AN11295 BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application Rev. 1 — 14 February 2013 Application note Document information Info Content Keywords BGA3018, Evaluation board, CATV, Drop amplifier Abstract This application note describes the schematic and layout requirements for using the BGA3018 as a CATV reverse amplifier. AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application Revision history Rev Date Description 1 First publication 20130214 Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 February 2013 © NXP B.V. 2013. All rights reserved. 2 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 1. Introduction The BGA3018 customer evaluation board enables the user to evaluate the performance of the wideband CATV MMIC amplifier BGA3018. The BGA3018 performance information is available in the BGA3018 datasheet. This application note describes the evaluation board schematic and layout requirements for using the BGA3018 as a CATV return path amplifier between 5 MHz and 300 MHz. The BGA3018 is fabricated in the BiCMOS process and packaged in a lead-free 3-pin SOT89 package. The BGA3018 is surface-mounted on an evaluation board with element matching and DC decoupling circuitry. The amplifier MMIC comprises a two stage amplifier with internal bias network and operates over a frequency range of 5 MHz to 1003 MHz with a supply voltage between 5 V and 8 V. 2. System features • • • • • • • • 18 dB gain Internally biased Flat gain between 5 MHz and 300 MHz Noise figure of 2.2 dB High linearity with an IP3O of 40 dBm and IP2O of 60 dBm 75 Ω input and output impedance Unconditionally stable Excellent input and output return loss 3. Customer evaluation kit contents The evaluation kit contains the following items: • ESD safe casing • BGA3018 evaluation board • BGA3018 SOT89 samples AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 3 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 4. Application Information For evaluation purposes an evaluation board is available. The evaluation circuit can be seen in figure 1 and the corresponding PCB is shown in figure 2. Table 1 shows the bill of materials. 4.1 Evaluation board circuit Fig 1. BGA3018 evaluation circuit The power supply is applied on the center pin of connector J3 and is applied to the MMIC via choke L2 which provides RF blocking to the supply line. Capacitors C4 and C5 are supply decoupling capacitors. At the F-connector J1 the RF input signal is applied where capacitor C1 provides DCblocking. Resistors R1 and R2 are used as feedback resistors to set the gain and slope. Two resistors are used to lower the influence of the parasitic capacitance from the circuit board. Capacitor C2 provides DC-blocking between the input and output of the MMIC. Capacitor C3 provides DC-blocking before the RF signal is available at F-connector J2. AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 4 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 4.2 Evaluation board layout PCB material PCB thickness PCB size εr Copper thickness Fig 2. = FR4 = 1.5 mm = 40 mm x 40 mm = 4.6 = 35 µm BGA3018 evaluation board layout For optimum distortion performance it is important to have enough ground vias underneath and around the MMICs ground pins. This lowers the inductance to the ground plane. The evaluation board is made with two layer FR4 material. AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 5 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 4.3 Bill of materials Table 1. Evaluation board BoM Circuit Description Qty Mfr Reference Manufacturer number Supplier Supplier part number U1 BGA3018 1 NXP BGA3018 NXP BGA3018 C1, C2, 10 nF 4 Murata GRM155R71E103KA01D Digikey 490-1312-1-ND C5 100 pF 1 Murata GRM1555C1H101JZ01D Digikey 490-3458-1-ND L2 22uH 1 Murata LQH31CN220K03L Digikey LQH31CN220K03L-ND R1 470 Ω 1 Yageo RC0402FR-07470RL Digikey 311-470LRCT-ND R2 300 Ω 1 Yageo RC0402FR-07300RL Digikey 311-300LRCT-ND J1, J2 75 Ω Fconnector 2 Bomar 861V509ER6 Mouser 678-861V509ER6 J3 Header 3 1 Molex 90121-0763 Digikey WM8109-ND C3, C4 AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 6 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 5. Measurement results at Vcc = 8 V -10 -12 -14 S11[dB] -16 -18 -20 -22 (1) (2) (3) -24 -26 -28 -30 5 55 105 155 205 255 305 Frequency[MHz] (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 3. Input matching (S11); Vcc = 8 V -10 -12 -14 S22[dB] -16 -18 -20 -22 (1) (2) (3) -24 -26 -28 -30 5 55 105 155 205 255 305 Frequency[MHz] (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 4. AN11295 Application note Output matching (S22): Vcc = 8 V All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 7 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 21 (1) (2) (3) 20 S21[dB] 19 18 17 16 15 5 55 105 155 205 255 305 205 255 305 Frequency[MHz] (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 5. Gain (S21); Vcc = 8 V 1.3 1.2 K-Factor 1.1 1 (1) (2) (3) 0.9 0.8 0.7 5 55 105 155 Frequency[MHz] (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 6. AN11295 Application note K-factor; Vcc = 8 V All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 8 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 3.0 2.8 (1) Noise figure [dB] 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0 50 100 150 200 250 300 Frequency [MHz] (1) Tamb = +25 °C Fig 7. AN11295 Application note Noise figure; Vcc = 8 V All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 9 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application Table 2. Symbol NF PL(1dB) IP3O IP2O [1] Measurement results at Vcc = 8 V Conditions -40 °C +25 °C +85 °C At 10 MHz 1.8 2.1 2.1 dB At 300 MHz 1.9 2.2 2.3 dB At 40 MHz Unit 24.5 24.5 24.5 dBm At 34 MHz [1] 46.5 45.0 44.0 dBc At 74 MHz [1] 46.5 45.5 44.0 dBc At 114 MHz [1] 47.0 45.5 44.0 dBc At 154 MHz [1] 47.0 44.5 43.0 dBc At 194 MHz [1] 45.5 43.5 41.5 dBc At 234 MHz [1] 44.5 42.5 40.5 dBc At 274 MHz [1] 44.0 42.0 40.0 dBc At 86 MHz [2] 63.0 61.0 60.0 dBc At 166 MHz [2] 63.0 61.0 59.0 dBc At 246 MHz [2] 63.0 61.0 59.0 dBc The fundamental frequencies (f1) and (f2) lay between 40 MHz and 300 MHz. The intermodulation product (IM3) is 2 x f2 – f1, where f2 = f1 ± 6 MHz. Input power Pi = -20 dBm. [2] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 300 MHz. The intermodulation product (IM20 is |f2 – f1|, with 40 MHz < |f1 – f2| < 300 MHz. Input power Pi = -20 dBm. AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 10 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 6. Measurement results at Vcc = 5V -10 -12 -14 S11[dB] -16 -18 -20 -22 (1) (2) (3) -24 -26 -28 -30 5 55 105 155 205 255 305 Frequency[MHz] (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 8. Input matching (S11); Vcc = 5 V -10 -12 -14 S22[dB] -16 -18 -20 -22 (1) (2) (3) -24 -26 -28 -30 5 55 105 155 205 255 305 Frequency[MHz] (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 9. AN11295 Application note Output matching (S22): Vcc = 5 V All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 11 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 21 (1) (2) (3) 20 S21[dB] 19 18 17 16 15 5 55 105 155 205 255 305 205 255 305 Frequency[MHz] (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 10. Gain (S21); Vcc = 5 V 1.3 1.2 K-Factor 1.1 1 (1) (2) (3) 0.9 0.8 0.7 5 55 105 155 Frequency[MHz] (1) Tamb = -40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 11. K-factor; Vcc = 5 V AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 12 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 3.0 2.8 Noise figure [dB] 2.6 (1) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0 50 100 150 200 250 300 Frequency [MHz] (1) Tamb = +25 °C Fig 12. Noise figure; Vcc = 5 V AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 13 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application Table 3. Symbol NF PL(1dB) IP3O IP2O [1] Measurement results at Vcc = 5 V Conditions -40 °C +25 °C +85 °C Unit At 10 MHz 1.8 1.9 1.9 dB At 300 MHz 2.0 2.0 2.1 dB At 40 MHz 19.5 19.0 19.5 dBm At 34 MHz [1] 41.0 40.0 39.0 dBc At 74 MHz [1] 41.0 40.5 39.0 dBc At 114 MHz [1] 41.5 40.0 38.5 dBc At 154 MHz [1] 41.0 39.5 38.0 dBc At 194 MHz [1] 40.5 38.5 37.0 dBc At 234 MHz [1] 39.5 38.0 36.5 dBc At 274 MHz [1] 39.0 37.5 36.0 dBc At 86 MHz [2] 57.5 55.0 53.5 dBc At 166 MHz [2] 57.0 54.5 53.0 dBc At 246 MHz [2] 57.0 54.5 53.0 dBc The fundamental frequencies (f1) and (f2) lay between 40 MHz and 300 MHz. The intermodulation product (IM3) is 2 x f2 – f1, where f2 = f1 ± 6 MHz. Input power Pi = -20 dBm. [2] The fundamental frequencies (f1) and (f2) lay between 40 MHz and 300 MHz. The intermodulation product (IM20 is |f2 – f1|, with 40 MHz < |f1 – f2| < 300 MHz. Input power Pi = -20 dBm. [3] AN11295 Application note Measured with 10 NTSC channels Vo = 30 dBmV. All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 14 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 7. Abbreviations Table 2. Abbreviations AN11295 Application note Acronym Description AC Alternating Current CATV Community Antenna TeleVision DC Direct Current ESD Electro Static Discharge MMIC Monolithic Microwave Integrated Circuit NTSC National Television Standards Committee PCB Printed Circuit Board RF Radio Frequency SMD Surface Mounted Device All information provided in this document is subject to legal disclaimers. Rev. 1 —14 February 2013 © NXP B.V. 2013. All rights reserved. 15 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 8. Legal information 8.1 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 8.2 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. AN11295 Application note Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. 8.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 February 2013 © NXP B.V. 2013. All rights reserved. 16 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 9. List of figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. BGA3018 evaluation circuit ............................... 4 BGA3018 evaluation board layout .................... 5 Input matching (S11); Vcc = 8 V ....................... 7 Output matching (S22): Vcc = 8 V .................... 7 Gain (S21); Vcc = 8 V ....................................... 8 K-factor; Vcc = 8 V ............................................ 8 Noise figure; Vcc = 8 V ..................................... 9 Input matching (S11); Vcc = 5 V ..................... 11 Output matching (S22): Vcc = 5 V .................. 11 Gain (S21); Vcc = 5 V ..................................... 12 K-factor; Vcc = 5 V .......................................... 12 Noise figure; Vcc = 5 V ................................... 13 AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 February 2013 © NXP B.V. 2013. All rights reserved. 17 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 10. List of tables Table 1. Table 2. Table 3. Evaluation board BoM....................................... 6 Measurement results at Vcc = 8 V .................. 10 Measurement results at Vcc = 5 V .................. 14 AN11295 Application note All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 February 2013 © NXP B.V. 2013. All rights reserved. 18 of 19 AN11295 NXP Semiconductors BGA3018 - 5 MHz to 300 MHz 18 dB reverse amplifier application 11. Contents 1. 2. 3. 4. 4.1 4.2 4.3 5. 6. 7. 8. 8.1 8.2 8.3 9. 10. 11. Introduction ......................................................... 3 System features................................................... 3 Customer evaluation kit contents ...................... 3 Application Information ...................................... 4 Evaluation board circuit ...................................... 4 Evaluation board layout...................................... 5 Bill of materials ................................................... 6 Measurement results at Vcc = 8 V...................... 7 Measurement results at Vcc = 5V..................... 11 Abbreviations .................................................... 15 Legal information .............................................. 16 Definitions ........................................................ 16 Disclaimers....................................................... 16 Trademarks ...................................................... 16 List of figures..................................................... 17 List of tables ...................................................... 18 Contents ............................................................. 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. © NXP B.V. 2013. All rights reserved. For more information, visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 14 February 2013 Document identifier: AN11295