CS1107 Single Relay Driver IC This ASIC provides up to 350 mA of drive current for driving a relay. On–chip diagnostic features include open and short circuit detection in the on state, duty cycle current limit control, and thermal shutdown. Faults are reported on the Fault lead. Fault is an active–low output. An on–chip zener provides protection from flyback pulses from the relay. Internal pull–down circuitry is provided to ensure the output pin turns off when the Control pin is floating. http://onsemi.com 8 Features • Fault Detection – Open Circuit – Short Circuit – Overtemperature • On–Chip Flyback Protection • Low Standby Current • Internally Fused Leads in SO–8 Package 1 SO–8 DF SUFFIX CASE 751 PIN CONNECTIONS AND MARKING DIAGRAM Output VCC Output ISOURCE Control 33 V 8 1107 ALYW VCC Fault 1 Control GND GND GND GND Drive & Bias A WL, L YY, Y WW, W Overtemp Shutdown = Assembly Location = Wafer Lot = Year = Work Week Duty cycle during short circuit ORDERING INFORMATION + – Fault – + GND GND GND Short Circuit Detect Device Open Circuit Detect Package Shipping CS1107EDF8 SO–8 95 Units/Rail CS1107EDFR8 SO–8 2500 Tape & Reel GND Figure 1. Block Diagram Semiconductor Components Industries, LLC, 2001 April, 2001 – Rev. 5 1 Publication Order Number: CS1107/D CS1107 MAXIMUM RATINGS* Rating Value Unit Storage Temperature –65 to +150 °C VCC, Fault, Control –0.5 to 6.0 V 2.0 kV 40 V 230 peak °C ESD Capability (Human Body Model) Peak Transient Voltage (output off mode, output pin only) (26 V Load Dump @ 14 V VBAT) Lead Temperature Soldering: 1. 60 second maximum above 183°C. *The maximum package power dissipation must be observed. Reflow: (SMD styles only) (Note 1) ELECTRICAL CHARACTERISTICS (4.75 ≤ VCC ≤ 5.25 V, –40°C ≤ TA ≤ 85°C, –40°C ≤ TJ ≤ 150°C; unless otherwise specified.) Characteristic Test Conditions Min Typ Max Unit Supply Requirements VCC Quiescent Current Output ON – 3.0 6.0 mA VCC Quiescent Current Output OFF – 70 250 µA Leakage Current VBAT = 14 V – 0 100 µA Saturation Voltage IOUTPUT = 350 mA IOUTPUT = 180 mA – – 1.1 0.9 1.5 1.3 V V VCLAMP VCC < 4.5 V, IOUTPUT = 180 mA 29 33 36 V Output Current Sense Short Circuit Current – 350 500 650 mA Open Circuit Current Output in the ON state 20 40 60 mA Input Voltage Logic = High Logic = Low 2.0 – – – – 0.8 V V Input Current Control = VCC – 40 80 µA IFAULT = 250 µA (sink) – 0.24 0.40 V Control–Input Fault Output – (Open Collector) Output Low Voltage Overtemperature Shutdown TJ Output Disable Threshold (Guaranteed by Design) 150 180 – °C TJ Hysteresis (Guaranteed by Design) 5.0 – – °C PACKAGE PIN DESCRIPTION PACKAGE PIN # 8 Lead SO Narrow PIN SYMBOL 1 Output 2 VCC 5.0 V regulated supply input. 3 Fault Open collector diagnostic output low during open load, short circuit and overtemperature conditions. 4 Control TTL compatible input. A high on this pin turns the output on. 5, 6, 7, 8 Ground Signal ground. FUNCTION Open collector output. http://onsemi.com 2 CS1107 CIRCUIT DESCRIPTION are only reported when the Control pin is high, due to the low quiescent current when the Control pin is low and the output device is turned off. Overcurrent protection is provided by duty cycle control. When the Output current exceeds the current limit threshold, the output enters duty cycle mode to reduce power dissipation of the IC to a safe level. The higher the threshold is exceeded the lower the duty cycle becomes. A 33 V on–chip zener diode on the Output pin protects the device from flyback pulses when a relay is turned off. The saturation voltage of this pin will not exceed 1.5 V at 350 mA. The CS1107 relay driver IC provides up to 350 mA of drive current in a low–side configuration. The Output driver pin is controlled through the TTL compatible Control input pin. A high condition on the Control pin turns the output pin on. The Fault pin reports short circuit, open circuit, and overtemperature conditions on the IC. If a fault is present, the open collector output Fault pin will be low. Typical numbers for faults are: exceeding 500 mA of drive current will report a short circuit. Less than 40 mA (typical) will report an open circuit. A temperature fault will be reported when the die temperature exceeds 180°C (typical). Faults Output CMODULE(ESD) 10 nF CS1107 VCC GND Fault GND Control GND 20 k VBAT GND VCC microprocessor Figure 2. Applications Diagram http://onsemi.com 3 CS1107 PACKAGE DIMENSIONS SO–8 DF SUFFIX CASE 751–07 ISSUE V –X– A 8 5 0.25 (0.010) S B 1 M Y M 4 K –Y– G C N DIM A B C D G H J K M N S X 45 SEATING PLANE –Z– 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 PACKAGE THERMAL DATA SO–8 Unit RΘJC Typical 25 °C/W RΘJA Typical 110 °C/W Parameter ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: [email protected] ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800–282–9855 Toll Free USA/Canada http://onsemi.com 4 CS1107/D