NB2769A Low Power, Reduced EMI Clock Synthesizer The NB2769A is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. The NB2769A reduces ElectroMagnetic Interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The NB2769A allows significant system cost savings by reducing the number of circuit board layers, ferrite beads and shielding that are traditionally required to pass EMI regulations. The NB2769A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. The NB2769A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation’. The NB2769A is targeted towards all portable devices with very low power requirements like MP3 players and digital still cameras. http://onsemi.com MARKING DIAGRAM* TSOP−6 (TSOT−23−6) SN SUFFIX CASE 318G 6 1 E05 A Y W E05AYW 1 = Specific Device Code = Assembly Location = Year = Work Week *For additional marking information, refer to Application Note AND8002/D. Features • • • • • • • • • • Generates an EMI Optimized Clocking Signal at the Output Integrated Loop Filter Components Operates with a 3.3 V / 2.5 V Supply Operating Current less than 4.0 mA Low Power CMOS Design Input Frequency Range: 6.0 MHz to 12 MHz for 2.5 V Input Frequency Range: 6.0 MHz to 13 MHz for 3.3 V Generates a 1X Low EMI Spread Spectrum clock of the Input Frequency Frequency Deviation "1% @ 10 MHz Available in TSOP−6 Package (TSOT−23−6) Pb−Free Package is Available © Semiconductor Components Industries, LLC, 2005 August, 2005 − Rev. 2 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. Publication Order Number: NB2769A/D NB2769A PD VDD PLL Modulation XIN/CLKIN Crystal Oscillator XOUT Frequency Divider Loop Filter Phase Detector Output Divider VCO Feedback Divider ModOUT VSS Figure 1. Block Diagram Table 1. KEY SPECIFICATIONS Description Specification Supply Voltages VDD = 3.3 V / 2.5 V Frequency Range For 2.5 V Supply For 3.3 V Supply 6 MHz < CLKIN < 12 MHz 6 MHz < CLKIN < 13 MHz Cycle−to−Cycle Jitter 200 ps (maximum) Output Duty Cycle 45/55% (worst case) Modulation Rate Equation FIN/256 Frequency Deviation "1% @ 10 MHz PD 1 XOUT 2 XIN/CLKIN 3 NB2769A 6 VSS 5 ModOUT 4 VDD Figure 2. Pin Configuration Table 2. PIN DESCRIPTION Pin # Pin Name Type Description 1 PD I Powerdown control pin. Pull low to enable powerdown mode. Connect to VDD if not used. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 XIN/CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 4 VDD P Power supply for the entire chip. 5 ModOUT O Spread spectrum clock output. 6 VSS P Ground connection. http://onsemi.com 2 NB2769A Figure 3. Modulation Profile Table 3. MAXIMUM RATINGS Symbol Description Rating Unit VDD, VIN Voltage on any pin with respect to Ground 0.5 to +7.0 V TSTG Storage Temperature −65 to +125 °C TA Operating Temperature 0 to 70 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per MIL−STD−883, Method 3015) 2 kV Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. http://onsemi.com 3 NB2769A Table 4. DC ELECTRICAL CHARACTERISTICS FOR 2.5 V SUPPLY (Test Conditions: All parameters are measured at room temperature 25°C) Symbol Description Min Typ Max Unit V VIL Input LOW Voltage GND − 0.3 0.8 VIH Input HIGH Voltage 2.0 VDD + 0.3 V IIL Input LOW Current −35 mA IIH Input HIGH Current 35 mA IXOL XOUT Output LOW Current (@ 0.5 V, VDD = 2.5 V) 3.0 mA IXOH XOUT Output HIGH Current (@ 1.8 V, VDD = 2.5 V) 3.0 mA VOL Output LOW Voltage (VDD = 2.5 V, IOL = 8.0 mA) VOH Output HIGH Voltage (VDD = 2.5 V, IOH = 8.0 mA) IDD Static Supply Current (Note 1) ICC Dynamic Supply Current (2.5 V, 10 MHz, and No Load) VDD Operating Voltage tON Powerup Time (first locked cycle after powerup) (Note 2) ZOUT Clock Output Impedance 0.6 V 10 mA 1.8 V 2.5 2.375 2.5 mA 2.625 V 5.0 mS W 50 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. XIN/CLKIN pin and PD are pulled low. 2. VDD and XIN/CLKIN input are stable, PD pin is made high from low. Table 5. AC ELECTRICAL CHARACTERISTICS FOR 2.5 V SUPPLY Symbol Description Min Typ Max Unit CLKIN Input Frequency 6.0 12 MHz ModOUT Output Frequency 6.0 12 MHz fd Frequency ±1.51 ±0.78 MHz tLH (Note 3) Output Rise Time (measured at 0.7 V to 1.7 V) 0.6 1.2 1.5 ns tHL (Note 3) Output Fall Time (measured at 1.7 V to 0.7 V) 0.4 0.9 tJC Jitter (Cycle−to−Cycle) tD Output Duty Cycle Input Frequency = 6.0 MHz Input Frequency = 12 MHz 45 50 1.1 ns 200 ps 55 % NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. tLH and tHL are measured at capacitive load of 15 pF. http://onsemi.com 4 NB2769A Table 6. DC ELECTRICAL CHARACTERISTICS FOR 3.3 V SUPPLY (Test Conditions: All parameters are measured at room temperature 25°C) Symbol Description Min Typ Max Unit V VIL Input LOW Voltage GND − 0.3 0.8 VIH Input HIGH Voltage 2.0 VDD + 0.3 V IIL Input LOW Current −35 mA IIH Input HIGH Current 35 mA IXOL XOUT Output LOW Current (@ 0.4 V, VDD = 3.3 V) 3.0 mA IXOH XOUT Output HIGH Current (@ 2.5 V, VDD = 3.3 V) 3.0 mA VOL Output LOW Voltage (VDD = 3.3 V, IOL = 8.0 mA) VOH Output HIGH Voltage (VDD = 3.3 V, IOH = 8.0 mA) IDD Static Supply Current (Note 4) ICC Dynamic Supply Current (3.3 V, 10 MHz, and No Load) VDD Operating Voltage tON Powerup Time (first locked cycle after powerup) (Note 5) ZOUT Clock Output Impedance 0.4 V 10 mA 2.5 V 3.5 2.7 3.3 mA 3.6 V 5.0 mS W 45 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. XIN/CLKIN pin and PD are pulled low. 5. VDD and XIN/CLKIN input are stable, PD pin is made high from low. Table 7. AC ELECTRICAL CHARACTERISTICS FOR 3.3 V SUPPLY Symbol Description Min Typ Max Unit CLKIN Input Frequency 6.0 13 MHz ModOUT Output Frequency 6.0 13 MHz fd Frequency ±1.51 ±0.75 MHz tLH (Note 6) Output Rise Time (measured at 0.8 V to 2.0 V) 0.4 1.2 1.4 ns tHL (Note 6) Output Fall Time (measured at 2.0 V to 0.8 V) 0.3 0.9 tJC Jitter (Cycle−to−Cycle) tD Output Duty Cycle Input Frequency = 6.0 MHz Input Frequency = 13 MHz 45 50 1.1 ns 200 ps 55 % NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. tLH and tHL are measured at capacitive load of 15 pF. http://onsemi.com 5 NB2769A Crystal R1 = 510 W C1 = 27 pF C2 = 27 pF Figure 4. Typical Crystal Oscillator Circuit Table 8. TYPICAL CRYSTAL SPECIFICATIONS Fundamental AT Cut Parallel Resonant Crystal Nominal Frequency 8.0 MHz Frequency Tolerance ±50 ppm or better at 25°C Operating Temperature Range −25°C to +85°C Storage Temperature −40°C to +85°C Load Capacitance 18 pF Shunt Capacitance 7 pF Maximum ESR 25 W http://onsemi.com 6 NB2769A ORDERING INFORMATION Marking Temperature Range Package Shipping† Availability NB2769ASNR2 E05 0°C − 70°C TSOP−6 (TSOT−23−6) 2500 Tape & Reel Now NB2769ASNR2G E05 0°C − 70°C TSOP−6 (TSOT−23−6) (Pb−Free) 2500 Tape & Reel Contact Sales Representative Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 NB2769A PACKAGE DIMENSIONS TSOP−6 (TSOT−23−6) CASE 318G−02 ISSUE N NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A L 6 S 1 5 4 2 3 B MILLIMETERS DIM MIN MAX A 2.90 3.10 B 1.30 1.70 C 0.90 1.10 D 0.25 0.50 G 0.85 1.05 H 0.013 0.100 J 0.10 0.26 K 0.20 0.60 L 1.25 1.55 M 0_ 10 _ S 2.50 3.00 D G M J C 0.05 (0.002) K H INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181 SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. This product utilizes US Patent #6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, Dated 11−11−2003. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 8 For additional information, please contact your local Sales Representative. NB2769A/D