parameters are as provided in the following list. The package type is 33mm × 33mm, 1023
flip chip plastic ball grid array (FC-PBGA).
Package outline
33 mm × 33 mm
Interconnects
1023
Pitch
1 mm
Module height
2.23 – 2.75 mm
Solder Balls
96.5% Sn 3.5% Ag
Ball diameter (typical)
0.6 mm
22.2
Mechanical Dimensions of the MPC8568E FC-PBGA
Figure 68 shows the top view, bottom and side view of the MPC8568E 1023 FC-PBGA package.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Package and Pinout
Figure 68. Top, Bottom, Side Views
1.
2.
3.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
All dimensions are symmetric across the package center lines, unless dimensioned otherwise.
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Package and Pinout
4.
5.
6.
7.
8.
22.3
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
ParalleUsm measurement shall exclude any effect of mark on top surface of package
Capacitors may not be present on all devices.
Caution must be taken not to short capacitors or exposed metal capacitor pads on top of package.
Pinout Listings
Some of the non-QE signals are multiplexed with QE port pins, as follows:
PC[0]
UART_SOUT[1]
PC[1]
UART_RTS[1]
PC[2]
UART_CTS[1]
PC[3]
UART_SIN[1]
PC[11]
IRQ[8]
PC[12]
IRQ[9]/DMA_DREQ[3]
PC[13]
IRQ[10]/DMA_DACK[3]
PC[14]
IRQ[11]/DMA_DDONE[3]
PC[15]
DMA_DREQ[1]
PC[16]
DMA_DACK[1]
PC[17]
DMA_DDONE[1]
PC[18]
IIC2_SCL
PC[19]
IIC2_SDA
PD[28]
UART_SOUT[1]
PD[29]
UART_RTS[1]
PD[30]
UART_CTS[1]
PD[31]
UART_SIN[1]
This applies to both MPC8568E and MPC8568E. Note that for DUART1, there are two options. DUART0
is multiplexed with PCI Req/Grant pins.
PCI_REQ[3]
UART_CTS[0]
PCI_REQ[4]
UART_SIN[0]
PCI_GNT[3]
UART_RTS[0]
PCI_GNT[4]
UART_SOUT[0]
For MPC8568E, GPIO is multiplexed with the TSEC2 interface:
TSEC2_TXD[7:0]
GPOUT[0:7]
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Package and Pinout
TSEC2_RXD[7:0]
GPIN[0:7]
Other muxing includes:
LCS[5]
DMA_DREQ[2]
LCS[6]
DMA_DACK[2]
LCS[7]
DMA_DDONE[2]
Table 79 provides the pin-out listing for the MPC8568E 1023 FC-PBGA package.
Table 78. MPC8568E Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI
PCI_AD[31:0]
AE19, AG20, AF19, AB20, AC20, AG21, AG22,
AB21, AF22, AH22, AE22, AF20, AB22, AE20,
AE23, AJ23, AJ24, AF27, AJ26, AE29, AH24,
AD24, AE25, AE26, AH27, AG27, AJ25, AE30,
AF26, AG26, AF28, AH26
I/O
OVDD
—
PCI_C_BE[3:0]
AC22, AD20, AE28, AH25
I/O
OVDD
—
PCI_GNT[4:1]
AF29, AB18, AC18, AD18
O
OVDD
5,9,35
PCI_GNT0
AE18
I/O
OVDD
—
PCI_IRDY
AF23
I/O
OVDD
2
PCI_PAR
AJ22
I/O
OVDD
PCI_PERR
AF24
I/O
OVDD
2
PCI_SERR
AD22
I/O
OVDD
2,4
PCI_STOP
AE24
I/O
OVDD
2
PCI_TRDY
AK24
I/O
OVDD
2
PCI_REQ[4:1]
AG29, AJ27, AH29, AB17
I
OVDD
—
PCI_REQ[0]
AC17
I/O
OVDD
—
PCI_CLK
AM26
I
OVDD
39
PCI_DEVSEL
AK23
I/O
OVDD
2
PCI_FRAME
AE21
I/O
OVDD
2
PCI_IDSEL
AB19
I
OVDD
—
DDR SDRAM Memory Interface
MDQ[0:63]
B22, C22, E20, A19, C23, A22, A20, C20, G22, E22,
E16, F16, E23, F23, F17, H17, A18, A17, B16, C16,
B19, C19, E17, A16, A13, A14, A12, C12, A15, B15,
B13, C13, G12, G11, H8, F8, D13, F12, E9, F9, A7,
B7, C5, E5, C8, E8, D6, A5, E6, G6, E1, F1, G7, E7,
E2, D1, C4, A3, B1, C1, A4, B4, C2, D2
I/O
GVDD
—
MECC[0:7]
C11, E11, D9, A8, D12, A11, A9, C9
I/O
GVDD
—
MDM[0:8]
A21, E21, D18, B14, F11, A6, G5, A2, A10
O
GVDD
—
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
102
Freescale Semiconductor
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
MDQS[0:8]
D21, G20, C17, D14, E10, C6, F4, C3, C10
I/O
GVDD
—
MDQS[0:8]
C21, G21, C18, D15, F10, C7, F5, D3, B10
I/O
GVDD
—
MA[0:15]
K7, H7, L7, J8, K8, L10, H9, K9, H10, G10, L6, K10,
K11, H3, J11, J12
O
GVDD
—
MBA[0:2]
K4, H6, L13
O
GVDD
—
MWE
K3
O
GVDD
—
MCAS
L3
O
GVDD
—
MRAS
K6
O
GVDD
—
MCKE[0:3]
L14, G13, K12, J13
O
GVDD
11
MCS[0:3]
J5, H2, K5, K2,
O
GVDD
—
MCK[0:5]
G15, F20, E4, F14, E19, G3
O
GVDD
—
MCK[0:5]
G14, F19, E3, F13, E18, G2
O
GVDD
—
MODT[0:3]
G4, J1, J4, K1
O
GVDD
—
MDIC[0:1]
G1, H1
I/O
GVDD
36
Local Bus Controller Interface
LAD[0:31]
M26, C30, F31, L24, G26, D30, M25, L26, D29,
G32, G28, K26, B32, M24, G29, L25, E29, J23, B30,
A31, J24, K23, H25, H23, F26, C28, B29, E25, D26,
G24, A29, E27,
I/O
BVDD
—
LDP[0:3]
G30, J26, H28, E26
I/O
BVDD
—
LA[27]
F29
O
BVDD
5,9
LA[28:31]
H24, C32, F30, H26
O
BVDD
5,7,9
LALE
G31
O
BVdd
8
LBCTL
L27
O
BVdd
8
LCS[0:4]
M27, H32, J28, J30, B31
O
BVDD
—
LCS5
G25
I/O
BVDD
1
LCS6
C29
O
BVDD
1
LCS7
A30
O
BVDD
1
LWE[0]
H30
O
BVDD
5,9
LWE[1]
E28
O
BVDD
5,9
LWE[2]
E32
O
BVDD
5,9
LWE[3]
G27
O
BVDD
5,9
LGPL0
E30
O
BVDD
5,9
LGPL1
J27
O
BVDD
5,9,46
LGPL2
D32
O
BVDD
5,8,9
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
103
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
LGPL3
J25
O
BVDD
5,9
LGPL4
C25
I/O
BVDD
49
LGPL5
F32
O
BVDD
5,9
LCKE
C31
O
BVDD
—
LCLK[0:2]
C27, C26, D25
O
BVDD
—
LSYNC_IN
A28
I
BVDD
—
LSYNC_OUT
A27
O
BVDD
—
DMA
DMA_DACK[0]
AM27
O
OVDD
5,9,46
DMA_DREQ[0]
AK28
I
OVDD
—
DMA_DDONE[0]
AK26
O
OVDD
—
Programmable Interrupt Controller
UDE
AG32
I
OVDD
—
MCP
AF32
I
OVDD
—
IRQ[0:7]
AD30, AG31, AL30, AF31, AD29, AK30, AG30,
AF30
I
OVDD
—
IRQ_OUT
AD28
O
OVDD
2,4
Interface
EC_MDC
AE17
O
OVDD
5,9
EC_MDIO
AF17
I/O
OVDD
—
I
LV DD
—
Gigabit Reference Clock
EC_GTX_CLK125
AM14
Three-Speed Ethernet Controller (Gigabit Ethernet 1)
TSEC1_RXD[7:0]
AE14, AM11, AK11, AF11, AJ14, AJ13, AD12,
AE13
I
LV DD
—
TSEC1_TXD[7]
AH12
O
LV DD
5, 9
TSEC1_TXD[6:1]
AL13, AL11, AK13, AH13, AG11, AD13
O
LVDD
—
TSEC1_TXD[0]
AM13
O
LV DD
5, 9
TSEC1_COL
AG13
I
LV DD
—
TSEC1_CRS
AB13
I/O
LV DD
20
TSEC1_GTX_CLK
AG12
O
LV DD
—
TSEC1_RX_CLK
AE11
I
LV DD
—
TSEC1_RX_DV
AH11
I
LV DD
—
TSEC1_RX_ER
AM12
I
LV DD
—
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
104
Freescale Semiconductor
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
TSEC1_TX_CLK
AJ11
I
LV DD
—
TSEC1_TX_EN
AC13
O
LV DD
30
TSEC1_TX_ER
AL12
O
LV DD
5,9
Three-Speed Ethernet Controller (Gigabit Ethernet 2)
TSEC2_RXD[7:0]
AC14, AD15, AB14, AH15, AD14, AH17, AE15,
AC15
I
LV DD
—
TSEC2_TXD[7]
AM16
O
LV DD
5, 9
TSEC2_TXD[6:1]
AJ15, AJ17, AF13, AK17, AH16, AG17
O
LV DD
—
TSEC2_TXD[0]
AL15
O
LV DD
5, 9
TSEC2_COL
AB15
I
LV DD
—
TSEC2_CRS
AB16
I/O
LV DD
20
TSEC2_GTX_CLK
AJ16
O
LV DD
—
TSEC2_RX_CLK
AE16
I
LV DD
—
TSEC2_RX_DV
AG15
I
LV DD
—
TSEC2_RX_ER
AF15
I
LV DD
—
TSEC2_TX_CLK
AH14
I
LV DD
—
TSEC2_TX_EN
AM15
O
LV DD
30
TSEC2_TX_ER
AK15
O
LV DD
—
I2C
interface
IIC1_SCL
AE32
I/O
OVDD
4,27
IIC1_SDA
AD32
I/O
OVDD
4,27
SerDes
SD_RX[0:7]
L30, M32, N30, P32, U30, V32, W30, Y32
I
SCOREVDD
43,44
SD_RX[0:7]
L29, M31, N29, P31, U29, V31, W29, Y31
I
SCOREVDD
43,44
SD_TX[0:7]
P26, R24, T26, U24, W24, Y26, AA24, AB26
O
XVDD
44
SD_TX[0:7]
P27, R25, T27, U25, W25, Y27, AA25, AB27
O
XVDD
44
SD_PLL_TPD
R32
O
SCOREVDD
24
SD_RX_CLK
U28
I
XVDD
41,44
SD_RX_FRM_CTL
V28
I
XVDD
41,44
Reserved
V26
—
—
48
Reserved
V27
—
—
48
SD_REF_CLK
T32
I
SCOREVDD
44
SD_REF_CLK
T31
I
SCOREVDD
44
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
105
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
QUICC Engine
PA[0:4]
M1, M2, M5, M4, M3
I/O
OVDD
5,17
PA[5]
N3
I/O
OVDD
29
PA[6:31]
M6, M7, M8, N5, M10, N1, M11, M9, P1, N9, N7, R6,
R2, P7, P5, R4, P3, P11, P10, P9, R8, R7, R5, R3,
R1, T2
I/O
OVDD
—
PB[4:31]
T1, R11, R9, T6, T5, T4, T3, U10, T9, T8, T7, U5,
U3, U1, T11, V1, U11, U9, U7, V5, W4, V3, W2, V9,
W8, V7, W6, W3
I/O
OVDD
—
PC[0:31]
W1, V11, V10, W11, W9, W7, W5, Y4, Y3, Y2, Y1,
Y8, Y7, Y6, Y5, AA1, Y11, AA10, Y9, AA9, AA7,
AA5, AA3, AB3, AC2, AB1, AA11, AB7, AC6, AB5,
AC4, AB9
I/O
OVDD
—
PD[4:31]
AC8, AD1, AC1, AC7, AB10, AC5, AD3, AD2, AC3,
AE4, AF1, AE3, AE1, AD6, AG2, AG1, AD5, AD7,
AD4, AH1, AK3, AD8, AF5, AM4, AC9, AL2, AE5,
AF3
I/O
OVDD
—
PE[5:7]
AM6, AL5, AL9
I/O
TVDD
—
PE[8:10]
AM9, AM10, AL10
I/O
TVDD
5
PE[11:19]
AJ9, AH10, AM8, AK9, AL7, AL8, AH9, AM7, AH8
I/O
TVDD
—
PE[20]
AH6
I/O
OVDD
—
PE[21:23]
AM1, AE10, AG5
I/O
OVDD
5
PE[24]
AJ1
I/O
OVDD
5
PE[25:31]
AH2, AM2, AE9, AH5, AL1, AD9, AL4
I/O
OVDD
—
PF[7]
AG9
I/O
TVDD
—
PF[8:10]
AF10, AK7, AJ6
I/O
TVDD
5
PF[11:19]
AH7, AF9, AJ7, AJ5, AF7, AG8, AG7, AM5, AK5
I/O
TVDD
—
PF[20]
AK1
I/O
OVDD
—
PF[21:22]
AH3, AL3
I/O
OVDD
5,33
PF[23:31]
AB11, AE7, AJ3, AC11, AG6, AG3, AH4, AM3,
AD11
I/O
OVDD
—
System Control
HRESET
AL21
I
OVDD
—
HRESET_REQ
AL23
O
OVDD
29
SRESET
AK18
I
OVDD
—
CKSTP_IN
AL17
I
OVDD
—
CKSTP_OUT
AM17
O
OVDD
2,4
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
106
Freescale Semiconductor
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Debug
TRIG_IN
AL29
I
OVDD
—
TRIG_OUT
AM29
O
OVDD
6,9,19
,29
MSRCID[0:1]
AK29, AJ29
O
OVDD
5,6,9
MSRCID[2:4]
AM28, AL28, AK27
O
OVDD
6,19,2
9
MDVAL
AJ28
O
OVDD
6
CLK_OUT
AF18
O
OVDD
11
Clock
RTC
AH20
I
OVDD
—
SYSCLK
AK22
I
OVDD
—
JTAG
TCK
AH18
I
OVDD
—
TDI
AH19
I
OVDD
12
TDO
AJ18
O
OVDD
11
TMS
AK19
I
OVDD
12
TRST
AK20
I
OVDD
12
DFT
L1_TSTCLK
AJ20
I
OVDD
25
L2_TSTCLK
AJ19
I
OVDD
25
LSSD_MODE
AH31
I
OVDD
25
TEST_SEL
AJ31
I
OVDD
25
Thermal Management
THERM0
AB30
—
—
14
THERM1
AB31
—
—
14
O
OVDD
9,19,2
9
Power Management
ASLEEP
AK21
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
107
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Power and Ground Signals
GND
A23, A26, A32, B3, B6, B9, B12, B18, B21, B23,
B24, B25, B26, B27, C15, C24, D5, D8, D11, D17,
D20, D23, D24, D28, E13, E14, E24, E31, F3, F7,
F15, F18, F22, F24, F27, G8, G16, G19, G23, H5,
H12, H13, H15, H16, H18, H19, H21, H22, J2, J7,
J10, J14, J15, J16, J17, J18, J19, J20, J21, J22,
J29, J31, J32, K14, K15, K16, K17, K18, K19, K20,
K21, K22, K24, L1, L4, L9, L12, L15, L16, L17, L18,
L19, L20, L21, L22, L23, M12, M13, M18, M20, M21,
M23, N4, N8, N11, N13, N15, N17, N19, N21, N23,
P2, P6, P12, P14, P16, P18, P20, P22, P23, R10,
R13, R15, R17, R19, R21, R23, T12, T14, T16, T18,
T20, T22, T23, U4, U8, U13, U15, U17, U19, U21,
U23, V2, V6, V12, V14, V16, V18, V20, V22, V23,
W10, W13, W15, W17, W19, W21, W23, Y12, Y14,
Y16, Y18, Y20, Y22, Y23, AA4, AA8, AA12, AA13,
AA15, AA17, AA19, AA21, AA22, AA23, AB2, AB6,
AB12, AB23, AB29, AB32, AC10, AC23, AC24,
AC25, AC28, AC29, AC30, AC31, AC32, AD16,
AD17, AD19, AD21, AD25, AD26, AD27, AD31,
AE8, AE12, AF2, AF4, AF6, AF16, AF21, AF25,
AG10, AG14, AG18, AG24, AG28, AH23, AJ4, AJ8,
AJ12, AJ21, AJ30, AJ32, AK2, AK10, AK16, AK32,
AL6, AL14, AL18, AL19, AL20, AL22, AL24, AL25,
AL26, AL31, AL32, AM19, AM21, AM23, AM25,
AM30, AM31, AM32
—
—
—
SCOREGND
K28, K29, K30, L28, L31, M28, M30, N32, P28, P30,
R28, T29, U32, V30, W28, W31, Y28, Y29, AA29,
AA30, AA32, AB28
Ground for
SerDes
receiver
—
—
XGND
N24, N26, P25, R27, T24, U26, V25, W27, Y24,
AA26, AB25, AC27
Ground for
SerDes
transmitter
—
—
OVDD
N2, N6, N10, P4, P8, T10, U2, U6, V4, V8, Y10,
AA2, AA6, AB4, AB8, AC19, AC21, AD10, AD23,
AE2, AE6, AE27, AE31, AG4, AG19, AG23, AG25,
AH21, AH28, AH30, AH32, AJ2, AK4, AK25, AK31,
AL27
Power for
PCI and
other
standards
(3.3V)
OVDD
—
LVDD
AC12, AC16, AF12, AF14, AG16, AK12, AK14,
AL16
Power for
eTSEC1 and
eTSEC2
(2.5V,3.3V)
LVDD
—
TVDD
AF8, AJ10, AK6, AK8
Power for QE
UCC1 and
UCC2
Ethernet
Interface
(2,5V,3.3V)
TVDD
—
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
108
Freescale Semiconductor
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Power
Supply
Notes
Power for
DDR1 and
DDR2
DRAM I/O
voltage
(1.8V,2.5V)
GVDD
—
B28, D27, D31, F25, F28, H27, H29, H31, K25, K27
Power for
Local Bus
(1.8V, 2.5V,
3.3V)
BVDD
—
VDD
M14, M15, M19, M22, N12, N14, N16, N18, N20,
N22, P13, P15, P17, P19, P21, R12, R14, R16, R18,
R20, R22, T13, T15, T17, T19, T21, U12, U14, U16,
U18, U20, U22, V13, V15, V17, V19, V21, W12,
W14, W16, W18, W20, W22, Y13, Y15, Y17, Y19,
Y21, AA14, AA16, AA18, AA20
Power for
Core (1.1)
VDD
—
SCOREVDD
K31, L32, M29, N28, N31, P29, T28, T30, U31, V29,
W32, Y30, AA31
Core Power
for SerDes
transceivers
(1.1V)
SCOREVDD
—
XVDD
N25, N27, P24, R26, T25, U27, V24, W26, Y25,
AA27, AB24, AC26
Pad Power
for SerDes
transceivers
(1.1V)
XVDD
—
AVDD_LBIU
A25
Power for
local bus PLL
(1.1V)
—
26
AVDD_PCI
AM22
Power for
PCI PLL
(1.1V)
—
26
AVDD_CE
AM18
Power for QE
PLL
(1.1V)
—
26
AVDD_CORE
AM24
Power for
e500 PLL
(1.1V)
—
26
AVDD_PLAT
AM20
Power for
CCB PLL
(1.1V)
—
26
AVDD_SRDS
R29
Power for
SRDSPLL
(1.1V)
—
26
AGND_SRDS
R31
Ground for
SRDSPLL
—
—
SENSEVDD
M17
O
VDD
13
Signal
Package Pin Number
Pin Type
GVDD
B2, B5, B8, B11, B17, B20, C14, D4, D7, D10, D16,
D19, D22, E12, E15, F2, F6, F21, G9, G17, G18,
H4, H11, H14, H20, J3, J6, J9, K13, L2, L5, L8, L11
BVDD
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
109
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Signal
SENSEVSS
Package Pin Number
M16
Pin Type
Power
Supply
Notes
—
—
13
Analog Signals
MVREF
A24
I
Reference
voltage
signal for
DDR
MVREF
—
SD_IMP_CAL_RX
K32
I
200Ω to GND
—
SD_IMP_CAL_TX
AA28
I
100Ω to GND
—
SD_PLL_TPA
R30
O
—
24
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
110
Freescale Semiconductor
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Notes:
1. All multiplexed signals are listed only once and do not re-occur. For example, LCS5/DMA_REQ2 is listed only once in the local
bus controller section, and is not mentioned in the DMA section even though the pin also functions as DMA_REQ2.
2. Recommend a weak pull-up resistor (2–10 KΩ) be placed on this pin to OVDD.
4. This pin is an open drain signal.
5. This pin is a reset configuration pin. It has a weak internal pull-up P-FET which is enabled only when the processor is in the
reset state. This pull-up is designed such that it can be overpowered by an external 4.7-kΩ pull-down resistor. However, if the
signal is intended to be high after reset, and if there is any device on the net which might pull down the value of the net at reset,
then a pullup or active driver is needed.
6. Treat these pins as no connects (NC) unless using debug address functionality.
7. The value of LA[28:31] during reset sets the CCB clock to SYSCLK PLL ratio. These pins require 4.7-kΩ pull-up or pull-down
resistors. See Section 23.2, “CCB/SYSCLK PLL Ratio.”
8. The value of LALE, LGPL2 and LBCTL at reset set the e500 core clock to CCB Clock PLL ratio. These pins require 4.7-kΩ
pull-up or pull-down resistors. See the Section 23.3, “e500 Core PLL Ratio.”
9. Functionally, this pin is an output, but structurally it is an I/O because it either samples configuration input during reset or
because it has other manufacturing test functions. This pin will therefore be described as an I/O for boundary scan.
11.This output is actively driven during reset rather than being three-stated during reset.
12.These JTAG pins have weak internal pull-up P-FETs that are always enabled.
13.These pins are connected to the V DD/GND planes internally and may be used by the core power supply to improve tracking
and regulation.
14.Internal thermally sensitive resistor. These two pins are not ESD protected.
17.. The value of PA[0:4] during reset set the QE clock to SYSCLK PLL ratio. These pins require 4.7-kΩ pull-up or pull-down
resistors. See Section 23.4, “QE/SYSCLK PLL Ratio.”
19. If this pin is connected to a device that pulls down during reset, an external pull-up is required to drive this pin to a safe state
during reset.
20. This pin is only an output in FIFO mode when used as Rx Flow Control.
24. Do not connect.
25.These are test signals for factory use only and must be pulled up (100 - 1 K) to OVDD for normal machine operation.
26. Independent supplies derived from board VDD.
27. Recommend a pull-up resistor (~1 K.) be placed on this pin to OVDD.
29. The following pins must NOT be pulled down during power-on reset: HRESET_REQ, TRIG_OUT/READY/QUIESCE,
MSRCID[2:4], ASLEEP, PA[5]
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
111
Package and Pinout
Table 78. MPC8568E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
30. This pin requires an external 4.7-kΩ pull-down resistor to prevent PHY from seeing a valid Transmit Enable before it is actively
driven.
33. PF[21:22] are multiplexed as cfg_dram_type[0:1]. THEY MUST BE VALID AT POWER-UP, EVEN BEFORE HRESET
ASSERTION.
35. When a PCI block is disabled, either the POR config pin that selects between internal and external arbiter must be pulled
down to select external arbiter if there is any other PCI device connected on the PCI bus, or leave the PCIn_AD pins as "No
Connect" or terminated through 2–10 KΩ pull-up resistors with the default of internal arbiter if the PCIn_AD pins are not
connected to any other PCI device. The PCI block will drive the PCIn_AD pins if it is configured to be the PCI arbiter—through
POR config pins—irrespective of whether it is disabled via the DEVDISR register or not. It may cause contention if there is any
other PCI device connected on the bus.
36.MDIC[0] is grounded through an 18.2-Ω precision 1% resistor and MDIC[1] is connected to GVDD through an 18.2-Ω precision
1% resistor. These pins are used for automatic calibration of the DDR IOs.
39. If PCI is configured as PCI asynchronous mode, a valid clock must be provided on pin PCI_CLK . Otherwise the processor
will not boot up.
41.These pins should be tied to SCOREGND through a 300 ohm resistor if the high speed interface is used.
43. It is highly recommended that unused SD_RX/SD_RX lanes should be powered down with lane_x_pd. Otherwise the
receivers will burn extra power and the internal circuitry may develop long term reliability problems.
44. See Section 25.9, “Guidelines for High-Speed Interface Termination.”
46. Must be high during HRESET. It is recommended to leave the pin open during HRESET since it has internal pullup resistor.
47. Must be pulled down with 4.7-kΩ resistor.
48. This pin must be left no connect.
49. A pull-up on LGPL4 is required for systems that boot from local bus (GPCM)-controlled NOR Flash.
Table 79 provides the pin-out listing for the MPC8567E 1023 FC-PBGA package.
Table 79. MPC8567E Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PCI
PCI_AD[31:0]
AE19, AG20, AF19, AB20, AC20, AG21, AG22,
AB21, AF22, AH22, AE22, AF20, AB22, AE20,
AE23, AJ23, AJ24, AF27, AJ26, AE29, AH24,
AD24, AE25, AE26, AH27, AG27, AJ25, AE30,
AF26, AG26, AF28, AH26
I/O
OV DD
—
PCI_C_BE[3:0]
AC22, AD20, AE28, AH25
I/O
OV DD
—
PCI_GNT[4:1]
AF29, AB18, AC18, AD18
O
OV DD
5,9,35
PCI_GNT0
AE18
I/O
OV DD
—
PCI_IRDY
AF23
I/O
OV DD
2
PCI_PAR
AJ22
I/O
OV DD
—
PCI_PERR
AF24
I/O
OV DD
2
PCI_SERR
AD22
I/O
OV DD
2,4
PCI_STOP
AE24
I/O
OV DD
2
PCI_TRDY
AK24
I/O
OV DD
2
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
112
Freescale Semiconductor
Package and Pinout
Table 79. MPC8567E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
I
OV DD
—
PCI_REQ[4:1]
AG29, AJ27, AH29, AB17
PCI_REQ[0]
AC17
I/O
OV DD
—
PCI_CLK
AM26
I
OV DD
39
PCI_DEVSEL
AK23
I/O
OV DD
2
PCI_FRAME
AE21
I/O
OV DD
2
PCI_IDSEL
AB19
I
OV DD
—
DDR SDRAM Memory Interface
MDQ[0:63]
B22, C22, E20, A19, C23, A22, A20, C20, G22, E22,
E16, F16, E23, F23, F17, H17, A18, A17, B16, C16,
B19, C19, E17, A16, A13, A14, A12, C12, A15, B15,
B13, C13, G12, G11, H8, F8, D13, F12, E9, F9, A7,
B7, C5, E5, C8, E8, D6, A5, E6, G6, E1, F1, G7, E7,
E2, D1, C4, A3, B1, C1, A4, B4, C2, D2
I/O
GV DD
—
MECC[0:7]
C11, E11, D9, A8, D12, A11, A9, C9
I/O
GV DD
—
MDM[0:8]
A21, E21, D18, B14, F11, A6, G5, A2, A10
O
GV DD
—
MDQS[0:8]
D21, G20, C17, D14, E10, C6, F4, C3, C10
I/O
GV DD
—
MDQS[0:8]
C21, G21, C18, D15, F10, C7, F5, D3, B10
I/O
GV DD
—
MA[0:15]
K7, H7, L7, J8, K8, L10, H9, K9, H10, G10, L6, K10,
K11, H3, J11, J12
O
GV DD
—
MBA[0:2]
K4, H6, L13
O
GV DD
—
MWE
K3
O
GV DD
—
MCAS
L3
O
GV DD
—
MRAS
K6
O
GV DD
—
MCKE[0:3]
L14, G13, K12, J13
O
GV DD
11
MCS[0:3]
J5, H2, K5, K2,
O
GV DD
—
MCK[0:5]
G15, F20, E4, F14, E19, G3
O
GV DD
—
MCK[0:5]
G14, F19, E3, F13, E18, G2
O
GV DD
—
MODT[0:3]
G4, J1, J4, K1
O
GV DD
—
MDIC[0:1]
G1, H1
I/O
GV DD
36
Local Bus Controller Interface
LAD[0:31]
M26, C30, F31, L24, G26, D30, M25, L26, D29,
G32, G28, K26, B32, M24, G29, L25, E29, J23, B30,
A31, J24, K23, H25, H23, F26, C28, B29, E25, D26,
G24, A29, E27,
I/O
BVDD
—
LDP[0:3]
G30, J26, H28, E26
I/O
BVDD
—
LA[27]
F29
O
BVDD
5,9
LA[28:31]
H24, C32, F30, H26
O
BVDD
5,7,9
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
113
Package and Pinout
Table 79. MPC8567E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
LALE
G31
O
BVdd
8
LBCTL
L27
O
BVdd
8
LCS[0:4]
M27, H32, J28, J30, B31
O
BVDD
—
LCS5
G25
I/O
BVDD
1
LCS6
C29
O
BVDD
1
LCS7
A30
O
BVDD
1
LWE[0]
H30
O
BVDD
5,9
LWE[1]
E28
O
BVDD
5,9
LWE[2]
E32
O
BVDD
5,9
LWE[3]
G27
O
BVDD
5,9
LGPL0
E30
O
BVDD
5,9
LGPL1
J27
O
BVDD
5,9,46
LGPL2
D32
O
BVDD
5,8,9
LGPL3
J25
O
BVDD
5,9
LGPL4
C25
I/O
BVDD
49
LGPL5
F32
O
BVDD
5,9
LCKE
C31
O
BVDD
—
LCLK[0:2]
C27, C26, D25
O
BVDD
—
LSYNC_IN
A28
I
BVDD
—
LSYNC_OUT
A27
O
BVDD
—
DMA
DMA_DACK[0]
AM27
O
OV DD
5,9,47
DMA_DREQ[0]
AK28
I
OV DD
—
DMA_DDONE[0]
AK26
O
OV DD
—
Programmable Interrupt Controller
UDE
AG32
I
OV DD
—
MCP
AF32
I
OV DD
—
IRQ[0:7]
AD30, AG31, AL30, AF31, AD29, AK30, AG30,
AF30
I
OV DD
—
IRQ_OUT
AD28
O
OV DD
2,4
I
LVDD
—
GPIO
GPIN[0:7]
AC14, AD15, AB14, AH15, AD14, AH17, AE15,
AC15
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
114
Freescale Semiconductor
Package and Pinout
Table 79. MPC8567E Pinout Listing (continued)
Signal
GPOUT[0:7]
Package Pin Number
AM16, AJ15, AJ17, AF13, AK17, AH16, AG17,
AL15
Pin Type
Power
Supply
Notes
O
LVDD
—
I2C interface
IIC1_SCL
AE32
I/O
OV DD
4,27
IIC1_SDA
AD32
I/O
OV DD
4,27
SerDes
SD_RX[0:7]
L30, M32, N30, P32, U30, V32, W30, Y32
I
SCOREVDD
43,44
SD_RX[0:7]
L29, M31, N29, P31, U29, V31, W29, Y31
I
SCOREVDD
43,44
SD_TX[0:7]
P26, R24, T26, U24, W24, Y26, AA24, AB26
O
XVDD
44
SD_TX[0:7]
P27, R25, T27, U25, W25, Y27, AA25, AB27
O
XVDD
44
SD_PLL_TPD
R32
O
SCOREVDD
24
SD_RX_CLK
U28
I
XVDD
41,44
SD_RX_FRM_CTL
V28
I
XVDD
41,44
Reserved
V26
—
—
48
Reserved
V27
—
—
48
SD_REF_CLK
T32
I
SCOREVDD
44
SD_REF_CLK
T31
I
SCOREVDD
44
QUICC Engine
PA[0:4]
M1, M2, M5, M4, M3
I/O
OV DD
5,17
PA[5]
N3
I/O
OV DD
29
PA[6:31]
M6, M7, M8, N5, M10, N1, M11, M9, P1, N9, N7, R6,
R2, P7, P5, R4, P3, P11, P10, P9, R8, R7, R5, R3,
R1, T2
I/O
OV DD
—
PB[4:31]
T1, R11, R9, T6, T5, T4, T3, U10, T9, T8, T7, U5,
U3, U1, T11, V1, U11, U9, U7, V5, W4, V3, W2, V9,
W8, V7, W6, W3
I/O
OV DD
—
PC[0:31]
W1, V11, V10, W11, W9, W7, W5, Y4, Y3, Y2, Y1,
Y8, Y7, Y6, Y5, AA1, Y11, AA10, Y9, AA9, AA7,
AA5, AA3, AB3, AC2, AB1, AA11, AB7, AC6, AB5,
AC4, AB9
I/O
OV DD
—
PD[4:31]
AC8, AD1, AC1, AC7, AB10, AC5, AD3, AD2, AC3,
AE4, AF1, AE3, AE1, AD6, AG2, AG1, AD5, AD7,
AD4, AH1, AK3, AD8, AF5, AM4, AC9, AL2, AE5,
AF3
I/O
OV DD
—
PE[5:7]
AM6, AL5, AL9
I/O
TVDD
—
PE[8:10]
AM9, AM10, AL10
I/O
TVDD
5
PE[11:19]
AJ9, AH10, AM8, AK9, AL7, AL8, AH9, AM7, AH8
I/O
TVDD
—
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
115
Package and Pinout
Table 79. MPC8567E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
PE[20]
AH6
I/O
OV DD
—
PE[21:23]
AM1, AE10, AG5
I/O
OV DD
5
PE[24]
AJ1
I/O
OV DD
5
PE[25:31]
AH2, AM2, AE9, AH5, AL1, AD9, AL4
I/O
OVDD
—
PF[7]
AG9
I/O
TVDD
—
PF[8:10]
AF10, AK7, AJ6
I/O
TVDD
5
PF[11:19]
AH7, AF9, AJ7, AJ5, AF7, AG8, AG7, AM5, AK5
I/O
TVDD
—
PF[20]
AK1
I/O
OV DD
—
PF[21:22]
AH3, AL3
I/O
OV DD
5,33
PF[23:31]
AB11, AE7, AJ3, AC11, AG6, AG3, AH4, AM3,
AD11
I/O
OV DD
—
System Control
HRESET
AL21
I
OV DD
—
HRESET_REQ
AL23
O
OV DD
29
SRESET
AK18
I
OV DD
—
CKSTP_IN
AL17
I
OV DD
—
CKSTP_OUT
AM17
O
OV DD
2,4
Debug
TRIG_IN
AL29
I
OV DD
—
TRIG_OUT
AM29
O
OV DD
6,9,19,
29
MSRCID[0:1]
AK29, AJ29
O
OV DD
5,6,9
MSRCID[2:4]
AM28, AL28, AK27
O
OV DD
6,19,29
MDVAL
AJ28
O
OV DD
6
CLK_OUT
AF18
O
OV DD
11
Clock
RTC
AH20
I
OV DD
—
SYSCLK
AK22
I
OV DD
—
JTAG
TCK
AH18
I
OV DD
—
TDI
AH19
I
OV DD
12
TDO
AJ18
O
OV DD
11
TMS
AK19
I
OV DD
12
TRST
AK20
I
OV DD
12
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
116
Freescale Semiconductor
Package and Pinout
Table 79. MPC8567E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
DFT
L1_TSTCLK
AJ20
I
OV DD
25
L2_TSTCLK
AJ19
I
OV DD
25
LSSD_MODE
AH31
I
OV DD
25
TEST_SEL
AJ31
I
OV DD
25
Thermal Management
THERM0
AB30
—
—
14
THERM1
AB31
—
—
14
O
OV DD
9,19,29
Power Management
ASLEEP
AK21
Power and Ground Signals
GND
A23, A26, A32, B3, B6, B9, B12, B18, B21, B23,
B24, B25, B26, B27, C15, C24, D5, D8, D11, D17,
D20, D23, D24, D28, E13, E14, E24, E31, F3, F7,
F15, F18, F22, F24, F27, G8, G16, G19, G23, H5,
H12, H13, H15, H16, H18, H19, H21, H22, J2, J7,
J10, J14, J15, J16, J17, J18, J19, J20, J21, J22,
J29, J31, J32, K14, K15, K16, K17, K18, K19, K20,
K21, K22, K24, L1, L4, L9, L12, L15, L16, L17, L18,
L19, L20, L21, L22, L23, M12, M13, M18, M20, M21,
M23, N4, N8, N11, N13, N15, N17, N19, N21, N23,
P2, P6, P12, P14, P16, P18, P20, P22, P23, R10,
R13, R15, R17, R19, R21, R23, T12, T14, T16, T18,
T20, T22, T23, U4, U8, U13, U15, U17, U19, U21,
U23, V2, V6, V12, V14, V16, V18, V20, V22, V23,
W10, W13, W15, W17, W19, W21, W23, Y12, Y14,
Y16, Y18, Y20, Y22, Y23, AA4, AA8, AA12, AA13,
AA15, AA17, AA19, AA21, AA22, AA23, AB2, AB6,
AB12, AB23, AB29, AB32, AC10, AC23, AC24,
AC25, AC28, AC29, AC30, AC31, AC32, AD16,
AD17, AD19, AD21, AD25, AD26, AD27, AD31,
AE8, AE12, AF2, AF4, AF6, AF16, AF21, AF25,
AG10, AG14, AG18, AG24, AG28, AH23, AJ4, AJ8,
AJ12, AJ21, AJ30, AJ32, AK2, AK10, AK16, AK32,
AL6, AL14, AL18, AL19, AL20, AL22, AL24, AL25,
AL26, AL31, AL32, AM19, AM21, AM23, AM25,
AM30, AM31, AM32
—
—
—
SCOREGND
K28, K29, K30, L28, L31, M28, M30, N32, P28, P30,
R28, T29, U32, V30, W28, W31, Y28, Y29, AA29,
AA30, AA32, AB28
Ground for
SerDes
receiver
—
—
XGND
N24, N26, P25, R27, T24, U26, V25, W27, Y24,
AA26, AB25, AC27
Ground for
SerDes
transmitter
—
—
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
117
Package and Pinout
Table 79. MPC8567E Pinout Listing (continued)
Power
Supply
Notes
Power for
PCI and
other
standards
(3.3V)
OVDD
—
Power for
GPIO
LVDD
—
AF8, AJ10, AK6, AK8
Power for
QE UCC1
and UCC2
Ethernet
Interface
(2,5V,3.3V)
TVDD
—
GVDD
B2, B5, B8, B11, B17, B20, C14, D4, D7, D10, D16,
D19, D22, E12, E15, F2, F6, F21, G9, G17, G18,
H4, H11, H14, H20, J3, J6, J9, K13, L2, L5, L8, L11
Power for
DDR1 and
DDR2
DRAM I/O
voltage
(1.8V,2.5V)
GVDD
—
BVDD
B28, D27, D31, F25, F28, H27, H29, H31, K25, K27
Power for
Local Bus
(1.8V, 2.5V,
3.3V)
BVDD
—
VDD
M14, M15, M19, M22, N12, N14, N16, N18, N20,
N22, P13, P15, P17, P19, P21, R12, R14, R16, R18,
R20, R22, T13, T15, T17, T19, T21, U12, U14, U16,
U18, U20, U22, V13, V15, V17, V19, V21, W12,
W14, W16, W18, W20, W22, Y13, Y15, Y17, Y19,
Y21, AA14, AA16, AA18, AA20
Power for
Core (1.1)
VDD
—
SCOREVDD
K31, L32, M29, N28, N31, P29, T28, T30, U31, V29, Core Power SCOREVDD
W32, Y30, AA31
for SerDes
transceivers
(1.1V)
XVDD
N25, N27, P24, R26, T25, U27, V24, W26, Y25,
AA27, AB24, AC26
AVDD_LBIU
Signal
Package Pin Number
Pin Type
OVDD
N2, N6, N10, P4, P8, T10, U2, U6, V4, V8, Y10,
AA2, AA6, AB4, AB8, AC19, AC21, AD10, AD23,
AE2, AE6, AE27, AE31, AG4, AG19, AG23, AG25,
AH21, AH28, AH30, AH32, AJ2, AK4, AK25, AK31,
AL27
LVDD
AC12, AC16, AF12, AF14, AG16, AK12, AK14,
AL16
TVDD
—
Pad Power
for SerDes
transceivers
(1.1V)
XVDD
—
A25
Power for
local bus
PLL
(1.1V)
—
26
AVDD_PCI
AM22
Power for
PCI PLL
(1.1V)
—
26
AVDD_CE
AM18
Power for
QE PLL
(1.1V)
—
26
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
118
Freescale Semiconductor
Package and Pinout
Table 79. MPC8567E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
AVDD_CORE
AM24
Power for
e500 PLL
(1.1V)
—
26
AVDD_PLAT
AM20
Power for
CCB PLL
(1.1V)
—
26
AVDD_SRDS
R29
Power for
SRDSPLL
(1.1V)
—
26
AGND_SRDS
R31
Ground for
SRDSPLL
—
SENSEVDD
M17
O
VDD
13
SENSEVSS
M16
—
—
13
Analog Signals
MVREF
A24
I
Reference
voltage
signal for
DDR
MVREF
—
SD_IMP_CAL_RX
K32
I
200Ω to GND
—
SD_IMP_CAL_TX
AA28
I
100Ω to GND
—
SD_PLL_TPA
R30
O
—
24
Reserved Pins
Reserved
AE17, AH12, AL13, AL11, AK13, AH13, AG11,
AD13, AM13, AG12, AC13, AL12, AJ16, AM15,
AK15
N/A
N/A
42
Reserved
AF17, AM14, AE14, AM11, AK11, AF11, AJ14,
AJ13, AD12, AE13, AG13, AB13, AE11, AH11,
AM12, AJ11, AB15, AB16, AE16, AG15, AF15,
AH14
N/A
N/A
45
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
119
Package and Pinout
Table 79. MPC8567E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Notes:
1. All multiplexed signals are listed only once and do not re-occur. For example, LCS5/DMA_REQ2 is listed only once in the local
bus controller section, and is not mentioned in the DMA section even though the pin also functions as DMA_REQ2.
2. Recommend a weak pull-up resistor (2–10 KΩ) be placed on this pin to OVDD.
4. This pin is an open drain signal.
5. This pin is a reset configuration pin. It has a weak internal pull-up P-FET which is enabled only when the processor is in the
reset state. This pull-up is designed such that it can be overpowered by an external 4.7-kΩ pull-down resistor. However, if the
signal is intended to be high after reset, and if there is any device on the net which might pull down the value of the net at reset,
then a pullup or active driver is needed.
6. Treat these pins as no connects (NC) unless using debug address functionality.
7. The value of LA[28:31] during reset sets the CCB clock to SYSCLK PLL ratio. These pins require 4.7-kΩ pull-up or pull-down
resistors. See Section 23.2, “CCB/SYSCLK PLL Ratio.”
8. The value of LALE, LGPL2 and LBCTL at reset set the e500 core clock to CCB Clock PLL ratio. These pins require 4.7-kΩ
pull-up or pull-down resistors. See the Section 23.3, “e500 Core PLL Ratio.”
9. Functionally, this pin is an output, but structurally it is an I/O because it either samples configuration input during reset or
because it has other manufacturing test functions. This pin will therefore be described as an I/O for boundary scan.
11.This output is actively driven during reset rather than being three-stated during reset.
12.These JTAG pins have weak internal pull-up P-FETs that are always enabled.
13.These pins are connected to the VDD/GND planes internally and may be used by the core power supply to improve tracking
and regulation.
14.Internal thermally sensitive resistor. These two pins are not ESD protected.
17.. The value of PA[0:4] during reset set the QE clock to SYSCLK PLL ratio. These pins require 4.7-kΩ pull-up or pull-down
resistors. See Section 23.4, “QE/SYSCLK PLL Ratio.”
19. If this pin is connected to a device that pulls down during reset, an external pull-up is required to drive this pin to a safe state
during reset.
20. This pin is only an output in FIFO mode when used as Rx Flow Control.
24. Do not connect.
25.These are test signals for factory use only and must be pulled up (100 - 1 K) to OVDD for normal machine operation.
26. Independent supplies derived from board VDD.
27. Recommend a pull-up resistor (~1 K.) be placed on this pin to OVDD.
29. The following pins must NOT be pulled down during power-on reset: HRESET_REQ, TRIG_OUT/READY/QUIESCE,
MSRCID[2:4], ASLEEP, PA[5].
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Clocking
Table 79. MPC8567E Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
30. This pin requires an external 4.7-kΩ pull-down resistor to prevent PHY from seeing a valid Transmit Enable before it is actively
driven.
33. PF[21:22] are multiplexed as cfg_dram_type[0:1]. THEY MUST BE VALID AT POWER-UP, EVEN BEFORE HRESET
ASSERTION.
35. When a PCI block is disabled, either the POR config pin that selects between internal and external arbiter must be pulled down
to select external arbiter if there is any other PCI device connected on the PCI bus, or leave the PCIn_AD pins as "No Connect"
or terminated through 2–10 KΩ pull-up resistors with the default of internal arbiter if the PCIn_AD pins are not connected to any
other PCI device. The PCI block will drive the PCIn_AD pins if it is configured to be the PCI arbiter—through POR config
pins—irrespective of whether it is disabled via the DEVDISR register or not. It may cause contention if there is any other PCI
device connected on the bus.
36.MDIC[0] is grounded through an 18.2-Ω precision 1% resistor and MDIC[1] is connected to GVDD through an 18.2-Ω precision
1% resistor. These pins are used for automatic calibration of the DDR IOs.
39. If PCI is configured as PCI asynchronous mode, a valid clock must be provided on pin PCI_CLK . Otherwise the processor
will not boot up.
41.These pins should be tied to SCOREGND through a 300 ohm resistor if the high speed interface is used.
43. It is highly recommended that unused SD_RX/SD_RX lanes should be powered down with lane_x_pd. Otherwise the receivers
will burn extra power and the internal circuitry may develop long term reliability problems.
44. See Section 25.9, “Guidelines for High-Speed Interface Termination.”
46. Must be high during HRESET. It is recommended to leave the pin open during HRESET since it has internal pullup resistor.
47. Must be pulled down with 4.7-kΩ resistor.
48. This pin must be left no connect.
49. A pull-up on LGPL4 is required for systems that boot from local bus (GPCM)-controlled NOR Flash.
23 Clocking
This section describes the PLL configuration of the MPC8568E. Note that the platform clock is identical
to the core complex bus (CCB) clock.
23.1
Clock Ranges
Table 80 provides the clocking specifications for the processor cores and Table 81 provides the clocking
specifications for the DDR/DDR2 memory bus. Table 82 provides the clocking specifications for the local
bus.
Table 80. Processor Core Clocking Specifications
Maximum Processor Core Frequency
Characteristic
e500 core processor frequency
800 MHz
1000 MHz
1333 MHz
Min
Max
Min
Max
Min
Max
533
800
533
1000
533
1333
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies. Refer to Section 23.2, “CCB/SYSCLK PLL Ratio,” and Section 23.3, “e500 Core PLL Ratio,” for ratio settings.
2.)The minimum e500 core frequency is based on the minimum platform frequency of 333 MHz.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Clocking
Table 81. DDR/DDR2 Memory Bus Clocking Specifications
Maximum Processor Core Frequency
Characteristic
800, 1000, 1333 MHz
DDR/DDR2 Memory bus clock frequency
Min
Max
166
266
Unit
Notes
MHz
1, 2
Notes:
1. Caution: The CCB clock to SYSCLK ratio and e500 core to CCB clock ratio settings must be chosen such that the
resulting SYSCLK frequency, e500 core frequency, and CCB clock frequency do not exceed their respective maximum
or minimum operating frequencies.
2. The memory bus clock speed is half the DDR/DDR2 data rate, hence, half the platform clock frequency.
Table 82. Local Bus Clocking Specifications
Maximum Processor Core Frequency
Characteristic
800, 1000, 1333 MHz
Local bus clock speed (for Local Bus Controller)
Min
Max
25
166
Unit
Notes
MHz
1
Notes:
1. The Local bus clock speed on LCLK[0:2] is determined by CCB clock divided by the Local Bus PLL ratio programmed
in LCCR[CLKDIV]. See the reference manual for more information on this.
23.2
CCB/SYSCLK PLL Ratio
The CCB clock is the clock that drives the e500 core complex bus (CCB) and is also called the platform
clock. The frequency of the CCB is set using the following reset signals, as shown in Table 83:
• SYSCLK input signal
• Binary value on LA[28:31] at power up
Note that there is no default for this PLL ratio; these signals must be pulled to the desired values. Also note
that the DDR data rate is the determining factor in selecting the CCB bus frequency, since the CCB
frequency must equal the DDR data rate.
For specifications on the PCI_CLK, refer to the PCI 2.2 Specification.
Table 83. CCB Clock Ratio
Binary Value of
LA[28:31] Signals
CCB:SYSCLK Ratio
Binary Value of
LA[28:31] Signals
CCB:SYSCLK Ratio
0000
16:1
1000
8:1
0001
Reserved
1001
9:1
0010
2:1
1010
10:1
0011
3:1
1011
Reserved
0100
4:1
1100
12:1
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Freescale Semiconductor
Clocking
Table 83. CCB Clock Ratio (continued)
23.3
Binary Value of
LA[28:31] Signals
CCB:SYSCLK Ratio
Binary Value of
LA[28:31] Signals
CCB:SYSCLK Ratio
0101
5:1
1101
20:1
0110
6:1
1110
Reserved
0111
Reserved
1111
Reserved
e500 Core PLL Ratio
Table 84 describes the clock ratio between the e500 core complex bus (CCB)platform and the e500 core
clock. This ratio is determined by the binary value of LBCTL, LALE and LGPL2 at power up, as shown
in Table 84.
Table 84. e500 Core to CCB Clock Ratio
23.4
Binary Value of
LBCTL, LALE,
LGPL2 Signals
e500 core:CCB Clock Ratio
Binary Value of
LBCTL, LALE,
LGPL2 Signals
e500 core:CCB Clock Ratio
000
4:1
100
2:1
001
9:2
101
5:2
010
Reserved
110
3:1
011
3:2
111
7:2
QE/SYSCLK PLL Ratio
The QE clock is defined by a multiplier and divisor applied to the SYSCLK input signal, as shown in the
following equation:
QE clock = SYSCLK * cfg_ce_pll[0:4].
The multiplier and divisor is determined by the binary value of PA[0:4] at power up.
Table 85. QE Clock Multiplier cfg_ce_pll[0:4]
Binary Value of
PA[0:4] Signals
cfg_ce_pll[0:4]
Binary Value of
PA[0:4] Signals
cfg_ce_pll[0:4]
0_0000
16
1_0000
16
0_0001
Reserved
1_0001
17
0_0010
2
1_0010
18
0_0011
3
1_0011
19
0_0100
4
1_0100
20
0_0101
5
1_0101
21
0_0110
6
1_0110
22
0_0111
7
1_0111
23
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
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Clocking
Table 85. QE Clock Multiplier cfg_ce_pll[0:4] (continued)
23.5
Binary Value of
PA[0:4] Signals
cfg_ce_pll[0:4]
Binary Value of
PA[0:4] Signals
cfg_ce_pll[0:4]
0_1000
8
1_1000
24
0_1001
9
1_1001
25
0_1010
10
1_1010
26
0_1011
11
1_1011
27
0_1100
12
1_1100
28
0_1101
13
1_1101
29
0_1110
14
1_1110
30
0_1111
15
1_1111
31
Frequency Options
23.5.1
SYSCLK to Platform Frequency Options
Table 86 shows the expected frequency values for the platform frequency when using a CCB clock to
SYSCLK ratio in comparison to the memory bus clock speed.
Table 86. Frequency Options of SYSCLK with Respect to Memory Bus Speeds
CCB clock to
SYSCLK Ratio
SYSCLK (MHz)
16.66
25
33.33
41.66
66.66
83
100
111
133.33
166
Platform /CCB clock Frequency (MHz)
2
333
3
4
333
400
500
5
333
415
6
400
500
8
333
9
375
10
333
417
12
400
500
16
20
400
333
333
400
445
533
500
533
533
500
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Freescale Semiconductor
Thermal
23.5.2
Minimum Platform Frequency Requirements for PCI Express, SRIO,
PCI interfaces Operation
For proper PCI Express operation, the CCB clock frequency must be greater than:
527 MHz × ( PCI Express link width )
---------------------------------------------------------------------------------------------8
Note that the “PCI Express link width” in the above equation refers to the negotiated link width as the
result of PCI Express link training, which may or may not be the same as the link width POR selection.
For proper Serial RapidIO operation, the CCB clock frequency must be greater than:
2 × ( 0.80 ) × ( serial RapidIO interface frequency ) × ( serial RapidIO link width )
----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------64
For proper PCI operation in synchronous mode, the minimum CCB:SYSCLK ratio is 6:1.
24 Thermal
This section describes the thermal specifications of the MPC8568E.
24.1
Thermal Characteristics
Table 87 provides the package thermal characteristics.
Table 87. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient Natural Convection on single layer board (1s)
RθJA
21
°C/W
1, 2
Junction-to-ambient Natural Convection on four layer board (2s2p)
RθJA
17
°C/W
1, 2
Junction-to-ambient (@200 ft/min or 1 m/s) on single layer board (1s)
RθJA
16
•C/W
C/W
1, 2
Junction-to-ambient (@200 ft/min or 1 m/s) on four layer board (2s2p)
RθJA
13
•C/W
C/W
1, 2
Junction-to-board
RθJB
9
•C/W
C/W
3
Junction-to-case
RθJC
<0.1
•C/W
C/W
4
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883, Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1 °C/W.
24.2
Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
125
Thermal
system-level design—the heat sink, airflow, and thermal interface material. The recommended attachment
method to the heat sink is illustrated in Figure 69. The heat sink should be attached to the printed-circuit
board with the spring force centered over the die. This spring force should not exceed 10 pounds force.
FC-PBGA Package
Heat Sink
Heat Sink
Clip
Thermal Interface Material
Die
Printed-Circuit Board
Figure 69. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the device. There
are several commercially-available heat sinks from the following vendors:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
603-224-9988
Advanced Thermal Solutions
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
781-769-2800
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
408-749-7601
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
818-842-7277
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
408-436-8770
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha Novatech, IERC, and
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
126
Freescale Semiconductor
Thermal
Millennium Electronics offer different heat sink-to-ambient thermal resistances, that will allow the
MPC8568E to function in various environments.
24.2.1
Recommended Thermal Model
For system thermal modeling, the MPC8568E thermal model without a lid is shown in Figure 70. The
substrate is modeled as a block 33x33x1.18 mm with an in-plane conductivity of 24 W/mK and a
through-plane conductivity of 0.92 W/mK. The solder balls and air are modeled as a single block
33x33x0.58 mm with an in-plane conductivity of 0.034 W/mK and a through plane conductivity of 12.2
W/mK. The die is modeled as 8.2x12.1 mm with a thickness of 0.75 mm. The bump/underfill layer is
modeled as a collapsed thermal resistance between the die and substrate assuming a conductivity of 5.3
W/m•K in the thickness dimension of 0.07 mm. The die is centered on the substrate. The thermal model
uses approximate dimensions to reduce grid. See the case outline for actual dimensions.
Conductivity
Value
Unit
Die
(8.2 × 12.1 × 0.75mm)
Silicon
Bump/Underfill
die
Temperature
dependent
substrate
W/(m × K)
solder/air
Side View of Model (Not to scale)
Bump/Underfill
(8.2 × 12.1 × 0.75 mm)
Collapsed Resistance
kz
Z
5.3
x
Substrate
(33 × 33× 1.18 mm)
Substrate
kx
24
ky
24
kz
0.92
Heat Source
Soldera and Air
(33 × 33 × 0.58 mm)
y
kx
0.034
ky
0.034
kz
12.2
Top View of Model (Not to Scale)
Figure 70. MPC8568E Thermal Model
24.2.2
Internal Package Conduction Resistance
For the packaging technology, shown in Table 87, the intrinsic internal conduction thermal resistance paths
are as follows:
• The die junction-to-case thermal resistance
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
127
Thermal
•
The die junction-to-board thermal resistance
Figure 71 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Radiation
External Resistance
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Internal Resistance
Printed-Circuit Board
External Resistance
Radiation
Convection
(Note the internal versus external package resistance)
Figure 71. Package with Heat Sink Mounted to a Printed-Circuit Board
The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is
conducted through the silicon, then through the heat sink attach material (or thermal interface material),
and finally to the heat sink. The junction-to-case thermal resistance is low enough that the heat sink attach
material and heat sink thermal resistance are the dominant terms.
24.2.3
Thermal Interface Materials
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 72 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a
thermal resistance approximately six times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 69). Therefore, the synthetic grease offers the best thermal performance, especially at the low
interface pressure.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
128
Freescale Semiconductor
Thermal
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Specific Thermal Resistance (K-in.2/W)
2
1.5
1
0.5
0
0
10
20
30
40
50
60
70
80
Contact Pressure (psi)
Figure 72. Thermal Performance of Select Thermal Interface Materials
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
781-935-4850
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
800-248-2481
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
888-642-7674
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
800-347-4572
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
129
System Design Information
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
888-246-9050
25 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8568E.
25.1
System Clocking
This device includes six PLLs, as follows:
1. The platform PLL generates the platform clock from the externally supplied SYSCLK input. The
frequency ratio between the platform and SYSCLK is selected using the platform PLL ratio
configuration bits as described in Section 23.2, “CCB/SYSCLK PLL Ratio.”
2. The e500 core PLL generates the core clock using the platform clock as the input. The frequency
ratio between the e500 core clock and the platform clock is selected using the e500 PLL ratio
configuration bits as described in Section 23.3, “e500 Core PLL Ratio.”
3. The PCI PLL generates the clocking for the PCI bus
4. The local bus PLL generates the clock for the local bus.
5. There is a PLL for the SerDes block.
6. QE PLL generates the QE clock from the externally supplied SYSCLK.
25.2
25.2.1
Power Supply Design and Sequencing
PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins
(AVDD_PLAT, AVDD_CORE, AVDD_PCI, AVDD_LBIU, and AVDD_SRDS, AVDD_CE respectively). The AVDD
level should always be equivalent to VDD, and preferably these voltages will be derived directly from VDD
through a low frequency filter scheme such as the following.
There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to
provide independent filter circuits per PLL power supply as illustrated in Figure 73, one to each of the
AVDD type pins. By providing independent filters to each PLL the opportunity to cause noise injection
from one PLL to the other is reduced.
This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz
range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL).
Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook
of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a
single large value capacitor.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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System Design Information
Each circuit should be placed as close as possible to the specific AVDD type pin being supplied to minimize
noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD
type pin, which is on the periphery of 1023FC-PBGA the footprint, without the inductance of vias.
Figure 73 shows the PLL power supply filter circuits for all PLLs except SerDes PLL.
10 Ω
V DD
AVDD
2.2 μF
2.2 μF
GND
Low ESL Surface Mount Capacitors
Figure 73. MPC8568E PLL Power Supply Filter Circuit
The AVDD_SRDS signal provides power for the analog portions of the SerDes PLL. To ensure stability of
the internal clock, the power supplied to the PLL is filtered using a circuit similar to the one shown in
following figure. For maximum effectiveness, the filter circuit is placed as closely as possible to the
AVDD_SRDS and AGND_SRDS ball to ensure it filters out as much noise as possible. The 0.003-µF
capacitor is closest to the ball, followed by the 2.2-µF capacitors, and finally the 1 ohm resistor to the board
supply plane. Use ceramic chip capacitors with the highest possible self-resonant frequency. All traces
should be kept short, wide and direct.
SCOEVDD
1.0 Ω
AVDD_SRDS
2.2
μF1
2.2 μF1
0.003 μF
AGND_SRDS
1. An 0805 sized capacitor is recommended for system initial bring-up.
Figure 74. SerDes PLL Power Supply Filter
Note the following:
• AVDD_SRDS should be a filtered version of SCOREVDD.
• The transmitter output signals on the SerDes interface are fed from the XVDD power plan.
• Power: XVDD consumes less than 300mW. SCOREVDD + AVDD_SRDS consumes less than
750mW.
25.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
MPC8568E system, and the device itself requires a clean, tightly regulated source of power. Therefore, it
is recommended that the system designer place at least one decoupling capacitor at each V DD, TVDD,
BVDD, OVDD, GVDD, and LVDD pin of the device. These decoupling capacitors should receive their
power from separate VDD,TVDD, BVDD, OVDD, GVDD, and LVDD and GND power planes in the PCB,
utilizing short traces to minimize inductance. Capacitors may be placed directly under the device using a
standard escape pattern. Others may surround the part.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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System Design Information
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, TVDD, BVDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the
smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating
to ensure the quick response time necessary. They should also be connected to the power and ground
planes through two vias to minimize inductance. Suggested bulk capacitors—100–330 µF (AVX TPS
tantalum or Sanyo OSCON).
25.4
SerDes Block Power Supply Decoupling Recommendations
The SerDes block requires a clean, tightly regulated source of power (SCOREVDD and XVDD) to ensure
low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is
outlined below.
Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections
from all capacitors to power and ground should be done with multiple vias to further reduce inductance.
• First, the board should have at least 10 x 10-nF SMT ceramic chip capacitors as close as possible
to the supply balls of the device. Where the board has blind vias, these capacitors should be placed
directly below the chip supply and ground connections. Where the board does not have blind vias,
these capacitors should be placed in a ring around the device as close to the supply and ground
connections as possible.
• Second, there should be a 1-µF ceramic chip capacitor on each side of the device. This should be
done for all SerDes supplies.
• Third, between the device and any SerDes voltage regulator there should be a 10-µF, low
equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-µF, low ESR SMT
tantalum chip capacitor. This should be done for all SerDes supplies.
25.5
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. All unused active low inputs should be tied to VDD, TVDD, BVDD, OVDD, GVDD and LVDD as
required. All unused active high inputs should be connected to GND. All NC (no-connect) signals must
remain unconnected. Power and ground connections must be made to all external VDD, LVDD, TVDD,
BVDD, OVDD, GVDD and GND pins of the device.
25.6
Pull-Up and Pull-Down Resistor Requirements
The MPC8568E requires weak pull-up resistors (2–10 kΩ is recommended) on open drain type pins
including I2C pins and MPIC interrupt pins.
Correct operation of the JTAG interface requires configuration of a group of system control pins as
demonstrated in Figure 75. Care must be taken to ensure that these pins are maintained at a valid deasserted
state under normal operating conditions as most have asynchronous behavior and spurious assertion will
give unpredictable results.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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System Design Information
Refer to the PCI 2.2 specification for all pull-ups required for PCI.
The following pins must NOT be pulled down during power-on reset: HRESET_REQ,
TRIG_OUT/READY/QUIESCE, MSRCID[2:4], ASLEEP, PA[5].
Three test pins also require pull-up resistors (100 Ω–1 KΩ). These pins are L1_TSTCLK, L2_TSTCLK,
and LSSD_MODE. These signals are for factory use only and must be pulled up to OVDD for normal
machine operation.
Refer to the PCI 2.2 specification for all pull-ups required for PCI.
25.7
Configuration Pin Muxing
The MPC8568E provides the user with power-on configuration options which can be set through the use
of external pull-up or pull-down resistors of 4.7 kΩ on certain output pins. These pins are generally used
as output only pins in normal operation.
While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins
while HRESET is asserted, is latched when HRESET deasserts, at which time the input receiver is disabled
and the I/O circuit takes on its normal function. Most of these sampled configuration pins are equipped
with an on-chip pull-up resistors of approximately 20 kΩ. This value should permit the 4.7-kΩ resistor to
pull the configuration pin to a valid logic low level. The pull-up resistor is enabled only during HRESET
(and for platform /system clocks after HRESET deassertion to ensure capture of the reset value). When the
HRESET is negated, the pull-up resistor is also disabled, thus allowing functional operation of the pin as
an output with minimal signal quality or delay disruption. The default value for all configuration bits
treated this way has been encoded such that a high voltage level puts the device into the default state and
external resistors are needed only when non-default settings are required by the user.
Careful board layout with stubless connections to these pull-down resistors coupled with the large value
of the pull-down resistor should minimize the disruption of signal quality or speed for output pins thus
configured.
The platform PLL ratio and e500 PLL ratio configuration pins are not equipped with these default pull-up
devices.
25.8
JTAG Configuration Signals
Boundary scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the
IEEE 1149.1 specification, but is provided on all processors that implement Power Architecture. The
device requires TRST to be asserted during reset conditions to ensure the JTAG boundary logic does not
interfere with normal chip operation. While it is possible to force the TAP controller to the reset state using
only the TCK and TMS signals, generally systems will assert TRST during power-on reset. Because the
JTAG interface is also used for accessing the common on-chip processor (COP) function, simply tying
TRST to HRESET is not practical.
The COP function of these processors allows a remote computer system (typically, a PC with dedicated
hardware and debugging software) to access and control the internal operations of the processor. The COP
interface connects primarily through the JTAG port of the processor, with some additional status
monitoring signals. The COP port requires the ability to independently assert HRESET or TRST in order
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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System Design Information
to fully control the processor. If the target system has independent reset sources, such as voltage monitors,
watchdog timers, power supply failures, or push-button switches, then the COP reset signals must be
merged into these signals with logic.
The arrangement shown in Figure 75 allows the COP to independently assert HRESET or TRST, while
ensuring that the target can drive HRESET as well. If the JTAG interface and COP header will not be used,
TRST should be tied to HRESET so that it is asserted when the system reset signal (HRESET) is asserted.
The COP header shown in Figure 75 adds many benefits—breakpoints, watchpoints, register and memory
examination/modification, and other standard debugger features are possible through this interface—and
can be as inexpensive as an unpopulated footprint for a header to be added when needed.
The COP interface has a standard header for connection to the target system, based on the 0.025"
square-post, 0.100" centered header assembly (often called a Berg header).
There is no standardized way to number the COP header shown in Figure 75; consequently, many different
pin numbers have been observed from emulator vendors. Some are numbered top-to-bottom then
left-to-right, while others use left-to-right then top-to-bottom, while still others number the pins counter
clockwise from pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended in
Figure 75 is common to all known emulators.
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System Design Information
From Target
Board Sources
(if any)
SRESET0
3
SRESET
SRESET1
HRESET
HRESET
13
11
10 kΩ
HRESET
OVDD
SRESET
OVDD
10 kΩ
OVDD
10 kΩ
OVDD
1
2
3
4
5
6
7
8
9
10
11
12
4
6
10 kΩ
TRST
VDD_SENSE
10 Ω
10 kΩ
51
15
CHKSTP_OUT
TRST
OVDD
OVDD
CHKSTP_OUT
10 kΩ
OVDD
14 2
KEY
13 No pin
16
COP Connector
Physical Pin Out
OVDD
CHKSTP_IN
COP Header
15
10 kΩ
CHKSTP_IN
8
TMS
9
1
3
TMS
TDO
TDI
TDO
TDI
TCK
7
2
TCK
NC
10
NC
12
NC
16
Notes:
1. RUN/STOP, normally found on pin 5 of the COP header, is not implemented.
Connect pin 5 of the COP header to OVDD with a 10-kΩ pull-up resistor.
2. Key location; pin 14 is not physically present on the COP header.
3. Use a NOR gate with sufficient drive strength to drive two inputs.
Figure 75. JTAG Interface Connection
25.9
25.9.1
Guidelines for High-Speed Interface Termination
Unused output
Any of the outputs that are unused should be left unconnected. These signals are:
• SD_TX[7:0]
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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135
Ordering Information
•
SD_TX[7:0]
25.9.2
25.9.2.1
Unused input
SerDes block power not supplied
If the high speed interface is not used at all, then SCOREVDD/XVDD/AVDD_SRDS can be tied to GND,
all receiver inputs should be tied to the GND as well. This includes:
• SD_RX[7:0]
• SD_RX[7:0]
• SD_REF_CLK
• SD_REF_CLK
• SD_RX_CLK
• SD_RX_FRM_CTL
25.9.2.2
SerDes Interface Partly used
If the high-speed SerDes interface is partly unused, any of the unused receiver pins should be terminated
as follows:
• SD_RX[7:0] = tied to SCOREGND
• SD_RX[7:0] = tied to SCOREGND
• SD_REF_CLK = tied to SCOREGND
• SD_REF_CLK = tied to SCOREGND
NOTE
Power down the unused lane through SERDESCR1[0:7] register
(offset = 0xE_0F08) (This prevents the oscillations and holds the receiver
output in a fixed state.) that maps to SERDES lane 0 to lane 7 accordingly.
During HRESET/POR, the high-speed interface must be in Serial RapidIO mode and/or PCI Express mode
according to the state of the PE[8:10]. Software must disable this mode through DEVDISR[SRIO] or
DEVDISR[PCIE] accordingly during software initialization.
26 Ordering Information
Contact your local Freescale sales office or regional marketing team for order information.
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Ordering Information
26.1
Part Marking
Parts are marked as the example shown in Figure 76.
MPC856Xxxxxxx
ATWLYYWW
MMMMM CCCCC
YWWLAZ
FC-PBGA
Notes:
MPC856Xxxxxxx is the orderable part number
ATWLYYWW is the freescale assembly, year and workweek code
MMMMM is the mask code
CCCC is the contry code for assembly.
YWWLAZ is the trace code for assembly.
Figure 76. Part Marking for FC-PBGA Device
26.2
Part Number Decoder
Figure 77 shows the MPC8568E/MPC8567E number decoder.
Product Code
PPC:
Prototype
KMPC: Sample
MPC: Qualified
MPC 856x E C VT ANG J A
Die revision
QE Speed
G: 400
J: 533
Device Number
8568, 8567
DDR speed
G: 400
J: 533
Security
Blank: No Security
E: With Security
CPU Speed
AN: 800
AQ: 1000
AU: 1333
Temperature
Blank: 0 - 105C
C:
-45(Ta) - 105C
Package
VT: Lead Free
Figure 77. MPC8568E Part Number Decoder
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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Document Revision History
27 Document Revision History
Table 88 provides a revision history for the MPC8568E hardware specification.
Table 88. Document Revision History
Rev
Number
Date
Substantive Change(s)
1
10/2010
In Table 78, “MPC8568E Pinout Listing,” and Table 78, “MPC8568E Pinout Listing,” added footnote
49 to LGPL4.
0
05/2009
Initial public release.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
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