Designing NCP1381 and NCP1382 in High Power AC-DC Adapters

AND8240
Designing NCP1381 and
NCP1382 in High Power
AC-DC Adapters
Nicolas Cyr
ON Semiconductor
http://onsemi.com
The NCP1381 and NCP1382 are valley−switching controllers offering various features making it ideal to build efficient High
Power AC−DC adapters. For instance, it has the capability to control the activity of the Power Factor Correction (PFC) front
stage that highly simplifies PFC implementation. More generally, the NCP1381/82 incorporates all the major up−to−date
functions (most of them programmable) to ease the optimization of any specific application and the compliance to the
specifications of modern power supplies, including reliability and standby efficiency.
Main features
• Current−Mode Operation with Quasi−Resonant Operation: Implementing peak current mode control, NCP1381/82
•
•
•
•
•
•
•
waits until the voltage across the external switching device crosses a minimum level. This is the quasi−resonance
approach, minimizing both EMI radiations and capacitive losses.
Over Power Protection: Using a current image of the bulk level (via the brown−out divider), it is easy to create an
offset on top of the current sense information by inserting a series resistor, providing an efficient line compensation
method.
Frequency Clamp: The controller monitors the sum of tON and tOFF, providing a real frequency clamp. Also the tON
maximum duration is safely limited to 45 ms in case the peak current information is lost. If the maximum tON limit is
reached, then the controller stops all pulses and enters a safe auto−recovery burst mode.
Blanking Time: to prevent false tripping with energetic leakage spikes, the controllers includes a 3 ms blanking time
after the TOFF event.
Go−to−Standby Signal for PFC Front Stage: NCP1381/82 includes an internal low impedance switch connected
between Pin 10 (VCC) and Pin 11 (GTS). The signal delivered by Pin 11 being of low impedance, it becomes possible to
connect PFC’s VCC directly to this pin and thus avoid any complicated interface circuitry between the PWM controller
and the PFC front−end section. In normal operation, Pin 11 routes the PWM auxiliary VCC to the PFC circuit which is
thus directly supplied by the auxiliary winding. When the SMPS enters skip−cycle at low output power levels, the
controller detects and confirms the presence of the skip activity by monitoring the signal applied on its pin ADJ_GTS
(typically a portion of FB signal) and opens Pin 11, shutting down the front−end PFC stage. When this signal level
increases, e.g. when the SMPS goes back to a normal output power, Pin 11 immediately (without delay) goes back to a
low impedance state. Finally, in short−circuit conditions, the PFC is disabled to lower the stress applied to the PWM
main switch.
Low Startup−Current: Reaching a low no−load standby power represents a difficult exercise when the controller
requires an external lossy resistor connected to the bulk capacitor. Due to a novel silicon architecture, the startup current
is guaranteed to be less than 15 mA maximum, helping to reach a low standby power level.
Skip−Cycle Capability: A continuous flow of pulses is not compatible with no−load standby power requirements.
Slicing the switching pattern in bunch of pulses drastically reduces overall losses but can, in certain cases, bring
acoustic noise in the transformer. Due to a skip operation taking place at low peak currents only, no mechanical noise
appears in the transformer. This is further strengthened by ON Semiconductor soft skip technique, which forces the
peak current in skip to gradually increase. In case the default skip value would be too large, connecting a resistor to the
Pin 6 will reduce or increase the skip cycle level. Adjusting the skip level also adjusts the maximum switching
frequency before skip occurs.
Soft−Start: A circuitry provides a soft−start sequence which precludes the main power switch from being stressed upon
startup. This soft−start is internal and reaches 5 ms typical.
© Semiconductor Components Industries, LLC, 2008
September, 2008 − Rev. 1
1
Publication Order Number:
AND8240/D
AND8240
• Overvoltage Protection: By sensing the plateau level after the power switch has opened, the controller can detect an
•
•
•
over voltage condition through the auxiliary reflection of the output voltage. If an OVP is sensed, the controller stops all
pulses and permanently stays latched until the VCC is cycled down below 4 V.
External Latch Input: By permanently monitoring Pin 5, the controller detects when its level rises above 3.5 V, e.g. in
presence of a fault condition like an OTP. This fault is permanently latched−off and needs the VCC to go down below
4 V to reset, for instance when the user un−plugs the SMPS.
Brown−Out Detection: By monitoring the level on pin 2 during normal operation, the controller protects the SMPS
against low mains condition. When the Pin 2 level falls below 240 mV, the controllers stops pulsing until this level goes
back to 500 mV to prevent any instability. During brown−out conditions, the PFC is not activated.
Short−Circuit Protection: Short−circuit and especially over−load protection is difficult to implement when a strong
leakage inductance between auxiliary and power windings affects the transformer (the auxiliary winding level does not
properly collapse in presence of an output short−circuit). In NCP1381/82, every time the internal 0.8 V maximum peak
current limit is activated, an error flag is asserted and a time period starts, due to an external timing capacitor. If voltage
on the capacitor reaches 4 V (after 90 ms for a 220 nF capacitor) while the error flag is still present, the controller stops
the pulses and goes into a latchoff phase, operating in a low−frequency burst−mode. As soon as the fault disappears, the
SMPS resumes its operation. The latchoff phase can also be initiated, more classically, when VCC drops below VCCmin
(10 V typical).
Typical Application
The above features makes NCP1381/82 well suited for medium to high power offline applications. Its typical application
is a 75 W to 200 W AC−DC power supply such as a notebook adapter.
HV
PFC Stage
+
+
To PFC’s VCC
OVP
NCP1381/82
GTS_ADJ
BO
DMG
Skip
GTS_ADJ
1
14
2
13
3
4
5
12
11
10
6
9
7
8
+
Vref
+
OPP
Figure 1. NCP1381/82 Typical Application Example
http://onsemi.com
2
Vout
AND8240
PIN−BY−PIN IMPLEMENTATION
Pin 1: “ADJ_GTS” Pin
This pin offers a comparator with adjustable hysteresis to define the turning ON and OFF conditions of the PFC controller.
It is primarily intended to be connected to a portion of the FB voltage, but any other signal could be used as well (such as a
rectified and averaged image of the DRV pin for instance). The purpose is to define the output power level at which the
front−end PFC turns ON and OFF, in order to reduce the standby consumption of the application.
It consists in a simple comparator with fixed 250 mV reference: when the voltage applied on the pin is higher than 250 mV,
GTS signal can turn on; and when it is lower than 250 mV, GTS signal is low. Additionally, when output of the comparator
is high an internal current source delivers 5 mA to the pin, allowing the creation of an offset on top of the signal applied: as this
offset disappears when the comparator turns off, it plays the same role as an hysteresis.
VDD
5 mA
Ext. Signal
(FB, Aux.)
RUP
Rhyst
+
GTS OK
−
+
250 mV
RLOW
Figure 2. Internal Configuration of ADJ_GTS Pin
Design Steps (Considering RHYST = 0)
• Choose the input signal levels at which GTS must turn on and off: VON and VOFF
• Find the division ratio of the input resistor divider based on the turn−on level (case where the internal 5 mA current
source is off):
h+
0.25
(eq. 1)
VON
• Find the equivalent resistance seen from the pin according to the turn−off level (case where the internal 5 mA current
source is on):
0.25 + h @ V OFF ) 5 @ 10 *6 @ R EQ
å R EQ +
0.25 * h @ V OFF
Knowing that
h+
5@
R LOW
R UP ) R LOW
(eq. 2)
10 *6
, and R EQ +
R UP @ R LOW
R UP ) R LOW
,
it may be deduced
R UP +
R EQ
h
(V ON * V OFF)
h
4
+ 2 @ 10 5 @ (V ON * V OFF) and R LOW + 1 * h @ R UP + 5 @ 10 @ (V * 0.25)
(eq. 3)
ON
• An additional constraint if the signal used is FB, is that RUP + RLOW must be greater than 20 kW in order not to disturb
FB behavior. If a smaller value is obtained, restart calculations with different VON and VOFF.
http://onsemi.com
3
AND8240
Pin 2: “BO” Pin
SMPS are designed for a given input range. When the input voltage is too low, the power supply tends to compensate by
sinking more current from the line to deliver the same output power. As a result, the power components may suffer from an
excessive heating and ultimately the SMPS may be destroyed. Another consequence is that as when the electricity network
weakens, its voltage tends to decrease, and as in this case SMPS tend to sink more current, electricity network gets weaker and
weaker and eventually collapses (it is the reason why this protection is called ‘brown−out’ protection).
A simple solution to protect at the same time the power supply and the network is to stop the SMPS controller when the input
voltage is too low. For this purpose Pin 2 offers a comparator with hysteresis able to stop the controller if the voltage applied
is too low. By applying an image of the input voltage on the pin, it becomes possible to authorize operation above a certain
level of mains only. The controller monitors this voltage and when the Pin 2 voltage is too low (i.e., when Vpin2 is below
240 mV), the controller stops pulsing and keeps disabled until this level exceeds 500 mV. The 260 mV hysteresis prevents the
instabilities that could result from the input voltage ripple. The brown−out protection is not latched: when the input voltage
(VIN) is below the target, the controller stops pulsing but it recovers operation as soon as (VIN) goes back within the acceptable
range.
Input Voltage
CMP
RBO1
CMP
5
Driver
+
−
RBO2
+
Driver is off
as long as
CMP is LOW
500 mV if CMP is LOW
240 mV if CMP is HIGH
VPin5
0.24 V
Figure 3. Internal Configuration of BO Pin
http://onsemi.com
4
0.5 V
AND8240
Which Input Voltage Should be Monitored?
• The PFC stage output voltage (“VBULK” − bulk voltage).
• “VSIN”, the PFC stage input voltage.
Figures 4 and 5 depict the two techniques.
VSIN
Vbulk
To Converter
PFC
Preconverter
RBO1
Input
Filtering
Capacitor
AC Line
Cbulk
+
2
RBO2
CBO1
Figure 4. Brown−Out Detection on VSIN
VSIN
Vbulk
To Converter
PFC
Preconverter
RBO1
AC Line
Input
Filtering
Capacitor
Cbulk
+
2
RBO2
CBO1
Figure 5. Brown−Out Detection on VBULK
We will focus on VSIN monitoring as this solution protects both PFC and SMPS stages. Figure 6 depicts VSIN behavior when
PFC stage starts.
400
200
0
Figure 6. Voltage Across the Input Diodes Bridge (VSIN) at PFC Startup
http://onsemi.com
5
AND8240
We clearly see two phases:
• The input voltage VSIN is a substantially constant voltage when the PFC stage is off. The input bridge acting as a peak
detector, the input voltage is flat and equates the AC line amplitude:
V IN + Ǹ2 @ V AC
(eq. 4)
Where VAC is the RMS voltage of the line. Hence, the voltage applied to BO pin is:
V BO + Ǹ2 @ V AC @
R BO2
(eq. 5)
R BO1 ) R BO2
This is the situation anytime when the PFC stage is off.
• The input voltage VSIN is a rectified sinewave when the PFC stage operates. If CBO1 is large enough to suppress the AC
component of BO voltage, pin 2 voltage is the following portion of the average value of VSIN:
V BO +
2 @ Ǹ2 @ V AC
p
@
R BO2
R BO1 ) R BO2
(eq. 6)
i.e. about 64% of the previous value. Therefore, the same line magnitude leads to a BO voltage that is 36% lower when the
PFC is working compared to the pin 2 level when it is off. That is why the NCP1381/82 features a 48% hysteresis
(VBOlow = 0.48 x VBOhigh). When the PFC stage starts operation, the input voltage equates the AC line peak. That is why the
initial threshold of the brown−out comparator is its upper one (VBO = VBOhigh = 500 mV when the NCP1381/82 starts
operation).
Design Steps:
RBO1 and RBO2 can be calculated by using the following procedure:
1. Fix the current drawn by RBO1 and RBO2 so that it is compatible with the standby requirements. For instance, choose
50 mA consumed when VBO reaches the 500 mV VBOhigh threshold.
2. Evaluate RBO2 by:
R BO2 +
0.5
50 @ 10 *6
+ 10 kW
(eq. 7)
3. Calculate RBO1 by:
V BO +
2 @ Ǹ2 @ VAC
50 @ 10 *6
[
Ǹ2 @ V
AChigh
50 @ 10 *6
(eq. 8)
Where VAChigh is the AC line RMS voltage above which the circuit enters operation. For instance, if the desired threshold is
85 Vac, RBO1 = 2.39 MW.
The threshold at which the power supply stops (VAClow) depends on the capacitor CBO1.
If CBO1 is infinite, it fully suppresses the AC component of the input voltage portion that is monitored. Hence, VBO is
proportional to the average of the rectified AC line voltage:
V BOlow +
2 @ Ǹ2 @ V AClow
p
As V AChigh + V BOhigh @
@
R BO2
R BO1 ) R BO2
å V AClow +
p @ V BOlow
2@
@
R BO1 ) R BO2
Ǹ2 @ R
BO2
.
(eq. 9)
B BOlow
R BO1 ) R BO2
we can deduce, i.e. V AClow + p @
@ V AChigh, i.e.
Ǹ2 @ R
2 V
BOhigh
BO2
VAClow = VAChigh x 75.4%. That means that if VAChigh = 85 V, VAClow = 64 V.
If VAClow is too low, reducing CBO1 will increase the ripple injected to BO pin, and as a result decrease the hysteresis.
Using a simple simulation circuit (as proposed in Figure 7) rapidly gives the right value for CBO1 and the desired VAClow. The
simulation result of Figure 8 gives the VBO ripple as a function of CBO1 in the case where:
V SIN + Ǹ2 @ 80 sin(w @ t)
(eq. 10)
To the light of this study, CBO1 = 470 nF is the capacitance necessary to have VAClow = 80 V.
http://onsemi.com
6
AND8240
VSIN
B1
Voltage
VAC
+
+
VPin5
R1
2390 k
−
V1
440 m 400
VSIN
340m 300
VPin5
V(VAC) > 0 ? V(VAC):
−V(VAC)
240m 200
R2
10 k
C1
470 n
140m 100
Figure 7. Brown−Out Detection Simulation Circuit
40m
0
890m
895m
900m
905m
910m
TIME (s)
Figure 8. Results of the Simulation for Circuit of Figure 7
Without simulation tools, the procedure consist in implementing a large CBO1 value (leading to a time constant RBO2 ⋅ CBO1
in the range of 20 ms in 50 Hz or 60 Hz line conditions) and decreasing it until VAClow reaches the wished value.
To Summarize
• Select RBO2 in the range of 10 kW (in order to limit the leakage current generated by the brown−out sensing network
•
around 50 mA).
Compute:
R BO1 + R BO2 @
ǒ
Ǹ2 @ V
AChigh
0.5
Ǔ
*1
(eq. 11)
• Implement CBO1 so that (RBO2⋅CBO1) is in the range of 20ms. Then measure VAClow and adjust CBO1 until VAClow has
the right value, knowing that reducing CBO1 increases VAClow.
We will see later that Overpower Protection is dependent on VBO voltage: to have an accurate protection, VBO should be
proportional to the input voltage of the SMPS stage, i.e. VBULK. But once PFC has started, VBULK is not any more an image
of the mains voltage: it means that even if VSIN goes below VAClow, PFC stage will still try to maintain VBULK high, and the
brown−out protection is not effective. So connecting VBO to VSIN is recommended, even if overpower protection is less
accurate. A solution to improve this protection is to use a “follower boost” type of PFC in which the output follows the input.
Pin 3: “DMG” Pin
In order to perform valley switching operation, NCP1381/82 monitors an auxiliary winding that gives an image of the voltage
appearing on the drain of the switching MOSFET (Figure 9). Each time the decreasing voltage on DMG pin crosses 0 V, an
internal comparator gives a clock signal to the internal latch that delivers the gate signal for the switching MOSFET (Figure 10).
The signal applied on DMG pin must be lower than 3.7 V in order not to activate the overvoltage protection, and the current
flowing in the negative clamping protection diode must be kept below 3 mA. Internal circuitry is depicted in Figure 11.
VDRAIN(t)
VDRAIN(t)
TW
Leakage
Ringing
3.0
1.0
1st Valley
0
0
Possible
Restart
2.0
tOFF
VIN
VPLATEAU
tON
Figure 9. Voltage Appearing on the Drain of
the Switching MOSFET
45 mV
0V
Figure 10. Corresponding Voltage Appearing
on Pin DMG
http://onsemi.com
7
AND8240
+
DMG
30k
10 V
−
DMG
Comp.
45 mV
+
10 V
Latch
Input
+
Vlatchdem
4V
+
DRV
Logic
−
4 ms
Mono
Stable
DRV
Figure 11. Internal Circuitry of DMG Pin
Design Steps:
• Knowing the plateau voltage VPLATEAU appearing on the auxiliary winding, calculate RDMG taking into account the
internal 30 kW pulldown resistor:
R DMG w 3 @ 10 4 @
V PLATEAU * 3.7
(eq. 12)
3.7
Verify that the current flowing through RDMG when ESD clamping diode is activated (+10 V during tOFF, −0.7V during tON)
is within specification (+/−3mA). If not, choose RDMG according to this maximum current, and then add an external resistor
between DMG pin and ground (in parallel to the internal 30 kW resistor) to ensure VDMG < 3.7 V during normal operation.
• Add a capacitor CDMG between DMG pin and ground in order to delay the turn−on to the exact valley of the Drain
signal. A first approximation for CDMG consists in measuring the period of the oscillation (due to LP the primary
inductance and CDRAIN the total capacitance on MOSFETs drain) appearing on the drain after demagnetization, or
estimate it by:
T OSC + 2 @ p @ Ǹ L P @ C DRAIN
(eq. 13)
The time Tdelay between the zero crossing and the exact valley is one fourth this period, minus the roughly 200 ns inherent
propagation delay of the controller:
T delay +
p Ǹ
@ L P @ C DRAIN * 2 @ 10 *7
2
(eq. 14)
Eventually choose CDMG so that (RDMG⋅CDMG) is in the range of Tdelay, and adjust it until the valley switching is correct.
Pin 4: “TIMER” Pin
The capacitor connected to this pin sets the duration of the fault timer, i.e. the delay after which the controller enters protection
mode after detecting an overload condition. Its main purpose is to allow the cold startup (during which, by definition, the output
is overloaded until the regulation level is reached), and to prevent any false triggering of the protection in a noisy environment.
This timer is also used to prevent PFC shutoff during transient activation of the skip mode.
It is built around an internal 10 mA current source that charges the external capacitor until a 4 V comparator toggles (See
Figure 12).
http://onsemi.com
8
AND8240
VDD
10 mA
Timer
+
FAULT
−
Reset
Timer
+
4V
Figure 12. Internal Circuitry of TIMER Pin
Design Steps:
Once the VCC capacitor is set (see VCC section below), it gives the minimum time duration TFAULT during which the
controller must deliver power in overload condition during start−up. CTIMER can then be estimated by:
C TIMER w
T FAULT @ 10 @ 10 *6
4
, i.e.
(eq. 15)
C TIMER w T FAULT @ 25 @ 10 *7.
For instance if TFAULT must be at least 80ms, CTIMER should be greater than 200nF.
Pin 5: “SKIP / OVP” Pin
This pin performs two functions: it allows the setting of the FB pin level at which the controller starts to skip pulses in order
to lower standby consumption, and at the same time provides a comparator to stop and latch the controller by any external
condition (See Figure 13).
FB
+
−
Skip
Comp.
DRV
Logic
VDD
32 mA
Latchoff
Comp.
SKIP/OVP
+
−
+
Latch
Input
3.5 V
25k
Figure 13. Internal Circuitry of Skip/OVP Pin
Design Steps:
• By default, skip level is set to 800 mV (32 mA through a 25 kW resistor), corresponding to 25% of maximum FB
•
•
voltage (See FB Pin Section). Adding an external resistor to ground allows decreasing skip level, while adding a resistor
from REF pin to Skip/OVP pin allows the increase of this level.
This pin being at rather high impedance, it is necessary to add a filtering capacitor, which value depends on the amount
of noise of the environment: a value from 100 nF to 1 mF is usually sufficient.
To perform a latch function, the best way is to drive the REF signal to Skip/OVP Pin through an optocoupler or a simple
bipolar transistor as exemplified in Figure 14.
http://onsemi.com
9
AND8240
Vref
Vref
OVP
OVP
SKIP
+
+
Latch
−
−
Latch
SKIP
SKIP
NTC
+
+
Vlatch
Vlatch
Vmax < 5 V!
Figure 14. Possible use of the Latch Function of Skip/OVP Pin
Pin 6: “FB” Pin
The voltage on FB pin is divided by 4 and compared to CS Pin voltage to elaborate the tON duration (NCP1381/82 is a
current−mode controller): it serves as a reference for the current sense comparator (See Figure 15). To simplify the connection
of an optocoupler, an internal 10 kW pullup resistor is provided: optocoupler transistor can thus directly be plugged between
FB pin and ground.
LEB
CS
Comparator
7
CS
6
FB
VDD
+
−
10k
/4
0.8 V
IP Flag
Figure 15. Internal Circuitry of FB Pin
Maximum CS pin voltage VCSmax is 0.8 V, corresponding to a maximum FB voltage of 3.2 V: when voltage on FB pin is
higher than 3.2 V, internal flag IP flag is raised and fault timer is started. If IPflag is still asserted when TIMER pin voltage
reaches 4 V, FAULT is detected and the controller enters protection mode: pulses are stopped, and VCC capacitor is discharged
at a constant 1.4 mA current down to 7 V. Then a new start−up phase takes place, leading to a low−frequency burst mode safe
for the power supply if the overload is still present. When the faulty condition disappears, the controller resumes normal
operation after the next restart attempt (See Figure 16). If a resistive load is connected to FB pin (to generate ADJ_GTS signal
for instance), it must be greater than 20 kW in order to allow the voltage on FB pin being greater than 3.2 V in overload
conditions.
http://onsemi.com
10
AND8240
VCC
VCCON
VCCmin
VCCLatch
Overload
FB
Max
IP Flag
TIMER
Figure 16. Typical Behavior in Overload Conditions
Pin 7: “CS” Pin
This pin performs two distinct functions: primary peak current reading and compensation for overpower protection.
Peak Current Reading
It is classically performed through the reading of the voltage appearing through a sense resistor connected between switching
MOSFETs source and ground. The internal maximum current sense level VCSmax is 0.8 V, so RSENSE must be calculated by:
R SENSE +
0.8
I pkmax
,
(eq. 16)
With Ipkmax the maximum peak primary current at the lowest input voltage and maximum output load.
A leading edge blanking (LEB) prevents any spike appearing during the first 350 ns after tON to toggle falsely the internal
current sense comparator. This LEB is usually enough, but if for some reasons an additional filtering is necessary, it is still
possible to add externally an RC filter.
Overpower Compensation
In the quasi−resonant mode of operation, the slope of the current during ON time is (VIN B LP), and is (N ⋅ VOUT) B (LP)
during OFF time. Thus for a given peak current Ipk, tON is shorter at high VIN than at low VIN, and tOFF is constant: so the
switching frequency FSW is higher at high VIN (See Figure 17).
http://onsemi.com
11
AND8240
Figure 17. tON Behavior at a Given Ipk for Different VIN
Knowing that:
P OUT + h @ P IN + h @ 1 @ L P @ I pk2 @ F SW (with h the efficiency),
2
(eq. 17)
It is clear that for a given Ipk, POUT is higher at high VIN than at low VIN. So for a constant output power, the peak current is
lower at high VIN than at low VIN (See Figure 18).
Figure 18. Ipk Behavior at a Given POUT for Different VIN
As the overload detection of NCP1381/82 is based on peak current detection, if an overpower protection is needed the voltage
applied on CS Pin at POUTmax must be the same at high VIN and low VIN. The solution consists in adding a compensation offset
proportional to VIN to the voltage sensed across the sense resistor. NCP1381/82 offers the possibility to easily create this offset
by activating an internal current source proportional to VBO during tON: this current flows out of pin CS and create an offset
proportional to VBO (which is proportional to VIN) through a series resistor (See Figure 19).
http://onsemi.com
12
AND8240
VIN
NCP1381/82
BO
TO BO
Comparator
2
CS
Comparator
I/V 85 mS
−
ROPP
CS
+
LEB
7
RSENSE
Figure 19. Internal Overpower Compensation Circuitry on CS Pin
Design Steps:
• Estimate peak current Ipk values at low VIN and high VIN for the maximum output power allowed. By neglecting the
delay between core reset and the real valley (it is small compared to the switching period at high output power), we can
estimate Ipk at a given VIN by:
I pk +
2 @ P OUT
h
@
ǒV1 ) N @ 1V Ǔ
IN
(eq. 18)
OUT
Thus calculate IpkmaxLV and IpkmaxHV, respectively max peak currents at low and high input voltages.
• In the case where no offset is added, we saw that:
R SENSE +
0.8
I pkmax
If an offset is added, we have at a given VIN:
R SENSE +
0.8 * V offset
I pkmax
As we know what is the value of VBO for a given VIN, we can calculate
V offset + R OPP @ V BO @ 85 @ 10 *6
Some lines of math eventually give:
R OPP +
0.8
85 @
10 *6
@
I pkmaxLV * I pkmaxHV
V BOHV @ I pkmaxLV * V BOLV @ I pkmaxHV
• Finally calculate RSENSE by using:
R SENSE +
0.8 * R OPP @ V BOLV @ 85 @ 10 *6
(eq. 19)
I pkmaxLV
Pin 8: “GND” pin
Reference ground for the controller.
Pin 9: “DRV” pin
By offering up to +500 mA/−800 mA peak, this pin allows to drive large QG MOSFETs without adding any additional
components.
http://onsemi.com
13
AND8240
Pin 10: “VCC” pin
This is the supply pin for the controller. It must be connected through a resistor to VBULK for start−up supply, and to an auxiliary
voltage for normal operation.
Design steps:
• Calculate VCC capacitor: it must be able to supply the controller during start−up before the auxiliary voltage is high
enough to take the hand, i.e. before the output reaches regulation. Startup VCC voltage is 15 V, and minimum operating
VCC is 10 V: the maximum voltage drop on VCC capacitor is thus 5 V. The current needed by the controller can be
estimated by ICC1 (for NCP1381/82 internal supply) added to the current necessary to drive the switching MOSFET,
given by the gate charge QG and the switching frequency FSW:
I DRV + Q G @ F SW
(eq. 20)
To simplify the calculation, an average frequency of 60 kHz can be used as a rather good estimation. If we call TREG the time
before the output reaches regulation, VCC capacitor must deliver ICC1 + IDRV during TREG without dropping more than 5 V.
Thus calculate:
C VCC u
(I CC1 ) I DRV) @ T REG
(eq. 21)
5
• Calculate the start−up resistor RSTART in order to fulfil the start−up time (TSTART) requirement:
T START +
C VCC @ VCC ON
(eq. 22)
I START
ISTART = (VBULK − VCC) B (RSTART) is minimum at low VIN when VCC reaches VCCON, thus:
R START t
T START
C VCC
@
V BULKmin * VCC ON
(eq. 23)
VCC ON
• Dissipated power in the start−up resistor at high input voltage is:
P START+
ǒV BULKmax * VCC minǓ
2
(eq. 24)
R START
This value will greatly contribute to the no−load standby power of the complete power supply. To reduce this wasted power,
several possibilities exist, for instance: allow longer startup time, allow higher maximum output power to reach earlier output
regulation, increase auxiliary voltage to supply VCC before reaching regulation (but voltage on VCC Pin must stay below 20 V).
A too big VCC capacitor leads to a too long start−up time, or to a too high standby power. But it is sometimes needed to keep
on supplying NCP1381/82 in no−load condition, where the power delivered by the auxiliary supply is very low. In this case,
it is possible to have a separate tank capacitor, different from the VCC capacitor (See Figure 20).
VBULK
RSTART
1M
VCC
CVCC
10 m
+
Ctank
100 m
18 V
+
AUX
Figure 20. Split Capacitor on VCC Pin
Pin 11: “GTS” Pin
VCC is applied to GTS through an internal low−resistance switch. It is intended to be connected directly to supply pin of the
front−end PFC controller.
Pin 12: “REF” Pin
A 5 V/10 mA reference voltage is available on pin REF. A filtering capacitor must be connected to this pin: 100 nF to 1 mF
(depending on the noisiness of the environment) is usually enough.
http://onsemi.com
14
AND8240
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
15
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
AND8240/D