CM1407 4 and 8-Channel EMI Filter Arrays with ESD Protection Product Description ON Semiconductor CM1407 is an EMI filter array with ESD protection, which integrates either four or eight pi filters (C−R−C). The CM1407 has component values of 7.5 pF − 200 W − 7.5 pF (fC = 210 MHz). The parts include ESD protection diodes on every pin, providing a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15 kV contact discharge, twice the specification requirement of the IEC 61000−4−2, Level 4 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well−suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package and easy−to−use pin assignments. In particular, the CM1407 is ideal for EMI filtering and protecting data lines from ESD in wireless handsets. The CM1407 is available in space−saving, low−profile, 8 and 16−lead WDFN packages. It is fabricated with ON Semiconductor’s Centuriont process and available with optional lead−free finishing. • • Four and Eight Channels of EMI Filtering with ESD Protection Greater than 25 dB of Attenuation from 800 Mhz to 3 GHz ±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge) ±30 kV ESD Protection (MIL−STD−883, Method 3015, HBM) Fabricated with Centuriont Advanced Low Capacitance Zener Process Technology Space Saving, Low Profile 8 and 16−lead 0.5 mm Pitch WDFN Packages These Devices are Pb−Free and are RoHS Compliant Applications • I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs etc. • EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook • WDFN16 DF/DE SUFFIX CASE 511AU WDFN8 DF/DE SUFFIX CASE 511BE BLOCK DIAGRAM 200 W FILTERn* FILTERn* 7.5 pF C GND 7.5 pF C 1 of 4/8 EMI Filtering + ESD Channels *See Package/Pinout Diagrams for Expanded Pin Information. Features • • • • • http://onsemi.com Computers EMI Filtering for LCD, Camera and Chip−to−Chip Data Lines MARKING DIAGRAM N78X N07 4X N07 4X = Specific Device Code N78X = Specific Device Code ORDERING INFORMATION Device Package Shipping† CM1407−04DF WDFN8 (Pb−Free) 3000/Tape & Reel CM1407−08DF WDFN16 (Pb−Free) 3000/Tape & Reel CM1407−04DE WDFN8 (Pb−Free) 3000/Tape & Reel CM1407−08DE WDFN16 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 3 1 Publication Order Number: CM1407/D CM1407 PACKAGE / PINOUT DIAGRAMS Top View (Pins Down View) 8 7 6 Bottom View (Pins Up View) 5 1 2 3 4 CM1407−04DE/DF 8−Lead WDFN Package GND PAD N07 4X Pin 1 Marking 8 7 6 5 1 2 3 4 16 15 14 13 12 11 10 9 1 CM1407−08DE/DF 16−Lead WDFN Package with Exposed End Pads 7 8 16 15 14 13 12 11 10 9 N78X Pin 1 Marking 1 2 3 4 5 2 3 4 5 6 GND PAD 6 7 8 Note: See Ordering Information section for device specific marking. Table 1. PIN DESCRIPTIONS Pins Pins 1406−04Dx 1406−08Dx Description 1406−04Dx Name 1406−08Dx 1 1 Name Description FILTER1 Filter Channel 1 8 16 FILTER1 Filter Channel 1 2 2 FILTER2 Filter Channel 2 7 15 FILTER2 Filter Channel 2 3 3 FILTER3 Filter Channel 3 6 14 FILTER3 Filter Channel 3 4 4 FILTER4 Filter Channel 4 5 13 FILTER4 Filter Channel 4 5 FILTER5 Filter Channel 5 12 FILTER5 Filter Channel 5 6 FILTER6 Filter Channel 6 11 FILTER6 Filter Channel 6 7 FILTER7 Filter Channel 7 10 FILTER7 Filter Channel 7 8 FILTER8 Filter Channel 8 9 FILTER8 Filter Channel 8 GND Device Ground GND Pad http://onsemi.com 2 CM1407 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units –65 to +150 °C DC Power per Resistor 100 mW Package DC Power Rating 300 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max 160 200 240 W 6 7.5 9 pF R Resistance C Capacitance At 2.5 V DC, 1 MHz, 30 mV AC Diode Standoff Voltage IDIODE = 10 mA 6.0 ILEAK Diode Leakage Current (Reverse Bias) VDIODE = 3.3 V 0.1 1 VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA 6.8 −0.8 9.0 −0.4 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 VDIODE (Note 2) 5.6 −1.5 30 15 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. http://onsemi.com 3 Units V mA V kV CM1407 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 1. Channel 1 EMI Filter Performance (CM1407−04) Figure 2. Channel 2 EMI Filter Performance (CM1407−04) http://onsemi.com 4 CM1407 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 3. Channel 3 EMI Filter Performance (CM1407−04) Figure 4. Channel 4 EMI Filter Performance (CM1407−04) http://onsemi.com 5 CM1407 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 5. Channel 1 EMI Filter Performance (CM1407−08) Figure 6. Channel 2 EMI Filter Performance (CM1407−08) http://onsemi.com 6 CM1407 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 7. Channel 3 EMI Filter Performance (CM1407−08) Figure 8. Channel 4 EMI Filter Performance (CM1407−08) http://onsemi.com 7 CM1407 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 9. Channel 5 EMI Filter Performance (CM1407−08) Figure 10. Channel 6 EMI Filter Performance (CM1407−08) http://onsemi.com 8 CM1407 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 0 V DC Bias, 50 W Environment) Figure 11. Channel 7 EMI Filter Performance (CM1407−08) Figure 12. Channel 8 EMI Filter Performance (CM1407−08) http://onsemi.com 9 CM1407 PERFORMANCE INFORMATION (Cont’d) Figure 13. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 V DC and 255C) http://onsemi.com 10 CM1407 PACKAGE DIMENSIONS WDFN8 2x2, 0.5P CASE 511BE−01 ISSUE O A D PIN ONE REFERENCE 2X ÇÇÇ ÇÇÇ ÇÇÇ 0.10 C E DETAIL A ALTERNATE CONSTRUCTIONS TOP VIEW ÇÇ ÉÉ EXPOSED Cu DETAIL B A 0.10 C A3 A3 MOLD CMPD A1 DETAIL B 0.08 C NOTE 4 C D2 1 8X 4 SEATING PLANE L 5 e BOTTOM VIEW 8X DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.50 1.70 2.00 BSC 0.80 1.00 0.50 BSC 0.25 REF 0.20 0.40 −−− 0.15 RECOMMENDED SOLDERING FOOTPRINT* 8X 1.70 PACKAGE OUTLINE E2 8 ÉÉ ÇÇ ÇÇ ALTERNATE CONSTRUCTIONS A1 SIDE VIEW DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 0.10 C 2X L L B 0.50 b 0.10 C A B 0.05 C 2.30 1.00 NOTE 3 1 0.50 PITCH 8X 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 CM1407 PACKAGE DIMENSIONS WDFN16, 4x1.6, 0.5P CASE 511AU−01 ISSUE O A B D PIN ONE REFERENCE 2X ÉÉ ÉÉ ÉÉ L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS 0.10 C 2X 0.10 C ÉÉ ÇÇ EXPOSED Cu TOP VIEW (A3) DETAIL B 0.10 C 0.08 C A1 SIDE VIEW D2 DETAIL A 1 K F C 16X 8 16 9 e e/2 MOLD CMPD ÉÉÉ ÇÇÇ ÇÇÇ A3 A1 DETAIL B A NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L SEATING PLANE ALTERNATE CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e F K L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 4.00 BSC 3.10 3.30 1.60 BSC 0.30 0.50 0.50 BSC 0.25 REF 0.30 REF 0.20 0.40 −−− 0.15 L E2 RECOMMENDED SOLDERING FOOTPRINT* 4.30 16X 2X b 0.10 C A B 0.05 C 0.35 16X 3.30 0.53 NOTE 3 BOTTOM VIEW 1.90 3X 0.50 16X 0.30 0.50 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Centurion is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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