The Powermite Family ¤ Introduction Powermite® is Microsemi’s patented low-profile architecture for packaging surface mount devices with the industry's highest power density in the smallest possible footprint. The current portfolio includes: • • • • • • • • 1A through 10A Schottky Rectifiers to 200V 1A through 8A Ultrafast Rectifiers to 800V 150W (10x1000) and 1500 W (10x1000) TVS diodes 2.5W PIN diodes to 400V Low Noise Zener Diodes 1.8V to 200V 3W Zener Diodes 3.3V to 200V High Speed Silicon Controlled Rectifiers N Channel MOSFET’s 500V and 1000V Outperforms Conventional SMT With no wire bonds and non-magnetic materials, Powermite reduces high frequency losses and provides dramatically higher surge ratings compared to conventional wire bonded SMT packages. With a large, full-metal bottom, all Powermite ® devices deliver superior heat dissipation and thermal capabilities. Mechanical strength is excellent due to a metal lock design that permanently bonds metal electrodes to the plastic housing. • Reduced High Frequency Losses • Built-in heatsink, superior heat dissipation • High Mechanical Strength • 1/3 the size of comparably rated products Contents Overview Powermite 1 Transient Voltage Suppressors 1W Zener Diodes 3W Zener Diodes UltraFast Rectifiers PIN Diodes Schottkys Powermite 3 Mosfet (N-channel) Schottkys Quality/Reliability Data Cross Reference 2 2 3 4 5 6 6 6 8 8 10 11 ¤ Powermite 1 The original 2-lead Powermite package provides a breakthrough high density design for handheld and thermally sensitive power supply and battery charging applications. In addition to its unique full-metal bottom that provides an optimal path for dissipating junction heat, the Powermite package’s patented wrap-around interlocking construction allows solder fillets to form during the surface mount reflow process for superior heat dissipation and mechanical strength. Measuring less than 1mm high and 2mm square, Powermite packaging provides a dramatic one-third reduction in size compared with two-leaded devices in conventional SMA packages. Compared with similarly-sized SOT-23 devices, Powermite delivers superior thermal and power handling capability. Powermite 1 • 1mm high x 2mm square • 1/3 smaller than SMA • Superior performance compared to SOT-23 Transient Voltage Suppressors Note: R equals Reverse Polarity 3 Powermite 1 1W Zener Diodes, Low Noise Note 1: Product shown has a standard tolerance of ±5% on the nominal zener voltage. Also available in 2% and 1% tolerance with suffix C and D respectively. VZ is measured at IZT with TC (TAB 1) at 30ºC. Note 2: Zener impedance is derived by superimposing on IZT a 60 Hz rms ac current equal to 10% of IZT (25µA ac). Note 3: Based upon 1W maximum power dissipation. Allowance has been made for the higher voltage associated with operation at higher currents and temperature. For determination of voltage change with current deviations from IZT see MicroNote 202. 4 Powermite 1 3W Zener Diodes Note 1: Product shown has a standard tolerance of ±5% on the nominal zener voltage. Also available in 2% and 1% tolerance with suffix C and D respectively. VZ is measured at IZT with TC (TAB 1) at 30ºC. Voltage measurement to be performed 20 seconds after application. Note 2: Zener impedance is derived by superimposing on IZT a 60 Hz rms ac current equal to 10% of IZT. Note 3: Based upon 1W maximum power dissipation. Allowance has been made for the higher voltage associated with operation at higher currents and temperature. For determination of voltage change with current deviations from IZT see MicroNote 202. 5 Powermite 1 Ultra Fast Rectifiiers Powermite 1 PIN Diodes, 2.5W Powermite 1 Schottkys UPS120-140 UPS120E-140E Low VF 1A, 20-40V Schottky Low IR 1A, 20-40V Schottky Both Series Feature: • Ultra Low profile (<1.1mm high) • Low thermal resistance • 1/3 the size of competing products UPS120-140 Series Feature: • Ultra Low VF of 0.45V at 1A • Ideal for efficient power supplies UPS 120E and 140E Series Feature: • Ultra Low IR of 400µA at 20 Volts • Ideal for portable battery chargers 6 Powermite 1 Specifications TAB 1 CATHODE TAB 2 ANODE C D ANNEALED MATTE-TIN B A ANNEALED MATTE-TIN J K F DIM Powermite1 mm A B C D E F G H J K L M N O P MIN MAX 1.73 1.73 1.73 1.73 0.889 NOM 1.83 NOM 1.73 1.73 0.178 NOM 1.73 1.73 1.73 1.73 0.178 NOM 1.73 1.73 1.73 1.73 1.73 1.83 1.73 1.73 1.73 1.73 1.73 1.73 Dimensions G E H N O L P M Pad Layout 7 ¤ Powermite 3: Small Size, Greater Power Actual Footprint Powermite 3 With three leads and a slightly larger footprint, Microsemi's new Powermite 3 package provides all of the thermal impedance and thermal resistance advantages of the original Powermite in a 1.1mm x 5.3mm x 4.8mm design having power capabilities previously available only in much larger D-PAK and TO-220 devices. Powermite 3 devices include 8 Amp Power Schottkys and UltraFast Rectifiers, 500 and 1000 Volt 1 Amp MOSFETs, High Speed Silicon Controlled Rectifiers, and 1500W Zener Diodes. 8 ® SMC UPS1040 High Density 10 Amp Power Schottky Features: • 10 Amp, 40 V Schottky barrier rectifier • Low 1.1mm profile (max) • 16.51 mm2 footprint • Low VF for higher efficiency • Low thermal resistance • Patented heat sink design Applications: • DC-DC converters • Battery charge regulation • Low voltage/high frequency inverters • Free wheeling and steering diodes Powermite 3 Mosfet (N-Channel) Powermite 3 Schottkys DPak The Powermite 3 Performance Advantage UPGA301 and UPGA350 Series High Speed Silicon Controlled Rectifier The UPGA301 and UPGA350 Series are nanosecond SCR switches designed for narrow pulse switching applications where size and curent handling capability are critical. They may be triggered using low power logic drivers (+0.8 V at 200mA). The Powermite 3 package provides high reliability and wire bond connections able to deliver high current surge capability. Epoxy packaged, oxide passivated planar SCR chips with metallurgic bonds on both sides to achieve high reliability. Internal wire bond connection allows high current surge capability for narrow pulse applications. Features: • • • • • Small mechanical outline High speed switching Logic drive capability Small 16.51 mm2 footprint Supplied in 6K-unit 16mm surface mount tape and reel • Choice of 60 V or 125 V repetitive peak off-state voltage • Available in 16mm Tape and Reel, 6000 units/reel Applications • Laser Range finders • Photo-flash circuits • Automotive collision avoidance systems 9 Powermite3 Internal Configurations SOLDER PIN 1 DIE PIN 3 Bottom Side Heat Sink FRAME CLIP (QTY 2) PIN 3 Bottom Side Heat Sink PIN 2 LEAD (QTY 2) Single Single die, dual clip construction SOLDER APPROX MAX DIE DIE FRAME CLIP (QTY 2) LEAD (QTY 2) Dual die, dual clip construction 10 Dual, Common Cathode Cross Reference Schottky 3W Zener Diodes Powermite3 11 Microsemi Powermite Products 8700 East Thomas Road Scottsdale, AZ Phone: (480) 947-6300 Fax: (480) 947-1503 www.microsemi.com © 2006 Microsemi Corporation. All trademarks of Microsemi Corporation.