NB2879A Low Power, Reduced EMI Clock Synthesizer The NB2879A is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. The NB2879A reduces ElectroMagnetic Interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The NB2879A allows significant system cost savings by reducing the number of circuit board layers, ferrite beads and shielding that are traditionally required to pass EMI regulations. The NB2879A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. The NB2879A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation’. The NB2879A is targeted towards all portable devices with very low power requirements like MP3 players, Notebooks and digital still cameras. Features Generates an EMI Optimized Clocking Signal at the Output Integrated Loop Filter Components Operates with a 3.3 V 0.3 V Supply Operating Current less than 4.0 mA Low Power CMOS Design Input Frequency Range: 15 MHz to 30 MHz Generates a 1X Low EMI Spread Spectrum clock of the Input Frequency Frequency Deviation 1.0% Available in TSOP--6 Package (TSOT--23--6) Pb--Free Package is Available Semiconductor Components Industries, LLC, 2010 November, 2010 -- Rev. 3 1 http://onsemi.com MARKING DIAGRAM* TSOP--6 (TSOT--23--6) SN SUFFIX CASE 318G 6 1 E0B A Y W G E0BAYWG G 1 = Specific Device Code = Assembly Location = Year = Work Week = Pb--Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Publication Order Number: NB2879A/D NB2879A VDD PLL Modulation XINCLKIN Crystal Oscillator XOUT Frequency Divider Loop Filter Phase Detector Output Divider VCO Feedback Divider ModOUT REFOUT VSS Figure 1. Block Diagram Table 1. KEY SPECIFICATIONS Description Specification Supply Voltages VDD = 3.3 V 0.3 V Frequency Range 15 MHz < CLKIN < 30 MHz Cycle--to--Cycle Jitter 300 ps (maximum) Output Duty Cycle 40 / 60% (worst case) Output Rise and Fall Times 1.1 ns (maximum) Modulation Equation FIN/640 Frequency Deviation 1% REFOUT 1 XOUT 2 XIN/CLKIN 3 NB2879A 6 VSS 5 ModOUT 4 VDD Figure 2. Pin Configuration Table 2. PIN DESCRIPTION Pin # Pin Name Type Description 1 REFOUT O Buffered output of the input frequency. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 XIN/CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock 4 VDD P Power supply for the entire chip (3.3 V). 5 ModOUT O Spread spectrum clock output. 6 VSS P Ground connection. http://onsemi.com 2 NB2879A Figure 3. Modulation Profile Table 3. MAXIMUM RATINGS Symbol Description Rating Unit VDD, VIN Voltage on any pin with respect to Ground 0.5 to + 7.0 V TSTG Storage Temperature --65 to +125 C TA Operating Temperature 0 to 70 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 4. DC ELECTRICAL CHARACTERISTICS (Test Conditions: All parameters are measured at room temperature 25C) Description Symbol Min Typ Max Unit VIL Input LOW Voltage GND -- 0.3 0.8 V VIH Input HIGH Voltage 2.0 VDD + 0.3 V IIL Input LOW Current --35 mA IIH Input HIGH Current 35 mA IXOL XOUT Output LOW Current (@ 4.0 V, VDD = 3.3 V) 3 mA IXOH XOUT Output HIGH Current (@ 2.5 V, VDD = 3.3 V) 3 mA VOL Output LOW Voltage (VDD = 3.3 V, IOL = 20 mA) VOH Output HIGH Voltage (VDD = 3.3 V, IOH = 20 mA) IDD 0.4 V Static Supply Current 10 mA ICC Dynamic Supply Current (3.3 V, 30 MHz, and 15 pF loading) 4 mA VDD Operating Voltage 3.6 V tON Powerup Time (first locked cycle after powerup) ZOUT Clock Output Impedance 2.5 3.0 V 3.3 0.18 mS 50 Ω NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. http://onsemi.com 3 NB2879A Table 5. AC ELECTRICAL CHARACTERISTICS Symbol Description Min Typ Max Unit CLKIN Input Frequency 15 30 MHz ModOUT Output Frequency 15 30 MHz REFOUT Output Frequency 15 30 MHz tLH (Note 1) Output Rise Time (measured at 0.8 V to 2.0 V) 0.7 0.9 1.1 ns tHL (Note 1) Output Fall Time (measured at 2.0 V to 0.8 V) 0.6 0.8 1.0 ns tJC Jitter (Cycle--to--Cycle) 360 ps tD Output Duty Cycle 55 % 45 50 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. tLH and tHL are measured at capacitive load of 15 pF. http://onsemi.com 4 NB2879A ORDERING INFORMATION Marking Temperature Range Package Shipping† Availability NB2879ASNR2 E0B 0C -- 70C TSOP--6 (TSOT--23--6) 2500 Tape & Reel Now NB2879ASNR2G E0B 0C -- 70C TSOP--6 (TSOT--23--6) (Pb--Free) 2500 Tape & Reel Contact Sales Representative Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NB2879A PACKAGE DIMENSIONS TSOP--6 CASE 318G--02 ISSUE U D H 6 5 L2 4 GAUGE PLANE E E1 1 NOTE 5 2 3 L b C DETAIL Z e A 0.05 M SEATING PLANE c A1 DETAIL Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. DIM A A1 b c D E E1 e L L2 M MIN 0.90 0.01 0.25 0.10 2.90 2.50 1.30 0.85 0.20 0 MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 2.75 3.00 1.50 1.70 0.95 1.05 0.40 0.60 0.25 BSC 10 -- RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 6X 3.20 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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