NCP4302 Secondary Side Synchronous Flyback Controller The NCP4302 is a full featured controller and driver that provide all the control and protection functions necessary for implementing a synchronous rectifier operation in a flyback converter. With the use of the NCP4302, the space conscious flyback applications such as Adaptors, chargers, set top boxes can achieve significant efficiency improvements at minimal extra cost. In addition to the synchronous rectifier control, the IC incorporates an accurate TL431 type shunt regulator, current monitoring circuit and optocoupler driver to provide a single IC secondary solution. The NCP4302 works with any type of flyback topology (continuous mode, Quasi−resonant mode or discontinuous mode) – providing a high level of versatility. Features • Self−contained Control of Synchronous Rectifier in CCM, DCM, and • • • • • • • • • QR Flyback Applications Interface to External Signal for CCM Mode True Secondary Zero Current Detection High Gate Drive Currents (2.5 A Source/Sink) High Voltage Operation Current Sense Flexibility (MOSFET RDS(on) OR CS Resistor) Accurate Low Voltage Reference − NCP4302A 2.55 V, 1% − NCP4302B 1.275 V, 1% Programmable Independent Secondary Side ton and toff Delays Maximum Frequency of Operation up to 250 kHz These are Pb−Free Devices www.onsemi.com MARKING DIAGRAM 8 SO−8 D SUFFIX CASE 751 8 1 x A L Y W G 1 4302x ALYW G = Reference Voltage (A or B) = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package PIN CONFIGURATION SYNC/CS 1 8 VCC TRIG 2 7 DRV CATH 3 6 GND VREF 4 5 DLYADJ (Top View) Typical Applications • • • • • Notebook Adapters LCD TV Adapters Consumer Appliances such as DVD, VCR Power Over Ethernet Applications (IP phones, Wireless Access Points) Battery Chargers ORDERING INFORMATION Device Package Shipping† NCP4302ADR2G SO−8 (Pb−Free) 2500/Tape & Reel NCP4302BDR2G SO−8 (Pb−Free) 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2015 May, 2015 − Rev. 4 1 Publication Order Number: NCP4302/D NCP4302 PIN DESCRIPTION Pin Number Symbol Description 1 SYNC/CS Connected to the flyback winding. The current on this pin is sensed and used to turn on the Synchronous Rectification MOSFET (SRFET). This pin is also used to sense the zero crossing of the MOSFET current either using the RDS(on) of the SRFET or using an external current sense resistor connected between drain of the SRFET and the flyback winding. 2 TRIG Input pin for direct turn−off of the MOSFET. Typically connected to a signal from primary controller (for CCM mode) or a signal derived from the transformer (for QR mode). Has very short propagation delay to output (<50 ns). 3 CATH Feedback compensation pin for the TL431 shunt regulator. Has the capability to sinking 10 ma of opto current. 4 VREF Output voltage feedback through resistive divider connected to this pin. Regulated at 1.28 V (option B) or 2.55 V (option A). 5 DLYADJ A resistive divider between the power supply output and ground with the center point tied to the DLYADJ input pin allows for independent adjustment of the minimum ton and toff delay time. The maximum external capacitance from this pin to ground is 25 pF. 6 GND Return pin for the controller – connected to the output return. 7 DRV Drive output for external MOSFET – 2.5 A peak drive capability, internally clamped to 13.5 V (Maximum) 8 VCC Bias voltage for the controller. Maximum voltage is 28 V. MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Input Current VCC ICC −0.3 to 28 100 V mA Drive Voltage Current VDRV −0.3 to 18 100 V mA Drive Current Source Sink IDRV Analog and Logic Inputs Maximum Voltage Current 2.5 −2.5 Apk TRIG, VREF, DLYADJ −0.3 to 10 100 V mA SYNC/CS − 10 to 95 100 V mA TJ −40 to 125 °C Operating Junction Temperature Range Maximum Junction Temperature TJmax 150 °C Storage Temperature Range TSmax −65 to 150 °C Lead Temperature (Soldering, 10 s) TLmax 300 °C Reference input Current, continuous IREF −0.05 to 10 mA Total Power Dissipation PD 225 mW Thermal Resistance Junction−to−Ambient qJA 178 °C/W Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Pin 1−8: Human Body Model 2000 V per JEDEC Standard JESD22, Method A114E. Machine Model (MM) 200 V per JEDEC Standard JESD22, Method A115A. 2. This device contains Latch−up protection and exceeds ±100 ma per JEDEC Standard JESD78 www.onsemi.com 2 NCP4302 DRV VCC 30 V VCC Mngt. UVLO ON 10.4 V UVLO OFF 9.2 V CS in VCC DRV UV CS Out Reset Dominant CS SYNC/CS GND 95 V Dlyton ton and toff Comparators S Q R Q Dlyoff CATH 30 V VREF UV 10 V Idischarge ton and toff Ramp DLYADJ 10 V Icharge S Q R Q UV Cdelay 10 pF Charge Enable Discharge Enable TRIG 10 V Figure 1. Block Diagram www.onsemi.com 3 TL431 NCP4302 +VDC Vout + J2 NCP1230 1 PFC_Vcc HV 2 FB 8 6 3 CS VCC 4 5 GND DRV Vout DRV Vcc SYNC/CS D LYADJ TRIG VREF GND CATH + Figure 2. Typical Application www.onsemi.com 4 NCP4302 ELECTRICAL CHARACTERISTICS (VCC = 19 V, Sync frequency = 100 kHz, VREF = VKA (IKA = 1 mA), RS = 75 ohms, VTRIG = GND, CDRV = 1 nF, RDLYADJ = 30.1 k, VDLYADJ = 2.0 V, for typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, Max TJ = 150°C, unless otherwise noted) Rating Test Conditions Symbol Min Typ Max Unit VCC Start−up Threshold VCC ↑, SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V VCC(on) 9.6 10.4 11.2 V Stop Threshold VCC ↓, SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V VCC(off) 8.5 9.2 − V VCC shutdown Hysteresis VCC(on) – VCC(off) VCC(HYS) 0.9 1.2 1.4 V Supply current after turn−on no−load on DRV pin, SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V ICC1 − 2.7 5.6 mA Supply current after turn−on SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V ICC2 − 3.6 7.5 mA Output voltage rise−time 10−90% of the output signal SYNC/ CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V tr − − 40 ns Output voltage fall−time 10−90% of the output signal SYNC/ CS = 0 to −0.5 V, 100 kHz, 5 ms pulse, Trig = 0 V tf − − 40 ns IDRV(source) − 2.5 − Apk VDRV(H) 6.5 9.5 − V IDRV(sink) − 2.5 − Apk VDRV(L) − 160 500 mV VDRV(CLMP) − − 17 V DRIVE OUTPUT Output source current (Note 3) Driver high level output voltage ISOURCE = 200 mA, SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V, VCC = 12 V Output sink current (Note 3) Driver Output low level output voltage ISINK = 200 mA, SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V, VCC = 12 V Drive voltage internal clamp VCC = 28 V, SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V, DRVpin = 10 kW Minimum drive output voltage VCC = VCC(off) + 200 mV, DRV pin = 10 kW + 1 nF, SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V VDRV(MIN) 5.5 6.5 − V The total propagation delay from SYNC/CS to the DRV output SYNC/CS = +0.5 V to −0.5 V 100 kHz, 5 ms pulse, (Trig = 0 V)(Refer to the Drive Output specifications for Tr 50% of the output signal tp1 − 70 135 ns Zero Current Detection VSYNC/CS < −30 mV Is(zcd) 50 230 450 mA VS(ZCD) −30 − − mV SCSLeakage − − 10 mA trig−pw 75 − − ns SYNC/CS Current Sense Pin Offset Voltage at Zero Current Level (Note 3) SYNC/CS Leakage current VSYNC/CS = 95 V TRIGGER SECTION Minimum Trigger pulse duration SYNC/CS = 0 to −0.5 V 100 kHz, 5Ăms pulse, Trig ↑ Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Guaranteed by Design www.onsemi.com 5 NCP4302 ELECTRICAL CHARACTERISTICS (VCC = 19 V, Sync frequency = 100 kHz, VREF = VKA (IKA = 1 mA), RS = 75 ohms, VTRIG = GND, CDRV = 1 nF, RDLYADJ = 30.1 k, VDLYADJ = 2.0 V, for typical values TJ = 25°C, for min/max values TJ = −40°C to +125°C, Max TJ = 150°C, unless otherwise noted) Rating Test Conditions Symbol Min Typ Max Unit Vtrig 2.0 − 4.0 V tp2 − 25 85 ns TRIGGER SECTION Trigger Pulse Voltage for Gate turn−off SYNC/CS = 0 to −0.5 V 100 kHz, 5Ăms pulse, Trig ↑ Propagation delay from TRIG to DRV turn−off CDRV = no−load, SYNC/CS= −0.5 V 100 kHz, 5 ms pulse, Trig = 0−5 V ↑ TL431 CHARACTERISTICS Reference input voltage IKA = 5 mA, VKA = VREF NCP4302A VREF TJ = +25°C TJ = −40°C to +125°C Reference input voltage V 2.525 2.499 (IK = 5 mA, VKA = VREF) NCP4302B TJ = +25°C TJ = −40°C to +125°C 2.55 − 2.575 2.60 VREF V 1.262 1.249 1.275 − 1.288 1.301 Reference Input Current IKA= 10 mA IRef − 0.0018 4.0 mA Minimum CATH current for regulation ISOURCE ↑ 0 to 1 mA IKA − 0.5 1.0 mA Reference voltage line regulation DVKA = VCCon− 16 V, IKA = 1 mA VKA − 2.0 5.0 mV/V + DV REF DV KA Off−State CATH Current VKA = 18 V, VREF = 0 V (test circuit 2, VREF pin grounded) IOff − 11 20 mA Dynamic impedance VKA = VREF, DIKA = 1 mA to 10 mA ZKA − 0.62 1.5 W The maximum sink current capability (ISOURCE ↑ 0 to 10 mA) Isinkmax 10 − − mA The ton time delay SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V CDLYADJ internal = 10 pF (Vs = 2.0 V, Rth = 30.1 kW) ton(delay) 1.0 1.4 1.8 ms The min and max ton(delay) range (Note 3) * R2 = 190 kW, R3 = 57 kW * R2 = 499 kW, R3 = 39 kW (*See Figure 27) ton(range) 0.45 − − − − 2.0 The maximum and minimum input voltage operating range. (Note 3) The maximum capacitance from pin 5 to ground is 25 pF. VinDLYADJ 1.5 − 4.5 V IinDLYADJ 9 − 200 mA 2.8 3.8 4.8 ms 0.8 − − − − 4.6 ADJUSTABLE TIME DELAY The maximum and minimum input operating current into the DLYADJ pin (Note 3) The toff time delay SYNC/CS = 0 to −0.5 V 100 kHz, 5 ms pulse, Trig = 0 V CDLYADJ internal = 10 pF (Vs = 2.0 V, Rth = 30.1 k) toff(delay) The min and max toff(delay) range (Note 3) R2 = 66 k, R3 = 23.6 k * R2 = 408 k, R3 = 32.4 k (*See the schematic below) toff(range) ms ms Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Guaranteed by Design www.onsemi.com 6 NCP4302 TYPICAL CHARACTERISTICS VCC(off), VOLTAGE THRESHOLD (V) 9.4 VTRIG = 0 V 10.5 10.4 10.3 10.2 −50 −25 0 25 50 75 100 125 9.1 −25 0 25 50 75 100 125 Figure 1. VCC(on) Threshold vs. Junction Temperature Figure 2. VCC(off) vs. Junction Temperature 150 3.10 VTRIG = 0 V 1.30 1.25 1.20 1.15 1.10 1.05 −25 0 25 50 75 100 125 VCC = 19 V CDRV = No Load 2.70 2.30 1.90 1.50 −50 150 −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 3. VCC(HYS) vs. Junction Temperature Figure 4. Internal Current Consumption at No Load vs. Junction Temperature trise, OUTPUT VOLTAGE RISE TIME (ns) 4.40 ICC2, SUPPLY CURRENT (mA) 9.2 TJ, JUNCTION TEMPERATURE (°C) 1.35 VCC = 19 V 4.00 CDRV = 1 nF 3.60 3.20 2.80 2.40 −50 9.3 TJ, JUNCTION TEMPERATURE (°C) 1.40 1.00 −50 VTRIG = 0 V 9.0 −50 150 ICC1, SUPPLY CURRENT (mA) VCC(HYS), SHUTDOWN HYSTERESIS (V) VCC(on), VOLTAGE THRESHOLD (V) 10.6 −25 0 25 50 75 100 125 150 35.0 CDRV = 1 nF 30.0 25.0 20.0 15.0 10.0 5.0 0 −50 −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 5. Supply Current Consumption with 1 nF Load vs. Junction Temperature Figure 6. Drive Output Rise Time vs. Junction Temperature www.onsemi.com 7 NCP4302 10.5 25.0 VDRV(H), DRIVER OUTPUT HIGH VOLTAGE (V) CDRV = 1 nF 20.0 15.0 10.0 5.0 0 −50 −25 0 25 50 75 100 125 9.5 9.0 8.5 0 50 100 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 7. Drive Output Fall−time vs. Junction Temperature Figure 8. Driver Vout High vs. Junction Temperature 14 0.28 VDRV(clmp), DRIVE VOLTAGE INTERNAL CLAMP (V) 0.26 0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 −50 −25 0 25 50 75 100 125 VCC = 28 V 12 10 8 6 4 2 0 −50 150 −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 9. Driver Vout Low vs. Junction Temperature Figure 10. Vgate Clamp vs. Junction Temperature 10 150 90 VCC = VCC(off) + 200 mV Load = 10 kW + 1 nF 9.0 8.0 7.0 6.0 5.0 4.0 −50 10.0 8.0 −50 150 tp1, PROPAGATION DELAY FROM SYNC TO DRIVE OUTPUT (ns) VDRV(min), MINIMUM DRIVE OUTPUT VOLTAGE (V) VDRV(L), DRIVER OUTPUT LOW VOLTAGE (V) tfall, OUTPUT VOLTAGE FALL TIME (ns) TYPICAL CHARACTERISTICS −25 0 25 50 75 100 125 85 Cload = 1 nF 80 75 70 65 60 55 50 −50 150 −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 11. VOUT(min) vs. Junction Temperature Figure 12. tp1 Propagation Delay, SYNC/CS to DRIVE vs. Junction Temperature www.onsemi.com 8 NCP4302 TYPICAL CHARACTERISTICS VTRIG, TRIGGER PULSE VOLTAGE FOR GATE TURN−OFF (V) IS(zcd), ZERO CURRENT DETECTION CURRENT (mA) 300 250 200 150 100 50 −50 −25 0 25 50 75 100 125 3.0 2.9 −50 2.8 150 −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) Figure 13. Zero Current Detect Isource vs. Junction Temperature Figure 14. Trigger Pulse Voltage for Gate Turn−off vs. Junction Temperature 150 VREF, REFERENCE VOLTAGE (V) 2.60 80 70 60 50 40 30 20 −50 −25 0 25 50 75 100 125 150 Isource = 5 mA 2.55 2.50 2.45 2.40 −50 −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 15. tp2 Propagation Delay TRIG in to DRIVE Off, NO Load vs. Junction Temperature Figure 16. 2.55 V Reference (Option A) Voltage vs. Junction Temperature 170 40 IKA, MINIMUM CATH CURRENT FOR REGULATION (mA) tp2, PROPAGATION DELAY FROM TRIG TO DRV TURN−OFF(ns) 3.1 TJ, JUNCTION TEMPERATURE (°C) 90 IREF, REFERENCE INPUT CURRENT (nA) 3.2 35 30 25 20 15 10 5.0 0 −50 −25 0 25 50 75 100 125 150 160 150 140 130 120 −50 −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 17. 2.55 V Reference Input Current vs. Junction Temperature Figure 18. 2.55 V Reference Minimum Cathode Current for Regulation vs. Junction Temperature www.onsemi.com 9 NCP4302 TYPICAL CHARACTERISTICS Ioff, OFF−STATE CATH CURRENT (mA) VKA, REFERENCE VOLTAGE LINE REGULATION (mV/V) 3.2 3 2.8 2.6 2.4 2.2 2 1.8 1.6 −50 −25 0 25 50 75 100 125 150 14.0 13.0 12.0 11.0 10.0 9.0 8.0 7.0 6.0 −50 −25 VREF, REFERENCE VOLTAGE (V) ZKA, DYNAMIC IMPEDANCE (mW) 75 100 125 150 1.28 1000 900 800 700 600 500 400 −25 0 25 50 75 100 125 150 Isource = 5 mA 1.27 1.26 1.25 1.24 1.23 1.22 −50 −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 21. 2.55 V Reference Dynamic Impedance vs. Junction Temperature Figure 22. 1.275 V Reference Voltage (Option B) vs. Junction Temperature 1.55 150 5.5 1.50 toff, OFF TIME DELAY (ms) ton(delay), ON TIME DELAY (ms) 50 Figure 20. 2.55 V Reference Off−State Cathode Current vs. Junction Temperature Figure 19. 2.55 V Reference Line Regulation vs. Junction Temperature 1.45 1.40 1.35 1.30 1.25 −50 25 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) 300 −50 0 −25 0 25 50 75 100 125 150 5 4.5 4 3.5 3 −50 −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 23. ton Delay vs. Junction Temperature Figure 24. toff Delay vs. Junction Temperature www.onsemi.com 10 NCP4302 Detailed Operating Description SYNC/CS Input The NCP4302 is designed to operate either as a standalone IC or as a companion IC to a primary side controller to help achieve efficient synchronous rectification for flyback converter systems. It has high current gate driver along with fast logic circuitry to provide appropriately timed drive signals to a synchronous MOSFET used for output rectification in a flyback converter. With its novel architecture, the NCP4302 has enough versatility to increase the synchronous rectification efficiency under any operating mode without requiring too much complexity. In a synchronous rectification application after the primary side MOSFET is turned−off, the current in the secondary of the flyback transformer initially flows through the synchronous rectification MOSFET’s internal body diode. When this occurs, the drain of the MOSFET will be −0.5 to −1.0 V negative with respect to ground (the VF of the internal body diode) and the NCP4302 current sense differential amplifier will output a 230 mA current (typical). This current detection method is used by the NCP4302 to determine when current is flowing in the secondary of the transformer and the Synchronous Rectification MOSFET needs to be turned−on. The zero current detection senses the current with a slight negative offset so that the switch turn−off occurs without reversal of the current. Supply Section The NCP4302 works from an available bias supply that can range from 10.4 V to 28 V (typical). This allows direct connection to the output voltage of many adapters such as notebook and LCD TV adapters. As a result, the NCP4302 simplifies circuit operation compared to other devices which require specific bias power supplies (e.g. 5 V). The high voltage capability of the VCC is also a unique feature designed to allow operation across a broader range of applications. To prevent gate signal from operating under inadequate bias conditions, the NCP4302 features a UVLO circuit that turns on at 10.4 V (VCC rising) typical and turns off at 9.2 V typical (VCC falling). Cout Vout Current Sense Amplifier To Reset Dominant Flip−Flop Mirror 75 Gate Drive Section The NCP4302 features high current gate drivers delivering up to (>2.5 A peak) to achieve fast turn−on and turn−off requirements in a synchronous rectifier. Having a high gate drive current enables fast turn−on when SYNC/CS signal is received (to minimize body diode conduction at the peak of the current waveform) and fast turn−off when zero current or a TRIG signals are received (to prevent current reversal or cross conduction). The higher sink current also allows the MOSFET to be kept off during the instances when there is high dv/dt on the drain. The gate voltage is clamped at 13.5 V typical to prevent larger excursion of gate voltage than needed when VCC is operating from a 28 Vdc output. The propagation delays through the logic circuits and the gate drivers are kept at a minimum as shown in the specification table. Figure 25. Input Current Sense Adjustable ton Delay The SYNC/CS input to the NCP4302 is used as a Reset (through logic) input to the drive enable Flip Flop; refer to the internal block diagram of the NCP4302. When current flows in the secondary of the Flyback transformer any parasitic inductance due to printed wiring board traces, or component lead can cause the voltage at the SYNC/CS input to ring above ground (refer to Figure 26). This ringing may cause the controller dive output to turn−off. To eliminate this problem the NCP4302 has a programmable ton time which blanks the secondary voltage ringing by adding a minimum controller drive on time. SYNCHRONOUS MOSFET DRAIN VOLTAGE (V) 45.0 V 37.5 V 25.0 V 12.5 V V(U1:4) 0V 60 ms 70 ms 80 ms 90 ms 100 ms 110 ms Figure 26. Discontinuous Conduction Mode Drain Waveform www.onsemi.com 11 120 ms Time NCP4302 Adjustable toff Delay The minimum on time is set with a voltage divider with resistors R2 and R3 (refer to Figure 27). I in + ǒǒ V The SYNC/CS input to the NCP4302 is used as the Set input to the drive enable Flip Flop; refer to the internal block diagram of the NCP4302. Refering to the SPICE simulations (Figure 28), you can see that when the system is operating under light load conditions the transformer secondary voltage rings below ground when the current reaches zero. When this occurs, the CS amplifier output may be falsely triggered providing a Set input to the Drive Flip Flop, turning on the output drive. To prevent the controller from prematurely turning on the synchronous rectification MOSFET, the output of the current sense amplifier is connected to a logic block with a programmable off time delay. The toff(delay) can be independently programmed through the DLYADJ pin. 1 Ǔ * 0.7Ǔ @ Rth R3 out @ R3 ) R2 Where Rth is the Thevenin equivalent resistance and is calculated by: Rth + 1 R3 1 1 ) R2 This input current is then used to charge an internal 10 pF capacitor setting the minimum ton time. t on(delay) + 10 pF @ 4V I in Vout + Rupper R2 I in + ǒǒ V Cout R3 RS out @ 1 Ǔ * 0.7Ǔ @ R3 ) R2 100k R3 t off(delay) + 10 pF @ Rlower 3.35 V I in Iin DRV VCC D SYNC/CS TRIG GND LYADJ VREF CATH Figure 27. Typical Application SYNCHRONOUS MOSFET DRAIN VOLTAGE (V) 100 V 50 V 0V −50 V 100 ms V(U1:4) 110 ms 120 ms 130 ms Time 140 ms 150 ms 160 ms Figure 28. Discontinuous Conduction Mode Drain Waveform Trigger Input TRIG input is not used. It is recommended to ground the TRIG pin in these cases. The TRIG input is used to turn−off the synchronous MOSFET prior to its current reaching zero. This input is required in a CCM operating mode. While there are several ways to determine the TRIG input, the simplest way is to generate a pulse in the primary side that precedes the turn−on of the primary MOSFET and transformer couple that pulse to the secondary into the Trig input. In converters where the operating mode is always designed to be DCM or QRM, the Voltage Amplifier and Reference The NCP4302 incorporates an accurate TL431 type Shunt regulator with two reference voltage options. The NCP4302A has a 2.5 V reference and the NCP4302B has a 1.25 V reference. www.onsemi.com 12 NCP4302 TX1 Cout operate in CCM, CRM, or QR modes. The next sections cover the losses associated for each of the three operating modes. Rbias Discontinuous Conduction Mode The basic switching waveforms for the Flyback converter operating in DCM are shown in Figure 31. When the primary side MOSFET (SP in Figure 30) is turned−on current flows is the transformer primary and ramps up from zero to Ipeak. When the primary side MOSFET (SP) turns−off, the polarity of the transformer reverses and the energy stored in the transformer is transferred to the secondary. When the energy transfer from the transformer primary to the transformer secondary begins, (prior to the secondary side synchronous MOSFET turning−on) the secondary current flows through the internal body diode synchronous rectifiers MOSFETs (SS) and (SSD). To minimize the losses in the SSD, the propagation delay (tp1) must be low. Otherwise, there will be high losses associated with the secondary peak current and the SSD forward voltage drop (NCP4302 has a typical propagation delay of 50 ns). Rupper Rcomp Ccomp TL431 Rlower Figure 29. Typical Secondary Side Regulator When the TL431 is being used to regulate the output of a power supply it is typically configured as shown in Figure 29. Where the output from the power supply is sensed and divided down with a resistive divider made up of Rupper and Rlower. The center point of the divider is connected to the reference pin of the NCP4302. The divider ratio scales down the output voltage to match the reference voltage, 2.5 V or 1.25 V. V REF + V out @ P Tsecondary + P on ) P SW ) P diode R lower R lower ) R upper I out + The Rbias resistor in Figure 29 sets the current through the TL431, which must be greater than 0.5 mA to guarantee its performance under all operating conditions. @ (1 * D on) Ǹ1 *3D (eq. 2) on (eq. 3) Combining equations 2 and 3, I sec,rms 2 + Cout P on + SSD SP 2 I sec,rms + I sec,pk @ Vout Vin I sec,pk (eq. 1) SS 4 @ I out 2 3 @ (1 * D on) 4 @ I out 2 @ R DS(on) 3 @ (1 * D on) Using Synchronous Rectification (eq. 6) P diode + V F @ I out @ t delay (eq. 7) V V S + nin ) V out For a flyback converter to operate correctly with synchronous rectification there must be a delay between the time when the primary side MOSFET (SP Figure 30) and the secondary side Synchronous rectification MOSFETs (SS Figure 29) are conducting current. The NCP4302 can n is the transformer turns ratio Tdelay is the delay from the sync to the drive output www.onsemi.com 13 (eq. 5) P SW + 1 @ C OSS @ V S 2 @ f 2 Where: Iout is the dc output current VF is D is the duty cycle RDS(on) is the on resistance of the MOSFET Figure 30. Synchronous Rectifier (eq. 4) NCP4302 Discontinuous Condition Mode SP DRV SP DRV Ipeak Ipk Ivally IPRM ISEC,PK Body−Diode Conduction Time ISEC ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ISEC ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ Ipeak,sec SYNC DRV SYNC DRV Body−Diode Conduction Time tdelay1 tp1 Figure 31. Discontinuous Conduction Mode Waveforms tdelay2 TRIG tp1 is the propagation delay from the SYNC/CS input to the drive output. Figure 32. Continuous Conduction Mode Waveforms Continuous Conduction Mode P sync + P ON ) P Qrr ) P dP ) PP OFF When operating in continuous conduction mode (CCM) the current in the secondary doesn’t fall to zero prior to turning on the primary side MOSFET. To eliminate cross conduction losses (have the primary side MOSFET and secondary side MOSFET on at the same time) the trigger input to the NCP4302 must be utilized. A signal which leads the Primary Side (SP) MOSFET turning on must be coupled to the TRIG input of the NCP4302 which will turn−off the SS MOSFET referring to Figure 32. When the energy transfer begins in the transformer secondary, prior to the secondary side synchronous MOSFET turning−on, the secondary current flows through the synchronous rectifiers MOSFET’s (SS) internal body diode (SSD). To minimize the power loss in the internal body the controller propagation delay has been minimized in the NCP4302. I sec,RMS [ 2 ǒ I sec,peak * I sec,RMS [ ǒ DI L Ǔ sec 2 I sec,peak * DI L Ǹ1 * D Ǔ (eq. 9) 2 sec 2 (eq. 8) 1*D (eq. 10) (1 * D)T (eq. 11) Combining equations 9 and 10, DIL sec + V OUT ) V f LM n2 P on + I sec,RMS 2 @ R DS(on) ǒ P QRR + Q RR V OUT ) Ǔ V IN n (eq. 12) f P BODY_DIODE + V f @ I OUT @ f(t delay1 ) td delay2) ǒ Ǔ V P off + 1 @ C OSS V out ) nin 2 (eq. 13) (eq. 14) 2 @f (eq. 15) QRR is the recovery charge of the internal body diode Coss is the MOSFET drain to source capacitance LM is the transformer primary inductance www.onsemi.com 14 NCP4302 ILSEC ISEC,PK IL IOUT Figure 33. www.onsemi.com 15 NCP4302 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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