Automotive Electronics Council Component Technical Committee Agenda (subject to change) 2014 - Sixteenth Annual Automotive Electronics Reliability Workshop April 22, 23, & 24 Novi, MI Sheraton Detroit Novi Hotel Page 1 Tuesday, April 22, 2014 7:30 am - 8:00 am Continental Breakfast (provided) 8:00 am - 8:30 am Workshop Introductions 1.1 8:30 am - 9:00 am Jayson Young KEMET Polymer Tantalum Capacitors for Automotive Applications 1.2 9:00 am - 9:30 am Reiner Kuehl Vishay BC Components Stability of Components During Biased Humidity Testing and Application 1.3 9:30 am - 10:00 am Peter Blais KEMET SMD and Leaded Ceramic Capacitors For High Temperature Applications 1.4 10:00 am - 10:30 am Charles Pothier Vishay Intertechnology New Tantalum Capacitor Technologies Ensure Reliability in the Next Generation of Automotive Electronics Session 1: Passive/Discrete Component Technology 8:30 am - 10:30 am 10:30 am - 11:00 am Workshop Session - W.1 11:00 am - 12:00 pm 12:00 pm - 1:30 pm Workshop Session - W.2 1:30 pm - 3:00 pm 3:00 pm - 3:30 pm Workshop Session - W.3 3:30 pm - 5:00 pm 5:00 PM BREAK: Coffee, drinks, snacks (provided) LED Qualification Review & Discussion Moderator: Ludger Kappius, Hella KGaA LUNCH (on own) Q200 Document Revision Status & Discussion Moderator: AEC Q200 Technical Committee BREAK: coffee, drinks, snacks (provided) Q101 Document Status & Discussion Moderator: AEC Q101 Technical Committee SESSION CLOSE Page 2 Wednesday, April 23, 2014 7:30 am - 8:00 am Session 2: Semiconductor Technology - Part 1 8:00 am - 11:00 am Continental Breakfast (provided) 2.1 8:00 am - 8:30 am Wolfgang Reinprecht AMS Advanced Latch-up Testing of HV Automotive IC’s 2.2 8:30am - 9:00am Warren Chen Macronix International NAND Flash Qualification Challenges for Automotive Applications 2.3 9:00 am - 9:30 am Sebastiano Russo STMicroelectronics Reliability of New Pb-Free Die Attach Materials for Power Devices 9:30 am - 10:00 am BREAK: Coffee, drinks, snacks (provided) 2.4 10:00 am - 10:30 am Shin Low Xilinx High Performance Flip Chip Packaging for High Reliability Semiconductor Devices 2.5 10:30 am - 11:00 am Eric Lei Global Foundries Evaluation of 40LP SRAM HTOL 150degC for Automotive Grade 0 Application 11:00 am - 12:00 pm Robustness Validation and Failure Rates - “Sample Sizes in Reliability Testing” Moderator: Werner Kanert, Infineon Technologies Session 2: (Continued) Workshop Session - W.4 12:00 pm - 1:30 pm LUNCH (on own) Page 3 Wednesday, April 23, 2014 (continued) 3.1 1:30 pm - 2:00 pm Ludger Kappius Hella KGaA ZVEI Delta Qualification Matrix 3.2 2:00 pm - 2:30 pm Joop Verwijst NXP Semiconductors Parameter Shift Analysis 3.3 2:30 pm - 3:00 pm Anil Gandhi Qualicent Analytics Advanced Analytics for Automotive Zero Defect 3.4 3:00 pm - 3:30 pm Tim Haifley Altera A Complete Lifetime Distribution Session 3: Semiconductor Technology - Part 2 1:30 pm - 5:00 pm 3:30 pm - 4:00 pm Session 3: (Continued) 3.5 4:00 pm - 4:30 pm Weiyen Kuo TSMC Cpk Challenges in Nanometer Semiconductor Technology 3.6 4:30 pm - 5:00 pm Megan Smitter GE Aviation Collaborative Approach For Practical Modeling of Microcircuit Failures in High-Reliability Applications 3.7 5:00 pm - 5:30 pm Tim Haifley Altera Combining Data From Similar Tests: A Bayesian Approach 5:30 pm - 7:30 pm Workshop Session - W.5 BREAK: Coffee, drinks, snacks (provided) 7:30 pm - 9:30 pm DINNER (on own) Q100 Document Review & Discussion Moderator: AEC Q100 Technical Committee Page 4 Thursday, April 24, 2014 7:30 am - 8:00 am Continental Breakfast provided Workshop Session - W.6 8:00 am - 9:00 am Known Good Die / Multi-Chip Module Moderator: Tom Lawler, Lattice Semiconductor Workshop Session - W.7 9:00 am - 10:00 am MEMS Moderator: Earl Fischer, Autoliv COFFEE (provided) 10:00 am - 10:30 am BREAK: Coffee, drinks, snacks (provided) Workshop Session - W.8 10:30 am - 11:00 am Touch Systems Moderator: Joe Lucia, John Deere Electonic Solutions Workshop Session - W.9 11:00 am - 11:30 am System-Level ESD Moderator: TBD Workshop Session - W.10 11:30 am - 12:00 pm PC Board Qualification Moderator: James McLeish, DfR Solutions WRAP-UP 12:00 pm - 12:30 pm AEC Technical Committee Closing Statements & Workshop Adjourned Page 5