LV52130A0XA LV52130A4XA www.onsemi.com Bi-CMOS IC 1coil Boost DC-DC converter and Inverter Charge Pump Overview The LV52130A0XA and LV52130A4XA are dual-output with 1coil boost DC-DC converter and built-in inverter charge pump circuit. Feature 1 coil Dual-outputs VOUT1 output (+5V/+5.4V) VOUT2 output (-5V/-5.4V) Operating Voltage from 2.5V to 5.5V Each output voltages adjusted by I2C (I2C disable at standby ) Synchronous Rectification SCP(VOUT1 to gnd / VOUT2 to gnd) Standby current dissipation 0.3A WLP15 - 0.4mm pitch (1.55mm 2.15mm, Amax=0.625mm) Typical Applications LCD / AMOLED panel power supply Fig.1 Application * I2C Bus is a trademark of Philips Corporation. ORDERING INFORMATION See detailed ordering and shipping information on page 19 of this data sheet. © Semiconductor Components Industries, LLC, 2015 October 2015 - Rev. 0 1 Publication Order Number : LV52130A0XA_4XA/D LV52130A0XA/4XA Specifications LV52130A0XA DEFAULT: VOUT1=+5V, VOUT2=–5V MARKING: 130A0 YMXX LV52130A4XA DEFAULT: VOUT1=+5.4V, VOUT2=–5.4V MARKING: 130A4 YMXX Absolute Maximum Ratings at Ta = 25C Parameter Symbol Conditions Maximum supply voltage VINmax VIN to GNDs Maximum Pin voltage1 Vpin1max CN,VOUT2 to GNDs Maximum Pin voltage2 Vpin2max LX Maximum Pin voltage3 Vpin3max Other pin to GNDs Allowable power dissipation Pdmax Ta=25°C The specified board*1 Operating temperature Topr Storage temperature Tstg *1 Mounted on a specified board: 50mm×50mm×1mm (2 layer glass epoxy) Ratings Unit +6 -6 +7 +6 1 –40 to +85 –55 to +125 V V V V W °C °C Caution 1) Absolute maximum ratings represent the values which cannot be exceeded for any length of time. Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current, high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Recommended Operating Conditions at Ta = 25C Parameter Supply voltage range Symbol VIN op Conditions Ratings VIN Unit 2.5 to 5.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Electrical Characteristics at Ta 25C, PVIN=VIN=3.7V VOUT1=5V VOUT2=-5V (Unless otherwise noted) Parameter Symbol Conditions Ratings min typ Unit max VIN current Standby current dissipation VBST DCDC Converter ICC1 IC disable VBST current limit VOUT1 LDO ICLBST LX VOUT1 voltage VOUT1 Default VOUT1 voltage range VOUT1 100mVsteps by I2C VOUT1 voltage accuracy VOUT1 VOUT1 dropout voltage Vdrop 0.3 0.9 1.2 µA 1.5 5 4.1 V 5.7 –1 1 150mA 150 A V % mV VOUT1 current IOUT1 IOUT2=0 200 mA VOUT1 line regulation VLINR1 dVo=1V Io=30mA 0.3 %/V VOUT1 load regulation VLDR1 Io=2mA/150mA 4 mV Discharge Resistance 1 RVO1 70 Soft-start tssvo1 0.2 ms Continued on next page www.onsemi.com 2 LV52130A0XA/4XA Continued from preceding page. Parameter Symbol Conditions Ratings min typ Unit max VOUT2 Charge pump VOUT2 voltage VOUT2 Default -5 VOUT2 voltage range VOUT2R 100mV steps by I2C VOUT2 voltage accuracy VOUT2A VOUT2 current IOUT2 IOUT1=0 100 mA VOUT2 line regulation VLINR2 dVo=1V Io=30mA 0.3 %/V VOUT2 load regulation VLDR2 Io=2mA/60mA 20 mV Discharge Resistance 2 RVO2 20 Soft-start tssvo2 0.2 ms –5.7 V –4.1 -1 1 V % OSC OSC frequency1 Fosc1 Boost-DCDC 1.48 1.85 2.22 MHz OSC frequency2 Fosc2 charge pump 0.74 0.925 1.11 MHz UVLO up Vuvlo_h VIN up 2.5 V UVLO down Vuvlo_l VIN down 2.3 V High level input voltage VINH SDA/SCL/EN1/EN2 1.26 VIN V Low level input voltage VINL SDA/SCL/EN1/EN2 0 0.54 V Pulldown Resistance Rpd EN1/EN2 ULVO Control Input 400 k Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 LV52130A0XA/4XA Package Dimensions unit : mm WLCSP15, 2.15x1.55 CASE 567HY ISSUE A E A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B PIN A1 REFERENCE DIM A A1 b D E e D 0.05 C 2X 0.05 C 2X MILLIMETERS MIN MAX 0.625 −−− 0.16 0.26 0.20 0.30 2.15 BSC 1.55 BSC 0.40 BSC TOP VIEW A 0.10 C A1 RECOMMENDED SOLDERING FOOTPRINT* 0.08 C NOTE 3 15X C SIDE VIEW SEATING PLANE A1 PACKAGE OUTLINE e b 0.05 C A B 0.03 C E e 0.40 PITCH D C 15X 0.40 PITCH B 0.20 DIMENSIONS: MILLIMETERS A 1 2 3 BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. LV52130A0XA/LV52130A4XA is as follows. 130Ax YMXX MARKING DIAGRAM Top view = Device Mark XX = Assembly lot Code (Tentative) www.onsemi.com 4 LV52130A0XA/4XA Block Diagram Fig.2 Block Diagram Pin Function PIN # Pin Name Description A1 EN2 Enable1 input pin A2 VOUT2 VOUT2 output pin A3 CN Flying capacitor connection pin for charge pump B1 EN1 Enable1 input pin B2 SCL I2C clock signal input pin PGND Power Ground C1 VIN Power supply voltage C2 SDA I2C data signal input / output pin C3 CP Flying capacitor connection pin for charge pump D1 LX Boost converter switching pin D2 SGND Signal Ground D3/E2 VBST Boost converter direct output pin VOUT1 VOUT1 output pin B3/E1 E3 www.onsemi.com 5 LV52130A0XA/4XA PIN CONNECTIONS Top view Bottom view Allowable power dissipation Pd-Max [w] Pd-Max Ambient temperature °C Mounted on a specified board: 50mm×50mm×1mm (2 layer glass epoxy) www.onsemi.com 6 LV52130A0XA/4XA Fig.3 Recommendation Applications Table . Component List for Typical Characteristics Circuit Reference C L Description 2.2µF, +-10%, 10V, X5R, ceramic 4.7µF, +-10%, 10V, X5R, ceramic 10µF, +-10%, 10V, X5R, ceramic 2.2µH, 1.1A, 120m, 2.5mm2.0mm1.1mm 4.7µH, 0.8A, 220m, 2.5mm2.0mm1.1mm www.onsemi.com 7 Manufacturer and Part Number TDK - C1608X5R1A225K TDK - C1608X5R1A475K TDK - C1608X5R1A106K TDK – MLP2520V2R2ST0S1 TDK – MLP2520V4R7ST0S1 LV52130A0XA/4XA BITMAP ( I2C control ) / I2C disable at standby WRITE: IC Address: 0111110x x=0:Write mode / x=1:inhibition Sub MSB Address (7) (6) (5) (4) (3) (2) (1) LSB (0) VOUT1 0000 0000 - - - VOUT1 VOUT1 VOUT1 VOUT1 VOUT1 VOUT2 0000 0001 - - - VOUT2 VOUT2 VOUT2 VOUT2 VOUT2 Mode 0000 0011 No use No use NOTE: About Sub address “0000 0011” Prohibit data's setting “0” of DATA (0) and DATA (1). bits VOUT1 [V] VOUT2 [V] 0 not use not use 1 4.1 -4.1 2 4.2 -4.2 3 4.3 -4.3 4 4.4 -4.4 5 4.5 -4.5 6 4.6 -4.6 7 4.7 -4.7 8 4.8 -4.8 9 4.9 -4.9 10 5.0* -5.0* 11 5.1 -5.1 12 5.2 -5.2 13 5.3 -5.3 14 5.4** -5.4** 15 5.5 -5.5 16 5.6 -5.6 17 5.7 -5.7 * :default = +-5.0V ( LV52130A0XA ) ** :default = +-5.4V ( LV52130A4XA ) www.onsemi.com 8 LV52130A0XA/4XA Serial Bus Communication Specifications Standard mode Parameter symbol Conditions min typ max unit 0 - 100 kHz SCL setup time relative to the fall of SDA 4.7 - - µs ts2 SDA setup time relative to the rise of SCL 250 - - µs ts3 SCL setup time relative to the rise of SDA 4.0 - - µs th1 SCL data hold time relative to the rise of SDA 4.0 - - µs th2 SDA hold time relative to the fall of SCL 0 - - µs twL SCL pulse width for the L period 4.7 - - µs twH SCL pulse width for the H period 4.0 - - µs SCL clock frequency fscl SCL clock frequency Data set up time ts1 Data hold time Pulse width Input waveform conditions ton SCL and SDA (input) rise time - - 1000 ns tof SCL and SDA (input) fall time - - 300 ns Bus free time tbuf Time between STOP and START conditions 4.7 - - µs Symbol Conditions min typ max unit 0 - 400 kHz High-speed mode Parameter SCL clock frequency fscl SCL clock frequency Data setup time ts1 SCL setup time relative to the fall of SDA 0.6 - - µs ts2 SDA setup time relative to the rise of SCL 100 - - ns ts3 SCL setup time relative to the rise of SDA 0.6 - - µs th1 SCL data hold time relative to the rise of SDA 0.6 - - µs th2 SDA hold time relative to the fall of SCL 0 - - µs twL SCL pulse width for the L period 1.3 - - µs twH SCL pulse width for the H period 0.6 - - µs Input waveform conditions ton SCL and SDA (input) rise time - - 300 ns tof SCL and SDA (input) fall time - - 300 ns Bus free time tbuf Time between STOP and START conditions 1.3 - - µs Data hold time Pulse width I2C serial transfer timing conditions www.onsemi.com 9 LV52130A0XA/4XA Input waveform condition I2C control transmission method In start and stop conditions of the I2C bus, SDA should be kept in the constant state while SCL is "H" as shown below during data transfer. When data transfer is not made, both SCL and SDA are in the "H" state. When SCL = SDA="H", change of SDA from "H" to "L" enables the start conditions to start access. When SCL is "H", change of SDA from "L" to "H" enables the stop conditions to stop access. www.onsemi.com 10 LV52130A0XA/4XA Data transfer and acknowledgement response After establishment of start conditions, Data transfer is made by one byte (8 bits). Data transfer enables continuous transfer of any number of bytes. Each time of the 8-bit data is transferred, the ACK signal is sent from the receive side to the send side. The ACK signal is issued when SDA(on the send side) is released and SDA(on the receive side) is set "L" immediately after fall of the clock pulse at the SCL eighth bit of data transfer to "L". When the next 1-byte transfer is left in the receive state after transmission of the ACK signal from the receive side, the receive side releases SDA at fall of the SCL ninth clock. In the I2C bus, there is no CE signal. Instead, 7-bit slave address is assigned to each device and the first byte of transfer is assigned to the command (R/W) representing the 7-bit slave address and subsequent transfer direction. Note that only WRITE is valid in this IC. The 7-bit address is transferred sequentially from MSB and the eighth bit is "L" representing WRITE. Input 1data Input 2data (register address auto Increment) www.onsemi.com 11 LV52130A0XA/4XA Detailed Descriptions The LV52130Ax has dual-output VOUT1 (LDO) and VOUT2 (built-in inverter charge pump) with 1coil boost dc-dc converter. Both outputs are separately controlled by I2C control and pin EN1/EN2. Boost converter is a fixed-frequency pulse width modulated (PWM) regulator. At rated load, each converter operates at continuous conduction mode (CCM). At light loads, both converters can enter in discontinuous conduction mode (DCM). Cycle-by-cycle peak current limit and thermal provide value added features to protect the device. Inductor Selection Three different electrical parameters need to be considered when selecting an inductor, the value of the inductor, the saturation current and the DCR. During normal and heavy load operation, the LV52130Ax is intended to operate in Continuous Conduction Mode (CCM). The equation below can be used to calculate the peak current. Ipeak_p = Iout1 / (n1 x ( 1- D1 )) + ( VIN x D1 ) / 2 x L1 x Fosc1 VIN:battery voltage, IOUT1:load current, L:inductor value, Fosc1: OSC frequency1, D1:duty cycle, n1:converter efficiency varies with load current. A good approximation is to use η = 0.85. It is important to ensure that the inductor current rating is high enough such that it not saturate. As the inductor size is reduced, the peak current for a given set of conditions increases along with higher current ripple so it is not possible to deliver maximum output power at lower inductor values. Finally an acceptable DCR must be selected regarding losses in the coil and must be lower than 250 mΩ (typical) to limit excessive voltage drop. In addition, as DCR is reduced, overall efficiency will improve. The inductor value is recommended to use a 4.7 µH or 2.2µH. POR function This is “Power On Reset” function to reset internal logic circuits which include SCP’s latch. This function can be worked by reducing IC’s VIN voltage until about 1V. www.onsemi.com 12 LV52130A0XA/4XA Start/Shutdown Sequencing Enable input (pin EN1/EN2) is used as enable input logic. An active high logic level on this pin enables the device. A built-in pull-down resistor disables the device if the pin is left open. If a high logic signal is applied, the LV52130Ax starts with timing sequence as depicted Figure 4. It must be kept below points in the start/shutdown sequence for stable operation. When Vout set 5.5V ≥ VOUT1 / VOUT2 ≤ -5.5V, please change to its voltage 45msec later. About shutdown, please send default (5.0V/5.4V) data by IIC before EN=OFF. The each load current of VOUT1 and VOUT2 while startup is only charging current for the each external capacitor (4.7uF). IC needs 55msec waiting time from the EN1 until loading of panel module. Keep each the H/L levels at lease 1msec VIN VIN 1ms VBST 1ms 200us VBST 200us VOUT1 VOUT1 VOUT2 200us VOUT2 40ms 40ms EN1 EN1 EN2 EN2 Load Allowed 50ms to 54ms Load Allowed 55ms (a) EN on simultaneously VIN EN1 /EN2 I2C (*1)Power-ON (*2)Operation (b) EN on separately (*5)Power-OFF (*1)Power-ON (*2)Operation >0s 45ms (*3)0x0For11 55ms >0s 45ms (*4)0x0A Default (*4)0x0A Default (*3)0x0For11 40ms VBST VOUT1 VOUT2 (*5)Power-OFF +5.2v +5.7 to +5.9v +5.0v +5.5v to +5.7v +5.0v +5.0v +5.5v to +5.7v -5.0v -5.5v to -5.7v -5.0v -5.0v -5.5v to -5.7v +5.2v #1 Operation to Power ON Power ON (EN1/EN2:Hi)(*1) Operation after 45ms (Until VOUT1&2 becomes stable)(*2) Data send (5.5V or 5.7V)(*3) #2 Operations to Power OFF Data send (5.0V)(*4) Power OFF (EN1/EN2:Lo)(*5) (c) In the case of LV52130A0XA-VH Fig.4 Sequencing Diagram www.onsemi.com 13 +5.7 to +5.9v LV52130A0XA/4XA OCP and SCP function IC has OCP and SCP function and the behavior is shown in figures below. (1) OCP limit transition in normal operation The OCP means “Over Current Protection” and is equipped for preventing excessive inrush current about Vout1. It watches for limit of 150mA during 300usec from ramp up of Vout1, and then changes almost free. (2) Heavy load of during ramp up If vout1 voltage doesn’t reach target voltage at the end of time of the 300usec, then IC is doubtful of excessive current load and changes the limit to 25mA. This small current is held until recovery of the Vout1 voltage. By way of example of a case, if high load current like as 25ohm that is bigger than 150mA current capacity of Vout1 comes during ramp up term and after 300usec at Vout1, then IC chooses 25mA mode which is defeated the load. As a result, IC goes to off with latch and requires VIN’s re-installation. As it was mentioned in Start/Shutdown Sequencing section above, the 55msec waiting time is needed to avoid the case. www.onsemi.com 14 LV52130A0XA/4XA (3) SCP function The SCP means “Short Circuit Protection”. This is used to protect each Vout when they are connected to the GND. SCP function becomes active when Vout voltage reaches under 60% of its target voltage. Once SCP is activated, the counter begins to count 10msec. If the SCP detection is active for full 10msec, IC then gets shut down and latch. On the other hand, if the Vout voltage is recovered within this 10msec IC will reactivate. This latch is released by dropping VIN. www.onsemi.com 15 LV52130A0XA/4XA Startup shutdown sequence summary When Vout set 5.5V ≥ VOUT1 / VOUT2 ≤ -5.5V For start up (1) EN1=H ; (2) 45msec later, send I2C wish data; (3) After 50msec from (1), EN2=H; (4) 55msec later, start panel load; For shut down (1) stop panel load (2) send I2C data of 0x0A; (3) EN1 and EN2 = L; Note: Need spacing over 1ms until the next EN1=H or EN2=H from “(3) EN1 and EN2=L”. www.onsemi.com 16 LV52130A0XA/4XA TYPICAL OPERATING CHARACTERISTICS Efficiency Efficiency VOUT1=5.4V, VOUT2=-5.4V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=4.7µF, Cbst=4.7µF, Ccp_cn=2.2µF, Cvin=10µF+4.7µF, L=4.7µH VOUT1=5V, VOUT2=-5V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=4.7µF, Cbst=4.7µF, Ccp_cn=2.2µF, Cvin=10µF+4.7µF, L=4.7µH Load Regulation VOUT1 Load Regulation VOUT1 VOUT1=5.4V, VOUT2=-5.4V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=4.7µF, Cbst=4.7µF, Ccp_cn=2.2µF, Cvin=10µF+4.7µF, L=4.7µH VOUT1=5V, VOUT2=-5V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=4.7µF, Cbst=4.7µF, Ccp_cn=2.2µF, Cvin=10µF+4.7uF, L=4.7µH Load Regulation VOUT2 Load Regulation VOUT2 VOUT1=5.4V, VOUT2=-5.4V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=4.7µF, Cbst=4.7µF, Ccp_cn=2.2µF, Cvin=10µF+4.7µF, L=4.7µH VOUT1=5V, VOUT2=-5V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=4.7µF, Cbst=4.7µF, Ccp_cn=2.2µF, Cvin=10µF+4.7µF, L=4.7µH www.onsemi.com 17 LV52130A0XA/4XA TYPICAL OPERATING CHARACTERISTICS Efficiency Efficiency VOUT1=5.4V, VOUT2=-5.4V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=10µF, Cbst=10µF, Ccp_cn=4.7µF, Cvin=10µF+4.7µF, L=4.7µH VOUT1=5V, VOUT2=-5V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=10µF, Cbst=10µF, Ccp_cn=4.7µF, Cvin=10µF+4.7µF, L=2.2µH Load Regulation VOUT1 Load Regulation VOUT1 VOUT1=5.4V, VOUT2=-5.4V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=10µF, Cbst=10µF, Ccp_cn=4.7µF, Cvin=10µF+4.7µF, L=4.7µH VOUT1=5V, VOUT2=-5V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=10µF, Cbst=10µF, Ccp_cn=4.7µF, Cvin=10µF+4.7µF, L=2.2µH Load Regulation VOUT2 Load Regulation VOUT2 VOUT1=5.4V, VOUT2=-5.4V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=10µF, Cbst=10µF, Ccp_cn=4.7µF, Cvin=10µF+4.7µF, L=4.7µH VOUT1=5V, VOUT2=-5V (Iout=VOUT1 to VOUT2) Cvout1=4.7µF, Cvout2=10µF, Cbst=10µF, Ccp_cn=4.7µF, Cvin=10µF+4.7µF, L=2.2µH www.onsemi.com 18 LV52130A0XA/4XA ORDERING INFORMATION Device LV52130A0XA-VH Package WLP15 (1.552.15) (Pb-Free) LV52130A4XA-VH WLP15 (1.552.15) (Pb-Free) Shipping (Qty / Packing) 4000 / Tape & Reel 4000 / Tape & Reel † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf . SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. www.onsemi.com 19