CM1218-C4 Low Capacitance Transient Voltage Suppressors / ESD Protectors Description http://onsemi.com The CM1218−C4 device features transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components which may be subjected to electrostatic discharge (ESD). All pins of the CM1218−C4 are rated to withstand ±15 kV ESD pulses using the IEC 61000−4−2 contact discharge method. Using the MIL−STD−883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected from contact discharges of greater than ±30 kV. The CM1218−C4 is supplied in an SOT−553, RoHS−compliant, lead−free finished package. SOT−553 SE SUFFIX CASE 463B BLOCK DIAGRAM • Low I/O Capacitance at 7 pF Typical • Four Channels of ESD Protection • In−system ESD Protection to ±15 kV Contact Discharge, per the • • • 1 IEC 61000−4−2 International Standard Compact SMT Package Saves Board Space and Facilitates Layout in Space−critical Applications Each I/O Pin Can Withstand over 1000 ESD Strikes These Devices are Pb−Free and are RoHS Compliant • High−speed Consumer Electronic Ports • ESD Protection of PC Ports, Including USB Ports, Serial Ports, Parallel Ports, IEEE1394 Ports, Docking Ports, Proprietary Ports, etc. Protection of Interface Ports or IC Pins which are Exposed to High ESD Levels 2 VN 3 CM1218−C4 MARKING DIAGRAM Applications • 4 5 Features* R4C M G R4C = Specific Device Code M = Month Code G = Pb−Free Package ORDERING INFORMATION Device CM1218−C4SE Package Shipping† SOT−553 (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *For Other Versions of the CM1218, see the CM1218 datasheet or the CM1218−H4 datasheet. © Semiconductor Components Industries, LLC, 2011 February, 2011 − Rev. 3 1 Publication Order Number: CM1218−C4/D CM1218−C4 PACKAGE / PINOUT DIAGRAM & PIN DESCRIPTIONS Top View 1 VN 2 CH2 3 5 CH4 R4C CH1 4 R4C CHx CH3 5−lead SOT−553 (CM1218−C4SE) = Specific Device Code = The Cathode of the Respective TVS Diode, which should be connected to the node requiring transient voltage protection = The Anode of the TVS Diodes VN SPECIFICATIONS Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Range Package Power Dissipation SOT−553 Rating Units −65 to +150 °C 0.15 W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 2. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Rating Units −40 to +85 °C Table 3. ELECTRICAL OPERATING CHARACTERISTICS Symbol CIN Parameter Conditions Min Typ Max Units Channel Input Capacitance TA = 25°C, 2.5 VDC, 1 MHz 7 pF DCIN Differential Channel I/O to GND Capacitance TA = 25°C, 2.5 VDC, 1 MHz 0.19 pF VRSO Reverse Stand−off Voltage IR = 10 mA, TA = 25°C 5.5 V IR = 1 mA, TA = 25°C 6.1 V ILEAK Leakage Current VIN = 5.0 VDC, TA = 25°C VSIG Small Signal Clamp Voltage Positive Clamp Negative Clamp I = 10 mA, TA = 25°C I = −10 mA, TA = 25°C ESD Withstand Voltage Contact Discharge per IEC 61000−4−2 standard Human Body Model, MIL−STD−883, Method 3015 TA = 25°C; Notes 2 & 3 TA = 25°C; Notes 1 & 3 VESD RD Diode Dynamic Resistance Forward Conduction Reverse Conduction 1 6.8 −0.8 mA V kV ±15 ±30 TA = 25°C; Note 1 0.57 1.36 1 Human Body Model per MIL−STD−883, Method 3015, CDischarge = 100 pF, RDischarge = 1.5 KW, VN grounded. 2 Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W, VN grounded. 3 These measurements performed with no external capacitor on CHX. http://onsemi.com 2 W CM1218−C4 Performance Information Diode Capacitance Typical diode capacitance with respect to positive TVS cathode voltage (reverse voltage across the diode) is given in Figure 1.Diode Capacitance vs. Reverse Voltage. Figure 1. Diode Capacitance vs. Reverse Voltage Typical High Current Diode Characteristics Measurements are made in pulsed mode with a nominal pulse width of 0.7 ms. http://onsemi.com 3 CM1218−C4 MECHANICAL SPECIFICATIONS The CM1218−C4SE is supplied in a 5−pin SOT−553 package. Dimensions are presented below. Table 4. CSP TAPE AND REEL SPECIFICATIONS Pocket Size (mm) Tape Width Part Number Chip Size (mm) B0 X A0 X K0 W Reel Diameter Qty per Reel P0 P1 CM1218−C4SE 1.60 X 1.60 X 0.55 1.78 X 1.78 X 0.69 8 mm 178 mm (7″) 5000 4 mm 4 mm Po Top Cover Tape Ao + Ko For Tape Feeder Reference Only Including Draft, Concerning around B. 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Embossment Bo + P1 User Direction of Feed http://onsemi.com 4 + Center Lines of Cavity W CM1218−C4 PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B−01 ISSUE B D −X− 5 A 4 1 2 b e L E −Y− 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. HE DIM A b c D E e L HE c 5 PL 0.08 (0.003) M X Y SOLDERING FOOTPRINT* 0.3 0.0118 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 STYLE 2: PIN 1. CATHODE 2. COMMON ANODE 3. CATHODE 2 4. CATHODE 3 5. CATHODE 4 0.45 0.0177 1.35 0.0531 MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 MIN 0.50 0.17 0.08 1.50 1.10 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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