APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA 1. Introduction This application note is a guide for migrating to the Macronix MX30LF1G08AA from the Spansion® S34ML01G1 1Gb, 3V, NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Feature Comparison Feature Vcc voltage range Bus Width Operating Temperature Interface Block Size Page Size ECC Requirement OTP size Guarantee Good blocks at shipping Unique ID ID Code ONFI signature Data Retention Package P/N: AN0257 Macronix MX30LF1G08AA 2.7V ~ 3.6V x8 -40°C ~ 85°C Standard NAND Interface 128KB+4KB 2KB+64B 1b/528B - Spansion S34ML01G1 2.7V ~ 3.6V x8 -40°C ~ 85°C ONFI 1.0 Standard 128KB+4KB 2KB+64B 1b/528B 128KB Block 0 Block 0 C2h/F1h/80h/1Dh 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) ONFI standard 01h/F1h/00h/1Dh 4Fh/4Eh/46h/49h 10 Years 48-TSOP (12x20mm) 63-VFBGA (9x11mm) 1 Ver.1, Sep. 11, 2013 APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA 3. Performance Table 3-1 and Table 3-2 show MX30LF1G08AA and S34ML01G1 Read/Write performance. Table 3-1: Read Function Performance (Read Latency time and Sequential Read) Read function Macronix MX30LF1G08AA Spansion S34ML01G1 Read Latency time (tR) 25us (max.) 25us (max.) Sequential Read time (tRC) 30ns (min.) 25ns (min.) Table 3-2: Write Function Performance (Program and Erase) Write Function Macronix MX30LF1G08AA Page Program time (tPROG) 250us (typ.)/700us (max.) Block Erase time (tERASE) 2ms (typ.)/3ms (max.) NOP 4 (max.) 1 Write/Erase Cycles* (Endurance) 100,000 Spansion S34ML01G1 200us (typ.)/700us (max.) 2ms (typ.)/3ms (max.) 4 (max.) 100,000 Note: 100K Endurance cycle with ECC protection. 4. DC Characteristics Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar. Table 4-1: Read / Write Current DC Characteristic Macronix MX30LF1G08AA Spansion S34ML01G1 Sequential Read Current (ICC1) Program Current (ICC2) Erase Current (ICC3) Standby Current – CMOS 15mA (typ.)/30mA (max.) 15mA (typ.)/30mA (max.) 15mA (typ.)/30mA (max.) 10uA (typ.)/50uA (max.) 15mA (typ.)/30mA (max.) 15mA (typ.)/30mA (max.) 15mA (typ.)/30mA (max.) 10uA (typ.)/50uA (max.) Macronix MX30LF1G08AA Spansion S34ML01G1 -0.3V (min.) / 0.2VCC (max.) 0.8VCC (min.) / VCC+0.3V (max.) 0.4V (max.) 2.4V (min.) -0.3V (min.) / 0.2VCC (max.) 0.8VCC (min.) / VCC+0.3V (max.) 0.4V (max.) 2.4V (min.) Table 4-2: Input / Output Voltage DC Characteristic Input Low Voltage (VIL) Input High Voltage (VIH) Output Low Voltage (VOL) Output High Voltage (VOH) P/N: AN0257 2 Ver.1, Sep. 11, 2013 APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA 5. Package Pin/Ball Definition Package physical dimensions are similar to each other. For detailed information, please refer to the individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the Macronix and Spansion devices. However because the corresponding pins of the Macronix MX30LF1G08AA are NC (no connect / not bonded), the S34ML01G1 can be compared by the MX30LF1G08AA without pin conflicts. Only 48-TSOP pin #35 (ball G3 on VFBGA) may need special attention because the pin is designated “DNU” (Do Not Use) on the MX30LF1G08AA-TI. A DNU pin should not be connected to any signal or power trace on the board. Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX30LF1G08AA 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 NC NC NC NC IO7 IO6 IO5 IO4 NC NC NC VCC VSS DNU NC NC IO3 IO2 IO1 IO0 NC NC NC NC Pin35: DNU (Do Not Use) NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 S34ML01G1 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC I/O7 I/O6 I/O5 I/O4 NC VCC*1 NC VCC VSS NC VCC*1 NC I/O3 I/O2 I/O1 IO0 NC NC NC VSS*1 Note: 1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally. Macronix is NC for those pinout. It is fine to connect to VCC or VSS Table 5-1: 48-TSOP Package Pin Definition Brand Part Name Macronix MX30LF1G08AA-TI Spansion S34ML01G1 #48 pin NC VSS (might not be bonded, just for ONFI compatibility) #39 pin NC VCC (might not be bonded, just for ONFI compatibility) #35 pin DNU NC #34 pin NC VCC (might not be bonded, just for ONFI compatibility) #25 pin NC VSS (might not be bonded, just for ONFI compatibility) P/N: AN0257 3 Ver.1, Sep. 11, 2013 APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison MX30LF1G08AA 1 2 A NC NC B NC 3 4 5 6 7 S34ML01G1 8 9 10 NC NC NC NC 1 2 A NC NC B NC 3 4 5 6 7 8 C WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# D NC RE# CLE NC NC NC D VCC *1 RE# CLE NC NC NC E NC NC NC NC NC NC E NC NC NC NC NC NC F NC NC NC NC NC NC F NC NC NC NC VSS *1 NC G DNU NC NC NC NC NC G NC VCC *1 NC NC NC NC H NC IO0 NC NC NC VCC H NC I/O0 NC NC NC Vcc J NC IO1 NC VCC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 K VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss 9 10 NC NC NC NC L NC NC NC NC L NC NC NC NC M NC NC NC NC M NC NC NC NC G3: DNU (Do Not Use) Note: 1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally. Macronix is NC for those pinout, and it is fine to connect to Vcc or Vss Table 5-2: 63-VFBGA Package Ball Definition Brand Macronix Spansion MX30LF1G08AA-XKI S34ML01G1 #D3 ball NC VCC (might not be bonded, just for ONFI compatibility) #G3 ball DNU NC #G4 ball NC VCC (might not be bonded, just for ONFI compatibility) #F7 ball NC VSS (might not be bonded, just for ONFI compatibility) Part Name P/N: AN0257 4 Ver.1, Sep. 11, 2013 APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA 6. Command Set Basic command sets and status checking methods are similar. The Read and Write operation commands are identical, but the devices have different command sequences when accessing the cache read function. Additionally, Macronix supports a cache program function and Spansion® does not (Table 6-1). Table 6-1: Command Table Command Macronix MX30LF1G08AA Spansion S34ML01G1 1st Cycle 2nd Cycle 1st Cycle 2nd Cycle Random Data Input 85h - 85h - Random Data Output 05h E0h 05h E0h Cache Read Begin 00h 31h 31h - Read Mode 00h 30h 00h 30h Cache Read End 34h - 3Fh - Read ID 90h - 90h - Reset FFh - FFh - Page Program 80h 10h 80h 10h Cache Program 80h 15h - - Block Erase 60h D0h 60h D0h Read Status 70h - 70h - Read Parameter Pg. - - ECh - P/N: AN0257 5 Ver.1, Sep. 11, 2013 APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA 6-2 Status Register When a flash read/program/erase operation is in progress, either the “Ready/Busy# pin checking” or “Status output checking” may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both device families. Table 6-2 shows that Status output content provided by the Read Status command (70h) is compatible. Table 6-2: Status Output Status Output Macronix MX30LF1G08AA Spansion S34ML01G1 SR[0] PGM/ERS status: Pass/Fail PGM/ERS status: Pass/Fail SR[1] Cache Program status: Pass/Fail Cache Program status: Pass/Fail SR[2] Reserved Reserved SR[3] Reserved Reserved SR[4] Reserved Reserved SR[5] PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read internal controller: Ready/Busy SR[6] PGM/ERS/Read status: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect P/N: AN0257 6 Ver.1, Sep. 11, 2013 APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA 7. Read ID Command The ID of the Macronix MX30LF1G08AA begins with a one-byte Manufacturer Code followed by a three-byte Device ID. While the same command set is used to read the Manufacturer ID, Device ID, and flash structure, the IDs are different, allowing software to identify the device manufacturer and device type (Table 7-1). Table 7-1: Manufacturer and Device IDs ID code Value 1 Code 2nd Code IO1, IO0 IO3, IO2 st 3rd Code IO5, IO4 IO6 4th Code IO7 IO1, IO0 IO2 IO7, IO3 IO5, IO4 IO6 P/N: AN0257 Macronix MX30LF1G08AA Spansion S34ML01G1 C2h/F1h/80h/1Dh Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (exclude Spare Area) Size of Spare Area (Byte per 512Byte) Sequential Read Cycle Time (tRC) Block Size (exclude Spare Area) Organization 01h/F1h/00h/1Dh Manufacturer Code Device Identifier Number of Die per Chip Enable Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (exclude Spare Area) Size of Spare Area (Byte per 512Byte) Serial Access Time (tRC) Block Size (exclude Spare Area) Organization 7 Ver.1, Sep. 11, 2013 APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA 8. Power-Up Timing Macronix and Spansion® power-up sequences are similar, but the timing is slightly different. Macronix defines 2.5V (Vth) as the measurement point while Spansion® uses 2.7V (Vcc min.) as the measurement point. Check the system timing to determine if adjustments are needed. Table 8-1: Power-Up Timing H/W Timing Characteristic Vth (2.5V) to WE# low Vcc (min.) to WE# low Vth (2.5V) to R/B# low Vcc (min.) to R/B# low Macronix MX30LF1G08AA 1us (min.) N/A 1ms (max.) N/A Spansion S34ML01G1 N/A 100us (max.) N/A 5ms (max.) Vth/Vcc(min. VCC WE# R/B# Figure 8-1: Power-Up Timing 9. Summary Macronix MX30LF1G08AA and Spansion® S34ML01G1 NAND have similar features and pinouts. While basic read/program/erase commands are the same, more advanced features such as cache access are implemented slightly differently. Overall, device migration may require minimal or no firmware modifications. P/N: AN0257 8 Ver.1, Sep. 11, 2013 APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA 10. Reference Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www.macronix.com Table 10-1: Datasheet Version Datasheet MX30LF1G08AA S34ML01G1_04G1 Location Date Issue Revision - MAR. 28, 2013 MAR. 7, 2013 Rev. 1.2 Rev. 15 Note: Macronix data sheet is subject to change without notice. 11. Appendix Cross Reference Table 11-1 shows basic part number and package information for the Macronix MX30LF1G08AA and Spansion® S34ML01G1 product families. Table 11-1: Part Number Cross Reference Density Macronix Part No. Spansion Part No. MX30LF1G08AA-TI S34ML01G100TFI00 1Gb MX30LF1G08AA-XKI S34ML01G100BHI00 Package 48-TSOP 63-VFBGA Dimension 12x20mm 9x11x1.0mm 12. Revision History Revision 1.0 P/N: AN0257 Description Initial Release 9 Date Sep. 11, 2013 Ver.1, Sep. 11, 2013 APPLICATION NOTE Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applica- tions only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liabil- ity arisen therefrom. Copyright© Macronix International Co., Ltd. 2013. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLite- Flash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN0257 10 Ver.1, Sep. 11, 2013