NUP4000 Bi-directional TVS Array for High-Speed Data Line Protection The NUP4000 transient voltage suppressor is designed to protect equipment attached to up to four high speed communication lines from ESD, EFT, and lightning. Features: • SO−8 Package • Peak Power − 400 W 8 x 20 mS • ESD Rating: • • IEC 61000−4−2 (ESD) ±15 kV (air) ±8 kV (contact) IEC 61000−4−4 (EFT) 40 A (5/50 ns) IEC 61000−4−5 (lightning) 12 A (8/20 ms) UL Flammability Rating of 94 V−0 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com SO−8 VOLTAGE SUPPRESSOR 400 WATTS PEAK POWER 15 VOLTS PIN CONFIGURATION AND SCHEMATIC Typical Applications: • • • • • • • • High Speed Communication Line Protection 15 V Data and I/O Lines Microprocessor Based Equipment LAN/WAN Equipment Servers Notebook and Desktop PC Serial and Parallel Ports Peripherals 1 8 2 7 3 6 4 5 8 1 SO−8 CASE 751 MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation 8 x 20 ms @ TA = 25°C (Note 1) Ppk 400 W Peak Pulse Current 8 x 20 ms @ TA = 25°C (Note 1) IPP 10 A Junction and Storage Temperature Range Lead Solder Temperature − Maximum 10 Seconds Duration MARKING DIAGRAM 8 NUP40 AYWWG G 1 TJ, Tstg −55 to +150 °C TL 260 °C 1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform A Y WW G = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† NUP4000DR2G SO−8 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2009 August, 2009 − Rev. 0 1 Publication Order Number: NUP4000/D NUP4000 ELECTRICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit VRWM − − 15 V VBR 16.7 − − V Reverse Leakage Current @ VRWM = 15 Volts IR N/A − 1.0 mA Maximum Clamping Voltage @ IPP = 1.0 A, 8 x 20 mS VC N/A − 24 V Maximum Clamping Voltage @ IPP = 5.0 A, 8 x 20 mS VC N/A − 30 V Maximum Peak Pulse Current IPP − − 10 A Junction Capacitance @ VR = 0 V, f = 1 MHz CJ − − 75 pF Reverse Working Voltage Reverse Breakdown Voltage @ It = 1.0 mA 100 tr 90 % OF PEAK PULSE CURRENT Ppk, PEAK SURGE POWER (WATTS) 1000 100 10 NOTE: Non−Repetitive Surge. 1 1 10 100 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 80 70 60 HALF VALUE IRSM/2 @ 20 ms 50 40 30 tP 20 10 0 1000 PEAK VALUE IRSM @ 8 ms 0 t, TIME (ms) 20 40 60 t, TIME (ms) Figure 1. Pulse Width Figure 2. 8 × 20 ms Pulse Waveform http://onsemi.com 2 80 NUP4000 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AJ −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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