NCN8024RGEVB NCN8024R SOIC-28 Evaluation Board User's Manual http://onsemi.com EVAL BOARD USER’S MANUAL Introduction This document gives a detailed description of the NCN8024R Evaluation Boards (SOIC−28 version) with the Bill Of Material (BOM), board schematic and layout. The appropriate lab test setup is also provided. The NCN8024R Evaluation Boards have been designed to help for a quick evaluation of the NCN8024R Smart card interface device. This document has to be used with the NCN8024R datasheet. The datasheet contains full technical details regarding the NCN8024R specifications and operation. The board (FR4 material) is implemented in two metal layers. The top and Bottom layers have thicknesses of 35 mm. The PCB thickness is 1.6 mm with dimensions of 100 mm by 74 mm (see Figure 1). These evaluation boards can be used to evaluate the device performance. This evaluation board is the same than the NCN8024 device. C1 and C2 not populated constitute the only difference with the NCN8024 Evaluation Board. Figure 1. Evaluation Board − SOIC−28 Table 1. EQUIPMENT Description Regulated Power Supply Example of Equipment (Note 1) Main Features 200 mA DC Current Capability Qty Tektronix PS2520G 2 Multimeter Keitley 2000 or 2001 2 Sourcemeter Keitley 2400 1 Oscilloscope 500 MHz Bandwidth, Four Channel Scope, Min 1 Mbit Memory per Channel (Note 2) Tecktronix TDS744, 754 or 784/TDS5054 Series or Lecroy WR5060 TDS5104B, 1 GHz, 5GS/s 1 Voltage Probe 4 Probes 500 MHz Bandwidth Tektronix or Lecroy 4 Waveform Generator Pattern Genarator Agilent 81104A 80 MHz or HP8110A 150 MHz 2 Outputs 1 External Clock Input 1 SMB Cable 1. Equipment used in the context of this Application Note Manual. 2. Greater Scope memory per channel offers better resolution. Semiconductor Components Industries, LLC, 2012 June, 2012 − Rev. 0 1 Publication Order Number: EVBUM2128/D NCN8024RGEVB Test Procedure See Figure 2. Clock Frequency CLKDIV1 and CLKDIV2 select the frequency divider according to the Table 2. Initial Setups (Figure 2) The initial setups given here are recommended before starting measurements on the board. Set the CMDVCC/in the OFF Position (High) Set CLKDIV1 and CLKDIV2 into Low Position (Lowest Frequency Fclkin) Set 5V/3Vbar into a 5V Position As a Precaution, Turn the 1 kW Potentiometer to Obtain a Resistor Output Value of 1 kW, and then Connect the Jumper Table 2. CLOCK FREQUENCY CLKDIV1 CLKDIV2 Divider 1 0 DIV 1/1 1 1 DIV 1/2 0 1 DIV 1/4 0 0 DIV 1/8 Card Presence The socket we use is a normally open, so CDR-PRES/ has been chosen; nevertheless the CRD_PRES and CRD_PRES/ test points can also be used for signaling the presence of a card and starting up the circuit. DC Power Supplies Two power supplies are used to bias the demo board. VDDP is the input voltage of the DC-DC converter. VDD is the “digital” power supply which biases the input stages of the NCN8024 device (control and signal inputs). VDD and VDDP must be connected to the board for a correct operation. Connect the VDD Power Supply Using the 2 Pin Male Connector J1 Connect the VDDP Power Supply Using the 2 Pin Male Connector J2 Power up VDDP in the Range 4.85 V–5.5 V Power up VDD in the Range 2.7 V–5.5 V Start the Measurement To start the measurements, set the board as it follows: Set CLKDIV1 and CLKDIV2 to Select the Correct Frequency Set 5V/3Vbar to Select the Correct Output Voltage Jumpers: 1 kW Potentiometer Jumper: Not Connected to Start Measurement Finally, Toggle/CMDVCC from High to Low to Start the Device (Activation Sequence Run) Figure 2. SOIC−28 Board Description http://onsemi.com 2 NCN8024RGEVB Figure 3. Schematic http://onsemi.com 3 NCN8024RGEVB Table 3. BILL OF MATERIAL (BOM) Designator Qty Value Footprint Manufacturer Part Number C1, C2 2 CAP CER .1 mF 16 V 10% X7R 0603 Description 100 nF SM/C_0603H Do Not Populate Do Not Populate C3 1 CAP CER .22 mF 16 V X7R 10% 0805 220 nF SM/C_0805H TDK C2012X7R1C224K C4 1 CAP CER .33 mF 16 V X7R 10% 0805 330 nF SM/C_0805H TDK C2012X7R1C334K/1.25 C5, C6 2 CAP CER .1 mF 25 V 10% X7R 0805 100 nF SM/C_0805H Murata GRM21BR71E104KA01L C7 1 CAP CER 10 mF 6.3 V X5R 10% 1206 10 mF SM/C_1206H TDK C3216X5R0J106K/1.60 C8, C9 2 CAP CER .1 mF 25 V 10% X7R 0805 100 nF SM/C_0805H Murata GRM21BR71E104KA01L C10 1 Do Not Populate − SM/C_0603H Do Not Populate Do Not Populate C11, C12, C13, C14 4 Do Not Populate − SM/C_0603H Do Not Populate Do Not Populate C15, C16, C17 3 Do Not Populate − SM/C_0603H Do Not Populate Do Not Populate R1 1 RES 100 kW 1/4 W 5% 0805 SMD 100 kW SM/C_0805H Rohm Semiconductor ESR10EZPJ104 R2 1 Do Not Populate − SM/C_0603H Do Not Populate Do Not Populate R3, R9, R10, R11, R12 5 RES 0.0 W 1/10 W 0603 SMD 0 SM/C_0603H Stackpole Electronics Inc RMCF0603ZT0R00 R4 1 Single Turn Cermet Trimmer 1 kW, 0.5 W, 10%, 63M100R 1 kW CERMET-72PT Bourns 3386F-1-102TLF R5, R6, R7, R8 4 RES 10 kW 1/4 W 5% 1206 SMD 10 kW SM/C_1206H Rohm Semiconductor MCR18EZPJ103 SW1, SW2, SW3, SW4 4 PCB Slide Switches − INTER3-2,54 EAO 09.03290.01 TP1-TP5, TP11-TP13, TP15-TP21 15 CLKDIV1/2, 5 V/3 Vb, INT/, I/OUC, AUX1UC, AUX2UC, CLKIN, CRD_AUX1, _AUX2, _I/O, _CLK, _RST, /PRES, PRES, Clip Test Point Hole Diameter 1.0 mm − TP_1 Keystone 5000 TP6, TP7, TP8, TP9, TP10, TP14 6 /CMDVCC, VUP, VDD, VDDP, CRD_VCC, RSTIN, Clip Test Point Hole Diameter 1.6 mm − TP_1.6MMHOLE_KEYS TONE_5010 Keystone 5010 J1, J2 2 VDD, VDDP, 2 Pins, Male Connector, 5.08 mm Step − MSTBA2-5.08MM Phoenix Contact MSTBA2.52G5.08 J3, J4, J5 3 Ground: Strap, Brass, Diameter 1.0 mm, Pitch 10.16 mm, Height 9.9 mm − GND_STRP HARWIN D3082-46 J6, J7, J8 3 IDD, IDDP, ICC, Breakable Single Row, Header (2 Pins) − CON2-2.54 TYCO Amp 5-826629-0 J9, J10, J11, J12 4 Standoff Nut − Standoff Hole Keystone 1903C J9, J10, J11, J12 4 Standoff Screw − Standoff Hole Keystone 4814K-ND J13 1 SMB Connector − SMB/V Amphenol Connex 142138 U1 1 NCN8024R Smart Card Interface − SOIC−28 ON Semiconductor NCN8024RDWR2G U2 1 Smart Card Socket − SmartCard_ FCI_74343L0825S01 FCI 7434L0825S01LF http://onsemi.com 4 NCN8024RGEVB ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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