ATWINC1500A-MU DATASHEET IEEE 802.11 b/g/n Network Controller SoC Datasheet Description ATWINC1500A is a single chip IEEE 802.11 b/g/n Radio/Baseband/MAC network controller optimized for low-power mobile applications. ATWINC1500A supports single stream 1x1 802.11n mode providing up to 72Mbps PHY rate. ATWINC1500A features fully integrated Power Amplifier, LNA, Switch, and Power Management. ATWINC1500A also features an on-chip microcontroller and integrated flash memory for system software. Implemented in 65nm CMOS technology, the ATWINC1500A offers very low power consumption while simultaneously providing high performance and minimal bill of materials. The ATWINC1500A supports 2- and 3-wire Bluetooth coexistence protocols. The ATWINC1500A provides multiple peripheral interfaces including UART, SPI, I2C the only external clock source needed for the ATWINC1500A is a high-speed crystal or oscillator with a wide range of reference clock frequencies supported (12-40MHz). The ATWINC1500A is available in QFN packaging. Features IEEE 802.11 b/g/n 20MHz (1x1) solution Single spatial stream in 2.4GHz ISM band Integrated PA and T/R Switch Superior Sensitivity and Range via advanced PHY signal processing Advanced Equalization and Channel Estimation Advanced Carrier and Timing Synchronization Wi-Fi Direct and Soft-AP support Supports IEEE 802.11 WEP, WPA, WPA2 Security Supports China WAPI security Superior MAC throughput via hardware accelerated two-level A-MSDU/AMPDU frame aggregation and block acknowledgement On-chip memory management engine to reduce host load Integrated Flash memory for system software SPI, UART, and I2C host interfaces 2/3 wire Bluetooth coexistence interface Operating temperature range of -40°C to +85°C Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 Power save modes: – <4µA Deep Power Down mode typical @3.3V I/O – 280uA Doze mode with chip settings preserved (used for beacon monitoring) – On-chip low power sleep oscillator – Fast host wake-up from Doze mode by a pin or host I/O transaction Fast boot options: – On-Chip Boot ROM (firmware instant boot) – SPI flash boot (firmware patches and state variables) – Low-leakage on-chip memory for state variables – Fast AP re-association (150ms) On-Chip Network Stack to offload MCU: – Integrated Network IP stack to minimize host CPU requirements – Network features: TCP, UDP, DHCP, ARP, HTTP, SSL, and DNS 2 Atmel ATWINC1500A-MU [DATASHEET] 2 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 Ta bl e of Conte nts 1 Ordering Information and IC Marking ........................................................................ 5 2 Block Diagram ............................................................................................................. 5 3 Pinout and Package Information ................................................................................ 5 3.1 3.2 4 Electric Specifications ................................................................................................ 9 4.1 4.2 4.3 5 7.2 7.3 MAC 7.1.1 7.1.2 PHY 7.2.1 7.2.2 Radio 7.3.1 7.3.2 .............................................................................................................................................. 13 Features ................................................................................................................................. 13 Description.............................................................................................................................. 13 .............................................................................................................................................. 14 Features ................................................................................................................................. 14 Description.............................................................................................................................. 14 .............................................................................................................................................. 14 Receiver Performance ............................................................................................................ 14 Transmitter Performance ........................................................................................................ 16 External Interfaces .................................................................................................... 16 8.1 8.2 8.3 8.4 8.5 8.6 9 Processor ............................................................................................................................................ 12 Memory Subsystem............................................................................................................................. 12 Non-Volatile Memory (EFuse) ............................................................................................................. 12 WLAN Subsystem ...................................................................................................... 13 7.1 8 Crystal Oscillator ................................................................................................................................. 10 Low Power Oscillator........................................................................................................................... 11 CPU and Memory Subsystems ................................................................................. 12 6.1 6.2 6.3 7 Absolute Ratings ................................................................................................................................... 9 Recommended Operating Conditions ................................................................................................... 9 DC Electric Characteristics .................................................................................................................. 10 Clocking ................................................................................................................... 10 5.1 5.2 6 Pin Description ...................................................................................................................................... 5 Package Description ............................................................................................................................. 7 I2C Slave Interface .............................................................................................................................. 17 I2C Master Interface ............................................................................................................................ 18 SPI Slave Interface.............................................................................................................................. 19 UART .............................................................................................................................................. 21 Wi-Fi/Bluetooth Coexistence ............................................................................................................... 22 GPIOs .............................................................................................................................................. 22 Power Management ................................................................................................... 22 9.1 9.2 9.3 9.4 Power Architecture .............................................................................................................................. 22 Power Consumption ............................................................................................................................ 24 9.2.1 Description of Device States................................................................................................... 24 9.2.2 Controlling the Device States¨ ................................................................................................ 24 9.2.3 Restrictions for Power States ................................................................................................. 24 Power-Up/Down Sequence ................................................................................................................. 24 Digital I/O Pin Behavior during Power-Up Sequences......................................................................... 26 Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 3 3 10 Reference Design ...................................................................................................... 26 11 Reference Documentation and Support................................................................... 28 11.1 Reference Documents......................................................................................................................... 28 12 Revision History ........................................................................................................ 29 4 Atmel ATWINC1500A-MU [DATASHEET] 4 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 1 Ordering Information and IC Marking Table 1-1. 2 Ordering Details Atmel Official Part Number (for ordering) Package Type IC Marking ATWINC1500A-MU 5x5 QFN in Tape and Reel ATWINC1500A Block Diagram Figure 2-1. ATWINC1500A Block Diagram Vbatt SDIO SPI I2C UART Bluetooth Coexistance RTC Clock PMU XO GPIO WINC1500 Host Interface 802.11bgn Forward Error Correction Microcontroller 802.11bgn OFDM Channel Estimation / Equalization Rx Digital Core 802.11bgn MAC Flash PLL RAM 802.11bgn Coding 802.11bgn iFFT Pinout and Package Information 3.1 Pin Description ~ Tx Digital Core DPD 3 X ADC DAC X ATWINC1500A is offered in an exposed pad 40-pin QFN package. This package has an exposed paddle that must be connected to the system board ground. The QFN package pin assignment is shown in Figure 3-1. The color shading is used to indicate the pin type as follows: green – power, red – analog, blue – digital I/O, yellow – digital input, grey – unconnected or reserved. The ATWINC1500A pins are described in Table 3-1. Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 5 5 6 Figure 3-1. Pin Assignment Table 3-1. Pin Description Pin # Pin Name Pin Type Description 1 TP_P Analog Test Pin/Customer No Connect 2 VDD_RF_RX Power Tuner RF Supply (see Section 9.1) 3 VDD_AMS Power Tuner BB Supply (see Section 9.1) 4 VDD_RF_TX Power Tuner RF Supply (see Section 9.1) 5 VDD_BATT_PPA Power PA 1st Stage Supply (see Section 9.1) 6 VDD_BATT_PA Power PA 2nd Stage Supply (see Section 9.1) 7 RFIOP Analog Pos RF Differential I/O 8 RFION Analog Neg RF Differential I/O 9 SDIO_SPI_CFG Digital Input Tie to 1 for SPI, 0 for SDIO 10 GPIO0/HOST_WAKE Digital I/O, Programmable Pull-Up GPIO0/SLEEP Mode Control 11 GPIO2/IRQN Digital I/O, Programmable Pull-Up GPIO2/Device Interrupt 12 SD_DAT3 Digital I/O, Programmable Pull-Up SDIO Data3 13 SD_DAT2/SPI_RXD Digital I/O, Programmable Pull-Up SDIO Data2/SPI Data Rx 14 VDDC Power Digital Core Power Supply (see Section 9.1) 15 VDDIO Power Digital I/O Power Supply (see Section 9.1) 16 SD_DAT1/SPI_SSN Digital I/O, Programmable Pull-Up SDIO Data1/SPI Slave Select 17 SD_DAT0/SPI_TXD Digital I/O, Programmable Pull-Up SDIO Data0/SPI Data Tx 18 SD_CMD/SPI_SCK Digital I/O, Programmable Pull-Up SDIO Command/SPI Clock 19 SD_CLK Digital I/O, Programmable Pull-Up SDIO Clock Atmel ATWINC1500A-MU [DATASHEET] 6 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 Pin # Pin Name Pin Type Description 20 VBATT_BUCK Power Battery Supply for DC/DC Converter (see Section 9.1) 21 VSW Power Switching output of DC/DC Converter (see Section 9.1) 22 VREG_BUCK Power Core Power from DC/DC Converter (see Section 9.1) 23 CHIP_EN Analog PMU Enable 24 GPIO1/RTC_CLK Digital I/O, Programmable Pull-Down GPIO1/32kHz Clock Input 25 TEST_MODE Digital Input Test Mode – Customer Tie to GND 26 VDDIO Power Digital I/O Power Supply (see Section 9.1) 27 VDDC Power Digital Core Power Supply (see Section 9.1) 28 NC None Customer no connect 29 GPIO15 Digital I/O, Programmable Pull-Up GPIO15 30 GPIO16 Digital I/O, Programmable Pull-Up GPIO16 31 GPIO18 Digital I/O, Programmable Pull-Up GPIO18 32 I2C_SCL1 Digital I/O, Programmable Pull-Up I2C Slave Clock 33 I2C_SDA1 Digital I/O, Programmable Pull-Up I2C Slave Data 34 RESETN Digital Input Active-Low Hard Reset 35 XO_N Analog Crystal Oscillator N 36 XO_P Analog Crystal Oscillator P 37 VDD_SXDIG Power SX Power Supply (see Section 9.1) 38 VDD_VCO Power VCO Power Supply (see Section 9.1) 39 VDDIO_A Power Tuner VDDIO Power Supply (see Section 9.1) 40 TP_N Analog Test Pin/Customer No Connect 41 PADDLE VSS Power Connect to System Board Ground Note: 3.2 1. All digital IO have 2mA drive strength expect for I2C_SCL/SDA which have 4mA. Package Description The ATWINC1500A QFN package information is provided in Table 3-2. Table 3-2. QFN Package Information Parameter Value Units Package Size 5x5 mm ±0.1mm QFN Pad Count 40 Total Thickness 0.85 mm ±0.05mm QFN Pad Pitch 0.40 mm Pad Width 0.20 mm Exposed Pad size 3.7x3.7 mm Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 7 7 The ATWINC1500A 40L QFN package view is shown in Figure 3-2. Figure 3-2. QFN Package The QFN package is a qualified Green Package. 8 Atmel ATWINC1500A-MU [DATASHEET] 8 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 4 Electric Specifications 4.1 Absolute Ratings Table 4-1. Absolute Maximum Ratings Characteristic Symbol Min Max Unit Core Supply Voltage VDDC -0.3 1.5 V I/O Supply Voltage VDDIO -0.3 5.0 V Battery Supply Voltage VBATT -0.3 5.0 V Digital Input Voltage VIN -0.3 VDDIO V Analog Input Voltage VESDHBM -0.3 1.5 V -1000, -2000 (see notes below) +1000, +2000 (see notes below) V -65 150 ºC Junction Temperature 1225 ºC RF input power max 23 dBm ESD Human Body Model Storage Temperature Notes: 1. 2. 3. 4.2 TA VIN corresponds to all the digital pins. VAIN corresponds to the following analog pins: VDD_RF_RX, VDD_RF_TX, VDD_AMS, RFIOP, RFION, XO_N, XO_P, VDD_SXDIG, VDD_VCO. For VESDHBM, each pin is classified as Class 1, or Class 2, or both: The Class 1 pins include all the pins (both analog and digital) The Class 2 pins are all digital pins only VESDHBM is ±1kV for Class1 pins. VESDHBM is ±2kV for Class2 pins Recommended Operating Conditions Table 4-2. Recommended Operating Conditions Characteristics Symbol Min Typ Max Units I/O Supply Voltage VDDIO 2.7 3.3 3.6 V Battery Supply Voltage VBATT 3.0 3.6 4.2 Operating Temperature Notes: 1. 2. 3. -40 85 ºC I/O supply voltage is applied to the following pins: VDDIO_A, VDDIO. Battery supply voltage is applied to following pins: VDD_BATT_PPA, VDD_BATT_PA, VBATT_BUCK. Refer to Sections 9.1 and Table 9-3 for the details of power connections. Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 9 9 4.3 DC Electric Characteristics Table 4-3 provides the DC characteristics for the ATWINC1500A digital pads. Table 4-3. Electrical Characteristics VDDIO Condition VDDIOL Characteristic Min Max Unit Input Low Voltage VIL -0.30 0.60 V Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 V 0.45 V Output Low Voltage VOL VDDIOM Output High Voltage VOH VDDIO-0.50 Input Low Voltage VIL -0.30 0.63 V Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 V 0.45 V V Output Low Voltage VOL VDDIOH Output High Voltage VOH VDDIO-0.50 Input Low Voltage VIL -0.30 0.65 V Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 (up to 3.60) V 0.45 V V Output Low Voltage VOL Output High Voltage VOH VDDIO-0.50 V All Output Loading 20 pF All Digital Input Load 6 pF 5 Clocking 5.1 Crystal Oscillator Table 5-1. Crystal Oscillator Parameters Parameter Min Typ Max Units Crystal Resonant Frequency 12 26 40 MHz 50 150 Ω Crystal Equivalent Series Resistance Stability – Initial Offset1 -100 100 ppm Stability - Temperature and Aging -25 25 ppm Note: 1. Initial offset must be calibrated to maintain ±25ppm in all operating conditions. This calibration is performed during final production testing. The block diagram in Figure 5-1(a) shows how the internal Crystal Oscillator (XO) is connected to the external crystal. The XO has 5pF internal capacitance on each terminal XO_P and XO_N. To bypass the crystal 10 Atmel ATWINC1500A-MU [DATASHEET] 1 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 0 oscillator with an external reference, an external signal capable of driving 5pF can be applied to the XO_N terminal as shown Figure 5-1(b). Figure 5-1. XO Connections: (a) Crystal Oscillator is Used, (b) Crystal Oscillator is Bypassed External Clock XO_N XO_P XO_N XO_P ATWINC1500A ATWINC1500A (a) (b) Table 5-2 specifies the electrical and performance requirements for the external clock. Table 5-2. 5.2 Bypass Clock Specification Parameter Min Max Unit Comments Oscillation frequency 12 32 MHz Must be able to drive 5pF load @ desired frequency Voltage swing 0.5 1.2 Vpp Must be AC coupled Stability – Temperature and Aging -25 +25 ppm Phase Noise -130 dBc/Hz Jitter(RMS) <1psec At 10kHz offset Based on integrated phase noise spectrum from 1kHz to 1MHz Low Power Oscillator ATWINC1500A has an internally-generated 32kHz clock to provide timing information for various sleep functions. Alternatively, ATWINC1500A allows for an external 32kHz clock to be used for this purpose, which is provided through Pin 24 (RTC_CLK). Software selects whether the internal clock or external clock is used. The internal low-power clock is ring-oscillator based and has accuracy within 10,000ppm. When using the internal low-power clock, the advance wakeup time in beacon monitoring mode has to be increased by about 1% of the sleep time to compensate for the oscillator inaccuracy. For example, for the DTIM interval value of 1, wakeup time has to be increased by 1ms. For any application targeting very low power consumption, an external 32kHz RTC clock should be used. Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 11 1 1 6 CPU and Memory Subsystems 6.1 Processor ATWINC1500A has a Cortus APS3 32-bit processor. This processor performs many of the MAC functions, including but not limited to association, authentication, power management, security key management, and MSDU aggregation/de-aggregation. In addition, the processor provides flexibility for various modes of operation, such as STA and AP modes. 6.2 Memory Subsystem The APS3 core uses a 128KB instruction/boot ROM along with a 128KB instruction RAM and a 64KB data RAM. ATWINC1500A also has 4Mb of flash memory, which can be used for system software. In addition, the device uses a 128KB shared RAM, accessible by the processor and MAC, which allows the APS3 core to perform various data management tasks on the TX and RX data packets. 6.3 Non-Volatile Memory (EFuse) ATWINC1500A has 768 bits of non-volatile EFuse memory that can be read by the CPU after device reset. This non-volatile one-time-programmable (OTP) memory can be used to store customer-specific parameters, such as MAC address; various calibration information, such as TX power, crystal frequency offset, etc.; and other software-specific configuration parameters. The EFuse is partitioned into six 128-bit banks. Each bank has the same bit map, which is shown in Figure 6-1. The purpose of the first 80 bits in each bank is fixed, and the remaining 48 bits are general-purpose software dependent bits, or reserved for future use. Since each bank can be programmed independently, this allows for several updates of the device parameters following the initial programming, e.g. updating MAC address. Refer to ATWINC1500A Programming Guide for the EFuse programming instructions. Flags 8 Bank 0 F 48 MAC ADDR 7 8 G 16 FO Bank 1 Bank 2 Bank 3 Bank 4 Bank 5 128 Bits 12 Atmel ATWINC1500A-MU [DATASHEET] 1 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 2 1 15 Freq. Offset 1 Used 1 TX Gain Correc tion Reserved 4 Used 3 Version 1 Invalid Used 1 EFuse Bit Map MAC ADDR Used Figure 6-1. 7 WLAN Subsystem The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY). The following two subsections describe the MAC and PHY in detail. 7.1 MAC 7.1.1 Features The ATWINC1500A IEEE802.11 MAC supports the following functions: IEEE 802.11b/g/n IEEE 802.11e WMM QoS EDCA/PCF multiple access categories traffic scheduling Advanced IEEE 802.11n features: 7.1.2 – Transmission and reception of aggregated MPDUs (A-MPDU) – Transmission and reception of aggregated MSDUs (A-MSDU) – Immediate Block Acknowledgement – Reduced Interframe Spacing (RIFS) Support for IEEE802.11i and WFA security with key management – WEP 64/128 – WPA-TKIP – 128-bit WPA2 CCMP (AES) Support for WAPI security Advanced power management – Standard 802.11 Power Save Mode – Wi-Fi Alliance WMM-PS (U-APSD) RTS-CTS and CTS-self support Supports either STA or AP mode in the infrastructure basic service set mode Supports independent basic service set (IBSS) Description The ATWINC1500A MAC is designed to operate at low power while providing high data throughput. The IEEE 802.11 MAC functions are implemented with a combination of dedicated datapath engines, hardwired control logic, and a low-power, high-efficiency microprocessor. The combination of dedicated logic with a programmable processor provides optimal power efficiency and real-time response while providing the flexibility to accommodate evolving standards and future feature enhancements. Dedicated datapath engines are used to implement data path functions with heavy computational. For example, an FCS engine checks the CRC of the transmitting and receiving packets, and a cipher engine performs all the required encryption and decryption operations for the WEP, WPA-TKIP, WPA2 CCMP-AES, and WAPI security requirements. Control functions which have real-time requirements are implemented using hardwired control logic modules. These logic modules offer real-time response while maintaining configurability via the processor. Examples of hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX control, interframe spacing, etc.), protocol timer module (responsible for the Network Access Vector, back-off timing, timing synchronization function, and slot management), MPDU handling module, aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block communication), and TX/RX control FSMs (coordinate data movement between PHY-MAC interface, cipher engine, and the DMA interface to the TX/RX FIFOs). Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 13 1 3 The MAC functions implemented solely in software on the microprocessor have the following characteristics: Functions with high memory requirements or complex data structures. Examples are association table management and power save queuing. Functions with low computational load or without critical real-time requirements. Examples are authentication and association. Functions which need flexibility and upgradeability. Examples are beacon frame processing and QoS scheduling. 7.2 PHY 7.2.1 Features The ATWINC1500A IEEE802.11 PHY supports the following functions: 7.2.2 Single antenna 1x1 stream in 20MHz channels Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, 11Mbps Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, 54Mbps Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2, 13.0, 14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, 72.2Mbps IEEE 802.11n mixed mode operation Per packet TX power control Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery, and frame detection Description The ATWINC1500A WLAN PHY is designed to achieve reliable and power-efficient physical layer communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced algorithms have been employed to achieve maximum throughput in a real world communication environment with impairments and interference. The PHY implements all the required functions such as FFT, filtering, FEC (Viterbi decoder), frequency and timing acquisition and tracking, channel estimation and equalization, carrier sensing and clear channel assessment, as well as the automatic gain control. 7.3 Radio 7.3.1 Receiver Performance Radio Performance under Typical Conditions: VBAT=3.6V; VDDIO=3.3V; Temp: 25°C. Table 7-1. Parameter Receiver Performance Description Frequency Sensitivity 802.11b Sensitivity 802.11g 14 Unit Minimum MHz 2,412 Typical 2,484 1Mbps DSS dBm -98 2Mbps DSS dBm -94 5.5Mbps DSS dBm -92 11Mbps DSS dBm -88 6Mbps OFDM dBm -90 9Mbps OFDM dBm -89 Atmel ATWINC1500A-MU [DATASHEET] 1 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 4 Maximum Parameter Sensitivity 802.11n (BW=20MHz) Maximum Receive Signal Level Adjacent Channel Rejection Cellular Blocker Immunity Description Unit Minimum Typical 12Mbps OFDM dBm -88 18Mbps OFDM dBm -85 24Mbps OFDM dBm -83 36Mbps OFDM dBm -80 48Mbps OFDM dBm -76 54Mbps OFDM dBm -74 MCS 0 dBm -89 MCS 1 dBm -87 MCS 2 dBm -85 MCS 3 dBm -82 MCS 4 dBm -77 MCS 5 dBm -74 MCS 6 dBm -72 MCS 7 dBm -71 1-11Mbps DSS dBm 0 6-54Mbps OFDM dBm 0 MCS 0 – 7 dBm 0 1Mbps DSS (30MHz offset) dB 50 11Mbps DSS (25MHz offset) dB 43 6Mbps OFDM (25MHz offset) dB 40 54Mbps OFDM (25MHz offset) dB 25 MCS 0 – 20MHz BW (25MHz offset) dB 40 MCS 7 – 20MHz BW (25MHz offset) dB 20 776-794MHz CDMA dBm -14 824-849MHz GSM dBm -10 880-915MHz GSM dBm -10 1710-1785MHz GSM dBm -15 1850-1910MHz GSM dBm -15 1850-1910MHz WCDMA dBm -24 1920-1980MHz WCDMA dBm -24 Maximum Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 15 1 5 7.3.2 Transmitter Performance Radio Performance under Typical Conditions: VBAT=3.6V; VDDIO=3.3V; Temp: 25°C. Table 7-2. Transmitter Performance Parameter Description Frequency Unit Minimum MHz 2,412 802.11b DSSS 1Mbps dBm 802.11b DSSS 11Mbps dBm 20.61 802.11g OFDM 6Mbps dBm 20.51 802.11g OFDM 54Mbps dBm 17.81 802.11n HT20 MCS 0 dBm 18.81 802.11n HT20 MCS 7 dBm 15.31 Tx Power Accuracy dB ±1.52 Carrier Suppression dBc 30.0 76-108 dBm/Hz -125 776-794 dBm/Hz -125 869-960 dBm/Hz -125 925-960 dBm/Hz -125 1570-1580 dBm/Hz -125 1805-1880 dBm/Hz -125 1930-1990 dBm/Hz -125 2110-2170 dBm/Hz -125 2nd dBm/MHz -33 3rd dBm/MHz -38 Out of Band Transmit Power Harmonic Output Power Notes: 1. 2. 3. Maximum 2,484 20.61 Output Power 8 Typical3 Measured at 802.11 spec compliant EVM/Spectral Mask. Measured at RF Pin assuming 50Ω differential. RF performance guaranteed for Temp range -30 to 85deg. 1dB derating in performance at -40deg. External Interfaces ATWINC1500A external interfaces include I2C Slave for control, SPI Slave and SDIO Slave for control and data transfer, I2C Master for external EEPROM, UART for debug, control, and data transfer, General Purpose Input/Output (GPIO) pins, and a Wi-Fi/Bluetooth coexistence interface. With the exception of the SPI Slave and SDIO Slave host interfaces, which are selected using the dedicated SDIO_SPI_CFG pin, the other interfaces can be assigned to various pins by programming the corresponding pin muxing control register for each pin to a specific value between 0 and 6.The default values of these registers are 0, which is GPIO mode. The summary of the available interfaces and their corresponding pin mux settings is shown in Table 8-1. For specific programming instructions refer to ATWINC1500A Programming Guide. 16 Atmel ATWINC1500A-MU [DATASHEET] 1 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 6 Table 8-1. 8.1 Pin-Mux Matrix of External Interfaces I2C Slave Interface The I2C Slave interface, used primarily for control by the host processor, is a two-wire serial interface consisting of a serial data line (SDA, Pin 33) and a serial clock (SCL, Pin 32). It responds to the seven bit address value 0x60. The ATWINC1500A I2C supports I2C bus Version 2.1 - 2000 and can operate in standard mode (with data rates up to 100Kb/s) and fast mode (with data rates up to 400Kb/s). The I2C Slave is a synchronous serial interface. The SDA line is a bidirectional signal and changes only while the SCL line is low, except for STOP, START, and RESTART conditions. The output drivers are open-drain to perform wire-AND functions on the bus. The maximum number of devices on the bus is limited by only the maximum capacitance specification of 400pF. Data is transmitted in byte packages. For specific information, refer to the Philips Specification entitled “The I2C -Bus Specification, Version 2.1”. The I2C Slave timing is provided in Figure 8-1 and 0. Figure 8-1. I2C Slave Timing Diagram tPR tSUDAT tHDDAT tBUF tSUSTO SDA tHL tLH tWL SCL tHDSTA tLH tHL tWH tPR fSCL tPR tSUSTA Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 17 1 7 Table 8-2. 8.2 I2C Slave Timing Parameters Parameter Symbol Min Max Units SCL Clock Frequency fSCL 0 400 kHz SCL Low Pulse Width tWL 1.3 µs SCL High Pulse Width tWH 0.6 µs SCL, SDA Fall Time tHL 300 ns SCL, SDA Rise Time tLH 300 ns START Setup Time tSUSTA 0.6 µs START Hold Time tHDSTA 0.6 µs SDA Setup Time tSUDAT 100 ns SDA Hold Time tHDDAT 0 40 ns ns STOP Setup time tSUSTO 0.6 µs Bus Free Time Between STOP and START tBUF 1.3 µs Glitch Pulse Reject tPR 0 50 Remarks This is dictated by external components Slave and Master Default Master Programming Option ns I2C Master Interface ATWINC1500A provides an I2C bus master, which is intended primarily for accessing an external EEPROM memory through a software-defined protocol. The I2C Master is a two-wire serial interface consisting of a serial data line (SDA) and a serial clock line (SCL). SDA can be configured on one of the following pins: GPIO1 (pin 24) or I2C_SDA (pin 33). SCL can be configured on one of the following pins: GPIO0 (pin 10) or I2C_SCL (pin 32). For more specific instructions refer to ATWINC1500A Programming Guide. The I2C Master interface supports three speeds: Standard mode (100kb/s) Fast mode (400kb/s) High-speed mode (3.4Mb/s) The timing diagram of the I2C Master interface is the same as that of the I2C Slave interface (see Figure 8-1). The timing parameters of I2C Master are shown in Table 8-3. Table 8-3. I2C Master Timing Parameters Standard Mode Parameter 18 Fast Mode High-Speed Mode Symbol Units Min Max Min Max Min Max 100 0 400 0 3400 SCL Clock Frequency fSCL 0 SCL Low Pulse Width tWL 4.7 1.3 0.16 µs SCL High Pulse Width tWH 4 0.6 0.06 µs SCL Fall Time tHLSCL 300 300 10 40 ns SDA Fall Time tHLSDA 300 300 10 80 ns SCL Rise Time tLHSCL 1000 300 10 40 ns Atmel ATWINC1500A-MU [DATASHEET] 1 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 8 kHz Standard Mode Parameter High-Speed Mode Units Min 8.3 Fast Mode Symbol Max Min 1000 Max Min Max 300 10 80 SDA Rise Time tLHSDA START Setup Time tSUSTA 4.7 0.6 0.16 µs START Hold Time tHDSTA 4 0.6 0.16 µs SDA Setup Time tSUDAT 250 100 10 ns SDA Hold Time tHDDAT 5 40 0 STOP Setup time tSUSTO 4 0.6 0.16 Bus Free Time Between STOP and START tBUF 4.7 1.3 Glitch Pulse Reject tPR 0 70 ns ns µs µs 50 ns SPI Slave Interface ATWINC1500A provides a Serial Peripheral Interface (SPI) that operates as a SPI slave. The SPI Slave interface can be used for control and for serial I/O of 802.11 data. The SPI Slave pins are mapped as shown in Table 8-4. The RXD pin is same as Master Output, Slave Input (MOSI), and the TXD pin is same as Master Input, Slave Output (MISO). The SPI Slave is a full-duplex slave-synchronous serial interface that is available immediately following reset when pin 9 (SDIO_SPI_CFG) is tied to VDDIO. Table 8-4. SPI Slave Interface Pin Mapping Pin # SPI Function 9 CFG: Must be tied to VDDIO 16 SSN: Active Low Slave Select 18 SCK: Serial Clock 13 RXD: Serial Data Receive (MOSI) 17 TXD: Serial Data Transmit (MISO) When the SPI is not selected, i.e., when SSN is high, the SPI interface will not interfere with data transfers between the serial-master and other serial-slave devices. When the serial slave is not selected, its transmitted data output is buffered, resulting in a high impedance drive onto the serial master receive line. The SPI Slave interface responds to a protocol that allows an external host to read or write any register in the chip as well as initiate DMA transfers. For the details of the SPI protocol and more specific instructions refer to ATWINC1500A Programming Guide. The SPI Slave interface supports four standard modes as determined by the Clock Polarity (CPOL) and Clock Phase (CPHA) settings. These modes are illustrated in 0 and Figure 8-2. The red lines in Figure 8-2 correspond to Clock Phase = 0 and the blue lines correspond to Clock Phase = 1. Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 19 1 9 Table 8-5. SPI Slave Modes Mode CPOL CPHA 0 0 0 1 0 1 2 1 0 3 1 1 Figure 8-2. SPI Slave Clock Polarity and Clock Phase Timing CPOL = 0 SCK CPOL = 1 SSN CPHA = 0 RXD/TXD (MOSI/MISO) CPHA = 1 z 1 z 2 1 3 2 4 3 The SPI Slave timing is provided in Figure 8-3 and Table 8-6. Figure 8-3. 20 SPI Slave Timing Diagram Atmel ATWINC1500A-MU [DATASHEET] 2 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 0 5 4 6 5 7 6 8 7 z 8 z Table 8-6. 8.4 SPI Slave Timing Parameters Parameter Symbol Min Max Units Clock Input Frequency fSCK 48 MHz Clock Low Pulse Width tWL 15 ns Clock High Pulse Width tWH 15 ns Clock Rise Time tLH 10 ns Clock Fall Time tHL 10 ns Input Setup Time tISU 5 ns Input Hold Time tIHD 5 ns Output Delay tODLY 0 Slave Select Setup Time tSUSSN 5 ns Slave Select Hold Time tHDSSN 5 ns 20 ns UART ATWINC1500A has a Universal Asynchronous Receiver/Transmitter (UART) interface for serial communication. It is intended primarily for debugging, and it can also be used for control or data transfer if the baud rate is sufficient for a given application. The UART is compatible with the RS-232 standard, where ATWINC1500A operates as Data Terminal Equipment (DTE). It has a two-pin RXD/TXD interface, where RXD can be enabled on one of four alternative pins and TXD can be enabled on one of three alternative pins by programming their corresponding pin mux control registers to 3 (see Table 8-1). The UART features programmable baud rate generation with fractional clock division, which allows transmission and reception at a wide variety of standard and non-standard baud rates. The UART input clock is selectable between 10MHz, 5MHz, 2.5MHz, and 1.25MHz. The clock divider value is programmable as 13 integer bits and 3 fractional bits (with 8.0 being the smallest recommended value for normal operation). This results in the maximum supported baud rate of 10MHz/8.0 = 1.25MBd. The UART can be configured for seven or eight bit operation, with or without parity, with four different parity types (odd, even, mark, or space), and with one or two stop bits. It also has Rx and Tx FIFOs, which ensure reliable high speed reception and low software overhead transmission. FIFO size is 4x8 for both Rx and Tx direction. The UART also has status registers showing the number of received characters available in the FIFO and various error conditions, as well the ability to generate interrupts based on these status bits. An example of UART receiving or transmitting a single packet is shown in Figure 8-4. This example shows 7-bit data (0x45), odd parity, and two stop bits. For more specific instructions refer to ATWINC1500A Programming Guide. Figure 8-4. Example of UART Rx or Tx Packet Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 21 2 1 8.5 Wi-Fi/Bluetooth Coexistence ATWILC1000A supports 2-wire and 3-wire Wi-Fi/Bluetooth Coexistence signaling conforming to the IEEE 802.15.2-2003 standard, Part 15.2. The type of coexistence interface used (2 or 3 wire) is chosen to be compatible with the specific Bluetooth device used in a given application. Table 8-7 shows a usage example of the 2-wire interface using the GPIO3 and GPIO4 pins; 3-wire interface using the GPIO3, GPIO4, and GPIO5 pins; for more specific instructions on configuring Coexistence refer to ATWILC1000A Programming Guide. Table 8-7. 8.6 Coexistence Pin Assignment Example Pin Name Function Target Pin # 2-wire 3-wire GPIO3 BT_Req BT is requesting to access the medium to transmit or receive. Goes high on TX or RX slot. 28 Used Used GPIO4 BT_Pri Priority of the BT packets in the requested slot. High to indicate high priority and low for normal. 29 Not Used Used GPIO5 WL_Act Device response to the BT request. High - BT_req is denied and BT slot blocked. 30 Used Used GPIO6 Ant_SW Direct control on Antenna (coex bypass). 31 Optional Optional GPIOs Eight General Purpose Input/Output (GPIO) pins, labeled GPIO0, GPIO1, GPIO2, GPIO7, GPIO8, GPIO15, GPIO16, and GPIO18, are available to allow for application specific functions. Each GPIO pin can be programmed as an input (the value of the pin can be read by the host or internal processor) or as an output (the output values can be programmed by the host or internal processor), where the default mode after powerup is input. GPIOs 7 and 8 are only available when the host does not use the SDIO interface, which shares two of its pins with these GPIOs. Therefore, for SDIO-based applications, six GPIOs are available. For more specific usage instructions refer to ATWINC1500A Programming Guide. 9 Power Management 9.1 Power Architecture ATWINC1500A uses an innovative power architecture to eliminate the need for external regulators and reduce the number of off-chip components. This architecture is shown in Figure 9-1. The Power Management Unit (PMU) has a DC/DC Converter that converts VBATT to the core supply used by the digital and RF/AMS blocks. Table 9-1 shows the typical values for the digital and RF/AMS core voltages. The PA and EFuse are supplied by dedicated LDOs, and the VCO is supplied by a separate LDO structure. 22 Atmel ATWINC1500A-MU [DATASHEET] 2 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 2 Figure 9-1. Power Architecture RF/AMS VDDIO VDD_VCO VDDIO_A 1.2V LDO1 LDO2 VBATT VDD_BATT 1.0V PA ~ SX VDD_AMS, VDD_RF, VDD_SXDIG EFuse LDO RF/AMS Core 2.5V Digital VDDC VDDIO RF/AMS Core Voltage EFuse Digital Core Pads dcdc_ena PMU Digital Core Voltage Sleep Osc CHIP_EN ena Sleep LDO Dig Core LDO ena VREG_BUCK ena VBATT_BUCK DC/DC Converter Vin Table 9-1. VSW Vout Off-Chip LC PMU Output Voltages Parameter Typical RF/AMS Core Voltage (VREG_BUCK) 1.35V Digital Core Voltage (VDDC) 1.10V The power connections in Figure 9-1 provide a conceptual framework for understanding the ATWINC1500A power architecture. Refer to the reference design in Chapter 10 for an example of power supply connections, including proper isolation of the supplies used by the digital and RF/AMS blocks. Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 23 2 3 9.2 Power Consumption 9.2.1 Description of Device States ATWINC1500A has several Devices States: 9.2.2 ON_Transmit – Device is actively transmitting an 802.11 signal ON_Receive – Device is actively receiving an 802.11 signal ON_Doze – Device is on but is neither transmitting nor receiving Power_Down – Device core supply off (Leakage) IDLE connect – Device is connected with 1 DTIM beacon interval Controlling the Device States Table 9-2 shows how to switch between the device states using the following: CHIP_EN – Device pin (pin #23) used to enable DC/DC Converter VDDIO – I/O supply voltage from external supply Table 9-2. Device States Power Consumption1 Device State VDDIO IVBATT IVDDIO ON_Transmit VDDIO On 230mA @ 18dBm 29mA ON_Receive VDDIO On 68mA 29mA ON_Doze VDDIO On 280µA <10µA Power_Down GND On <0.5µA <0.2µA Note: 9.2.3 CHIP_EN 1. Conditions: VBAT @ 3.6v, [email protected]. Restrictions for Power States When no power supplied to the device, i.e., the DC/DC Converter output and VDDIO are both off (at ground potential). In this case, a voltage cannot be applied to the device pins because each pin contains an ESD diode from the pin to supply. This diode will turn on when voltage higher than one diode-drop is supplied to the pin. If a voltage must be applied to the signal pads while the chip is in a low power state, the VDDIO supply must be on, so the SLEEP or Power_Down state must be used. Similarly, to prevent the pin-to-ground diode from turning on, do not apply a voltage that is more than one diode-drop below ground to any pin. 9.3 Power-Up/Down Sequence The power-up/down sequence for ATWILC1000A is shown in Figure 9-2. The timing parameters are provided in Table 9-3. 24 Atmel ATWINC1500A-MU [DATASHEET] 2 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 4 Figure 9-2. Power Up/Down Sequence VBATT tA t A' VDDIO tB t B' CHIP_EN tC t C' RESETN XO Clock Table 9-3. Power-Up/Down Sequence Timing Parameter Min tA tB Max Units Description Notes 0 ms VBATT rise to VDDIO rise VBATT and VDDIO can rise simultaneously or can be tied together. VDDIO must not rise before VBATT. 0 ms VDDIO rise to CHIP_EN rise CHIP_EN must not rise before VDDIO. CHIP_EN must be driven high or low, not left floating. tC 5 ms CHIP_EN rise to RESETN rise This delay is needed because XO clock must stabilize before RESETN removal. RESETN must be driven high or low, not left floating. tA’ 0 ms VDDIO fall to VBATT fall VBATT and VDDIO can fall simultaneously or can be tied together. VBATT must not fall before VDDIO. tB’ 0 ms CHIP_EN fall to VDDIO fall VDDIO must not fall before CHIP_EN. CHIP_EN and RESETN can fall simultaneously. tC’ 0 ms RESETN fall to VDDIO fall VDDIO must not fall before RESETN. RESETN and CHIP_EN can fall simultaneously. Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 25 2 5 9.4 Digital I/O Pin Behavior during Power-Up Sequences Table 9-4 represents digital IO Pin states corresponding to device power modes. Table 9-4. Digital I/O Pin Behavior in Different Device States Device State VDDIO CHIP_EN RESETN Output Driver Input Driver Pull Up/Down Resistor (96kΩ) Power_Down: core supply off High Low Low Disabled (HiZ) Disabled Disabled Power-On Reset: core supply on, hard reset on High High Low Disabled (HiZ) Disabled Enabled Power-On Default: core supply on, device out of reset but not programmed yet High High High Disabled (HiZ) Enabled Enabled High Programmed by firmware for each pin: Enabled or Disabled Opposite of Output Driver state Programmed by firmware for each pin: Enabled or Disabled On_Doze/ On_Transmit/ On_Receive: core supply on, device programmed by firmware 10 High High Reference Design The ATWINC1500A reference design schematic is shown in Figure 10-1. 26 Atmel ATWINC1500A-MU [DATASHEET] 2 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 6 Figure 10-1. ATWINC1500A Reference Schematic Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 27 2 7 11 Reference Documentation and Support 11.1 Reference Documents Atmel offers a set of collateral documentation to ease integration and device ramp. The following list of documents available on Atmel web or integrated into development tools. Title Content Datasheet This Document Design Files Package User Guide, Schematic, PCB layout, Gerber, BOM & System notes on: RF/Radio Full Test Report, radiation pattern, design guidelines, temperature performance, ESD. Platform Getting Started Guide How to use package: Out of the Box starting guide, HW limitations and notes, SW Quick start guidelines. HW Design Guide Best practices and recommendations to design a board with the product, Including: Antenna Design for Wi-Fi (layout recommendations, types of antennas, impedance matching, using a power amplifier etc), SPI/UART protocol between Wi-Fi SoC and the Host MCU. SW Design Guide Integration guide with clear description of: High level Arch, overview on how to write a networking application, list all API, parameters and structures. Features of the device, SPI/handshake protocol between device and host MCU, with flow/sequence/state diagram, timing. SW Programmer Guide Explain in details the flow chart and how to use each API to implement all generic use cases (e.g. start AP, start STA, provisioning, UDP, TCP, http, TLS, p2p, errors management, connection/transfer recovery mechanism/state diagram) - usage & sample App note For a complete listing of development-support tools & documentation, visit http://www.atmel.com/, or contact the nearest Atmel field representative. 28 Atmel ATWINC1500A-MU [DATASHEET] 2 Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 8 12 Revision History Doc Rev. Date Comments 42353D 02/2015 New sections added, replaced text in most sections, new and updated drawings. 42353C 01/2015 Datasheet status changed from “Preliminary” to “Complete”. Updated “Ordering Information” on page 3. Major editing updates. 42353B 11/2014 Major document update, new sections added, replaced text in most sections, new and updated drawings. 42353A 09/2014 Initial document release. Atmel ATWINC1500A-MU [DATASHEE] Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015 29 2 9 Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 │ www.atmel.com © 2015 Atmel Corporation. / Rev.: Atmel-42353D-ATWINC1500-MU-SmartConnect-Datasheet_022015. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. ARM®, ARM Connected® logo, and others are the registered trademarks or trademarks of ARM Ltd. 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