CM1408-04DE 4-Channel LCD and Camera EMI Filter Array with ESD Protection Features http://onsemi.com • Four Channels of EMI Filtering with Integrated ESD Protection • Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) • • • • • • Network ±15 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) ±30 kV ESD Protection on Each Channel (HBM) Greater than −35 dB Attenuation (Typical) at 1 GHz WDFN Packaging with 0.5 mm Lead Pitch: • 8−Lead WDFN, 2.0 mm x 2.0 mm Increased Robustness Against Vertical Impacts During Manufacturing Process These Devices are Pb−Free and are RoHS Compliant 1 WDFN8 DE SUFFIX CASE 511BE MARKING DIAGRAM N08 4E Applications • LCD and Camera Data Lines in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook Computers, • • • • PDAs, etc. EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers Wireless Handsets Handheld PCs/PDAs LCD and Camera Modules N08 4E = CM1408−04DE ORDERING INFORMATION Device Package Shipping† CM1408−04DE WDFN−8 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. BLOCK DIAGRAM 100 W FILTER+ESDn* Pins 1 − 4 GND PAD R C 8.5 pF 8.5 pF FILTER+ESDn* Pins 5 − 8 C 1 of 4 EMI / RFI + ESD Channels *See Package/Pinout Diagrams for expanded pin information. © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 3 1 Publication Order Number: CM1408−04DE/D CM1408−04DE PACKAGE / PINOUT DIAGRAMS Pin 1 Marking Top View (Pins Down View) Bottom View (Pins Up View) 8 7 6 5 1 2 3 4 N08 4E GND PAD 1 2 3 4 8 7 6 5 8 Lead WDFN Package Table 1. PIN DESCRIPTIONS Device Pin(s) Name 1 FILTER1 2 Description Device Pin(s) Name Description Filter + ESD Channel 1 8 FILTER1 Filter + ESD Channel 1 FILTER2 Filter + ESD Channel 2 7 FILTER2 Filter + ESD Channel 2 3 FILTER3 Filter + ESD Channel 3 6 FILTER3 Filter + ESD Channel 3 4 FILTER4 Filter + ESD Channel 4 5 FILTER4 Filter + ESD Channel 4 GND PAD GND Device Ground SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range http://onsemi.com 2 Rating Units −40 to +85 °C CM1408−04DE Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol R CTOTAL Parameter Conditions Resistance Min Typ Max Units 80 100 120 W 14 17 22 pF Total Channel Capacitance At 2.5 VDC Reverse Bias, 1 MHz, 30 mVAC Capacitance C At 2.5 VDC Reverse Bias, 1 MHz, 30 mVAC 8.5 pF Standoff Voltage IDIODE = 10 mA 6.0 V ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3 V 0.1 1.0 VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA 6.8 −0.8 9.0 −0.4 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 RDYN Dynamic Resistance Positive Negative C VDIODE fC (Notes 2 and 3) 5.6 −1.5 Channel R = 100 W, Channel CSINGLE = 8.5 pF 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. These parameters are guaranteed by design and characterization. http://onsemi.com 3 V kV 30 15 2.3 0.9 Cut−off Frequency ZSOURCE = 50 W, ZLOAD = 50 W mA 200 W MHz CM1408−04DE PERFORMANCE INFORMATION Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND) Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND) http://onsemi.com 4 CM1408−04DE PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 3. Insertion Loss vs. Frequency (FILTER3 Input to GND) Figure 4. Insertion Loss vs. Frequency (FILTER4 Input to GND) http://onsemi.com 5 CM1408−04DE PERFORMANCE INFORMATION (Cont’d) Typical Diode Capacitance vs. Input Voltage Figure 5. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5 VDC and 255C) http://onsemi.com 6 CM1408−04DE PACKAGE DIMENSIONS WDFN8 2x2, 0.5P CASE 511BE−01 ISSUE O A D PIN ONE REFERENCE 2X ÇÇÇ ÇÇÇ ÇÇÇ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 E DETAIL A ALTERNATE CONSTRUCTIONS 0.10 C 2X L L B TOP VIEW ÇÇ ÉÉ ÉÉ EXPOSED Cu DETAIL B A 0.10 C A3 A3 MOLD CMPD A1 ÇÇ ÉÉ DETAIL B 0.08 C NOTE 4 ALTERNATE CONSTRUCTIONS A1 SIDE VIEW C D2 DETAIL A 1 8X 4 SEATING PLANE DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.50 1.70 2.00 BSC 0.80 1.00 0.50 BSC 0.25 REF 0.20 0.40 −−− 0.15 RECOMMENDED SOLDERING FOOTPRINT* L 8X 1.70 PACKAGE OUTLINE 0.50 E2 8 5 e BOTTOM VIEW 8X b 2.30 1.00 0.10 C A B 0.05 C NOTE 3 1 0.50 PITCH 8X 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM1408−04DE/D