FLEXMOS Hex Low-side MOSFET Pre-driver

NCV7519, NCV7519A
FLEXMOS] Hex Low-side
MOSFET Pre-driver
The NCV7519/A programmable six channel low−side MOSFET
pre−driver is one of a family of FLEXMOS automotive grade products
for driving logic−level MOSFETs. The product is controllable by a
combination of serial SPI and parallel inputs. The device offers 3.3 V/
5 V compatible inputs and the serial output driver can be powered
from either 3.3 V or 5 V. An internal power−on reset provides
controlled power up. A reset input allows external re−initialization and
an enable input allows all outputs and diagnostics to be simultaneously
disabled.
Each channel independently monitors its external MOSFET’s drain
voltage for fault conditions. Shorted load fault detection thresholds are
fully programmable using an externally programmed reference
voltage and a combination of discrete internal ratio values. The ratio
values are SPI selectable and allow different detection thresholds for
each channel.
Fault recovery operation for each channel is programmable and may
be selected for latch−off or automatic retry. Status information for
each channel is 3−bit encoded by fault type and is available through
SPI communication.
The FLEXMOS family of products offers application scalability
through choice of external MOSFETs.
Features
•
•
•
•
•
•
•
•
•
•
•
•
16−bit SPI with Parity and Frame Error Detection
3.3 V/5 V Compatible Parallel and Serial Control Inputs
3.3 V/5 V Compatible Serial Output Driver
Reset and Enable Inputs
Open−drain Fault Flag
Priority Encoded Diagnostics with Latched Unique Fault Type Data
♦ Shorted Load, Short to GND
♦ Open Load
♦ On and Off State Pulsed Mode Diagnostics
Ratiometric Diagnostic References and Currents
Programmable
♦ Shorted Load Fault Detection Thresholds
♦ Fault Recovery Mode
♦ Blanking Timers
Wettable Flanks Pb−Free Packaging
Commercial Vehicle Capable
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
This is a Pb−Free Device
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QFN32
MW SUFFIX
CASE 488AM
QFN32
MW SUFFIX
CASE 485CZ
MARKING DIAGRAM
1
NCV7519x
AWLYYWWG
G
x
A
WL
YY
WW
G
= blank or A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 36 of this data sheet.
Benefits
• Scalable to Load by Choice of External MOSFET
© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. 2
1
Publication Order Number:
NCV7519/D
NCV7519, NCV7519A
IN5 IN4 IN3 IN2 IN1 IN0
ENB
NCV7519
VCC2
RAIL
Hex MOSFET Pre-Driver
VREG
3V
INTERNAL
RAIL
CHANNEL0
DRN0
POWER ON RESET
&
POR
BIAS
VCC1
FAULT
DETECT
DRN
VSS
VCC2
REF
DISABLE
DRIVER
ENB
RST
RSTB
VSS
CONTROL
REGISTERS
RAIL
GAT0
DRN
RST ENB VCC2
REF
CHANNEL1
DRN1
DISABLE
PARALLEL
SERIAL
CSB
IREF
DRN
RST ENB VCC2
REF
SCLK
SI
RST
DISABLE
CSB
PARALLEL
SCLK
SERIAL
VSS
CHANNEL2
GAT1
DRN2
GAT2
SI
SPI
16 BIT
DRN
RST ENB VCC2
CHANNEL3
REF
VDD
DRN3
DISABLE
PARALLEL
SERIAL
SO
DRIVER
GAT3
SO
DRN
VSS
RST ENB VCC2
REF
CHANNEL4
DRN4
DISABLE
RST
PARALLEL
FAULT DATA
SERIAL
IREF
FLTB
CSB
DRN
FAULT LOGIC
&
REFRESH TIMER
RST
DISABLE
DRN
RST ENB VCC2
REF
CHANNEL5
RST
GAT4
DRN5
DISABLE
PARALLEL
SERIAL
GND
VSS
GAT5
CLOCK
RST ENB
RST
VCC1
FLTREF
+
OA
−
FAULT REFERENCE
GENERATOR
REF
REF
Figure 1. Block Diagram
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2
OFF−STATE
DIAGNOSTICS
GENERATOR
VSS
VLOAD
NCV7519, NCV7519A
VLOAD
CB3
VBAT
UNCLAMPED LOAD
REVERSE
BATTERY
&
TRANSIENT
PROTECTION
M
+5V
+5V OR
+3.3V
PARALLEL
HOST CONTROLLER
RST
VLOAD
VCC2
VCC1
DRN0
RSTB
GAT0
ENB
DRN1
IN0
GAT1
IN1
DRN2
IN2
GAT2
IN3
SPI
IN4
IN5
RX1
IRQ
RFPU
NCV7519
POWER-ON
RESET
CB1
RFILT
DRN3
RD1*
RD2*
RD3*
GAT3
DRN4
FLTB
GAT4
CSB
DRN5
SCLK
GAT5
SI
RD4*
RD5*
VDD
FLTREF
RX2
RD0*
SO
GND
VSS
* Optional R DX - See Application Guidelines
Figure 2. Application Diagram
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3
CB2
NCV7519, NCV7519A
PACKAGE PIN DESCRIPTION 32 PIN QFN EXPOSED PAD PACKAGE
Label
FLTREF
Description
Analog Fault Detect Threshold: 5 V Compliant
DRN0 − DRN5
Analog Drain Feedback
GAT0 − GAT5
Analog Gate Drive: 5 V Compliant
RSTB
Digital Master Reset Input: 3.3 V/5 V (TTL) Compatible
ENB
Digital Master Enable Input: 3.3 V/5 V (TTL) Compatible
IN0 − IN5
Digital Parallel Input: 3.3 V/5 V (TTL) Compatible
CSB
Digital Chip Select Input: 3.3 V/5 V (TTL) Compatible
SCLK
Digital Shift Clock Input: 3.3 V/5 V (TTL) Compatible
SI
Digital Serial Data Input: 3.3 V/5 V (TTL) Compatible
SO
Digital Serial Data Output: 3.3 V/5 V Compliant
FLTB
Digital Open−Drain Output: 3.3 V/5 V Compliant
VLOAD
Power Supply − Diagnostic References and Currents
VCC1
Power Supply − Low Power Path
GND
Power Return − Low Power Path − Device Substrate
VCC2
Power Supply − Gate Drivers
VDD
Power Supply − Serial Output Driver
VSS
Power Return − VLOAD, VCC2, VDD
GND
FLTREF
VCC1
VCC2
GAT0
DRN0
GAT1
DRN1
Exposed Pad − Connected to GND − Device Substrate
32
31
30
29
28
27
26
25
Exposed Pad
(EP)
IN0
1
24 GAT2
IN1
2
23 DRN2
IN2
3
22 GAT3
IN3
4
21 DRN3
NCV7519
7
18 GAT5
RSTB
8
17 DRN5
9
10
11
12
13
14
15
16
VLOAD
ENB
VSS
19 DRN4
VDD
6
SO
IN5
SI
20 GAT4
SCLK
5
CSB
IN4
FLTB
EP
Figure 3. 32 Pin QFN Exposed Pad Pinout (Top View)
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4
NCV7519, NCV7519A
MAXIMUM RATINGS (Voltages are with respect to device substrate.)
Rating
Value
Unit
DC Supply − VLOAD
−0.3 to 45
V
DC Supply − VCC1, VCC2, VDD
−0.3 to 5.8
V
Difference Between VCC1 and VCC2
±0.3
V
Difference Between GND (Substrate) and VSS
±0.3
V
Drain Input Clamp Forward Voltage Transient (≤2 ms, ≤1% duty)
78
V
Drain Input Clamp Forward Current Transient (≤2 ms, ≤1% duty)
10
mA
Drain Input Clamp Energy Repetitive (≤2 ms, ≤1% duty)
1.56
mJ
Drain Input Clamp Reverse Current VDRNX ≥ −1.0 V
−50
mA
Input Voltage (Any Input Other Than Drain)
−0.3 to 5.8
V
Output Voltage (Any Output)
−0.3 to 5.8
V
Junction Temperature, TJ
−40 to 150
°C
Storage Temperature, TSTG
−65 to 150
°C
260 peak
°C
Peak Reflow Soldering Temperature: Lead−free 60 to 150 seconds at 217°C (Note 1)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ATTRIBUTES
Characteristic
Value
ESD Capability
Human Body Model per AEC−Q100−002
Drain Feedback Pins (Note 3)
All Other Pins
≥ ±4.0 kV
≥ ±2.0 kV
≥ ±200 V
(Note 2)
MSL3
(Note 4)
(Note 5)
95°C/W
46°C/W
3.2°C/W
Machine Model per AEC−Q100−003
Moisture Sensitivity
Package Thermal Resistance − Still−air
Junction−to−Ambient, RqJA
Junction−to−Exposed Pad, RYJPAD
2.
3.
4.
5.
See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
With GND & VSS pins tied together − path between drain feedback pins and GND, or between drain feedback pins.
Based on JESD51−3, 1.2 mm thick FR4, 2S0P PCB, 2 oz. signal, 20 thermal vias to 400 mm2 spreader on bottom layer.
Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB, 2 oz. signal, 20 thermal vias to 80 x 80 mm 1 oz. internal spreader planes.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
MIN
MAX
Unit
VLOAD
Diagnostic References and Currents Power Supply Voltage
7.5
36.0
V
VDRNX
Drain Input Feedback Voltage
−0.3
60
V
VCC1
Main Power Supply Voltage
VCC2
Gate Drivers Power Supply Voltage
4.75
5.25
V
VCC1 − 0.3
VCC1 + 0.3
V
VDD
Serial Output Driver Power Supply Voltage
3.0
VCC1
V
VFLTREF
Fault Detect Threshold Reference Voltage
0.35
2.75
V
VIN High
Logic High Input Voltage
2.0
VCC1
V
VIN Low
Logic Low Input Voltage
0
0.8
V
Ambient Still−air Operating Temperature
−40
125
°C
Startup Delay at Power−on Reset (POR) (Note 6)
500
−
ms
TA
tRESET
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
6. Minimum wait time until device is ready to accept serial input data.
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5
NCV7519, NCV7519A
PARAMETRIC TABLES
ELECTRICAL CHARACTERISTICS
(4.75 V ≤ VCCX ≤ 5.25 V, VDD = VCCX, 4.5 V ≤ VLOAD ≤ 36 V, RSTB = VCCX, ENB = 0, −40°C ≤ TJ ≤ 150°C, unless otherwise specified.)
(Note 7)
Characteristic
Symbol
Conditions
Min
Typ
Max
Unit
ICC1A
RSTB = 0
−
2.80
5.0
mA
ICC1B
ENB = 0, RSTB = VCC1, VDRNX=0 V, GATX
Drivers Off
−
3.10
5.0
mA
ICC1C
ENB = 0, RSTB = VCC1, GATX Drivers On
−
2.80
5.0
mA
Power−On Reset Threshold
POR
VCC1 Rising
Power−On Reset Hysteresis
PORH
VCC1 SUPPLY
Operating Current −
VCC1 = 5.25 V, VFLTREF = 2.75 V
3.65
4.125
4.60
V
0.150
0.385
−
V
VCC2 SUPPLY
ICC2
VCC2 = 5.25 V, ENB = 0, RSTB = VCC1 = 5.25 V
VDRNX = 0 V, GATX Drivers Off
−
2.80
5.0
mA
Standby Current
IDD1
VDD = 5.25V, ENB = 0, RSTB = VCC1 = 5.25 V
SO = Z
−
25.0
34.0
mA
Operating Current
IDD2
VDD = 5.25V, ENB = 0, RSTB = VCC1 = 5.25 V
SO = H or L
−
625
850
mA
Standby Current
VLDSBY
VLOAD = 24 V, 0 ≤ VCC1 ≤ 5.25,
ENB = RSTB = VCC1, TA ≤ 85°C
−
−
10
mA
Operating Current
VLDOP
VLOAD = 36 V, ENB = 0, RSTB = VCC1,
VDRNX = 0 V
−
22
30
mA
VIHX
RSTB, ENB, INX, SI, SCLK, CSB
2.0
−
−
V
VIN Low
VILX
RSTB, ENB, INX, SI, SCLK, CSB
−
−
0.8
V
VIN Hysteresis
INHY
RSTB, ENB, INX, SI, SCLK, CSB
100
330
500
mV
Input Pullup Resistance
RPUX
ENB, CSB, VIN = 0 V
50
125
200
kW
Input Pulldown Resistance
RPDX
RSTB, INX, SI, SCLK, VIN = VCC1
50
125
200
kW
SO Low Voltage
VSOL
VDD = 3.0 V, ISINK = 2 mA
−
−
0.4
V
SO High Voltage
VSOH
VDD = 3.0 V , ISOURCE = 2 mA
VDD −
0.6
−
−
V
SO Output Resistance
RSO
Output High or Low
−
25
−
W
SO Tri−State Leakage Current
SOLKG
CSB = 3.0 V
−5.0
−
5.0
mA
FLTB Low Voltage
VFLTB
FLTB Active, IFLTB = 1.25 mA
−
−
0.4
V
IFLTLKG
VFLTB = VCC1
−
−
10
mA
FLTREF Input Current
IFLTREF
0 V ≤ VFLTREF ≤ 2.75 V
−1.0
−
1.0
mA
FLTREF Input Linear Range
VREFLIN
(Note 8)
0.35
−
2.75
V
PSRR
(Note 8)
30
−
−
dB
Operating Current
VDD SUPPLY
VLOAD SUPPLY
DIGITAL I/O
VIN High
FLTB Leakage Current
FAULT DETECTION − GATX ON
FLTREF Op−amp VCC1 PSRR
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Min/Max values are valid for the temperature range −40°C ≤ TJ ≤ 150°C unless noted otherwise. Min/Max values are guaranteed by test,
design or statistical correlation.
8. Guaranteed by design.
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NCV7519, NCV7519A
ELECTRICAL CHARACTERISTICS (continued)
(4.75 V ≤ VCCX ≤ 5.25 V, VDD = VCCX, 4.5 V ≤ VLOAD ≤ 36 V, RSTB = VCCX, ENB = 0, −40°C ≤ TJ ≤ 150°C, unless otherwise specified.)
(Note 7)
Characteristic
Symbol
Conditions
Min
Typ
Max
Unit
DRNX Shorted Load Threshold
V25
Register R2.C[11:9] = 000 (DEFAULT)
20
25
30
VFLTREF = 0.35 V
V40
Register R2.C[11:9] = 001
35
40
45
%
VFLTREF
V50
Register R2.C[11:9] = 010
45
50
55
V60
Register R2.C[11:9] = 011
55
60
65
V70
Register R2.C[11:9] = 100
65
70
75
V80
Register R2.C[11:9] = 101
75
80
85
V90
Register R2.C[11:9] = 110
85
90
95
V100
Register R2.C[11:9] = 111
95
100
105
IDLKG
0 V ≤ VCC1 = VCC2 = VDD ≤ 5.25 V,
RSTB = 0 V, VLOAD = VDRNX = 36 V
TA ≤ 25°C
−5.0
−1.0
−
−
5.0
1.0
60
−
78
V
FAULT DETECTION − GATX ON
DRNX Input Leakage Current
DRNX Clamp Voltage
VCL
IDRNX= ICL(MAX) =10 mA; Transient
(≤2 ms, ≤1% Duty)
mA
Fault Detection − GATX OFF (7.5 V ≤ VLOAD ≤ 36 V, Register R3.D[5:0] = 1)
DRNX Diagnostic Current
− Proportional to VLOAD
ISG
Short to GND Detection, VDRNX = 43%VLOAD
−81
−60
−39
mA / V
IOL
Open Load Detection, VDRNX = 61%VLOAD
2.73
4.20
5.67
mA / V
DRNX Fault Threshold Voltage
VSG
Short to GND Detection
39.56
43
46.44
%VLOAD
VOL
Open Load Detection
56.12
61
65.88
%VLOAD
46.92
51
55.08
%VLOAD
DRNX Off State Bias Voltage
VCTR
VLOAD Undervoltage Threshold
VLDUV
VLOAD Decreasing
4.1
6.3
7.5
V
tBL(ON)
VDRNX = VLOAD; INX rising to FLTB Falling
Register R2.C[6:5] = 00
4.8
6
7.2
ms
Register R2.C[6:5] = 01
9.6
12
14.4
Register R2.C[6:5] = 10 (DEFAULT)
19.2
24
28.8
Register R2.C[6:5] = 11
28.8
48
57.6
VDRNX = 0V; INX falling to FLTB Falling
Register R2.C[8:7] = 00
44
55
66
FAULT TIMERS
Channel Fault Blanking Timers
(Figure 6)
tBL(OFF)
Channel Fault Filter Timer
(Figure 7)
ms
Register R2.C[8:7] = 01
65
81
97
Register R2.C[8:7] = 10 (DEFAULT)
130
162
195
Register R2.C[8:7] = 11
260
325
390
2.0
44
3.0
55
4.0
66
ms
tFF(ON)
tFF(OFF)
Global Fault Retry Timer
(Figure 8)
tFR
Register R0.M[5:0] = 1
6
8
10
ms
Timer Clock
fCLK
RSTB = VCC1
−
4.0
−
MHz
GATX Output Resistance
RGATX
Output High or Low
200
350
500
W
GATX High Output Current
IGSRC
VGATX = 0 V
−26.25
−
−9.5
mA
GATE DRIVER OUTPUTS
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Min/Max values are valid for the temperature range −40°C ≤ TJ ≤ 150°C unless noted otherwise. Min/Max values are guaranteed by test,
design or statistical correlation.
8. Guaranteed by design.
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NCV7519, NCV7519A
ELECTRICAL CHARACTERISTICS (continued)
(4.75 V ≤ VCCX ≤ 5.25 V, VDD = VCCX, 4.5 V ≤ VLOAD ≤ 36 V, RSTB = VCCX, ENB = 0, −40°C ≤ TJ ≤ 150°C, unless otherwise specified.)
(Note 7)
Characteristic
Symbol
Conditions
Min
Typ
Max
Unit
GATX Low Output Current
IGSNK
VGATX = VCC2
9.5
−
26.25
mA
Turn−On Propagation Delay
tP(ON)
−
−
1.0
ms
Turn−Off Propagation Delay
tP(OFF)
−
−
1.0
ms
GATE DRIVER OUTPUTS
INX to GATx (Figure 4)
CSB to GATX (Figure 5)
INX to GATX (Figure 4)
CSB to GATX (Figure 5)
Output Rise Time
tR
20% to 80% of VCC2, CLOAD = 400 pF (Figure 4,
Note 8)
−
−
Output Fall Time
tF
80% to 20% of VCC2, CLOAD = 400 pF (Figure 4,
Note 8)
−
−
277
277
ns
ns
SERIAL PERIPHERAL INTERFACE (Figure 9) VCCX = 5.0 V, VDD = 3.3 V, FSCLK = 4.0 MHz, CLOAD = 200 pF
3.3
3.6
4.5
5.0
5.5
V
−
250
−
ns
Sl, SCLK (Note 8)
−
−
12
pF
tCLKH
SCLK = 2.0 V to 2.0 V
125
−
−
ns
SCLK Low Time
tCLKL
SCLK = 0.8 V to 0.8 V
125
−
−
ns
Sl Setup Time
tSISU
Sl = 0.8 V/2.0 V to SCLK = 2.0 V (Note 8)
25
−
−
ns
Sl Hold Time
tSIHD
SCLK = 2.0 V to Sl = 0.8 V/2.0 V (Note 8)
25
−
−
ns
SO Rise Time
tSOR
(20% VSO to 80% VDD) CLOAD = 200 pF (Note 8)
−
25
50
ns
SO Fall Time
tSOF
(80% VSO to 20% VDD) CLOAD = 200 pF (Note 8)
−
−
50
ns
CSB Setup Time
tCSBSU
CSB = 0.8 V to SCLK = 2.0 V (Note 8)
60
−
−
ns
CSB Hold Time
tCSBHD
SCLK = 0.8 V to CSB = 2.0 V (Note 8)
75
−
−
ns
CSB to SO Time
tCS−SO
CSB = 0.8 V to SO Data Valid (Note 8)
−
65
125
ns
SO Delay Time
SODLY
SCLK = 0.8 V to SO Data Valid (Note 8)
−
65
125
ns
Transfer Delay Time
CSDLY
CSB Rising Edge to Next Falling Edge (Note 8)
1.6
−
−
ms
SO Supply Voltage
VDD
SCLK Clock Period
tSCLK
Maximum Input Capacitance
CINX
SCLK High Time
3.3 V Interface
3.0
5 V Interface
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Min/Max values are valid for the temperature range −40°C ≤ TJ ≤ 150°C unless noted otherwise. Min/Max values are guaranteed by test,
design or statistical correlation.
8. Guaranteed by design.
INX
50%
tP(OFF)
GAT X
tR
80%
20%
50%
tP(ON)
Figure 4. Gate Driver Timing Diagram − Parallel Input
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8
tF
NCV7519, NCV7519A
CSB
50%
DRNX
GX
INX
50%
tP(OFF)
GAT X
tBL(ON)
50%
FLTB
tBL(OFF)
50%
50%
tP(ON)
Figure 5. Gate Driver Timing Diagram − Serial Input
DRNX
Figure 6. Blanking Timing Diagram
OPEN LOAD
THRESHOLD
SHORTED
LOAD
THRESHOLD
INX
tFF(ON)
FLTB
tFF(OFF)
50%
50%
Figure 7. Filter Timing Diagram
GATX
tBL(ON)
tFR
tFF
tFR
tBL(ON)
tFR
(ON)
DRNX
SHORTED LOAD THRESHOLD (FLTREF)
INX
Figure 8. Fault Retry Timing Diagram
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NCV7519, NCV7519A
CSB
SETUP
TRANSFER
DELAY
CSB
SI
SETUP
SCLK
CSB
HOLD
1
16
SI
HOLD
SI
MSB IN
SO
DELAY
CSB to
SO VALID
SO
LSB IN
BITS 14...1
MSB OUT
SO
RISE,FALL
BITS 14...1
LSB OUT
SEE
NOTE
80% VDD
20% VDD
Note: Not defined but usually MSB of data just received.
Figure 9. SPI Timing Diagram
DETAILED OPERATING DESCRIPTION
General
The active−low ENB input with resistive pull−up
provides a global enable. ENB disables all GATX outputs
and diagnostics, and resets the auto−retry timer when
brought high. The SPI is enabled, fault data is not cleared
and registers remain as programmed. Faulted outputs are
re−enabled when ENB goes low.
The NCV7519 is a six channel general−purpose low−side
pre−driver for controlling and protecting N−type logic level
MOSFETs. Programmable fault detection and protection
modes allow the device to accommodate a wide range of
external MOSFETs and loads, providing flexible
application solutions. Separate power supply pins are
provided for low and high current paths to improve analog
accuracy and digital signal integrity.
SPI Communication
The NCV7519 is a 16−bit slave device. Communication
between the host and the device may either be parallel via
individual CSB addressing or daisy−chained through other
devices using a compatible SPI protocol.
The active−low CSB chip select input has a pull−up
resistor. The SI and SCLK inputs have pull−down resistors.
The recommended idle state for SCLK is low. The tri−state
SO line driver is powered via the VDD and the VSS pins, and
can be supplied with either 3.3 V or 5 V.
The device employs odd parity, and frame error detection
that requires integer multiples of 16 SCLK cycles during
each CSB high−low−high cycle (valid communication
frame.) A parity or frame error does not affect the FLTB flag.
The host initiates communication when a selected
device’s CSB pin goes low. Output data is simultaneously
sent MSB first from the SO pin while input data is received
MSB first at the SI pin under synchronous control of the
master’s SCLK signal while CSB is held low (Figure 10).
Output data changes on the falling edge of SCLK and is
guaranteed valid before the next rising edge of SCLK. Input
data received must be valid before the rising edge of SCLK.
Power Up/Down Control
An internal Power−On Reset (POR) monitors VCC1 and
causes all GATX outputs to be held low until sufficient
voltage is available to allow proper control of the device. All
internal registers are initialized to their defaults, status data
is cleared, and the open−drain fault flag (FLTB) is disabled.
When VCC1 exceeds the POR threshold, the device is
initialized and ready to accept input data. When VCC1 falls
below the POR threshold during power down, FLTB is
disabled and all GATX outputs are driven and held low until
VCC1 falls below about 1.5 V.
RSTB and ENB Inputs
The active−low RSTB input with a resistive pull−down
allows device reset by an external signal. When RSTB is
brought low, all GATX outputs, the timer clock, the SPI, and
the FLTB flag are disabled. All internal registers are
initialized to their default states, status data is cleared, and
the SPI and FLTB are enabled when RSTB goes high.
www.onsemi.com
10
NCV7519, NCV7519A
remains latched and available for retrieval during the next
valid frame. The FLTB flag will be set if a fault (not a frame
or parity error) is detected.
The interaction between CSB and FLTB facilitates fault
polling. When multiple NCV7519 devices are configured
for parallel SPI access with individual CSB addressing, the
device reporting a fault can be identified by pulsing each
CSB in turn.
When CSB goes low, frame error detection is initialized,
output data is transferred to the SPI, and the FLTB flag is
disabled and reset if previously set.
If a valid frame has been received when CSB goes high,
the last multiple of 16 bits received is decoded into
command data, and FLTB is re−enabled. The FLTB flag will
be set if a fault is detected.
If a frame or parity error is detected when CSB goes high,
new command data is ignored, and previous fault data
CSB
MSB
SCLK
LSB
1
2
4 − 13
3
14
15
16
SI
X
B15
B14
B13
B12 − B3
B2
B1
B0
SO
Z
B15
B14
B13
B12 − B3
B2
B1
B0
X
UKN
Z
Note: X=Don’t Care, Z=Tri−State, UKN=Unknown Data
Figure 10. SPI Communication Frame Format
Serial Data and Register Structure
registers. The valid register addresses are shown in Table 1.
The input command structure is shown in Table 3. Each
register is later described in detail.
The 16−bit data received by the NCV7519 is decoded into
a 3−bit address, a 12−bit data word, and an odd parity bit
(Figure 11). The upper three bits, beginning with the
received MSB, are fully decoded to address one of eight
B15 B14 B13 B12 B11
A2
A1
A0
D11
D10
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
MSB
P
LSB
ADDRESS
INPUT DATA + PARITY
ADDRESS ECHO
OUTPUT DATA + PARITY
MSB
LSB
B15 B14 B13 B12 B11
A2
B0
A1
A0
D11
D10
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
Figure 11. SPI Data Format
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11
NCV7519, NCV7519A
Table 1. VALID REGISTER ADDRESSES
Type
Alias
A2
A1
A0
GATE & MODE SELECT
Function
W
R0
0
0
0
DIAGNOSTIC PULSE
W
R1
0
0
1
DIAGNOSTIC CONFIG 1
W
R2
0
1
0
DIAGNOSTIC CONFIG 2
W
R3
0
1
1
STATUS CH2:0
R
R4
1
0
0
STATUS CH5:3
R
R5
1
0
1
R
R6
1
1
0
TEST
R7
1
1
1
REVISION INFO
RESERVED
The 16−bit data sent by the NCV7519 is an echo of the
previously received 3−bit address with the remainder of the
12−bit data and parity bit formatted into one of four response
types − an echo of the previously received input data, the
diagnostic status information, the device revision
information, or a transmission error (Table 2). The first
response frame sent after reset (via POR or RSTB) is the
device revision information.
Table 2. OUTPUT RESPONSE TYPES
ECHO RESPONSE
A2
A1
A0
D11
D10
D9
D8
D7
D6
ADDRESS
ECHO
D5
D4
D3
D2
D1
D0
INPUT DATA ECHO
P
?
DIAGNOSTIC STATUS RESPONSE
1
0
0
0
0
ENB
CH2
CH1
CH0
CH2
CH1
CH0
CH2
CH1
CH0
?
1
0
1
0
0
ENB
CH5
CH4
CH3
CH5
CH4
CH3
CH5
CH4
CH3
?
D0
?
ST2
ST1
ST0
DEVICE REVISION RESPONSE
1
1
0
0
0
0
0
0
1
D5
D4
D3
DIE REVISION
D2
D1
MASK REVISION
TRANSMISSION ERROR RESPONSE
1
1
1
0
1
0
1
0
1
0
1
0
1
0
PARITY ERROR
1
1
1
0
1
0
1
0
1
FRAME ERROR
www.onsemi.com
12
0
1
0
1
0
D0
P
1
0
D0
P
0
1
NCV7519, NCV7519A
Table 3. INPUT COMMAND STRUCTURE OVERVIEW
ALIAS
3−BIT ADDR
12−BIT COMMAND INPUT DATA
ODD PARITY
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
0
0
0
M5
M4
M3
M2
M1
M0
G5
G4
G3
G2
G1
G0
?
R0
GATE & MODE
SELECT
1 = AUTO RETRY
DEFAULT = LATCH OFF
1 = GATx ON
DEFAULT = ALL OFF
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
0
0
1
F5
F4
F3
F2
F1
F0
N5
N4
N3
N2
N1
N0
?
R1
DIAGNOSTIC
PULSE
1 = DIAGNOSTIC OFF PULSE
DEFAULT = 0
1 = DIAGNOSTIC ON PULSE
DEFAULT = 0
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
0
1
0
C11
C10
C9
C8
C7
C6
C5
C4
C3
C2
C1
C0
?
R2
DIAGNOSTIC
CONFIG 1
%VFLTREF
SELECT
TBLANK
OFF
TBLANK
ON
NOT
USED
CHANNEL
SELECT
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
0
1
1
X
X
X
X
X
X
CH5
CH4
CH3
CH2
CH1
CH0
?
R3
1 = ENABLE DIAGNOSTIC
DEFAULT = ENABLE
DIAGNOSTIC
CONFIG 2
OPEN LOAD DIAGNOSTIC ENABLE/DISABLE
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
1
0
0
X
X
X
X
X
X
X
X
X
X
X
X
?
R4
DIAGNOSTIC
STATUS CH2:CH0
RETURN ENB STATUS; D[9] = 0 = ENABLED
RETURN CH2:CH0 STATUS; DEFAULT D[8:0] = 1
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
?
R5
DIAGNOSTIC
STATUS CH5:CH3
RETURN ENB STATUS; D[9] = 0 = ENABLED
RETURN CH5:CH3 STATUS; DEFAULT D[8:0] = 1
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
1
1
0
X
X
X
X
X
X
X
X
X
X
X
X
?
R6
REVISION
INFORMATION
RETURN REVISION INFORMATION
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
1
1
1
T11
T10
T9
T8
T7
T6
T5
T4
T3
T2
T1
T0
?
R7
RESERVED
RESERVED FOR TEST MODE
Gate & Mode Select − Register R0
The disable mode for shorted load (on−state) faults is
controlled by each channel’s respective MX bit. Setting
R0.MX = 0 causes the selected GATX output to latch−off
when a fault is detected. Setting R0.MX = 1 causes the
selected GATX output to auto−retry when a fault is detected.
Recovery from latch−off is performed for all channels by
disabling then re−enabling the device via the ENB input.
Recovery for selected channels is performed by reading the
status registers (R4, R5) for the faulted channels then
executing a diagnostic ON or OFF pulse for the desired
channels.
Each GATX output is turned on/off serially by
programming its respective GX bit (Table 4). When parallel
inputs INX = 0, setting R0.GX = 1 causes the selected GATX
output to drive its external MOSFET’s gate to VCC2 (ON).
Setting R0.GX = 0 causes the selected GATX output to drive
its external MOSFET’s gate to VSS (OFF.) Note that the
actual state of the output depends on POR, RSTB, ENB and
shorted load fault states (SHRTX) as later defined by
Equation 1. Default after reset is R0.D[11:0] = 0 (all
channels latch−off mode, all outputs OFF.) R0 is an echo
type response register.
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13
NCV7519, NCV7519A
When auto−retry is selected, input changes for turn−on
time are ignored while the retry timer is active. Once active,
the timer will run to completion of the programmed time.
The output will follow the input at the end of the retry
interval. The timer is reset when ENB = 1 or when the mode
is changed to latch−off.
Table 4. GATE & MODE SELECT REGISTER
R0
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
0
0
0
M5
M4
M3
M2
M1
M0
G5
G4
G3
G2
G1
G0
?
1 = AUTO RETRY
DEFAULT = LATCH OFF
Diagnostic Pulse Select − Register R1
1 = GATx ON
DEFAULT = ALL OFF
timer is active); the selected channels are currently under
auto−retry control (i.e. refresh timer is active).
When R1.FX = 1, the diagnostic OFF pulse command is
executed. The open load diagnostic is turned on if disabled
(see Diagnostic Config 2 − R3), the output changes state for
the programmed tBL(OFF) blanking period, and the
diagnostic status is latched if of higher priority than the
previous status. The output assumes the currently
commanded state at the end of the pulse.
When R1.NX = 1, the diagnostic ON pulse command is
executed. The output changes state for the programmed
tBL(ON) blanking period, and the diagnostic status is latched
if of higher priority than the previous status. The output
assumes the currently commanded state at the end of the
pulse. A flowchart for the diagnostic pulse is given in
Figure 16.
The NCV7519 has functionality to perform either
on−state or off−state diagnostic pulses (Table 5) The
function is provided for applications having loads normally
in a continuous on or off state. The diagnostic pulse function
is available for both latch−off and auto−retry modes. The
pulse executes for the selected channel(s) on low−high
transition on CSB. Default after reset is R1.D[11:0] = 0. R1
is an echo type response register.
Diagnostic pulses have priority and are not dependant on
the input (INX, GX) or the output (GATX) states. The pulse
does not execute if: ENB =1 (device is disabled); both an ON
and OFF pulse is simultaneously requested for the same
channel; an ON or OFF pulse is requested and a SCB
(shorted load) diagnostic code is present for the selected
channels; an ON or OFF pulse is requested while a pulse is
currently executing in the selected channels (i.e. a blanking
Table 5. DIAGNOSTIC PULSE SELECT REGISTER
R1
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
0
0
1
F5
F4
F3
F2
F1
F0
N5
N4
N3
N2
N1
N0
?
1 = DIAGNOSTIC OFF PULSE
DEFAULT = 0
Diagnostic Config 1 − Register R2
1 = DIAGNOSTIC ON PULSE
DEFAULT = 0
select the fault reference (Table 9). Default after reset is
indicated by “(DEF)” in the tables. R2 is an echo type
response register.
If a blanking timer is currently running when the register
is changed, the new value is accepted but will not take effect
until the next activation of the timer.
The diagnostic Config 1 register programs the turn−on/off
blanking time and shorted load fault detection references for
each channel (Table 6) Bits R2.C[2:0] select which channels
receive the configuration data (Table 7). Bits R2.C[8:5]
select turn−on/off blanking time (Table 8). Bits R2.C[11:9]
Table 6. DIAGNOSTIC CONFIG 1 REGISTER
R2
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
0
1
0
C11
C10
C9
C8
C7
C6
C5
C4
C3
C2
C1
C0
?
%VFLTREF
SELECT
TBLANK
OFF
TBLANK
ON
www.onsemi.com
14
NOT
USED
CHANNEL
SELECT
NCV7519, NCV7519A
Table 7. CHANNEL SELECT
C2
C1
C0
CHANNEL
SELECT
0
0
0
NONE
0
0
1
CHANNEL 0
0
1
0
CHANNEL 1
0
1
1
CHANNEL 2
1
0
0
CHANNEL 3
1
0
1
CHANNEL 4
1
1
0
CHANNEL 5
1
1
1
ALL (DEF)
Table 8. BLANKING TIME SELECT
C8
C7
C6
C5
C4
C3
X
X
TBLANK
OFF
TBLANK
ON
0
0
6 ms
0
1
12 ms
1
0
24 ms (DEF)
1
1
48 ms
0
0
55 ms
0
1
81 ms
1
0
162 ms (DEF)
1
1
325 ms
Table 9. FAULT REFERENCE SELECT
C11
C10
C9
%VFLTREF
SELECT
0
0
0
25 (DEF)
0
0
1
40
0
1
0
50
0
1
1
60
1
0
0
70
1
0
1
80
1
1
0
90
1
1
1
100
Diagnostic Config 2 − Register R3
information is suppressed when the diagnostic is turned off
via R3. Open load diagnostic and OLF status is temporarily
enabled when a diagnostic off pulse is executed via R1.
Default after reset is R3.D[5:0] = 1. R3 is an echo type
response register.
Off−state open load diagnostic currents for each channel
can be enabled or disabled for LED loads. Short to GND
diagnostic is unaffected. Channels are selected by bit
positions in the register (Table 10.) Open load status (OLF)
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15
NCV7519, NCV7519A
Table 10. DIAGNOSTIC CONFIG 2 REGISTER
R3
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
0
1
1
X
X
X
X
X
X
CH5
CH4
CH3
CH2
CH1
CH0
?
1 = ENABLE DIAGNOSTIC
DEFAULT = ENABLE
OPEN LOAD DIAGNOSTIC ENABLE/DISABLE
Diagnostic Status Registers − Register R4 & R5
encoded (Table 12). Bit D[9] returns the state of the ENB
input e.g. D[9] = 0 when ENB = 0 (enabled). Default
response after reset or SPI read is D[8:0] = 1 (“Diagnostic
Not Complete”).
Diagnostic status and ENB status information is returned
when R4 or R5 is selected (Table 11) Diagnostic status
information for each channel is 3−bit (ST2:0) priority
Table 11. DIAGNOSTIC STATUS REGISTERS
R4
R5
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
1
0
0
X
X
X
X
X
X
X
X
X
X
X
X
?
SI
1
0
0
0
0
ENB
CH2
CH1
CH0
CH2
CH1
CH0
CH2
CH1
CH0
?
SO
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
?
SI
1
0
1
0
0
ENB
CH5
CH4
CH3
CH5
CH4
CH3
CH5
CH4
CH3
?
SO
ST2
ST1
ST0
Table 12. DIAGNOSTIC STATUS ENCODING
ST2
ST1
ST0
0
0
0
INVALID
0
0
1
SCB − SHORT TO BATTERY
1 HIGHEST
0
1
0
SCG − SHORT TO GROUND
2
0
1
1
OLF − OPEN LOAD
1
0
0
Diagnostic Complete − No Fault
4
1
0
1
No SCB Fault − ON State
5
1
1
0
No SCG/OLF Fault − OFF State
6
1
1
1
Diagnostic Not Complete (DEFAULT)
NOTE:
STATUS
PRIORITY
−
3 (Note)
7 LOWEST
OLF status report is suppressed when open load diagnostic is turned off via
Diagnostic Config 2 − register R3
Status is latched for the currently higher priority fault and
is not demoted if a fault of lower priority occurs. The status
registers are reset to “Diagnostic Not Complete” after
reading the registers, or by asserting a reset via RSTB. Status
registers are not affected by ENB.
(i.e. “00” = 7518, “01” = 7519), bits D[5:3] are hard coded
with the die (silicon) revision, and bits D[2:0] are hard coded
with the mask (interconnect) revision. The first response
frame sent after reset is the device revision information. The
revision encoding scheme is shown in Table 14.
Mask revision may be incremented when an interconnect
revision is made. Die revision is incremented when a silicon
revision is made. Mask revision is reset to “000” when a die
revision is made.
Revision Information − Register R6
Device revision information is returned when R6 is
selected (Table 13). Output bits D[11:8] are hard coded to 0,
bits D[7:6] are encoded with the specific device identifier
Table 13. DEVICE REVISION INFORMATION
R6
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
1
1
0
X
X
X
X
X
X
X
X
X
X
X
X
?
SI
1
1
0
0
0
0
0
0
1
D5
D4
D3
D2
D1
D0
?
SO
DEVICE
www.onsemi.com
16
DIE REV
MASK REV
NCV7519, NCV7519A
Table 14. DEVICE REVISION ENCODING
D5
D4
D3
DIE
D2
REV
0
0
0
0
0
0
1
0
D1
D0
MASK
REV
A
0
0
0
0
1
B
0
0
1
1
0
C
0
1
0
2
1
1
D
0
1
1
3
1
0
0
E
1
0
0
4
1
0
1
F
1
0
1
5
1
1
0
G
1
1
0
6
1
1
1
H
1
1
1
7
Reserved − Register R7
Register R7 is reserved for factory test use. Data sent to R7
is ignored. In normal operation, R7 is an echo type response
register. In the event of a transmission error, R7 responds
with either a parity or frame error on the next valid frame.
Table 15. TEST MODE REGISTER
R7
A2
A1
A0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
P
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
?
SI
?
SO
PARITY ERR
0
1
0
1
0
1
0
1
0
1
0
1
0
SO
FRAME ERR
0
1
0
1
0
1
0
1
0
1
0
0
1
SO
ECHO
INPUT DATA ECHO
Gate Driver Control and Enable
The INX input state and the GX register bit data are
logically combined with the internal (active low) power−on
reset signal (POR), the RSTB and ENB input states, and the
shorted load state (internal SHRTX) to control the
corresponding GATX output such that:
Each GATX output may be turned on by either its
respective parallel INX input or the Gate & Mode Select
register bits R0.G[5:0] via SPI communication. The
device’s RSTB reset and ENB enable inputs can be used to
implement global control functions, such as system reset,
over−voltage or input override by a watchdog controller.
The RSTB input has an internal pull−down resistor and
the ENB input has an internal pull−up resistor. Each parallel
input has an internal pull−down resistor. Parallel input is
recommended when low frequency (≤ 10 kHz) PWM
operation of the outputs is desired. Unused parallel inputs
should be connected to GND.
When RSTB is brought low, all GATX outputs, the timer
clock, the SPI, and the FLTB flag are disabled. All internal
registers are initialized to their default states, status data is
cleared, and the SPI and FLTB are enabled when RSTB goes
high.
ENB disables all GATX outputs and diagnostics, and
resets the auto−retry timer when brought high. The SPI is
enabled, fault data is not cleared and registers remain as
programmed. Faulted outputs are re−enabled when ENB
goes low.
(eq. 1)
GAT X + POR @ RSTB @ ENB @ SHRT X @ ǒIN x ) G XǓ
The GATX state truth table is given in Table 16.
www.onsemi.com
17
NCV7519, NCV7519A
Table 16. GATE DRIVER TRUTH TABLE
POR
RSTB
ENB
SHRTX
INX
GX
GATX
0
X
X
X
X
X
L
1
0
X
X
X
X
L
1
1
1
X
X
X
L
1
1
0
1
0
0
L
1
1
0
1
1
X
H
1
1
0
1
X
1
H
1
1
0
0
X
X
→L
1
1
0→1
X
X
GX
→L
1
1
1→0
→1
0
GX
→GX
1
1→0
X
X
X
→0
→L
Gate Drivers
The non−inverting GATX drivers are symmetrical
resistive switches (350 W typ.) to the VCC2 and VSS
voltages. While the outputs are designed to provide
symmetrical gate drive to an external MOSFET, load current
R3.D[X,X+6]
R2.C[11:9]
STX[2:0]
R0.M[X]
R1.F|N[X]
INX
GX
RSTB
ENB
POR
FAULT
DETECTION
FILTER
TIMER
ENCODING
LOGIC
DRNX
BLANKING
TIMER
R2.C[8:5]
R2.C[4:3]
switching symmetry is dependent on the characteristics of
the external MOSFET and its load. Figure 12 shows the gate
driver block diagram.
LATCH OFF /
AUTO RE−TRY
EN
SHRT X
VSS
VCC2
DRIVER
DIAGNOSTIC
PULSE
EN
350
GAT X
VSS
Figure 12. Gate Driver Channel
Blanking and Filter Timers
If a blanking timer is currently running when the register
is changed, the new value is accepted but will not take effect
until the next activation of the timer.
Blanking timers for all channels are started when both
RSTB goes high and ENB goes low, when RSTB goes high
while ENB is low, when ENB goes low while RSTB is high,
or by POR.
Blanking timers are used to allow drain feedback to
stabilize after a channel is commanded to change states.
Filter timers are used to suppress glitches while a channel is
in a stable state.
A turn−on blanking timer is started when a channel is
commanded on. Drain feedback is sampled after tBL(ON). A
turn−off blanking timer is started when a channel is
commanded off. Drain feedback is sampled after tBL(OFF).
A filter timer is started when a channel is in a stable state
and a fault detection threshold associated with that state has
been crossed. Drain feedback is sampled after tFF(ON|OFF).
A filter timer may also be started while a blanking timer is
active, so the blanking interval could be extended by the
filter time.
Each channel has independent blanking and filter timers.
The parameters for the tFF(ON|OFF) filter timer are the same
for all channels. The turn−on/off blanking time for each
channel can be selected via the Diagnostic Config 1 register
bits R2.C[8:5] (Tables 6 and 8).
Fault Diagnostics and Behavior
Each channel has independent fault diagnostics and
employs blanking and filter timers to suppress false faults.
An external MOSFET is monitored for fault conditions by
connecting its drain to a channel’s DRNX feedback input
through an optional external series resistor.
Shorted load (or short to VLOAD) faults can be detected
when a driver is on. Open load or short to GND faults can be
detected when a driver is off.
On−state faults will initiate MOSFET protection
behavior, set the FLTB flag and the respective channel’s
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NCV7519, NCV7519A
range of 0.35 to 2.75 V and can be derived via a voltage
divider between VCC1 and GND.
Shorted load detection thresholds can be programmed via
SPI in eight increments that are ratiometric to the applied
FLTREF voltage. Separate thresholds can be selected for
each channel via the Diagnostic Config 1 register bits
R2.C[11:9] (Tables 6 and 9).
A shorted load fault is detected when a channel’s DRNX
feedback is greater than its selected fault reference after
either the turn−on blanking or the filter has timed out.
status bits in the device’s status registers. Off−state faults
will simply set the FLTB flag and the channel’s status bits.
Status information is retrieved by SPI read of registers R4
and R5 (Table 11). Status information for each channel is
3−bit priority encoded (Table 12). Shorted load fault has
priority over open load and short to GND. Short to GND has
priority over open load. Priority ensures that the most severe
fault data is available at the next SPI read.
Status is latched for the currently higher priority fault and
is not demoted if a fault of lower priority occurs. The status
registers are reset to “Diagnostic Not Complete” after
reading the registers, or by asserting a reset via RSTB. Status
registers are not affected by ENB.
When either RSTB is low or ENB is high, diagnostics are
disabled. When RSTB is high and ENB is low, open load
diagnostics are enabled according to the state of the
Diagnostic Config 2 register bits R3.D[5:0] (Table 10).
Shorted Load Fault Disable and Recovery
Shorted load fault disable mode for each channel is
individually SPI programmable via the device’s Gate &
Mode select register bits R0.M[5:0] (Table 4).
When latch−off mode (default) is selected, the
corresponding GATX output is latched off upon detection of
a fault. Recovery from latch−off is performed for all
channels by disabling then re−enabling the device via the
ENB input. Recovery for selected channels is performed by
reading the status registers (R4, R5) for the faulted channels
then executing a diagnostic ON or OFF pulse for the desired
channels.
When auto−retry mode is selected the corresponding
GATX output is turned off upon detection of a fault for the
duration of the fault retry time (tFR). When auto−retry is
selected, input changes for turn−on blanking time are
ignored while the retry timer is active. Once active, the timer
will run to completion of the programmed time. The output
will follow the input at the end of the retry interval. The timer
is reset when ENB = 1 or when the mode is changed to
latch−off.
The output is automatically turned back on (if still
commanded on) when the retry time ends. The channel’s
DRNX feedback is re−sampled after the turn−on blanking
time. The output will automatically be turned off if a fault is
again detected. This behavior will continue for as long as the
channel is commanded on and the fault persists.
In either mode, a fault may exist at turn−on or may occur
some time afterward. To be detected, the fault must exist
longer than either tBL(ON) at turn−on or longer than tFF(ON)
some time after turn−on. The length of time that a MOSFET
stays on during a shorted load fault is thus limited to either
tBL(ON) or tFF(ON).
Diagnostic Pulse Mode
The NCV7519 has functionality to perform either
on−state or off−state diagnostic pulses (Table 5). The
function is provided for applications having loads normally
in a continuous on or off state. The diagnostic pulse function
is available for both latch−off and auto−retry modes. The
pulse executes for the selected channel(s) on low−high
transition on CSB.
Diagnostic pulses have priority and are not dependant on
the input (INX, GX) or the output (GATX) states. The pulse
does not execute if: ENB =1 (device is disabled); both an ON
and OFF pulse is simultaneously requested for the same
channel; an ON or OFF pulse is requested and a SCB
(shorted load) diagnostic code is present for the selected
channels; an ON or OFF pulse is requested while a pulse is
currently executing in the selected channels (i.e. a blanking
timer is active); the selected channels are currently under
auto−retry control (i.e. refresh timer is active).
When R1.FX = 1, the diagnostic OFF pulse command is
executed. The open load diagnostic is turned on if disabled
(see Diagnostic Config 2 − R3), the output changes state for
the programmed tBL(OFF) blanking period, and the
diagnostic status is latched if of higher priority than the
previous status. The output assumes the currently
commanded state at the end of the pulse.
When R1.NX = 1, the diagnostic ON pulse command is
executed. The output changes state for the programmed
tBL(ON) blanking period, and the diagnostic status is latched
if of higher priority than the previous status. The output
assumes the currently commanded state at the end of the
pulse. A flowchart for the diagnostic pulse is given in
Figure 16.
Recovery Retry Time
A global retry timer is used for auto−retry timing. The first
faulted channel triggers the timer and the full retry time is
guaranteed for that channel. An additional faulted channel
may initially retry immediately after its turn−on blanking
time, but subsequent retries will have the full retry time.
If all channels become faulted, they will become
synchronized to the global retry timer.
Shorted Load Detection
An external reference voltage applied to the FLTREF
input serves as a common reference for all channels
(Figures 1 and 2). The FLTREF voltage should be within the
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19
NCV7519, NCV7519A
Open Load and Short to GND Detection
No fault is detected if the feedback voltage at DRNX is
greater than the VOL open load reference. If the feedback is
less than the VSG short to GND reference, a short to GND
fault is detected. If the feedback is less than VOL and greater
than VSG, an open load fault is detected.
When either RSTB is low or ENB is high, diagnostics are
disabled. When RSTB is high and ENB is low, off−state
diagnostics are enabled according to the content of the
Diagnostic Config 2 register bits R3.D[5:0] (Tables 10
and 17.)
A window comparator with references and bias currents
proportional to VLOAD is used to detect open load or short
to GND faults when a channel is off. Each channel’s DRNX
feedback is compared to the references after either the
turn−off blanking or the filter has timed out. Figure 13
shows the DRNX bias and fault detection zones.
IDRNX
IOL
Short to
GND
Open
Load
No
Fault
Table 17. OPEN LOAD DIAGNOSTIC CONTROL
(CH0 shown)
0
D0
OPEN LOAD DIAGNOSTIC
0
OFF
1
ON
(DEF)
-ISG
Figure 14 shows the simplified detection circuitry. Bias
currents ISG and IOL are applied to a bridge along with bias
voltage VCTR.
VDRNX
VSG
V CTR
V OL
Figure 13. DRNX Bias and Fault Detection Zones
VBAT
DX1
VLOAD
RSTB
ENB
R1.D[11:0]
R3.D[5:0]
tBL(OFF)
CONTROL
LOGIC
S1
S2
R1
A
−
VOL
+
R2
VLD
ISG
CMP1
D3
RLD
D1
DRNX
+
B
CMP2
−
+
R3
VSG
DZ1
OA
−
D4
D2
(VCL)
VX
RDX
RSG
±VOS
R4
VCTR
IOL
S3
Figure 14. Short to GND/Open−Load Detection
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20
CESD
NCV7519, NCV7519A
Current ISG will charge external capacitance CESD
toward VCTR. VDRNX will remain at VCTR if an open load
truly exists, otherwise the capacitance can continue to
charge via RLD.
When a channel is off and VLD and RLD are present, RSG
is absent, and VDRNX >> VCTR, bias current IOL is supplied
from VLD to ground through resistors RLD and optional
RDX, and bridge diode D2. Bias current ISG is supplied from
VLOAD to VCTR through D3. No fault is detected if the
feedback voltage (VLD minus the total voltage drop caused
by IOL and the resistance in the path) is greater than VOL.
When RSG and either VLD or RLD are absent, the bridge
will self−bias so that VDRNX will settle to about VCTR. An
open load fault can be detected since the feedback is between
VSG and VOL.
Short to GND detection can tolerate up to a ±1.0 V offset
(VOS) between the NCV7519’s GND and the short. When
RSG is present and VDRNX << VCTR, bias current ISG is
supplied from VLOAD to VOS through D1, and the RSG and
optional RDX resistances. Bias current IOL is supplied from
VCTR to ground through D4.
When VLD and RLD are present, a voltage divider between
VLD and VOS is formed by RLD and RSG. A “soft” short to
GND may be detected in this case depending on the ratio of
RLD and RSG and the values of RDX, VLD, and VOS.
Optional RDX resistor is used when voltages greater than
the 60 V minimum clamp voltage or down to −1 V are
expected at the DRNx inputs. Note that the comparators see
a voltage drop or rise due to the RDX resistance and the bias
currents. This produces an error in the comparison of
feedback voltage at the comparator inputs to the actual node
voltage VX.
Several equations for choosing RDX and for predicting
open load or short to GND resistances, and a discussion of
the dynamic behavior of the short to GND/ open load
diagnostic are provided in the “Application Guidelines”
section of this data sheet.
OTHER
CHANNELS
FLTB
FAULTX
ENB
RSTB
POR
CSB
Figure 15. FLTB Flag Logic
The interaction between CSB and FLTB facilitates fault
polling. When multiple NCV7519 devices are configured
for parallel SPI access with individual CSB addressing, the
device reporting a fault can be identified by pulsing each
CSB in turn.
Fault Detection and Capture
Each channel of the NCV7519 is capable of detecting
shorted load faults when the channel is on, and short to
ground or open load faults when the channel is off. Each
fault type is priority encoded into 3−bit per channel fault data
(Table 12.) Shorted load fault data has priority over open
load and short to GND data. Short to GND data has priority
over open load data. Priority ensures that the most severe
fault data is available at the next SPI read.
A drain feedback input for each channel compares the
voltage at the drain of the channel’s external MOSFET to
several internal reference voltages. Separate detection
references are used to distinguish the three fault types.
Blanking and filter timers are used respectively to allow for
output state transition settling and for glitch suppression.
When enabled and configured, each channel’s drain
feedback input is continuously compared to references
appropriate to the channel’s input state to detect faults, but
the comparison result is only latched at the end of either a
blanking or filter timer event.
Blanking timers for all channels are started when both
RSTB goes high and ENB goes low, when RSTB goes high
while ENB is low, when ENB goes low while RSTB is high,
or by POR. A single channel’s blanking timer is triggered
when its input state changes. If the comparison of the
feedback to a reference indicates an abnormal condition
when the blanking time ends, a fault has been detected and
the fault data is latched into the channel’s status register.
A channel’s filter timer is triggered when its drain
feedback comparison state changes. If the change indicates
an abnormal condition when the filter time ends, a fault has
Fault Flag (FLTB)
The open−drain active−low fault flag output can be used
to provide immediate fault notification to a host controller.
Fault detection from all channels is logically ORed to the
flag (Figure 15) The FLTB outputs from several devices can
be wire−ORed to a common pull−up resistor connected to
the controller’s 3.3 or 5 V VDD supply.
When RSTB and CSB are high, and ENB is low, the flag
is set (low) when any channel detects any fault. The flag is
reset (hi−Z) and disabled during POR, when either RSTB or
CSB is low, or when ENB is high. See Table 18 for details.
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NCV7519, NCV7519A
When a diagnostic cycle starts from an off−state and no
fault is detected, “No SCG/OLF Fault” will be encoded
unless a fault of higher priority has previously been encoded.
Otherwise, “OLF” or “SCG” will be encoded unless a fault
of higher priority has previously been encoded. If the cycle
continues to an on−state and no fault is detected, “Diagnostic
Complete − No Fault” will be encoded. Otherwise, “SCB”
will be encoded.
When a diagnostic cycle starts from an on−state and no
fault is detected, “No SCB Fault” will be encoded unless a
fault of higher priority has previously been encoded.
Otherwise, “SCB” will be encoded. If the cycle continues to
an off−state and no fault is detected, “Diagnostic Complete
− No Fault” will be encoded unless a fault of higher priority
has previously been encoded. Otherwise, “OLF” or “SCG”
will be encoded unless a fault of higher priority has
previously been encoded.
Status is latched for the currently higher priority fault and
is not demoted if a fault of lower priority occurs. The status
registers are reset to “Diagnostic Not Complete” after
reading the registers, or by asserting a reset via RSTB. Status
registers are not affected by ENB.
A Statechart diagram of the diagnostic status encoding is
given in Figure 17 and additional clarification is given in
“Appendix A − Diagnostic and Protection Behavior
Tutorial”.
been detected and the fault data is latched into the channel’s
status register.
Thus, a state change of the inputs (POR, RSTB, ENB, INX
or GX) or a state change of an individual channel’s feedback
(DRNX) comparison must occur for a timer to be triggered
and a detected fault to be captured.
Fault Capture, SPI Communication, and SPI Frame
Error Detection
The NCV7519 latches a fault when it is detected, and
parity and frame error detection will not allow any register
to accept data if an invalid frame occurred.
The fault capture, parity, and frame error detection
strategies combine to ensure that intermittent faults can be
captured and identified, and that the device cannot be
inadvertently re−programmed by a communication error.
When a fault has been detected, status information is
latched into a channel’s status register if of higher priority
than current status, and the FLTB flag is set. The register
holds the status data and ignores subsequent lower priority
status data for that channel.
Current status information is transferred from the selected
status register into the SPI shift register at the start of the SPI
frame following the read status request. This ensures that
status updates continue during inter−frame latency between
the status request and delivery. The FLTB flag is reset when
CSB goes low.
The selected status register is cleared when CSB goes high
at the end of the SPI frame only if a valid frame has occurred;
otherwise the register retains status information until a valid
read frame occurs. The FLTB flag will be set if a fault is still
present.
Status registers and the FLTB flag can also be cleared by
toggling RSTB H→L→H. A full I/O truth table is given in
Table 18.
VLOAD Undervoltage Detection
Undervoltage detection is used to suppress off−state
diagnostics when VLOAD falls below the specified
VLDUV operating voltage. This ensures that potentially
incorrect diagnostic status is not captured. On−state
diagnostics continue to operate normally and status
information is updated appropriately for an off−to−on input
transition during undervoltage.
Previous status information and FLTB are unchanged
when entering or leaving undervoltage. Upon a read of the
status registers during undervoltage, the status is changed to
“Diagnostic Not Complete” and will remain as such for
channels in an off−state during the entire undervoltage
interval. Status information and FLTB are updated
appropriately if a channel changes from off to on during the
interval.
When VLOAD returns to its normal operating range, a
channel’s tBL(OFF) blanking timer is started if the channel
was in an off state. Status information is updated
appropriately after the tBL(OFF) blanking interval, or after
the tFF(OFF) filter interval if the filter has been activated.
Status Priority Encoding
Shorted load (SCB) faults can be detected when a driver
is ON. Open load (OLF) or short to GND (SCG) faults can
be detected when a driver is OFF. Status memory is priority
encoded in a 3−bit per driver format (Table 12).
Status memory will be encoded “Diagnostic Not
Complete” during a blanking period unless a fault of higher
priority has previously been encoded. Status memory will be
encoded “Diagnostic Not Complete” (cleared) for the
selected status register at the end of a valid SPI frame.
“Diagnostic Complete − No Fault” will be encoded when
BOTH on−state AND off−state diagnostics have been
completed unless a fault of higher priority has previously
been encoded. A diagnostic cycle may start from either an
off−state or an on−state.
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NCV7519, NCV7519A
ON or OFF Pulse
Request
*A blanking or
refresh timer is
currently running
for the selected
channel
Device
Enabled
?
NO
Currently
Executing*
?
YES
Both ON &
OFF Request
?
SCB Code
Present
?
Execute
ON
Pulse
YES
YES
END
YES
ON Pulse
Request
?
Open Load
Enabled
?
YES
Execute
OFF
Pulse
Enable
Open Load
Execute
OFF
Pulse
Disable
Open Load*
* Don’t disable if a SPI
access to R3.D[5:0]
occurred during the
pulse to enable the
channel’s diagnostic.
END
3/11 /2010
Figure 16. Pulse Mode Diagnostic Flowchart
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23
NCV7519, NCV7519A
SHORTED LOAD (SCB)
001
SHORT TO GND (SCG)
010
OPEN LOAD (OLF)
011
DIAG COMPLETE
NO FAULTS
100
{ If no SCB AND no SCG/OLF}
NO SCB
101
NO SCG/OLF
110
DIAG NOT COMPLETE
111
RESET
ENB = 1
OR
VLOAD UV
AND
(INx AND Gx=0)
READ STATUS
OR
RESET
Figure 17. Diagnostic Status Encoding Statechart
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NCV7519, NCV7519A
Table 18. I/O TRUTH TABLE
Inputs
Outputs*
POR
RSTB
ENB
CSB
INX
GX
DRNX
GATX
FLTB
ST[2:0]
COMMENT
0
X
X
X
X
→0
X
→L
→Z
→111
POR RESET
1
0
X
X
X
X
X
L
Z
111
RSTB
1
1
1
X
X
GX
X
L
Z
ST[2:0]
ENB
1
1→0
0
X
X
→0
X
→L
→Z
→111
RSTB RESET
1
1
0→1
X
X
GX
X
→L
→Z
ST[2:0]
ENB DISABLE
1
1
0
X
0
0
> VOL
L
Z
ST[2:0]
FLTB RESET
1
1
0
1
0
0
VSG < V < VOL
L
L
→ 011
FLTB SET − OLF
1
1
0
1→0
0
0
VSG < V < VOL
L
L→Z
011
FLTB RESET
1
1
0
0→1
0
0
VSG < V < VOL
L
Z→L
011
FLTB SET
1
1
0
1
0
0
< VSG
L
L
→ 010
FLTB SET − SCG
1
1
0
1→0
0
0
< VSG
L
L→Z
010
FLTB RESET
1
1
0
0→1
0
0
< VSG
L
Z→L
010
FLTB SET
1
1
0
X
1
X
< VFLTREF
H
Z
ST[2:0]
FLTB RESET
1
1
0
1
1
X
> VFLTREF
L
L
→ 001
FLTB SET − SCB
1
1
0
1→0
1
X
> VFLTREF
L
L→Z
001
FLTB RESET
1
1
0
0→1
1
X
> VFLTREF
L
Z→L
001
FLTB SET
1
1
0
1
X
1
< VFLTREF
H
Z
ST[2:0]
FLTB RESET
1
1
0
1
X
1
> VFLTREF
L
L
→ 001
FLTB SET − SCB
1
1
0
1→0
X
1
> VFLTREF
L
L→Z
001
FLTB RESET
1
1
0
0→1
X
1
> VFLTREF
L
Z→L
001
FLTB SET
*Output states after blanking and filter timers end and when channel is set to latch−off mode.
APPLICATION GUIDELINES
General
circuit by the use of series resistors for slew control, or
resistors and diodes for symmetry. Any benefit of EMI
reduction by this method comes at the expense of increased
switching losses in the MOSFETs.
The channel fault blanking timers must be considered
when choosing external components (MOSFETs, slew
control resistors, etc.) to avoid false faults. Component
choices must ensure that gate circuit charge/discharge times
stay within the turn−on/turn−off blanking times.
The NCV7519 does not have integral drain−gate flyback
clamps. Self−clamped MOSFET products, such as
ON Semiconductor’s NIF9N05CL or NCV8440A devices,
are recommended when driving unclamped inductive loads.
This flexibility allows choice of MOSFET clamp voltages
suitable to each application.
Unused DRNX inputs should be connected to VLOAD to
prevent false open load faults. Unused parallel inputs should
be connected to GND and unused reset or enable inputs
should be connected to VCC1 or GND respectively. The
user’s software should be designed to ignore fault
information for unused channels. For best shorted−load
detection accuracy, the external MOSFET source terminals
should be star−connected and the NCV7519’s GND pin, and
the lower resistor in the fault reference voltage divider
should be Kelvin connected to the star (see Figure 2).
Consideration of auto−retry fault recovery behavior is
necessary from a power dissipation viewpoint (for both the
NCV7519 and the MOSFETs) and also from an EMI
viewpoint.
Driver slew rate and turn−on/off symmetry can be
adjusted externally to the NCV7519 in each channel’s gate
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NCV7519, NCV7519A
Appendix A − Diagnostic and Protection Behavior
Tutorial
Initial Conditions:
The following tutorial can be used together with Table 19
and the Statechart of Figure 17 to further understand how
diagnostic status information is updated.
♦ Digital core is disabled if these conditions are not valid
• VCC2 present and in specified range
• VLOAD present and in specified range
♦
♦
♦
♦
♦
♦
♦
♦
♦
♦
♦
VFLTREF present and in specified range
INx OR Gx = 1 AND ENB 1 → 0
ENB = 0 AND INx OR Gx 0 → 1
ENB = 0 AND ON−State Diagnostic Pulse Request
Blanking and/or Filter timer ran till end
√ “Diagnostic Complete”
• VCC1 > V(POR) AND RSTB = 1
ON−State Diagnostic:
• SCB − Short Circuit to Battery
• Qualifiers:
OFF−State Diagnostic:
• OLF/SCG − Open Load Fault / Short Circuit to GND
• Qualifiers:
VLOAD present and in specified range
INx AND Gx = 0 AND ENB 1 → 0
ENB = 0 AND INx 1 → 0 AND Gx = 0
ENB = 0 AND INx = 0 AND Gx 1 → 0
ENB = 0 AND OFF−State Diagnostic Pulse Request
Blanking and/or Filter timer ran till end
√ “Diagnostic Complete”
Transition Trigger Events:
• Diagnostic status can transition from one state to
another by several trigger events:
♦ ON and/or OFF state diagnostic completed
♦ SPI Read of the status register(s)
♦ Recovery from VLOAD undervoltage detected
♦ Reset via POR or RSTB
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NCV7519, NCV7519A
Table 19. DIAGNOSTIC STATE TRANSITIONS
Entering
State
Description
Entering Criteria
Exiting Criteria
Exiting
State
001
[SCB] − Short Circuit to
Battery
SCB Detected
READ
111
010
[SCG] − Short Circuit to
Ground
SCG Detected
SCB Detected
READ
001
111
011
[OLF] − Open Load Failure
OLF Detected
SCB Detected
SCG Detected
READ
001
010
111
100
Diagnostic Complete − No
Fault
OFF State No Fault
AND
ON State No Fault
SCB Detected
SCG Detected
OLF Detected
READ
001
010
011
111
101
No SCB Detected
ON State No Fault
SCB Detected
SCG Detected
OLF Detected
OFF State No Fault
READ
001
010
011
100
111
110
No SCG/OLF Detected
OFF State No Fault
SCB Detected
SCG Detected
OLF Detected
ON State No Fault
READ
001
010
011
100
111
111
Diagnostic Not Complete
READ
SCB Detected & ENB = 0
SCG Detected & ENB = 0, VLOAD > VLDUV
OLF Detected & ENB = 0, VLOAD > VLDUV
ON State No Fault & ENB = 0
OFF State No Fault & ENB = 0, VLOAD > VLDUV
001
010
011
101
110
Diagnostic Status and Protection Interactions
• ENB = 0
• SPI Response is shown in−frame
The following figures are graphical representations of
some interactions between diagnostics and protections.
The following assumptions apply:
♦ Actual NCV7519 response is one frame behind
• SPI Frames are always valid
♦ Integer multiples of 16 SCLK cycles
♦ No parity errors
www.onsemi.com
27
NCV7519, NCV7519A
1
INx
0
1
DRNx
GATx
0
VBAT
VOL
VOL
FLTREF
VSG
0
1
INTERNAL SIGNALS
RSTB
0
BLANK 1
TIMER 0
tBL(ON)
t BL(OFF )
FILTER 1
TIMER 0
DIAG NOT COMPLETE
NO SCB FAULT
111
101
DIAG 1
STATUS 0
NO FAULT
110
100
NO SCG/OLF FAULT
111
110
111
110
1
CSB
0
1
SO
100
0
110
1
FLTB
0
Start ON Normal Cycle1
Figure 18. Normal Start−up out of Reset with Input High − Diagnostics Complete, No Fault
1
INx
0
1
DRNx
GATx
0
VBAT
VOL
VOL
FLTREF
VSG
0
1
RSTB
0
INTERNAL SIGNALS
TRUNCATED
BLANK 1
TIMER 0
tBL(ON )
t BL(OFF )
FILTER 1
TIMER 0
DIAG NOT COMPLETE
DIAG 1
STATUS 0
NO SCG/OLF FAULT
111
NO SCG/OLF FAULT
110
111
110
111
110
1
CSB
0
1
SO
110
0
110
1
FLTB
0
Start ON Normal Cycle 2
Figure 19. Normal Start−up Out of Reset with Input High, tBL(ON) Truncated − SCB Not Checked
www.onsemi.com
28
NCV7519, NCV7519A
1
INx
0
1
DRNx
GATx
0
VBAT
VOL
VOL
VSG
FLTREF
0
1
INTERNAL SIGNALS
RSTB
0
BLANK 1
TIMER 0
tBL(ON )
t BL(OFF )
FILTER 1
TIMER 0
DIAG NOT COMPLETE
DIAG 1
STATUS 0
111
NO SCG/OLF FAULT
110
NO FAULT
101
100
NO SCB FAULT
111
101
111
101
1
CSB
0
1
SO
100
0
101
1
FLTB
0
Start OFF Normal Cycle 1
Figure 20. Normal Start−up Out of Reset with Input Low − Diagnostics Complete, No Fault
1
INx
0
1
DRNx
GATx
0
VBAT
VOL
VOL
VSG
FLTREF
0
1
RSTB
0
INTERNAL SIGNALS
TRUNCATED
BLANK 1
TIMER 0
tBL(OFF )
tBL(ON )
FILTER 1
TIMER 0
DIAG 1
STATUS 0
DIAG NOT COMPLETE
NO SCB FAULT
111
101
NO SCB FAULT
111
101
111
101
1
CSB
0
1
SO
101
0
101
1
FLTB
0
Start OFF Normal Cycle 2
Figure 21. Normal Start−up Out of Reset with Input Low, tBL(OFF) Truncated − SCG/OLF Not Checked
www.onsemi.com
29
NCV7519, NCV7519A
1
INx
Don’t Care
0
1
GATx
0
DRNx
VBAT
VOL
VOL
FLTREF
VSG
0
1
RSTB
0
INTERNAL SIGNALS
TRUNCATED
BLANK 1
TIMER 0
tBL(OFF)
FILTER 1
TIMER 0
tBL(ON)
tBL(ON)
tBL(OFF)
tFF(ON)
DIAG 1
STATUS 0
NO FAULT
SCB FAULT
DIAG NOT COMPLETE
NO SCB FAULT
100
001
111
101
NO FAULT
110
100
1
CSB
0
ON Pulse Req
1
SO
001
0
ECHO
1
FLTB
0
SCB Latch & Clear 1
Figure 22. SCB Latch−off & Recovery − Read Status & Request ON Pulse
1
INx
Don’t Care
0
1
GATx
0
DRNx
VBAT
VOL
VOL
FLTREF
VSG
FLTREF
0
1
INTERNAL SIGNALS
RSTB
0
BLANK 1
TIMER 0
tBL(OFF)
FILTER 1
TIMER 0
DIAG 1
STATUS 0
tBL(ON)
tFF(ON)
NO FAULT
SCB FAULT
DIAG NOT COMPLETE
NO SCG/OLF FAULT
100
001
111
110
NO FAULT
101
100
1
CSB
0
OFF Pulse Req
1
SO
0
001
ECHO
1
FLTB
0
SCB Latch & Clear 2
Figure 23. SCB Latch−off & Recovery − Read Status & Request OFF Pulse
www.onsemi.com
30
NCV7519, NCV7519A
1
INx
Don’t Care
0
1
GATx
0
DRNx
VBAT
VOL
VOL
FLTREF
VSG
0
1
INTERNAL SIGNALS
RSTB
0
BLANK/ 1
REFRESH
TIMER 0
t FR
FILTER 1
TIMER 0
DIAG 1
STATUS 0
tFF(ON)
tBL(ON)
t FR
tFF(ON)
NO FAULT
SCB FAULT
DIAG NOT COMPLETE
SCB FAULT
100
001
111
001
1
CSB
0
ON/OFF Pulse Req
Ignored During Retry
1
SO
001
0
ECHO
1
FLTB
0
Retry 1
Figure 24. Auto−retry Timer Started, INx Went Low During Second Retry − Retry Timer Runs to Completion
1
INx
Don’t Care
0
1
DRNx
GATx
0
VBAT
VOL
VOL
FLTREF
VSG
0
1
INTERNAL SIGNALS
RSTB
0
BLANK/ 1
REFRESH
TIMER 0
tFR
FILTER 1
TIMER 0
DIAG 1
STATUS 0
tBL(ON )
tFR
tFF(ON )
NO FAULT
SCB FAULT
DIAG NOT COMPLETE
SCB FAULT
NOT COMPLETE
NO SCG/OLF
100
001
111
001
111
110
1
CSB
0
ON/OFF Pulse Req
Ignored During Retry
1
SO
0
001
001
ECHO
1
FLTB
0
Retry 2
Figure 25. Auto−retry Timer Started, INx Went Low During Second Retry − Retry Timer Runs to Completion
Status Read Clears SCB, Allows OFF−state Status Update
www.onsemi.com
31
NCV7519, NCV7519A
1
INx
Don’t Care
0
1
DRNx
GATx
0
VBAT
VOL
VOL
VSG
FLTREF
VSG
0
1
INTERNAL SIGNALS
RSTB
0
OFF BLANK STARTED TO ALLOW
DRAIN TO SETTLE
BLANK 1
TIMER 0
tBL(ON)
tBL(OFF )
FILTER 1
TIMER 0
DIAG 1
STATUS 0
DIAG NOT COMPLETE
NO SCB FAULT
111
101
1
CSB
NO FAULT
110
100
ON or OFF Pulse Req Ignored
During tBL(ON|OFF)
0
ON Pulse Req
1
SO
ECHO
ECHO
0
1
FLTB
0
Pulse 1
Figure 26. Normal ON Pulse Request & Second Request Ignored − INx Remains in Low State at End of Pulse
1
INx
BLANKING NOT RE−STARTED
0
1
DRNx
GATx
0
VBAT
VOL
VSG
FLTREF
0
1
INTERNAL SIGNALS
RSTB
0
ON BLANK STARTED TO
ALLOW DRAIN TO SETTLE
BLANK 1
TIMER 0
tBL(ON )
t BL(ON)
t BL(OFF )
tBL(ON )
FILTER 1
TIMER 0
DIAG 1
STATUS 0
DIAG NOT COMPLETE
NO SCB FAULT
111
101
NO FAULT
110
100
NO SCB FAULT
111
101
1
CSB
0
ON Pulse Req
1
SO
ECHO
ECHO
ON or OFF
Pulse Req ON Pulse Req
IGNORED
ECHO
OFF Pulse Req
Status Req
ECHO
100
0
1
FLTB
0
Pulse 2
Figure 27. Normal ON Pulse Request & Second Request Ignored − INx State Change During First Pulse
Execution, Normal OFF Pulse Request
www.onsemi.com
32
NCV7519, NCV7519A
1
INx
BLANKING NOT RE−STARTED
0
1
GATx
0
DRNx
VBAT
VOL
VSG
FLTREF
0
1
INTERNAL SIGNALS
RSTB
0
OFF BLANK STARTED TO
ALLOW DRAIN TO SETTLE
BLANK 1
TIMER 0
tBL(ON)
t BL(ON)
tBL(OFF)
t BL(ON)
FILTER 1
TIMER 0
DIAG 1
STATUS 0
DIAG NOT COMPLETE
NO SCB FAULT
111
101
NO FAULT
110
NO SCB FAULT
100
111
101
1
CSB
0
ON Pulse Req
1
SO
ECHO
ECHO
ON or OFF
Pulse Req ON Pulse Req
IGNORED
ECHO
ON or OFF
Pulse Req
IGNORED
ECHO
Status Req
100
0
1
FLTB
0
Pulse 2a
Figure 28. Normal ON Pulse Request & Second Request Ignored, Normal ON Pulse Request,
INx State Change During Normal Pulse Executions
1
INx
Don’t Care
0
1
DRNx
GATx
0
VBAT
VOL
VSG
FLTREF
0
1
INTERNAL SIGNALS
RSTB
0
OFF BLANK NOT STARTED
(ON STATE)
BLANK 1
TIMER 0
tBL(ON )
t BL(ON)
ON BLANK NOT STARTED
(OFF STATE)
t BL(OFF )
FILTER 1
TIMER 0
DIAG 1
STATUS 0
DIAG NOT COMPLETE
NO SCB FAULT
111
101
NO FAULT
110
100
NO SCG/OLF FAULT
111
110
1
CSB
0
ON Pulse Req
1
SO
ECHO
ECHO
ON or OFF
Pulse Req
IGNORED
ON Pulse Req
OFF Pulse Req
Status Req
ECHO
ECHO
100
0
1
FLTB
0
Pulse 3
Figure 29. Normal ON Pulse Request & Second Request Ignored, Normal OFF Pulse Request,
INx State Change During Normal Pulse Executions and Goes Low During OFF Pulse
www.onsemi.com
33
NCV7519, NCV7519A
1
INx
0
1
GATx
0
DRNx
VBAT
t < tFF(ON)
VOL
VSG
FLTREF
VSG
FLTREF
VSG
0
1
INTERNAL SIGNALS
RSTB
0
BLANK 1
TIMER 0
FILTER 1
TIMER 0
DIAG 1
STATUS 0
tBL(ON)
tBL(OFF )
t FF(ON)
tBL(OFF )
tFF(ON )
PREVIOUS DATA
SCB
DIAG NOT COMPLETE
111
NO SCG/OLF FAULT
1
CSB
0
1
SO
SCB
111
0
1
FLTB
0
ON BLANK & FILTER & SCB
Figure 30. Filter Timer Started During Blank Timer Because of Intermittent SCB, Re−started Just Before End of
Blank Timer − SCB Latch−off Time Extended
1
INx
0
1
GATx
0
DRNx
VBAT
OLF
OLF
SCG
VOL
FLTREF
VSG
FLTREF
0
1
INTERNAL SIGNALS
RSTB
0
BLANK 1
TIMER 0
FILTER 1
TIMER 0
DIAG 1
STATUS 0
t BL(OFF )
t FF(OFF )
tBL(ON )
tFF(OFF )
tFF(OFF )
PREVIOUS DATA
111
OLF
NO SCB FAULT
1
CSB
0
1
SO
OLF
0
1
FLTB
0
OFF BLANK & FILTER & FLT
Figure 31. Filter Timer Started When Falling Through OLF Threshold During Blank Timer, Re−started When
Falling Through SCG Threshold, Re−started When Falling Through OLF Threshold − OFF−State Diagnostic
Status Acquisition Time Extended by Filter Timer
www.onsemi.com
34
NCV7519, NCV7519A
1
INx
0
DRNx
VBAT
0
VLOAD
VBAT
VLD
UV
0
INTERNAL SIGNALS
1
VLDUV
0
BLANK 1
TIMER 0
tBL(ON)
t BL(OFF)
FILTER 1
TIMER 0
DIAG 1
STATUS 0
VALID ON
STATE DATA
PREVIOUS DATA
111
VALID ON
STATE DATA
DIAGNOSTIC NOT COMPLETE
1
CSB
0
Read Status
Read Status
1
SO
STATUS
STATUS
0
1
FLTB
0
VLDUV 1
Figure 32. OFF−State Diagnostic Status is Suppressed While in VLOAD Undervoltage −
ON−State Diagnostics Remain Functional
1
INx
0
DRNx
VBAT
0
VLOAD
VBAT
VLD
UV
0
INTERNAL SIGNALS
1
VLDUV
0
BLANK 1
TIMER 0
tBL(OFF)
tBL(OFF)
FILTER 1
TIMER 0
DIAG 1
STATUS 0
PREVIOUS DATA
DIAGNOSTIC NOT COMPLETE
VALID OFF STATE DIAGNOSTIC
1
CSB
0
Read Status
1
SO
STATUS
0
1
FLTB
0
VLDUV 2
Figure 33. OFF−State Diagnostic Starts When Recovery From Undervoltage Occurs
www.onsemi.com
35
NCV7519, NCV7519A
ORDERING INFORMATION
Device
NCV7519MWTXG
NCV7519AMWTXG
Marking
Package
Shipping†
NCV7519
QFN32, CASE 488AM
(Pb−Free)
5000 / Tape & Reel
NCV7519A
QFN32, CASE 485CZ
(Pb−Free)
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
36
NCV7519, NCV7519A
PACKAGE DIMENSIONS
QFN32 5x5, 0.5P
CASE 488AM
ISSUE A
A
B
D
PIN ONE
LOCATION
ÉÉ
ÉÉ
L
L
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
0.15 C
0.15 C
A
DETAIL B
0.10 C
ÉÉÉ
ÉÉÉ
ÇÇÇ
EXPOSED Cu
TOP VIEW
(A3)
A1
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTION
0.08 C
SEATING
PLANE
C
SIDE VIEW
NOTE 4
RECOMMENDED
SOLDERING FOOTPRINT*
DETAIL A
9
K
D2
5.30
17
8
32X
MILLIMETERS
MIN
MAX
0.80
1.00
−−−
0.05
0.20 REF
0.18
0.30
5.00 BSC
2.95
3.25
5.00 BSC
2.95
3.25
0.50 BSC
0.20
−−−
0.30
0.50
−−−
0.15
3.35
L
32X
0.63
E2
1
32
3.35 5.30
25
e
e/2
BOTTOM VIEW
32X
b
0.10
M
C A B
0.05
M
C
NOTE 3
0.50
PITCH
32X
0.30
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
37
NCV7519, NCV7519A
PACKAGE DIMENSIONS
QFN32 5x5, 0.5P (PUNCHED)
CASE 485CZ
ISSUE A
PIN ONE
REFERENCE
0.15 C
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.15 C
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
A B
D
L
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
DIM
A
A1
A3
b
D
D2
E
E2
e
L
TOP VIEW
DETAIL B
(A3)
A
(0.15)
(0.10)
DETAIL B
ALTERNATE
CONSTRUCTION
0.08 C
A1
NOTE 4
C
SIDE VIEW
0.10
D2
DETAIL A
32X
9
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT
C A B
M
MILLIMETERS
MIN
MAX
0.80
0.90
−−−
0.05
0.20 REF
0.20
0.30
5.00 BSC
3.20
3.40
5.00 BSC
3.20
3.40
0.50 BSC
0.30
0.50
5.30
L
32X
0.62
3.60
8
E2
3.60
1
24
32
e
e/2
BOTTOM VIEW
32X
0.10
M
5.30
C A B
b
0.10
M
C A B
0.05
M
C
PKG
OUTLINE
NOTE 3
0.50
PITCH
32X
0.30
DIMENSIONS: MILLIMETERS
FLEXMOS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
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specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
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38
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCV7519A/D