APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C 1. Introduction Macronix MX29LV800C and Spansion® S29AL008J 8Mb 3.0V parallel flash have similar features, performance, and command codes. This application note explains how to simply and easily compare the Spansion® device with the equivalent Macronix MX29LV800C flash. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. General Features Both flash devices have similar features and functions as shown in Table 2-1. Table 2-1: Features Type / Function VCC Voltage Range Access Time Bus Width Boot Block Sector Architecture OTP Security Region CFI Compliant Sector Protect/Unprotect Temp Sector Protect/Unprotect Erase Suspend/Resume Hardware Reset# Pin WP# Pin Manufacture ID Device ID Top/Bottom Notes: MX29LV800C 2.7V ~ 3.6V 55ns*1/70ns X8 / x16 Top/Bottom S29AL008J 2.7V ~ 3.6V 55ns*1/70ns X8 / x16 Top/Bottom 16KB+ 2*8KB+32KB + 15*64KB sectors. 16KB+ 2*8KB+32KB + 15*64KB sectors. Yes Yes Yes Yes Yes C2h 256Byte Yes Yes Yes Yes Yes Yes 01h 22DAh/225Bh 22DAh/225Bh 1. Restricted Vcc Voltage Range, Vcc = 3.0V ~ 3.6V. P/N: AN0222 1 Ver:1 Mar. 21, 2013 APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C 3. Package and Pinout Current package offerings are shown in Table 3-1. Table 3-1: Package Options Package MX29LV800C Yes Yes Yes Yes*1 Yes*1 Yes Yes 44-SOP 48-TSOP (12x20mm) Normal 48-CSP TFBGA(6x8x1.2mm) 0.3mm ball 48-TFBGA (6x8x1.2mm) 0.4mm ball 48-LFBGA (6x8x1.3mm) 0.4mm ball 48-XFLGA (4 x 6 x 0.5mm) 0.3mm ball 48-WFBGA (4 x 6 x 0.75mm) 0.3mm ball S29AL008J Yes Yes*1 Yes*1 - Notes: 1. Spansion Package body thickness = 0.75mm while Macronix TFBGA= 1.2mm and LFBGA=1.3mm. The Macronix and Spansion® flash have virtually identical footprints and pinouts. The 48-TSOP and 48-LFBGA packages are shown below for comparison. The only significant difference being the Spansion devices have a hardware WP# input (pin #14 of the 48-TSOP package and pin B3 of the 48-BGA package) to protect the boot sector. These same pins are NC on the Macronix devices. This difference will be transparent if the WP# pin is left unconnected or pulled high. Figure 3-1: 48-TSOP (12x20mm) Package Pin-out Comparison A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX29LV800 48 47 46 45 44 43 43 42 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0 A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC WP# RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 Note: Pin 14= NC P/N: AN0222 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 S29AL008 48 47 46 45 44 43 43 42 42 41 40 39 38 37 36 35 34 33 32 31 30 29 27 28 26 25 A16 BYTE# VSS DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 Note: Spansion pin 14= WP# 2 Ver:1 Mar. 21, 2013 APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C Figure 3-2: 48-LFBGA (6x8mm) Package Pin-out Comparison MX29LV800 S29AL008 6 A13 A12 A14 A15 A16 BYTE # Q15/ A-1 GND 6 A13 A12 A14 A15 A16 BYTE # DQ15 /A-1 VSS 5 A9 A8 A10 A11 Q7 Q14 Q13 Q6 5 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 4 WE# RESET# NC NC Q5 Q12 VCC Q4 4 WE# RESET# NC NC DQ5 DQ12 VCC DQ4 3 RY/ BY# NC A18 NC Q2 Q10 Q11 Q3 3 RY/ BY# WP# A18 NC DQ2 DQ10 DQ11 DQ3 2 A7 A17 A6 A5 Q0 Q8 Q9 Q1 2 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 1 A3 A4 A2 A1 A0 CE# OE# GND 1 A3 A4 A2 A1 A0 CE# OE# VSS A B C D Note: Macronix pin B3= NC E F G H A B C D Note: Spansion pin B3= WP# E F G H P/N: AN0222 3 Ver:1 Mar. 21, 2013 APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C 4. Command Set and Firmware Basic commands and write status checking methods are the same. The Read operation and Write command could be used directly without any modification. Table 4-1 shows the command set in Word mode. Table 4-1: Basic Commands (Word Mode) Command st 1 Bus Cycle Read Reset Program Chip Erase Sector Erase Program/Erase Suspend Program/Erase Resume Addr Addr XXX 555h 555h 555h XXX XXX Data Data F0h AAh AAh AAh B0h 30h 2 Bus Cycle Addr 2AAh 2AAh 2AAh Data 55h 55h 55h 3rd Bus Cycle Addr 555h 555h 555h Data A0h 80h 80h Addr Addr 555h 555h Data Data AAh AAh Addr 2AAh 2AAh Data 55h 55h Addr 555h SA 10h 30h nd th 4 Bus Cycle th 5 Bus Cycle th 6 Bus Cycle Data Note: SA: Sector Address P/N: AN0222 4 Ver:1 Mar. 21, 2013 APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C 5. Electrical Characteristics Both device families have similar power requirements during Program and Erase. Table 5-1: Read / Write Current DC Characteristic Condition typ @ 5MHz Read Current max @ 5MHz typ Standby Current max typ Write Current max MX29LV800C 7mA 12mA 0.2uA 5uA 15mA 30mA S29AL008J 7mA 12mA 0.2uA 5uA 20mA 30mA Table 5-2 shows that both flash devices have similar input and output characteristics. Table 5-2: Input / Output Voltage DC Characteristic Condition MX29LV800C S29AL008J min -0.5V -0.1V max 0.8V 0.8V min 0.7VCC 0.7VCC max VCC+0.3V VCC+0.3V Output Low Voltage max 0.45V 0.45V Output High Voltage min 0.85VCC 0.85VCC 11.5V ~ 12.5V 8.5V ~ 12.5V Input Low Voltage Input High Voltage VHV Temporary Sector Unprotect Range P/N: AN0222 5 Ver:1 Mar. 21, 2013 APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C 6. Erase and Programming Performance Table 6-1 and 6-2 show MX29LV800C and S29AL008J have similar Read/Write performance. Table 6-1: AC Characteristics Symbol Taa Tce Tcp Description Random Read Access Time VCC =3.0-3.6V VCC= 2.7-3.6V MX29LV800C 55ns 70ns Valid data output after CE# low VCC =3.0-3.6V 55ns - VCC= 2.7-3.6V 70ns 70ns VCC =2.7-3.6V 35ns 35ns Chip Enable Pulse Width S29AL008J 70ns Note: Values provided in Table 6-1 are “maximum” values. Table 6-2: Write Function Performance (Program and Erase) Write Function MX29LV800C Byte Program Time 9us Word Program Time 11us Accelerated Byte/Word Programming Time Chip Program Time Byte Mode Chip Program Time Word Mode Sector Erase time Chip Erase time S29AL008J 6us 6us 7us - 9s 5.8s 0.7s 8s 6.3s 3.2s 0.5s 10s Note: Values provided in Table 6-2 are “typical” values. P/N: AN0222 6 Ver:1 Mar. 21, 2013 APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C 7. Memory Organization The memory and sector architecture of the MX29LV800C is identical to the S29AL008J, as seen in Features Table 2-1. 8. Manufacturer ID & Device ID Command Manufacturer IDs are different and permits software to identify the device manufacturer, but Device IDs are the same. The same command set is used to read the different Manufacturer IDs. Table 8-1: Manufacturer and Device ID Command Definitions (Word Mode) Manufacturer ID Flash Vender st 1 Bus Cycle (command) 2nd Bus Cycle (command) 3rd Bus Cycle (command) 4th Bus Cycle (ID output) Address Data Address Data Address Data Address Data Device ID MX29LV800C S29AL008J MX29LV800C S29AL008J 555h AAh 2AAh 55h 555h 90h X00h C2h 555h AAh 2AAh 55h 555h 90h X00h 01h 555h AAh 2AAh 55h 555h 90h X01h 22DAh/225Bh 555h AAh 2AAh 55h 555h 90h X01h 22DAh/225Bh Note. (1) Device ID can be read out after Manufacturer ID with proper address and does not need another command sequence. (2) Use Reset command (F0h) to return to normal read mode. P/N: AN0222 7 Ver:1 Mar. 21, 2013 APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C 9. Part Number Cross-Reference Cross Reference Table 9-1 shows basic part number and package information for the Macronix MX29LV800C and Spansion products. Table 9-1: Part Number Cross Reference Density Macronix Part*1 Spansion® Part *1 8Mb MX29LV800CTXGI-70G MX29LV800CBXGI-70G*1 MX29LV800CTXGI-70G*1 MX29LV800CBXGI-70G*1 MX29LV800CTXGI-55Q*1 MX29LV800CBXGI-55Q*1 MX29LV800CTXEI-70G*1 MX29LV800CBXEI-70G*1 MX29LV800CTXEI-70G*1 MX29LV800CBXEI-70G*1 MX29LV800CTXEI-55Q*1 MX29LV800CBXEI-55Q*1 MX29LV800CTTI-70G MX29LV800CBTI-70G MX29LV800CTTI-70G MX29LV800CBTI-70G MX29LV800CTTI-55Q MX29LV800CBTI-55Q S29AL008J70BFI01 S29AL008J70BFI02 S29AL008J70BFI03 S29AL008J70BFI04 S29AL008J55BFIR1 S29AL008J55BFIR2 S29AL008J70BFI01 S29AL008J70BFI02 S29AL008J70BFI03 S29AL008J70BFI04 S29AL008J55BFIR1 S29AL008J55BFIR2 S29AL008J70TFI01 S29AL008J70TFI02 S29AL008J70TFI03 S29AL008J70TFI04 S29AL008J55TFIR1 S29AL008J55TFIR2 Package Dimension 48-TFBGA*1 6x8x1.2mm 0.4mm ball 48-LFBGA*1 6x8x1.3mm 0.4mm ball 48-TSOP 12x20mm Notes: 1. Spansion Package body thickness = 0.75mm while Macronix TFBGA= 1.2mm and LFBGA=1.3mm. 10. Reference Documents Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www.macronix.com Table 10-1: Datasheet Version Data sheet Location Date Issue Revision MX29LV800C S29AL008J_00 Website Website Dec. 22, 2011 Apr. 12, 2012 Rev. 2.6 Rev. 11 P/N: AN0222 8 Ver:1 Mar. 21, 2013 APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C 11. Summary Macronix MX29LV800C and Spansion S29AL008J 8Mb parallel Flash occupy the same PCB footprint and have similar commands, functions, and features. Macronix does not support the WP# pin function and does not contain a Secured Silicon Sector. 12. Revision History Table 12-1: Revision History Revision No. REV. 1 P/N: AN0222 Description Page Initial Release ALL 9 Date Jan. 15, 2013 Ver:1 Mar. 21, 2013 APPLICATION NOTE Comparing Spansion® S29AL008J with Macronix MX29LV800C Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2013. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN0222 10 Ver:1 Mar. 21, 2013