MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS NMP (Taping) CASE 135AD ISSUE B DATE 14 JUL 2015 A2 E H A D DIM A A2 b b2 b3 c D E e H L L1 L2 L1 L2 L 2X b3 3X MILLIMETERS MIN MAX 2.30 2.70 0.85 1.25 0.40 0.60 0.50 0.70 0.75 1.05 0.35 0.55 4.30 4.70 6.70 7.10 2.44 2.64 0.80 1.20 14.50 15.50 0.80 1.20 0.80 1.20 c SIDE VIEW b2 3X 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. 4. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. b e TOP VIEW END VIEW DOCUMENT NUMBER: STATUS: 98AON78697E ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 NMP (TAPING) http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON78697E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION FROM SANYO ENACT# TC−00000733 TO ON SEMICONDUCTOR. REQ. BY D. TRUHITTE. 31 MAR 2012 A CHANGED DOCUMENT TITLE AND DESCRIPTION TO NMP (TAPING). REQ. BY D. TRUHITTE. 31 MAY 2012 B MODIFED A2 DIMENSION. REDREW TO ON SEMICONDUCTOR AND JEDEC STANDARDS. REQ. BY H. SAKAI. 14 JUL 2015 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2015 July, 2015 − Rev. B Case Outline Number: 135AD