APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB 1. Introduction This application note is a guide for comparing Macronix MX30UF2G28AB (2Gb) and MX30UF4G28AB (4Gb) with Spansion® S34MS02G100 (2Gb) and S34MS04G100 (4Gb) 1.8V, x8 NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Feature Comparison Feature Vcc voltage range Bus Width Operating Temperature Interface ECC Requirement Block Size Page Size Plane Size OTP size Guaranteed Good blocks at shipping Unique ID ID Code ONFI signature Data Retention Package P/N: AN0292 Macronix MX30UF2G28AB (2Gb) MX30UF4G28AB (4Gb) 1.7V ~ 1.95V x8 -40°C ~ 85°C ONFI 1.0 Standard 8b/(512B+28B) 128KB+7KB 2KB+112B 2Gb= 1024Blks/Plane x 2 4Gb= 2048Blks/Plane x 2 30 pages Spansion S34MS02G100 (2Gb) S34MS04G100 (4Gb) 1.7V ~ 1.95V x8 -40°C ~ 85°C ONFI 1.0 Standard 1b/(512B+16B) 128KB+4KB 2KB+64B 2Gb= 1024Blks/Plane x 2 4Gb= 2048Blks/Plane x 2 64 pages Block 0 Block 0 and 1 ONFI standard 2Gb=C2h/AAh/90h/15h/07h 4Gb=C2h/ACh/90h/15h/57h 4Fh/4Eh/46h/49h 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) 2Gb=01h/AAh/90h/15h/44h 4Gb=01h/ACh/90h/15h/54h 4Fh/4Eh/46h/49h 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) 1 Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB 3. Performance While Table 3-1 and Table 3-2 show Macronix has improved Read and Erase performance, it results in a higher average current (Table 4-1). Table 3-1: Read Function Performance (Read Latency time and Sequential Read) Macronix Spansion Read function MX30UF2G28AB S34MS02G100 MX30UF4G28AB S34MS04G100 Read Latency time (tR) 25us (max.) 25us (max.) Sequential Read time (tRC) 25ns (min.) 45ns (min.) Table 3-2: Write Function Performance (Program and Erase) Macronix Write Function MX30UF2G28AB MX30UF4G28AB Page Program time (tPROG) 250us (typ.)/700us (max.) Block Erase time (tERASE) 3.5ms (typ.)/10ms (max.) NOP 4 (max.) 1 Write/Erase Cycles* (Endurance) 100,000 Spansion S34MS02G100 S34MS04G100 250us (typ.)/700us (max.) 3.5ms (typ.)/10ms (max.) 4 (max.) 100,000 Note: 100K Endurance cycle with ECC protection. P/N: AN0292 2 Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB 4. DC Characteristics Table 4-1: Read / Write Current DC Characteristic Sequential Read Current (ICC1) Program Current (ICC2) Erase Current (ICC3) Standby Current – CMOS Macronix MX30UF2G28AB MX30UF4G28AB 20mA (typ.)/30mA (max.) 20mA (typ.)/30mA (max.) 20mA (typ.)/30mA (max.) 10uA (typ.)/50uA (max.) Spansion S34MS02G100 S34MS04G100 10mA (typ.)/20mA (max.) N/A (typ.)/20mA (max.) N/A (typ.)/20mA (max.) 10uA (typ.)/50uA (max.) Table 4-2: Input / Output Voltage Macronix Spansion MX30UF2G28AB S34MS02G100 MX30UF4G28AB S34MS04G100 Input Low Voltage (VIL) -0.3V (min.) / 0.2VCC (max.) -0.3V (min.) / 0.2Vcc (max.) Input High Voltage (VIH) 0.8VCC (min.) / VCC+0.3V (max.) 0.8Vcc (min.) / Vcc+0.3V (max.) Output Low Voltage (VOL) 0.1V @ IOL = 2.1mA (max.) 0.1V @ IOL = 100uA (max.) Output High Voltage (VOH) VCC-0.1V @ IOH= -400uA (min.) VCC-0.1V @ IOH= -100uA (min.) DC Characteristic P/N: AN0292 3 Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB 5. Package Pins Package physical dimensions are similar to each other. For detailed information, please refer to the individual datasheets. The Spansion NAND can be compared by the Macronix NAND without pin conflicts. The devices only have one noticeable difference; the addition of the PT pin to enable the Macronix Block Protection feature (48-TSOP pin 38 and 63-VFBGA pin G5). This same pin/ball is not connected on the Spansion NAND, and can be left floating if the feature is not going to be used, as the Macronix flash has a weak internal pull-down on the PT pin. Figure 5-1: 48-TSOP (12x20mm) Package Pin Comparison NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX30UF2G28AB-TI MX30UF4G28AB-TI 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC IO7 IO6 IO5 IO4 NC VCC*1 PT VCC VSS NC VCC*1 NC IO3 IO2 IO1 IO0 NC NC NC VSS*1 NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 SM34S02G100TFI00 SM34S04G100TFI00 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC I/O7 I/O6 I/O5 I/O4 NC VCC*1 NC VCC VSS NC VCC*1 NC I/O3 I/O2 I/O1 IO0 NC NC NC VSS*1 Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-1: 48-TSOP Package Pin Differences Brand Part Name Pin 38 P/N: AN0292 Macronix Spansion MX30UF2G28AB-TI and MX30UF4G28AB-TI S34MS02G100TFI00 and S34MS04G100TFI00 PT (has weak internal pullpull-down) (Nott Connected ed)) NC (No Connected 4 Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB Figure 5-2: 63-VFBGA (9x11mm) Package Ball Comparison MX30UF2G28AB-XKI and MX30UF4G28AB-XKI 1 2 A NC NC B NC 3 4 5 6 7 8 9 10 NC NC NC NC S34MS02G100BHI00 and S34MS04G100BHI00 1 2 A NC NC B NC 3 4 5 6 7 8 C WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# D VCC *1 RE# CLE NC NC NC D VCC *1 RE# CLE NC NC NC E NC NC NC NC NC NC E NC NC NC NC NC NC F NC NC NC NC VSS *1 NC F NC NC NC NC VSS *1 NC G NC VCC *1 PT NC NC NC G NC VCC *1 NC NC NC NC H NC IO0 NC NC NC VCC H NC I/O0 NC NC NC Vcc J NC IO1 NC VCC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 K VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss 9 10 NC NC NC NC L NC NC NC NC L NC NC NC NC M NC NC NC NC M NC NC NC NC Note: 1. These pins might not be connected internally. It is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-2: 63-VFBGA Package Pin Differences Brand Part Name Ball G5 P/N: AN0292 Macronix Spansion MX30UF2G28AB-XKI and MX30UF4G28AB-XKI S34MS02G100BHI00 and S34MS04G100BHI00 PT (has weak internal pullpull-down) (Nott Connected ed)) NC (No Connected 5 Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB 6. Command Set Basic command sets and status checking methods are the same (Table 6-1). Basic Two-Plane commands are also the same (Table 6-2). Spansion also supports some non-ONFI multi-plane and cache commands not supported by Macronix and not shown in Table 6-1. Table 6-1: Command Table Command Macronix MX30UF2G28AB MX30UF4G28AB Spansion S34MS02G100 S34MS04G100 1st Cycle 2nd Cycle 1st Cycle 2nd Cycle Read 00h 30h 00h 30h Random Data Input 85h - 85h - Random Data Output 05h E0h 05h E0h Cache Read Random 00h 31h 00h 31h Cache Read Sequential 31h - 31h - Cache Read End 3Fh - 3Fh - Read ID 90h - 90h - Reset FFh - FFh - Page Program 80h 10h 80h 10h Cache Program 80h 15h 80h 15h Block Erase 60h D0h 60h D0h Read Status 70h - 70h - Read Status Enhanced 78h Read Parameter Page ECh Read Unique ID EDh - Set Feature EFh - Get Feature EEh - P/N: AN0292 78h - 6 ECh - Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB Table 6-2: Two-Plane Command Table Macronix MX30UF2G28AB MX30UF4G28AB Command Spansion S34MS02G100 S34MS04G100 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle 2 Plane Program 80h 11h 80h 10h 80h 11h 80h 10h 2 Plane Cache Program 80h 11h 80h 15h 80h 11h 80h 15h 2 Plane Block Erase 60h D1h 60h D0h 60h D1h 60h D0h 6-1 Status Register When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking” or “Status Output Checking” method may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both device families. Table 6-3 shows that Status Output content provided by the Read Status command (70h) is compatible. Table 6-3: Status Output Status Output Macronix MX30UF2G28AB MX30UF4G28AB Spansion S34MS02G100 S34MS04G100 SR[0] PGM/ERS status: Pass/Fail PGM/ERS status: Pass/Fail SR[1] Cache Program status: Pass/Fail Cache Program status: Pass/Fail SR[2] Not Used Not Used SR[3] Not Used Not Used SR[4] Not Used Not Used SR[5] PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read internal controller: Ready/Busy SR[6] PGM/ERS/Read status: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect P/N: AN0292 7 Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB 7. Read ID Command The ID codes of the Macronix and Spansion NAND flash differ in the manufacturer ID and in the last byte for ECC level required.(Table 7-1). Table 7-1: Manufacturer and Device IDs ID code Value 1st Code 2nd Code IO1, IO0 IO3, IO2 3rd Code IO5, IO4 IO6 4th Code 5th Code IO7 IO1, IO0 IO2 IO7, IO3 IO5, IO4 IO6 IO0, IO1 IO2, IO3 IO4~IO6 IO7 P/N: AN0292 Macronix MX30UF2G28AB MX30UF4G28AB 2Gb=C2h/AAh/90h/15h/07h 4Gb=C2h/ACh/90h/15h/57h Spansion S34MS02G100 S34MS04G100 2Gb=01h/AAh/90h/15h/44h 4Gb=01h/ACh/90h/15h/54h Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (excluding Spare Area) Spare Area Size (per 512 Bytes) Sequential Read Cycle Time (tRC) Block Size (excluding Spare Area) Organization ECC Level Requirement Number of Planes per Chip Enable Plane Size Reserved Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (excluding Spare Area) Spare Area Size (per 512 Bytes) Serial Access Time (tRC) Block Size (excluding Spare Area) Organization Reserved Number of Planes per Chip Enable Plane Size Reserved 8 Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB 8. Power-Up Timing Macronix and Spansion® Power-up sequences are similar, but the timing is slightly different. Although both devices use 1.7V (VCC min.) as the start point to activate the internal initialization sequence, timing parameters used to identify the end of the sequence are different. Table 8-1: Power-Up Timing H/W Timing Characteristic Vcc (min.) to WE# low Vcc (min.) to R/B# high Vcc (min.) to R/B# low Macronix MX30UF2G28AB MX30UF4G28AB 1ms (max.) N/A 10us (max.) Spansion S34MS02G100 S34MS04G100 N/A 5ms (max.) 100us (max.) Vcc(min.) VCC WE# R/B# Figure 8-1: Power-Up Timing P/N: AN0292 9 Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB 9. Summary Macronix MX30UF2G28AB/MX30UF4G28AB and Spansion® S34MS02G100/S34MS04G100 1.8V 2Gb and 4Gb NAND have similar features and pinouts. Basic Read/Program/Erase commands are the same. Overall, device comparing may require minimal or no firmware modifications, except those that may be needed to accommodate differences in ECC requirements. 10. Reference Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix website at http://www.macronix.com Table 10-1: Datasheet Version Datasheet MX30UF2G28AB/MX30UF4G28AB S34MS01G1_04G1 Location Website Website Date Issued Nov. 22, 2013 Aug. 9, 2013 Revision Rev. 0.00 Rev. 06 Note: Macronix datasheet is subject to change without notice. 11. Part Number Cross-Reference Table 11-1: Part Number Cross Reference Density 2Gb 4Gb Macronix Part No. MX30UF2G28AB-TI MX30UF2G28AB-XKI MX30UF4G28AB-TI MX30UF4G28AB-XKI Spansion Part No. S34MS02G100TFI00 S34MS02G100BHI00 S34MS04G100TFI00 S34MS04G100BHI00 Package 48-TSOP 63-VFBGA 48-TSOP 63-VFBGA Dimension 12x20mm 9x11mm 12x20mm 9x11mm 12. Revision History Table 12-1: Revision History Revision 1.0 P/N: AN0292 Description Initial Release 10 Date Mar. 13, 2014 Ver.1, Mar. 13, 2014 APPLICATION NOTE Comparing Spansion® S34MS02G100 and S34MS04G100 with Macronix MX30UF2G28AB and MX30UF4G28AB Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN0292 11 Ver.1, Mar. 13, 2014