PLCC 52 QGW

Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
52‐Lead, Plastic J‐Leaded Chip Carrier (PLCC)
52J
GPC
QGW
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
Amkor Philippines
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Epoxy Resin A
Epoxy Resin B
Diluent
Phenolic Hardener
Butyl Cellosolve Acetate
Dicyandiamide
7440‐22‐4
9003‐36‐5
Proprietary
Proprietary
92‐88‐6
112‐07‐2
461‐58‐5
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica (Amorphous)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
29690‐82‐2
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
551.620
13.592
0.566
0.566
566.345
13.787
13.787
0.723
0.095
0.095
0.028
0.015
0.010
0.003
0.968
1.255
1.255
0.558
0.558
2232.438
201.285
83.651
83.651
13.070
2614.096
25.231
25.231
3222.240
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
74.7
747000
9.8
98000
9.8
98000
2.9
29000
1.5
15000
1.0
10000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
85.4
854000
7.7
77000
3.2
32000
3.2
32000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
17.12
171192
0.42
4218
0.02
176
0.02
176
17.58
175761
0.43
4279
0.43
4279
0.02
224
0.00
29
0.00
29
0.00
9
0.00
5
0.00
3
0.00
1
0.03
300
0.04
389
0.04
389
0.02
173
0.02
173
69.28
692822
6.25
62468
2.60
25961
2.60
25961
0.41
4056
81.13
811267
0.78
7830
0.78
7830
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China
RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by
a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
August 19, 2015
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.