APPLICATION NOTE Comparing Spansion® S29AL016J with Macronix MX29LV160D 1. Introduction Macronix MX29LV160D and Spansion® S29AL016J 16Mb 3.0V parallel flash have similar features, performance, and command codes. This application note explains how to simply and easily compare the Spansion® device with the equivalent Macronix MX29LV160D flash. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. General Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Features Type / Function VCC Voltage Range Access Time Bus Width Boot Block Sector Architecture OTP Security Region CFI Compliant Sector Protect/Unprotect Temp Sector Protect/Unprotect Erase Suspend/Resume Hardware Reset# Pin WP# Pin Manufacture ID Device ID Top/Bottom Note: MX29LV160D 2.7V ~ 3.6V 70ns X8 / x16 Top/Bottom S29AL016J 2.7V ~ 3.6V 55ns*1/70ns X8 / x16 Top/Bottom 16KB+ 2*8KB+32KB + 31*64KB sectors. 16KB+ 2*8KB+32KB + 31*64KB sectors. Yes Yes Yes Yes Yes Yes C2h 256Byte Yes Yes Yes Yes Yes Yes 01h 22C4h/2249h 22C4h/2249h Restricted Vcc Voltage Range, Vcc = 3.0V ~ 3.6V. P/Nr: AN0223 1 Ver.1, Jan. 15, 2013 APPLICATION NOTE Comparing Spansion® S29AL016J with Macronix MX29LV160D 3. Package and Pinout Current package offerings are shown in Table 3-1. Table 3-1: Package Options Package MX29LV160D Yes Yes Yes*1 Yes*1 Yes Yes - 48-TSOP (12x20mm) Normal 48-CSP TFBGA(6x8x1.2mm) 0.3mm ball 48-TFBGA (6x8x1.2mm) 0.4mm ball 48-LFBGA (6x8x1.3mm) 0.4mm ball 48-XFLGA (4 x 6 x 0.5mm) 0.3mm ball 48-WFBGA (4 x 6 x 0.75mm) 0.3mm ball 64-LFBGA (9x9mm) 0.6mm ball S29AL016J Yes Yes*1 Yes*1 Yes Notes: 1. Spansion Package body thickness = 0.75mm while Macronix TFBGA= 1.2mm and LFBGA=1.3mm. The Macronix and Spansion® families have virtually identical footprints and pinouts. The 48-TSOP and 48-LFBGA packages are shown below for comparison. Macronix offers an accelerated programming option on pin 14 of the 48TSOP (pin B3 of the LFBGA) shared with the WP# pin. No modifications are necessary to accommodate this extra feature. Figure 3-1: 48-TSOP (12x20mm) Package Pin-out Comparison A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE# RESET# NC WP#/ACC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 43 42 42 MX29LV160 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0 A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE# RESET# NC WP# RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 Note: Pin 14= WP#/ACC P/Nr: AN0223 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 43 42 42 S29AL016 41 40 39 38 37 36 35 34 33 32 31 30 29 27 28 26 25 A16 BYTE# VSS DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 Note: Spansion pin 14= WP# 2 Ver.1, Jan. 15, 2013 APPLICATION NOTE Comparing Spansion® S29AL016J with Macronix MX29LV160D Figure 3-2: 48-LFBGA (6x8mm) Package Pin-out Comparison MX29LV160 S29AL016 6 A13 A12 A14 A15 A16 BYTE # Q15/ A-1 GND 7 A13 A12 A14 A15 A16 BYTE # DQ15 /A-1 VSS 5 A9 A8 A10 A11 Q7 Q14 Q13 Q6 6 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 4 WE# RESET# NC A19 Q5 Q12 VCC Q4 5 WE# RESET# NC A19 DQ5 DQ12 VCC DQ4 3 RY/ BY# WP#/ ACC A18 NC Q2 Q10 Q11 Q3 4 RY/ BY# WP# A18 NC DQ2 DQ10 DQ11 DQ3 2 A7 A17 A6 A5 Q0 Q8 Q9 Q1 3 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 1 A3 A4 A2 A1 A0 CE# OE# GND 2 A3 A4 A2 A1 A0 CE# OE# VSS D E F G H A B C D Note: Spansion pin B3= WP# E F G H A B C Note: Pin B3= WP#/ACC 4. Command Set and Firmware Basic commands and write status checking methods are the same. The Read operation and Write command could be used directly without any modification. Table 4-1 shows the command set in Word mode. Table 4-1: Basic Commands (Word Mode) Command Read Reset Program Chip Erase Sector Erase Program/Erase Suspend Program/Erase Resume Addr Addr XXX 555h 555h 555h XXX XXX Cycle Data Data F0h AAh AAh AAh B0h 30h nd Addr 2AAh 2AAh 2AAh Data 55h 55h 55h Addr 555h 555h 555h st 1 Bus 2 Bus Cycle rd 3 Bus Cycle Data A0h 80h 80h 4 Bus Addr Addr 555h 555h Cycle Data Data AAh AAh 2AAh 2AAh Data 55h 55h Addr 555h SA 10h 30h th th 5 Bus Cycle th 6 Bus Addr Cycle Data Note: SA: Sector Address P/Nr: AN0223 3 Ver.1, Jan. 15, 2013 APPLICATION NOTE Comparing Spansion® S29AL016J with Macronix MX29LV160D 5. Electrical Characteristics Both device families have similar power requirements during Program and Erase. Table 5-1: Read / Write Current DC Characteristic Condition typ @ 5MHz Read Current max @ 5MHz typ Standby Current max typ Write Current max MX29LV160D 5mA 12mA 5uA 15uA 15mA 30mA S29AL016J 7mA 12mA 0.2uA 5uA 20mA 30mA Table 5-2 shows that both devices have similar input sink and output drive characteristics. Macronix supports a high voltage Accelerated Programming option (typically done off-line). Table 5-2: Input / Output Voltage DC Characteristic Condition min Input Low Voltage max min Input High Voltage max Output Low Voltage max Output High Voltage min ACC Program Acceleration Voltage P/Nr: AN0223 MX29LV160D -0.5V 0.8V 0.7VCC VCC+0.3V 0.45V 0.85VCC 9.5V ~ 10.5V 4 S29AL016J -0.1V 0.8V 0.7VCC VCC+0.3V 0.45V 0.85VCC - Ver.1, Jan. 15, 2013 APPLICATION NOTE Comparing Spansion® S29AL016J with Macronix MX29LV160D 6. Erase and Programming Performance Table 6-1 and 6-2 show MX29LV160D and S29AL016J series have similar Read/Write performance. Table 6-1: AC Characteristics Symbol Taa Tce Tcp Note: Description Random Read Access Time VCC =3.0-3.6V VCC= 2.7-3.6V MX29LV160D 70ns Valid data output after CE# low VCC =3.0-3.6V - 55ns VCC= 2.7-3.6V 70ns 70ns VCC =2.7-3.6V 35ns 35ns Chip Enable Pulse Width S29AL016J 55ns 70ns Values provided in Table 6-1 are “maximum” values. Table 6-2: Write Function Performance (Program and Erase) Write Function MX29LV160D Byte Program Time 9us Word Program Time 11us Accelerated Byte/Word Programming 7us Time S29AL016J 6us 6us - Chip Program Time Byte Mode 18s 21.6s Chip Program Time Word Mode 12s 6.3s Sector Erase time 0.7s 0.5s Chip Erase time 15s 16s Note: Values provided in Table 6-2 are “typical” values. P/Nr: AN0223 5 Ver.1, Jan. 15, 2013 APPLICATION NOTE Comparing Spansion® S29AL016J with Macronix MX29LV160D 7. Memory Organization The memory and sector architecture of the MX29LV160D is identical to the S29AL016J, as seen in Features Table 2-1. 8. Manufacturer ID & Device ID Command Manufacturer IDs are different and permits software to identify the device manufacturer, but Device IDs are the same. The same command set is used read the different Manufacturer IDs. Table 8-1: Manufacturer and Device ID Command Definitions (Word Mode) Manufacturer ID Flash Vender st 1 Bus Cycle (command) 2nd Bus Cycle (command) 3rd Bus Cycle (command) 4th Bus Cycle (ID output) Address Data Address Data Address Data Address Data Device ID MX29LV160D S29AL016J MX29LV160D S29AL016J 555h AAh 2AAh 55h 555h 90h X00h C2h 555h AAh 2AAh 55h 555h 90h X00h 01h 555h AAh 2AAh 55h 555h 90h X01h 22C4h/2249h 555h AAh 2AAh 55h 555h 90h X01h 22C4h/2249h Note. (1) Device ID can be read out after Manufacturer ID with proper address and does not need another command sequence. (2) Use Reset command (F0h) to return to normal read mode. P/Nr: AN0223 6 Ver.1, Jan. 15, 2013 APPLICATION NOTE Comparing Spansion® S29AL016J with Macronix MX29LV160D 9. Part Number Cross-Reference Cross Reference Table 9-1 shows basic part number and package information for the Macronix MX29LV160D and Spansion products. Table 9-1: Part Number Cross Reference Density Macronix Part*1 Spansion® Part 16Mb MX29LV160DTXGI-70G*1 MX29LV160DBXGI-70G*1 MX29LV160DTXGI-70G*1 MX29LV160DBXGI-70G*1 MX29LV160DTXGI-55Q*1 MX29LV160DBXGI-55Q*1 MX29LV160DTXEI-70G*1 MX29LV160DBXEI-70G*1 MX29LV160DTXEI-70G*1 MX29LV160DBXEI-70G*1 MX29LV160DTXEI-55Q*1 MX29LV160DBXEI-55Q*1 MX29LV160DTTI-70G MX29LV160DBTI-70G MX29LV160DTTI-70G MX29LV160DBTI-70G MX29LV160DTTI-55Q MX29LV160DBTI-55Q S29AL016J70BFI01 S29AL016J70BFI02 S29AL016J70BFI03 S29AL016J70BFI04 S29AL016J55BFIR1 S29AL016J55BFIR2 S29AL016J70BFI01 S29AL016J70BFI02 S29AL016J70BFI03 S29AL016J70BFI04 S29AL016J55BFIR1 S29AL016J55BFIR2 S29AL016J70TFI01 S29AL016J70TFI02 S29AL016J70TFI03 S29AL016J70TFI04 S29AL016J55TFIR1 S29AL016J55TFIR2 Package Dimension 48-LFBGA*1 6x8x1.2mm 0.4mm ball 48-LFBGA*1 6x8x1.3mm 0.4mm ball 48-TSOP 12x20mm Notes: 1. Spansion Package body thickness = 0.75mm while Macronix TFBGA= 1.2mm and LFBGA=1.3mm. 10. Reference Documents Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www.macronix.com Table 10-1: Datasheet Version Data sheet Location Date Issue Revision MX29LV160D S29AL016J_00 Website Website Dec. 22, 2011 Apr. 12, 2012 Rev. 1.2 Rev. 12 P/Nr: AN0223 7 Ver.1, Jan. 15, 2013 APPLICATION NOTE Comparing Spansion® S29AL016J with Macronix MX29LV160D 11. Summary Macronix MX29LV160D and Spansion S29AL016J 16Mb 3.0V parallel Flash occupy the same PCB footprint and have similar commands, functions, and features. Macronix does not support a Secured Silicon Sector. 12. Revision History Table 12-1: Revision History Revision No. Description Page Date REV. 1 Initial Release ALL Jan. 15, 2013 P/Nr: AN0223 8 Ver.1, Jan. 15, 2013 APPLICATION NOTE Comparing Spansion® S29AL016J with Macronix MX29LV160D Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2011~2012. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/Nr: AN0223 9 Ver.1, Jan. 15, 2013