MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−143 CASE 318A−06 ISSUE U DATE 07 SEP 2011 SCALE 4:1 D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIM UM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO TRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, AND GATE BURRS SHALL NOT EXCEED 0.25 PER SIDE. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL NOT EXCEED 0.25 PER SIDE. 5. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 6. DATUMS A AND B ARE DETERMINED AT DATUM H. e D A GAUGE PLANE E SEATING PLANE L L2 DETAIL A E1 b1 e1 B 3X b 0.20 TOP VIEW H c A A1 c 0.10 C C SIDE VIEW C A-B D M DETAIL A SEATING PLANE END VIEW MILLIMETERS MIN MAX 0.80 1.12 0.01 0.15 0.30 0.51 0.76 0.94 0.08 0.20 2.80 3.05 2.10 2.64 1.20 1.40 1.92 BSC 0.20 BSC 0.35 0.70 0.25 BSC DIM A A1 b b1 c D E E1 e e1 L L2 GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT 1.92 XXX MG G 1 4X 0.75 XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 2.70 0.20 3X 0.96 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 0.54 DIMENSIONS: MILLIMETERS STYLE 1: PIN 1. 2. 3. 4. COLLECTOR EMITTER EMITTER BASE STYLE 2: PIN 1. 2. 3. 4. SOURCE DRAIN GATE 1 GATE 2 STYLE 3: PIN 1. 2. 3. 4. GROUND SOURCE INPUT OUTPUT STYLE 4: PIN 1. 2. 3. 4. STYLE 7: PIN 1. 2. 3. 4. SOURCE GATE DRAIN SOURCE STYLE 8: PIN 1. 2. 3. 4. SOURCE GATE DRAIN N/C STYLE 9: PIN 1. 2. 3. 4. GND IOUT VCC VREF STYLE 10: PIN 1. DRAIN 2. N/C 3. SOURCE 4. GATE DOCUMENT NUMBER: STATUS: 98ASB42227B ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 OUTPUT GROUND GROUND INPUT SOT−143 http://onsemi.com 1 STYLE 5: PIN 1. 2. 3. 4. SOURCE DRAIN GATE 1 SOURCE STYLE 6: PIN 1. 2. 3. 4. GND RF IN VREG RF OUT STYLE 11: PIN 1. SOURCE 2. GATE 1 3. GATE 2 4. DRAIN Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98ASB42227B PAGE 2 OF 2 ISSUE U REVISION REDREW TO JEDEC STANDARDS. ADDED SOLDER FOOTPRINT. REQ. BY D. TRUHITTE. DATE 07 SEP 2011 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2011 September, 2011 − Rev. 06U Case Outline Number: 318A