NCN8024R D

NCN8024R
Smart Card Interface IC
The NCN8024R is a single smart card interface IC. It is dedicated
for 3.0 V/5.0 V smart card reader/writer applications. The card VCC
supply is provided by a very low drop−out and low noise regulator
(LDO).
The device is fully compatible with the ISO 7816−3 and EMV
standards as well as with standards specifying conditional access in
Set−Top−Box (STB) including NDS.
The smart card interface IC is available in SOIC−28 and TSSOP−28
packages providing the industry−standard features required by STB
smart card interfaces.
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MARKING
DIAGRAMS
28
Features
• Single IC Card Interface
• Fully Compatible with ISO 7816−3, EMV and Related Standards
•
•
•
•
•
•
•
•
•
•
•
•
•
Including NDS and Other STB Standards (Nagravision, Irdeto, …)
Three Bidirectional Buffered I/O Level Shifters (C4, C7 and C8 Card
Pins)
3.0 V or 5.0 V ± 5% Regulated Card Power Supply such as ICC ≤
70 mA with 3.0 V ≤ VDDP ≤ 5.5 V @ 3.0 V (Class B) and 4.85 V ≤
VDDP ≤ 5.5 V @ 5.0 V (Class A)
Independent Power Supply Range on Controller Interface
(2.7 V < VDD < 5.5 V)
Handles 5.0 V and 3.0 V Smart Cards (Class A & B)
Thermal and Short Circuit Protection on all Card Pins
Support up to 27 MHz Clock with Internal Division Ratio 1/1, 1/2,
1/4 and 1/8 through CLKDIV1 and CLKDIV2 Pins
ESD Protection on Card Pins up to 8 kV+ (Human Body Model)
Activation/Deactivation Sequences (ISO7816)
Fault Protection Mechanisms Enabling Automatic Device
Deactivation in Case of Overload, Overheating, Card Take−off or
Power Supply Drop−out (OCP, OTP, UVP)
Interrupt Signal INT for Card Presence and Faults
External Under−Voltage Lockout Threshold Adjustment on VDD
(PORADJ Pin)
Available in Two Package Formats: SOIC−28 and TSSOP−28
These are Pb−Free Devices
NCN8024R
AWLYYWWG
SOIC−28
CASE 751F
TSSOP−28
CASE 948AA
1
NCNR
8024G
ALYW
NCN8024R = Specific Device Code
A
= Assembly Location
WL, L = Wafer Lot
YY, Y
= Year
WW, W = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information on page 13 of
this data sheet.
Typical Application
• Pay TV, Set−Top−Box Decoder with Conditional Access and
Pay−per−View
• Conditional Access Modules (CAM)
• POS / ATM
• Access Control, Identification
© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. 1
1
Publication Order Number:
NCN8024R/D
NCN8024R
VDDP
10 uF
100 nF
VDD
100 nF
VDDP
Microcontroller
VDD
VDD
R1
INT
CRD_PRES
PORADJ
DATAPORT
CRD_PRES
CMDVCC
5V/3V
CLKDIV1
NCN8024R
CONTROL
R2
CRD_VCC
CRD_RST
CLKIN
CRD_CLK
CRD_AUX1
CRD_AUX2
CRD_IO
RSTIN
CRD_GND
CLKDIV2
I/Ouc
SMART CARD
GND
100 nF
GND
220 nF
1
2
3
4
GNDP
AUX1uc
AUX2uc
GND
GND
Figure 1. Typical Smart Card Interface Application
CLKDIV1
1
28
AUX2uc
CLKDIV2
2
27
AUX1uc
5V/3V
3
26
I/Ouc
GNDP
4
25
NC
NC
5
24
CLKIN
VDDP
6
23
INT
NC
7
22
GND
NC
8
21
VDD
CRD_PRES
9
20
RSTIN
CRD_PRES
10
19
CMDVCC
CRD_I/O
11
18
PORADJ
CRD_AUX2
12
17
CRD_VCC
CRD_AUX1
13
16
CRD_RST
14
15
CRD_CLK
CRD_GND
Figure 2. SOIC−28 and TSSOP−28 Pinout (Top View)
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2
DET
DET
Vcc
RST
CLK
C4
GND
Vpp
I/O
C8
5 GND
6
7
8
NCN8024R
VDDP
VDD
21
6
9 CRD_PRES
Interrupt Block
INT 23
Card Detection
10 CRD_PRES
5V/3V
Supply Voltage
Monitoring
3
CMDVCC 19
PORADJ
18
CLKDIV1
1
CLKDIV2
2
3.0 V / 5.0 V LDO
17 CRD_VCC
14 CRD_GND
4
GNDP
Thermal Control
CLKIN
24
NC
25
RSTIN
20
I/Ouc
26
11
AUX2uc
27
13 CRD_AUX2
AUX1uc
28
12 CRD_AUX1
GND
22
Clock Dividers
15 CRD_CLK
Control Logic
and Sequencer
Card Pin
Drivers
16 CRD_RST
CRD_I/O
Figure 3. NCN8024R Block Diagram
PIN FUNCTION AND DESCRIPTION
Pin #
Name
Type
Description
1
CLKDIV1
Input
This pin coupled with CLKDIV2 is used to program the clock frequency division ratio (Table 1).
2
CLKDIV2
Input
This pin coupled with CLKDIV1 is used to program the clock frequency division ratio (Table 1).
3
5V/3V
Input
Allows selecting card VCC power supply voltage. CRD_VCC = 5 V when 5V/3V = HIGH or 3 V when
5V/3V = LOW
4
GNDP
GND
Regulator Power Supply Ground
5
NC
−
6
VDDP
Power
7
NC
−
Not Connected
8
NC
−
Not Connected
9
CRD_PRES
Input
Card presence pin active (card present) when CRD_PRES = Low. A built−in debounce timer of
about 8 ms is activated when a card is inserted. Convenient for Normally Open (NO) smart card
connector.
10
CRD_PRES
Input
Card presence pin active (card present) when CRD_PRES = High. A built−in debounce timer of
about 8 ms is activated when a card is inserted. Convenient for Normally Closed (NC) smart card
connector.
Not Connected
Regulator Power Supply
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3
NCN8024R
PIN FUNCTION AND DESCRIPTION
Pin #
Name
Type
Description
11
CRD_I/O
Input/
Output
This pin handles the connection to the serial I/O (C7) of the card connector. A bi−directional level
translator adapts the serial I/O signal between the card and the micro controller. An 11 kW (typical)
pullup resistor to CRD_VCC provides a High impedance state for the smart card I/O link.
12
CRD_AUX2
Input/
Output
This pin handles the connection to the chip card’s serial auxiliary AUX2 I/O pin (C8). A bi−directional
level translator adapts the serial I/O signal between the card and the micro controller. An 11 kW
(typical) pullup resistor to CRD_VCC provides a High impedance state for the smart card C8 pin.
13
CRD_AUX1
Input/
Output
This pin handles the connection to the chip card’s serial auxiliary AUX1 I/O pin (C4). A bi−directional
level translator adapts the serial I/O signal between the card and the micro controller. An 11 kW
(typical) pullup resistor to CRD_VCC provides a High impedance state for the smart card C4 pin.
14
CRD_GND
GND
15
CRD_CLK
Output
This pin is connected to the CLOCK card connector’s pin (Chip card’s pin C3). The Clock signal
comes from the CLKIN input through clock dividers and level shifter.
16
CRD_RST
Output
This pin is connected to the chip card’s RESET pin (C2) through the card connector. A level
translator adapts the external Reset (RSTIN) signal to the smart card.
17
CRD_VCC
Power
This pin is connected to the smart card power supply pin. An internal DC/DC converter is
programmable using the pin 5V/3V to supply either 5 V or 3 V output voltage. An external distributed
ceramic capacitor ranging from 80 nF to 1.2 mF recommended must be connected across
CRD_VCC and CRD_GND. This set of capacitor must be low ESR (< 100 mW).
18
PORADJ
Input
Power−on reset threshold adjustment input pin for changing the reset threshold with an external
resistor power divider. Recommended to be connected to ground when unused.
19
CMDVCC
Input
Command VCC pin. Activation sequence Enable/Disable pin (active Low). The activation sequence is
enabled by toggling CMDVCC High to Low and when a card is present.
20
RSTIN
Input
This Reset input connected to the host and referred to VDD (microcontroller side), is connected to
the smart card Reset pin through the internal level shifter which translates the level according to the
CRD_VCC programmed value.
21
VDD
Power
22
GND
GND
23
INT
Output
24
CLKIN
Input
25
NC
26
I/Ouc
Input/
Output
This pin is connected to an external micro−controller. A bi−directional level translator adapts the
serial I/O signal between the smart card and the external controller. A built−in constant 11 kW
(typical) resistor provides a high impedance state.
27
AUX1uc
Input/
Output
This pin is connected to an external micro−controller. A bi−directional level translator adapts the
serial C4 signal between the smart card and the external controller. A built−in constant 11 kW
(typical) resistor provides a high impedance state.
28
AUX2uc
Input/
Output
This pin is connected to an external micro−controller. A bi−directional level translator adapts the
serial C8 signal between the smart card and the external controller. A built−in constant 11 kW
(typical) resistor provides a high impedance state.
Card Ground
This pin is connected to the system controller power supply. It configures the level shifter input
stage to accept the signals coming from the controller. A 0.1 mF capacitor shall be used to bypass
the power supply voltage. When VDD is below 2.30 V typical the card pins are disabled.
Ground
The interrupt request is activated LOW on this pin. This is enabled when a card is present and the
card presence is detected by CRD_PRES or CRD_PRES pins. Similarly an interrupt is generated
when CRD_VCC is overloaded. 20 kW typical integrated pullup resistor to VDD.
Clock Input for External Clock
Not Connected
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4
NCN8024R
ATTRIBUTES
Characteristics
Values
ESD protection
Human Body Model (HBM) (Note 1)
Card Pins (Card Interface Pins 9 − 17)
All Other Pins
Machine Model (MM)
Card Pins (Card Interface Pins 9 − 17)
All Other Pins
Moisture sensitivity (Note 2) SOIC−28 and TSSOP−28
Flammability Rating Oxygen
8 kV
2 kV
400 V
150 V
Level 3
Index: 28 to 34
UL 94 V−0 @ 0.125 in
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch−up Test
1. Human Body Model (HBM), R = 1500 W, C = 100 pF.
2. For additional information, see Application Note AND8003/D.
MAXIMUM RATINGS (Note 3)
Rating
Symbol
Value
Unit
DC/DC Converter Power Supply Voltage
VDDP
−0.3 v VDDP v 5.5
V
Power Supply from Microcontroller Side
VDD
−0.3 v VDD v 5.5
V
CRD_VCC
−0.3 v CRD_VCC v 5.5
V
Charge Pump Output
VUP
−0.3 v VUP v 5.5
Digital Input Pins
Vin
−0.3 v Vin v VDD
V
Digital Output Pins (I/Ouc, AUX1uc, AUX2uc, INT)
Vout
−0.3 v Vout v VDD
V
Smart Card Output Pins
Vout
−0.3 v Vout v CRD_VCC
V
RqJA
75
76
°C/W
Operating Ambient Temperature Range
TA
−40 to +85
°C
Operating Junction Temperature Range
TJ
−40 to +125
°C
TJmax
+125
°C
Tstg
−65 to + 150
°C
External Card Power Supply
Thermal Resistance Junction−to−Air
SOIC−28
TSSOP−28
Maximum Junction Temperature
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C
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NCN8024R
POWER SUPPLY SECTION (VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 10 MHz)
Symbol
VDDP
Rating
Min
DC/DC Converter Power Supply,
CRD_VCC = 5 V
|ICC| v 70 mA (EMV Conditions)
|ICC| v 70 mA (NDS Conditions)
CRD_VCC = 3 V
|ICC| v 70 mA
Typ
Max
Unit
V
4.75
4.85
5.0
5.5
3.0
IDDP
Inactive Mode
−
−
1
mA
IDDP
DC Operating Supply Current, FCLKIN = 10 MHz,
CoutCRD_CLK = 33 pF, ⎢ICRD_VCC⎢ = 0 (CMDVCC = Low)
−
−
3.0
mA
IDDP
DC Operating Supply Current,
CRD_VCC = 5 V, ICRD_VCC = 70 mA
CRD_VCC = 3 V, ICRD_VCC = 70 mA
−
−
80
80
VDD
Operating Voltage
2.7
−
5.5
V
IVDD
Inactive Mode 0 Standby Current
−
−
60
mA
IVDD
Operating Current − FCLK_IN = 10 MHz,
CoutCRD_CLK = 33 pF, ⎢ICRD_VCC⎢ = 0 (CMDVCC = Low)
−
−
1
mA
2.20
2.30
2.40
V
50
100
180
mV
UVLOVDD
Undervoltage Lockout (UVLO), No External Resistor at Pin PORADJ (Connected to GND), Falling VDD Level
UVLOHys
UVLO Hysteresis, No External Resistor at Pin PORADJ
(Connected to GND) (Note 4)
mA
PORADJ PIN
VPORth+
External Rising Threshold Voltage on VDD for Power On Reset − Pin PORADJ
1.20
1.27
1.34
V
VPORth−
External Falling Threshold voltage on VDD for Power On Reset − Pin PORADJ
1.15
1.20
1.28
V
VPORHys
Hysteresis on VPORth (pin PORADJ) (Note 4)
30
80
100
mV
tPOR
Width of Power−On Reset Pulse (Note 4)
No External Resistor on PORADJ
External Resistor on PORADJ
4
4
8
8
12
12
IIL
Low Level Input Leakage Current, VIL<0.5 V (Pulldown Current Source)
5
ms
mA
LOW DROP OUT REGULATOR
CCRD_VCC
Output Capacitance on card power supply CRD_VCC (Notes 4 and 5)
80
100 +
220
1200
CRD_VCC
Output Card Supply Voltage (including ripple)
3.0 V CRD_VCC Mode @ ICC ≤ 70 mA
5.0 V CRD_VCC Mode @ ICC ≤ 70 mA with 4.85 V VDDP 5.5 V (NDS)
5.0 V CRD_VCC Mode @ ICC ≤ 70 mA with 4.75 V VDDP 5.5 V (EMV)
2.85
4.75
4.60
3.00
5.00
5.00
3.15
5.25
5.25
CRD_VCC
Current Pulses 40 nAs (t < 400 ns & |ICC| ≤ 200 mA peak)
3.0 V mode / Ripple ≤ 250 mV (2.9 V ≤ VDDP ≤ 5.5 V)
Current Pulses 40 nAs (t < 400 ns & |ICC| ≤ 200 mA peak)
5.0 V mode / Ripple ≤ 250 mV (4.85 V ≤ VDDP ≤ 5.5 V)
ICRD_VCC
2.70
4.60
3.00
5.00
3.20
5.25
70
70
Short−Circuit Current − CRD_VCC Shorted to Ground
DVCRD_VCC
CRD_VCCSR
V
V
Card Supply Current
@ CRD_VCC = 3.0 V
@ CRD_VCC = 5.0 V
ICRD_VCC_SC
nF
150
mA
Output Card Supply Voltage Ripple Peak−to−Peak − fripple = 100 Hz to
200 MHz (Load Transient with 65 mA Peak Current) (Note 4)
300
mV
Slew Rate on CRD_VCC Up or Down (Note 4)
0.22
V/ms
NOTE:
120
mA
Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
4. Guaranteed by design and characterization
5. These values take into account the tolerance of the cms capacitor used. The allowed values are single or distributed capacitor combination
not exceeding 1.2 mF with 100 nF + 220 nF typical and recommended. It is recommended to use X5R or X7R−type capacitors with very
low ESR (< 100 mW) for optimal performances.
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NCN8024R
HOST INTERFACE SECTION CLKIN, RSTIN, I/Ouc, AUX1uc, AUX2uc, CLKDIV1, CLKDIV2, CMDVCC, 5V/3V
(VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 10 MHz)
Symbol
FCLKIN
Rating
Clock Frequency on Pin CLKIN (with Divider Ratio w 2) (Note 6)
Min
Typ
Max
Unit
−
−
27
MHz
−0.3
−
0.3 x VDD
V
VIL
Input Voltage Level Low: CLKIN, RSTIN, I/Ouc, AUX1uc, AUX2uc, CLKDIV1,
CLKDIV2, CMDVCC, 5V/3V
VIH
Input Voltage Level High: CLKIN, RSTIN, I/O, AUX1, AUX2, CLKDIV1, CLKDIV2,
CMDVCC, 5V/3V
0.7 x VDD
−
VDD + 0.3
V
|IIL|
CLKDIV1, CLKDIV2, CMDVCC, RSTIN, CLKIN, 5V/3V Low Level Input Leakage
Current, VIL = 0 V
−
−
1.0
mA
|IIH|
CLKDIV1, CLKDIV2, CMDVCC, RSTIN, CLKIN, 5V/3V Low Level Input Leakage
Current, VIH = VDD
−
−
1.0
mA
VIL
Input Voltage Level Low: I/Ouc, AUX1uc, AUX2uc
−0.3
−
0.5
V
VIH
Input Voltage Level High: I/Ouc, AUX1uc, AUX2uc
0.7 x VDD
−
VDD + 0.3
V
|IIL|
I/Ouc, AUX1uc, AUX2uc Low Level Input Leakage Current, VIL = 0 V
−
−
600
mA
|IIH|
I/Ouc, AUX1uc, AUX2uc High Level Input Leakage Current, VIH = VDD
−
−
10
mA
0.9 x VDD
0.75 x VDD
−
−
VDD + 0.1
VDD + 0.1
V
V
Low Level Output Voltage (CRD_I/O= CRD_AUX1 = CRD_AUX2 = 0 V)
IOL = +1 mA
0
−
0.3
V
Input Rising/Falling Times (Note 6)
−
−
1.2
ms
Output Rising/Falling Times (Note 6)
−
−
0.1
ms
Fbidi
Maximum Frequency through Bidirectional I/O, AUX1 and AUX2 Channels (Note 6)
−
−
1
MHz
Rpu
I/0uc, AUX1uc, AUX2uc Pullup Resistor
8.0
11
16
kW
VOH
Output High Voltage
INT @ IOH = −15 mA (Source)
0.6 x VDD
−
−
VOL
Output Low Voltage
INT @ IOL = 2 mA (Sink)
0
−
0.30
RINT
INT Pullup Resistor
40
50
60
VOH
VOL
tRi/Fi
tRo/Fo
I/Ouc, AUX1uc, AUX2uc data channels, @ Cs v 30 pF
High Level Output Voltage (CRD_I/O = CRD_AUX1 = CRD_AUX2 = CRD_VCC)
IOH = 0
IOH = −40 mA for VDD > 2 V (IOH = −20 mA for VDD ≤ 2 V)
NOTE:
Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
6. Guaranteed by design and characterization
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7
V
V
kW
NCN8024R
SMART CARD INTERFACE SECTION, CRD_IO, CRD_AUX1, CRD_AUX2, CRD_CLK, CRD_RST, CRD_PRES,
CRD_PRES (VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 10 MHz)
Symbol
Rating
Min
Typ
Max
Unit
VOH
VOL
CRD_RST @ CRD_VCC = 3.0 V, 5.0 V
Output RESET VOH @ Irst = −200 mA
Output RESET VOL @ Irst = 200 mA
0.9 x CRD_VCC
0
−
−
CRD_VCC
0.20
V
V
VOH
VOL
Output RESET VOH @ Irst = −20 mA
Output RESET VOL @ Irst = 20 mA
0
CRD_VCC − 0.4
−
−
0.4
CRD_VCC
V
V
tR
tF
Output RESET Risetime @ Cout = 100 pF (Note 7)
Output RESET Falltime @Cout = 100 pF (Note 7)
−
−
−
−
100
100
ns
ns
td
RSTIN to CRD_RST Delay − Reset Enabled (Note 7)
−
−
2
ms
−
−
18
MHz
CRD_CLK @ CRD_VCC = 3.0 V or 5.0 V
FCRDCLK
Output Frequency (Note 7)
VOH
VOL
Output CRD_CLK VOH @ Iclk = −200 mA
Output CRD_CLK VOL @ Iclk = 200 mA
0.9 x CRD_VCC
0
−
−
CRD_VCC
+0.2
V
V
VOH
VOL
Output CRD_CLK VOH @ Iclk = −70 mA
Output CRD_CLK VOL @ Iclk = 70 mA
0
CRD_VCC −0.4
−
−
0.4
CRD_VCC
V
V
FDC
Output Duty Cycle (Note 7)
45
−
55
%
−
−
−
−
16
16
ns
ns
0.2
−
−
V/ns
2.3
1.6
0.30
−
−
CRD_VCC+0.3
CRD_VCC+0.3
0.80
V
V
V
600
10
mA
mA
CRD_VCC+0.1
V
0.30
V
1.2
ms
0.1
ms
trills
tulsa
Rise & Fall time (Note 5)
Output CRD_CLK Risetime @ Cout = 30 pF
Output CRD_CLK Falltime @ Cout = 30 pF
SR
Slew Rate @ Cout = 33 pF (Note 7)
CRD_AUX1, CRD_AUX2, CRD_IO @ CRD_VCC = 3.0 V, 5.0 V
VIH
VIH
VIL
IIL
IIH
Input Voltage High Level (5 V Mode)
Input Voltage High Level (3 V Mode)
Input Voltage Low Level
Low Level Input Current VIL = 0 V
High Level Input Current VIH = CRD_VCC
VOH
Output VOH
@ IOH = −40 mA
VOL
Output VOL
@ IOL = 1 mA, VIL = 0 V
tRi/Fi
tRo/Fo
RPU
−
−
0.75 x CRD_VCC
0
Input Rising/Falling Times
−
Output Rising/Falling Times / Cout = 80 pF
−
CRD_AUX1, CRD_AUX2, CRD_IO Pullup Resistor
−
−
−
−
−
−
8.0
11
16
kW
tIO
Propagation delay IOuc −> CRD_IO and CRD_IO −> IOuc (Falling
Edge) (Note 7)
−
−
200
ns
tpu
Active pull−up pulse width buffers I/O, AUX1 & AUX2 (Note 7)
−
200
−
ns
VIH
VIL
CRD_PRES, CRD_PRES
Card Presence Voltage High Level
Card Presence Voltage Low Level
0.7 x VDD
−0.3
NOTE:
VDD + 0.3
0.3 x VDD
V
Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
7. Guaranteed by design and characterization
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NCN8024R
SMART CARD INTERFACE SECTION, CRD_IO, CRD_AUX1, CRD_AUX2, CRD_CLK, CRD_RST, CRD_PRES,
CRD_PRES (VDD = 3.3 V; VDDP = 5 V; Tamb = 25°C; FCLKIN = 10 MHz)
Symbol
|IIH|
|IIL|
Rating
Min
CRD_PRES, CRD_PRES
High level input leakage current, VIH = VDD
CRD_PRES
CRD_PRES
Low level input leakage current, VIL = 0 V
CRD_PRES
CRD_PRES
Typ
Max
Unit
mA
3
10
1
3
1
10
5
8
12
ms
−
−
15
mA
ICRD_CLK CRD_CLK Current Limitation
−
−
70
mA
ICRD_RST CRD_RST Current Limitation
−
−
20
mA
Activation Time (Note 7)
30
−
100
ms
Deactivation Time (Note 7)
30
−
250
ms
Shutdown Temperature
−
160
−
°C
Tdebounce Debounce Time CRD_PRES and CRD_PRES (Note 7)
ICRD_IO
tact
tdeact
Temp SD
CRD_IO, CRD_AUX1, CRD_AUX2 Current Limitation
NOTE:
Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed
circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the
declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device
specification limit values are applied individually under normal operating conditions and not valid simultaneously.
7. Guaranteed by design and characterization
POWER SUPPLY
application, to adjust the VDD UVLO threshold. If not used
PORADJ pin is connected to Ground (recommended even
if it may be left unconnected).
The input supply voltage is continuously monitored to
prevent under voltage operation. At power up, the system
initializes the internal logic during POR timing and no
further signal can be provided or supported during this
period.
The system is ready to operate when the input voltage has
reached the minimum VDD. Considering this, the
NCN8024R will detect an Under−Voltage situation when
the input supply voltage will drop below 2.30 V typical.
When VDD goes down below the UVLO falling threshold a
deactivation sequence is performed.
The device is inactive during power−on and power−off of
the VDD supply (8 ms reset pulse).
PORADJ pin is used to modify the UVLO threshold
according to the below relationship considering an external
resistor divider R1 / R2 (see block diagram Figure 1):
The NCN8024R smart card interface has two power
supplies: VDD and VDDP.
VDD is usually common to the system controller and the
interface. The applied VDD ranges from 2.7 V up to 5.5 V.
If VDD goes below 2.30 V typical (UVLOVDD) a
power−down sequence is automatically performed. In that
case the interrupt (INT) pin is set Low.
A Low Drop−Out (LDO) and low noise regulator is used
to provide the 3 V or 5 V power supply voltage (CRD_VCC)
to the card. VDDP is the LDO’s input voltage. CRD_VCC is
the LDO output. The typical distributed reservoir output
capacitor connected to CRD_VCC is 100 nF + 220 nF. To
minimize dI/dt effects the capacitor of 100 nF is connected
as close as possible to the CRD_VCC’s pin and the 220 nF
one as close as possible to the card connector C1 pin. Both
feature very low ESR values (lower than 50 mW). The
decoupling capacitors on VDD and VDDP respectively
100 nF and 10 mF have also to be connected close to the
respective IC pins.
The CRD_VCC pin can source up to 70 mA continuously
over the VDDP range, the absolute maximum current being
internally limited below 150 mA (Typical at 120 mA).
There’s no specific sequence for applying VDD or VDDP.
They can be applied to the interface in any sequence. After
powering the device INT pin remains Low until a card is
inserted.
UVLO + R1 ) R2 V POR
R2
If PORADJ is connected to Ground the VDD UVLO
threshold (VDD falling) is typically 2.30 V. In some cases it
can be interesting to adjust this threshold at a higher value
and by the way increase the VDD supply dropout detection
level which enables a deactivation sequence if the VDD
voltage is too low.
For example, there are microcontrollers for which the
minimum supply voltage insuring a correct operating is
higher than 2.70 V, increasing UVLOVDD (VDD falling) is
consequently necessary. Considering for instance a resistor
SUPPLY VOLTAGE MONITORING
The supply voltage monitoring block includes the Power
On Reset (POR) circuitry and the under voltage lockout
(UVLO) detection (VDD voltage dropout detection).
PORADJ pin allows the user, according to the considered
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9
NCN8024R
STANDBY MODE
bridge with R1 = 56 kW, R2 = 42 kW and VPOR− = 1.20 V
typical the VDD dropout detection level can be increased up to:
After a Power−on reset, the circuit enters the standby
mode. A minimum number of circuits are active while
waiting for the microcontroller to start a session:
• All card contacts are inactive
• Pins I/Ouc, AUX1uc and AUX2uc are in the
high−impedance state (11 kW pull−up resistor to VDD)
• Card pins are inactive and pulled Low
• Supply Voltage monitoring is active
UVLO + 59k ) 42k V POR − + 2.75 V
42k
The minimum dropout detection voltage should be higher
than 2 V.
The maximum detection level may be up to VDD.
CLOCK DIVIDER:
The input clock can be divided by 1/1, 1/2, 1/4, or 1/8,
depending upon the specific application, prior to be applied
to the smart card driver. These division ratios are
programmed using pins CLKDIV1 and CLKDIV2 (see
Table 1). The input clock is provided externally to pin
CLKIN.
POWER−UP
In the standby mode the microcontroller can check the
presence of a card using the signals INT and CMDVCC as
shown in Table 2:
Table 2. Card Presence State
Table 1. Clock Frequency Programming
CLKDIV1
CLKDIV2
FCRD_CLK
0
0
CLKIN/8
0
1
CKLKIN / 4
1
0
CLKIN
1
1
CLKIN / 2
INT
CMDVCC
State
HIGH
HIGH
Card present
LOW
HIGH
Card not present
If a card is detected present (CRD_PRES or CRD_PRES
active) the controller can start a card session by pulling
CMDVCC Low. Card activation is run (t0, Figure 5). This
Power−Up Sequence makes sure all the card related signals
are LOW during the CRD_VCC positive going slope. These
lines are validated when CRD_VCC is stable and above the
minimum voltage specified. When the CRD_VCC voltage
reaches the programmed value (3.0 V or 5.0 V), the circuit
activates the card signals according to the following
sequence (Figure 5):
• CRD_VCC is powered−up at its nominal value (t1)
• I/O, AUX1 and AUX2 lines are activated (t2)
• Then Clock channel is activated and the clock signal is
applied to the card (typically 500 ns after I/Os lines)
(t3)
• Finally the Reset level shifter is enabled (typically
500 ns after clock channel) (t4)
The clock can also be applied to the card using a RSTIN
mode allowing controlling the clock starting by setting
RSTIN Low (Figure 4). Before running the activation
sequence, that is before setting Low CMDVCC RSTIN is set
High. The following sequence is applied:
• The Smart Card Interface is enable by setting
CMDVCC LOW (RSTIN is High).
• Between t2 (Figure 4) and t5 = 200 ms, RSTIN is reset
to LOW and CCLK will start precisely at this moment
allowing a precise count of clock cycles before toggling
CRST Low to High for ATR (Answer To Reset)
request.
• CRST remains LOW until 200 ms; after t5 = 200 ms
CRST is enabled and is the copy of RSTIN which has
no more control on the clock.
The clock input stage (CLKIN) can handle a 27 MHz
maximum frequency signal. Of course, the ratio must be
defined by the user to cope with Smart Card considered in
a given application
In order to avoid any duty cycle out of the 45% / 55%
range specification, the divider is synchronized by the last
flip flop, thus yielding a constant 50% duty cycle, whatever
be the divider ratio 1/2, 1/4 or 1/8. On the other hand, the
output signal Duty Cycle cannot be guaranteed 50% if the
division ratio is 1 and if the input Duty Cycle signal is not
within the 46 − 56% range at the CLKIN input.
When the signal applied to CLKIN is coming from the
external controller, the clock will be applied to the card
under the control of the microcontroller or similar device
after the activation sequence has been completed.
DATA I/O, AUX1 and AUX2 LEVEL SHIFTERS
The three bidirectional level shifters I/O, AUX1 and
AUX2 adapt the voltage difference that might exist between
the micro−controller and the smart card. These three
channels are identical. The first side of the bidirectional
level shifter dropping Low (falling edge) becomes the driver
side until the level shifter enters again in the idle state pulling
High CRD_IO and I/Ouc.
Passive 11 kW pull−up resistors have been internally
integrated on each terminal of the bidirectional channel. In
addition with these pull−up resistors, an active pull−up
circuit provides a fast charge of the stray capacitance.
The current to and from the card I/O lines is limited
internally to 15 mA and the maximum frequency on these
lines is 1 MHz.
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10
NCN8024R
If controlling the clock with RSTIN is not necessary
(Normal Mode), then /CMDVCC can be set LOW with
RSTIN LOW. In that case, CLK will start minimum 500 ns
after the transition on I/O (Figure 5), and to obtain an ATR,
CRST can be set High by RSTIN also about 500 ns after the
clock channel activation (tact).
The internal activation sequence activates the different
channels according to a specific hardware built−it sequencing
internally defined but at the end the actual activation
sequencing is the responsibility of the application software
and can be redefined by the micro−controller to comply with
the different standards and the different ways the standards
manage this activation (for example light differences exist
between the EMV and the ISO7816 standards).
CMDVCC
CVCC
ATR
CIO
CCLK
RSTIN
CRST
t0
t1 t2
t4
t5
−200 ms
Figure 4. Activation Sequence − RSTIN mode (RSTIN Starting High)
CMDVCC
CVCC
CIO
ATR
CCLK
RSTIN
CRST
t0
t4
t1 t2 t3
tact
Figure 5. Activation Sequence − Normal Mode
POWER−DOWN
• CRD_CLK is set Low 12 ms after CRD_RST.
• CRD_IO, CRD_AUX1 and CRD_AUX2 are pulled Low
• Finally CRD_VCC supply can be shut−off.
When the communication session is completed the
NCN8024R runs a deactivation sequence by setting High
CMDVCC. The below power down sequence is executed:
• CRD_RST is forced to Low
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11
NCN8024R
CMDVCC
CRD_RST
CRD_CLK
CRD_IO
CRD_VCC
tdeact
Figure 6. Deactivation Sequence
• Card pin current limitation: in the case of a short circuit
FAULT DETECTION
In order to protect both the interface and the external smart
card, the NCN8024R provides security features to prevent
failures or damages as depicted here after.
• Card extraction detection
• VDD under voltage detection
• Short−circuit or overload on CRD_VCC
to ground. No feedback is provided to the external MPU.
• LDO operation: the internal circuit continuously senses
•
•
•
the CRD_VCC voltage (in the case of either over or
under voltage situation).
LDO operation: under−voltage detection on VDDP or
overload on VUP
Overheating
Card pin current limitation: in the case of a short circuit
to ground. No feedback is provided to the external
MPU
CRD_PRES
INT
CMDVCC
Debounce
Debounce
CRD_VCC
Powerdown Resulting of
Card Extraction
Powerdown Caused by
Short−Circuit
Figure 7. Fault Detection and Interrupt Management
Interrupt Pin Management:
During a card session, CMDVCC is Low and INT pin
goes Low when a fault is detected. In that case a deactivation
is immediately and automatically performed (see Figure 6).
When the microcontroller resets CMDVCC to High it can
sense the INT level again after having got completed the
deactivation.
As illustrated by Figure 7 the device has a debounce timer
of 8 ms typical duration. When a card is inserted, output INT
goes High only at the end of the debounce time. When the
card is removed a deactivation sequence is automatically
and immediately performed and INT goes Low.
A card session is opened by toggling CMDVCC High to
Low.
Before a card session, CMDVCC is supposed to be in a
High position. INT is Low if no card is present in the card
connector (Normally open or normally closed type). INT is
High if a card is present. If a card is inserted (INT = High)
and if VDD drops below the UVLO threshold then INT pin
drops Low immediately. It turns back High when VDD
increases again over the UVLO limit (including hysteresis),
a card being still present.
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12
NCN8024R
ESD PROTECTION
CRD_RST,
CRD_CLK,
CRD_IO,
CRD_AUX1,
CRD_AUX2, CRD_PRES and CRD_PRES pins can sustain
8 kV. The CRD_VCC pin has the same ESD protection and
can source up to 70 mA continuously, the absolute
maximum current being internally limited with a max at
150 mA. The CRD_VCC current limit depends on VDDP
and CRD_VCC.
The NCN8024R includes devices to protect the pins
against the ESD spikes voltages. To cope with the different
ESD voltages developed across these pins, the built in
structures have been designed to handle either 2 kV, when
related to the micro controller side, or 8 kV when connected
with the external contacts (HBM model). Practically, the
VDD
+3.3V
XTAL1 XTAL2
CLKDIV1
AUX2uc
CLKDIV2
AUX1uc
I/Ouc
5V/3V
100 nF
10 mF
CLKIN
NC
INT
VDDP
NC
GND
NC
VDD
CMDVCC
CRD_PRES
CRD_I/O
100 kW
100 nF
RSTIN
CRD_PRES
VDD
+3.3V
3.3 V Microcontroller
NC
GNDP
PORADJ
CRD_AUX2
CRD_VCC
CRD_AUX1
CRD_RST
CRD_GND
CRD_CLK
Optional R1/R2 resistor divider − if not
used PORADJ has to be connnected to
R1 Ground
R2
220 nF
100 nF
1
VCC
GND
2
RST
VPP
3
CLK
I/O
4
C4
C8
5
6
7
8
DET
Normally Open
SMART CARD
Figure 8. Application Schematic
ORDERING INFORMATION
Package
Shipping†
NCN8024RDWR2G
SOIC−28
(Pb−Free)
1000 / Tape & Reel
NCN8024RDTBR2G*
TSSOP−28
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Consult Sales Office
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13
NCN8024R
PACKAGE DIMENSIONS
SOIC−28 WB
CASE 751F−05
ISSUE H
−X−
D
28
15
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBER
PR5OTRUSION SHALL NOT BE 0.13 TOTATL IN
EXCESS OF B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
H
E
0.25
M
Y
M
−Y−
1
14
PIN 1 IDENT
A
L
0.10
G
B
0.025
M
T X
S
−T−
A1
Y
SEATING
PLANE
C
M
S
SOLDERING FOOTPRINT*
8X
11.00
28X
1.30
1
28
28X
0.52
1.27
PITCH
14
15
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
DIM
A
A1
B
C
D
E
G
H
L
M
MILLIMETERS
MIN
MAX
2.35
2.65
0.13
0.29
0.35
0.49
0.23
0.32
17.80
18.05
7.40
7.60
1.27 BSC
10.05
10.55
0.41
0.90
0_
8_
NCN8024R
PACKAGE DIMENSIONS
TSSOP28
CASE 948AA
ISSUE A
e
28
PIN ONE
LOCATION
2X
0.20 C B A
15
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
1
B
DETAIL A
E1 E
14
A
0.05
A
D
0.10 C
A
A2
A
SEATING
PLANE
C
28X
A1
b
02
0.10 C B A
S
H
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
R1
(b)
c
R
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE
0.08 MM TOTAL IN EXCESS OF THE “b”
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
4. DATUMS A AND B TO BE DETERMINED
AT DATUM PLANE H.
DIM
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
R
R1
S
01
02
03
MILLIMETERS
MIN
MAX
−−−
1.20
0.05
0.15
0.80
1.05
0.19
0.30
0.19
0.25
0.09
0.20
0.09
0.16
9.60
9.80
6.40 BSC
4.30
4.50
0.65 BSC
0.45
0.75
1.00 REF
0.09
−−−
0.09
−−−
0.20
−−−
0_
8_
12 _ REF
12 _ REF
GAUGE PLANE
c1
SECTION A−A
L
(L1)
0.25
b1
03
RECOMMENDED
SOLDERING FOOTPRINT*
28X
01
DETAIL A
0.42
28X
1.15
6.70
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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For additional information, please contact your local
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NCN8024R/D