CM6136 Single-Channel Transient Voltage Suppressor Product Description ON Semiconductor’s CM6136 is an Application Specific Integrated Passivet (ASIPt) component in a 2 x 2, 4−bump, 0.4 mm pitch, CSP form factor. This device is designed for: • • • • http://onsemi.com Fuse Transient Voltage Suppression (TVS) Electrostatic Discharge Protection Electrical Overstress Protection WLCSP4 CP SUFFIX CASE 567CA Features • 4−Bump, 0.8 mm X 0.8 mm Footprint Chip Scale Package (CSP) • These Devices are Pb−Free and are RoHS Compliant ELECTRICAL SCHEMATIC Fuse A1 A2 Table 1. PIN DESCRIPTIONS 4−bump CSP Package Pin TVS Description A1 Fuse Terminal 1 A2 TVS Channel / Fuse Terminal 2 B1 & B2 GND B1 & B2 Device Ground PACKAGE / PINOUT DIAGRAMS Orientation Marking 1 A 2 + 2 MARKING DIAGRAM 1 FX A1 FX B A A2 A1 B B2 B1 Top View (Bumps Down View) Orientation Marking Device CM6136 X = Single Digit Date Code Package Shipping† WLCSP4 (Pb−Free) 10,000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 4−Bump CSP Package April, 2011 − Rev. 1 = CM6136 = Single Digit Date Code ORDERING INFORMATION Bottom View (Bumps Up View) © Semiconductor Components Industries, LLC, 2011 F X 1 Publication Order Number: CM6136/D CM6136 ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. ABSOLUTE RATINGS Rating Units Failing to nonconductive, I2t − from A1 pin to device ground (Maximum IPP value using 10/1000 ms pulse). See Notes 1 and 2. Parameter 4 A Failing to nonconductive, I2t − from A2 pin to device ground (Maximum IPP value using 10/1000 ms pulse). See Notes 1 and 2. 50 A 1. The device must not burn to open−circuit, when the value is below maximum IPP. 2. This parameter is characterized at 25°C using an ON Semiconductor−specific test board. Table 3. PARAMETERS AND OPERATING CONDITIONS Rating Units Storage Temperature Range Parameter –55 to +150 °C Operating Temperature Range –30 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol R Parameter Conditions Typ Max Units 50 mW Resistance A1 − A2 B1 and B2 floating (Note 2) ROPEN Resistance after open fuse B1 and B2 floating tFUSE Fusing time B1 and B2 floating; I = 5 A (Note 3) tLIFE Fuse life time B1 and B2 floating; I = 2 A (Notes 3, 4 and 9) IOFF Stand−off quiescent current From A1 pin to B1 and B2 pins; Stand−off voltage VOFF = 12 V VBR Break down voltage From A1 pin to B1 and B2 pins; Break down current IBR = 20 mA (Note 6) VCL Clamping voltage during transient From A1 pin to B1 and B2 pins; Clamping current ICL = 1 A (Notes 6 and 7) 19.5 V VF Forward voltage From A1 pin to B1 and B2 pins; Forward current IF = 850 mA 1.3 V CL1 Line capacitance VBIAS = 0 V CL2 VESD fC 1. 2. 3. 4. 5. 6. 7. 8. 9. Min VBIAS = 5 V ESD protection peak discharge Voltage at A1 pin or A2 to B1 and B2 a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 8) Minimum attenuation Freq = 80 MHz − 1 GHz Freq = 1 − 4 GHz RSOURCE = RLOAD = 50 W 1 MW 100 4000 Hours 100 15.5 73 ms nA V 190 pF 92 pF kV ±30 ±30 8 20 dB All parameters specified for TA = 25°C unless otherwise noted. Characterization data for DC parameters is taken from −30°C to 85°C. This parameter is measured using low current to avoid self−heating. These parameters are characterized using ON Semiconductor−specific test boards. Fuse is considered failed when its resistance is higher than 1 W. Cumulative distribution of VBR between 15.5 V and 16.0 V is about 4.5%. Transient: 8 x 20 ms current pulse. Cumulative distribution of VCL between 19.0 V and 19.5 V is about 4.5%. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. Fuse lifetime is extrapolated from Accelerated Life Test (ALT) at 125°C. http://onsemi.com 2 CM6136 RF CHARACTERISTICS TA = 255C, 50 W Environment 0 dB 5V IN SER TION LOS S − 10 dB 0V −20 dB − 30 dB −40 dB −50 dB 3 10 100 1000 FR EQUEN CY (MH z) Figure 1. Insertion Loss (0 V and 5 V Bias) http://onsemi.com 3 2000 60 00 CM6136 PACKAGE DIMENSIONS WLCSP4, 0.8x0.8 CASE 567CA−01 ISSUE O ÈÈ PIN A1 REFERENCE 2X 0.05 C 2X A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E e 0.05 C TOP VIEW A2 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 4X A1 0.05 C A B 0.03 C C SIDE VIEW e b MILLIMETERS MIN MAX 0.47 0.53 0.17 0.24 0.30 REF 0.24 0.29 0.80 BSC 0.80 BSC 0.40 BSC SEATING PLANE A1 4X 0.40 PITCH e B A PACKAGE OUTLINE 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS 1 2 BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Application Specific Integrated Passive is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM6136/D