SC2542
High Performance Wide Input Range
Dual Synchronous Buck Controller
POWER MANAGEMENT
Description
Features
SC2542 is a high performance dual PWM controller. It is
designed to convert a widely ranged battery rail down to
two independent output rails. The PWM operation of the
two channels are 180 degrees out of phase which can
greatly reduce the size and the cost of the input capacitors. Synchronous buck PWM topology and voltage mode
control allow fast transient response and flexible component selection for easy designs. A 5V standby regulator is integrated. A 10V internal linear regulator provides
the bias for the controller, and this voltage is optimized
for gate drivers to deliver high efficiency.
Independent dual-switcher-outputs
Integrated 5V standby output with over 50mA
The light load efficiency can be greatly improved by turning off the low side MOSFET upon reversal of inductor
current. There is no need for a current sensing resistor
because the MOSFET on resistance is used as the sensing element. Under extreme light load conditions, the
device will operate in a pulse skip mode. The switching
frequency can be dropped significantly to a level programmed by external resistors. The battery energy is better utilized with these efficiency enhancement schemes.
capability
Wide input voltage range: 6.5V ~ 28V
Adjustable output voltage down to 0.75V
Light load efficiency enhancement
Programmable skip mode operation
Flexible power sequencing with enable and power
good output
Synchronous buck topology with voltage mode
control
Out of phase operation to reduce cost of input
capacitor
10V internal regulator for gate driver to deliver high
efficiency
Programmable switching frequency:
100KHz ~ 300KHz
Full protection: UVLO, OVP, and programmable OCP
No need for current sense resistor
Low standby operating current (200µA typical)
Low shut down current (100nA typical)
28 lead TSSOP package with exposed die pad
(EDP)
Fully WEEE package and RoHS Compliant
The power sequencing is fully supported including inde
pendent start up and power good output. In shutdown
mode the controller only draws 100nA from the supply.
The controller also offers full protection features for the
conditions of under voltage, over voltage, and over current. The switching frequency is adjustable from 100KHz
to 300KHz. TSSOP-28-EDP package is offered.
Applications
Typical Application Circuit
SC2542
VIN+
1
VCC
2
3
ENABLE
4
STBY MODE
5
FB1
6
7
8
VIN+
9
10
11
VO1 (3.3V/10A)
12
13
FB1
Revision: August 24, 2005
Notebook computer system power
Systems with 6.5V ~ 28V input
Network and telecom systems
Other portable devices
14
VIN
AGND
VCC
5VSBY
EN
ROSC
STBY
PWRGD
FB1
FB2
ERROUT1
MINSET1
ERROUT2
MINSET2
SS1
SS2
ILIM1
ILIM2
BST1
BST2
DRVH1
DRVH2
PHASE1
PHASE2
DRVL1
DRVL2
PGND TH-PAD
1
PVCC
28
27
5VSBY
VO1
26
25
PWGRD
24
FB2
23
22
21
VIN+
20
19
18
VO2 (5V/10A)
17
16
15
VCC
FB2
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SC2542
POWER MANAGEMENT
Absolute Maximum Ratings
Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified
in the Electrical Characteristics section is not implied.
Parameter
Symbol
Maximum
Units
V BST
38
V
VIN
28
V
ILIM1 and ILIM2 to PGND
VIN
V
VCC and PVCC to PGND
14
V
± 0.3
V
-0.3 to 14
V
-0.3 to VCC
V
-0.3 to VIN
V
-0.3 to VCC
V
TJ
-40 to +150
°C
Storage Temperature Range
TSTG
-60 to +150
°C
Thermal Resistance, Junction to Case
θJC
3
° C/W
Thermal Resistance, Junction to Ambient
θJA
35
° C/W
TSOLDER
260
°C
PHASE to AGND pulse (100nS) peak voltage
-3
V
DRVL to AGND pulse (100nS) peak voltage
-3
V
BST1, BST2 to PGND
VIN to PGND
PGND to AGND
BST1 to PH1, BST2 to PH2,
DRVH1 to PH1, DRVH2 to PH2
DRVL1, DRVL2 to PGND
EN to PGND
All other pins to AGND
Operating Junction Temperature Range
Lead Temperature (Soldering) 10 Sec.
Note: (1) This device is ESD sensitive. Use of standard ESD handling precautions is required.
Electrical Characteristics
Unless specified: TA = 25°C, VIN = 16V, FS = 200KHz.
Parameter
Test Conditions
Min
Typ
Max
Unit
Start Threshold
VCC rising
5.25
5.5
5.75
V
UVLO Hysteresis
hysteresis
400
SS1/SS2, EN = high, FS = 200 KHz
7
FS = 200KHz, 1nF on TG and BG
14
mA
VIN > 12V
10
V
VCC Load Regulation
Load current 0 to 20mA
2
%
Standby Supply Current
STBY mode
200
350
µA
Shutdown mode
0.1
10
µA
Undervoltage Lockout
mV
Pow er Supply
Operating Current (IIN - IPVCC)
PVCC Operating Current
VCC Regulated
Shutdown Supply Current
© 2005 Semtech Corp.
2
12
mA
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SC2542
POWER MANAGEMENT
Electrical Characteristics (Cont.)
Unless specified: TA = 25°C, VIN = 16V, FS = 200KHz.
Parameter
Test Conditions
Min
Typ
Max
Unit
0A < load current < 50mA
4.85
5
5.15
V
Pow er Supply (Cont.)
5VSBY Regulation
1
%
100
mA
0A < load current < 50mA
1
µF
Line Regulation
7V < VIN < 28V
0.5
%
Load Regulation
0A < load current < 10A, MINSET
pin float
0.5
%
5VSBY Line Regulation
VIN = 12V ~ 28V
5VSBY Current Limit Threshold
Minimum 5VSBY Output Capacitance
Main Sw itcher Output
Output Voltage Accuracy
Without feedback attenuation,
TA = -40º C to +85º C
0.735
0.750
0.765
V
2
V
ENABLE
EN High Threshold Voltage
EN Low Threshold Voltage
0.6
V
S TB Y
STBY High Threshold Voltage
2
STBY Low Threshold Voltage
V
0.6
V
Soft Start
Soft Start Charge Current
85
µA
Soft Start Discharge Current
15
µA
0.65
V
Disable Threshold Voltage for DRVL
Out of Tri-state
Pull below this level, turning ON
DRVL (Turn ON low side FET)
Error Amplifier
Voltage Feedback Reference
TA = -40º C to +85º C
0.735
0.750
Input Bias Current (Source)
0.765
V
2
µA
Open Loop Gain (1)
70
dB
Unity Gain Bandwidth (1)
3
MHz
Output Source/Sink Current
1
mA
10
V/µS
75
nS
Slew Rate (1)
100pF capacitive loading
PWM Comparator to Output Delay (1)
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SC2542
POWER MANAGEMENT
Electrical Characteristics (Cont.)
Unless specified: TA = 25°C, VIN = 16V, FS = 200KHz.
Parameter
Test Conditions
Min
Typ
Max
Units
300
KHz
245
KHz
Oscillator
Frequency Range per Phase
100
ROSC = 73K Ω
175
210
300
400
nS
Oscillator Ramp Peak Voltage
3.0
V
Oscillator Ramp Valley Voltage
1
V
Oscillator Frequency per Phase
Minimum OFF Time
Current Limit
ILIM Source Current
9
ILIM Offset Voltage
10
11
µA
2
mV
MINSET
Minimum Pulse Width Set
VIN = 16V, R = 107K Ω
1
µS
Minimum Pulse Width Set
VIN = 8V, R = 107K Ω
2
µS
Minimum Pulse Width Set
VIN = 16V, R = 53K Ω
500
nS
PWM 1 & 2 Maximum Duty Cycle
ROSC = 73k Ω
90
%
PWM 1 & 2 Minimum Duty Cycle
ROSC = 73k Ω
0
%
High Side Gate Drive (Source)
Source/Sink
0.5
A
Low Side Gate Drive (Source)
Source/Sink
0.5
A
Gate Drive Rise Time
COUT = 1000pF
30
nS
Gate Drive Fall Time
COUT = 1000pF
30
nS
80
nS
Feedback voltage
0.89
V
Threshold Voltage
FB1 & FB2 rising
0.675
V
Threshold Voltage
FB1 & FB2 falling
0.57
V
Duty Cycle
Driver
Dead Time
OVP
OVP Threshold Voltage
Pow er Good
Power Good Sink Capability
2005 Semtech Corp.
Sink 1mA
4
0.4
V
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SC2542
POWER MANAGEMENT
Pin Configuration
Ordering Information
TOP VIEW
VIN
1
28
AGND
VCC
2
27
5VSBY
EN
3
26
ROSC
STBY
4
25
PWRGD
FB1
5
24
FB2
ERROUT1
6
23
ERROUT2
MINSET1
7
22
MINSET2
SS1
8
21
SS2
ILIM1
9
20
ILIM2
BST1
10
19
BST2
DRVH1
11
18
DRVH2
PHASE1
12
17
PHASE2
DRVL1
13
16
DRVL2
PGND
14
15
PVCC
Part Number
Package(1)
Temp. Range (TA)
SC2542TETRT(2)
TSSOP-28-EDP
-40 to +85
S C 2542E V B
Evaluation Board
Notes:
(1) Only available in tape and reel packaging. A reel
contains 2500 devices.
(2) Lead free product. This product is fully WEEE and RoHS
compliant.
(28 Pin TSSOP-EDP)
Marking Information
(TOP VIEW)
SC2542TE
yyww
xxxxxx
yyww = Date Code (Example: 0012)
xxxxx = Semtech Lot No. (Example: P94A01)
© 2005 Semtech Corp.
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SC2542
POWER MANAGEMENT
Pin Descriptions
Pin #
Pin Name
1
VIN
2
VC C
3
ENABLE
4
STBY
5
FB 1
6
ERROUT1
Error amplifier output for buck converter 1.
7
MINSET1
Connect external resistor from this pin to AGND to set the minimum pulse width in
discontinuous mode. This also sets the operating frequency in skip mode for a given load.
8
SS1
An external capacitor connected from this pin to AGND sets the soft-start time. Disable
output1 by pulling this pin below 0.65V.
9
ILIM1
An external resistor connected from this pin to PHASE1 sets the overcurrent shutdown trip
point.
10
BST1
Boost capacitor connection for OUTPUT1 high side gate drive. Connect an external capacitor
as shown in the Typical Application Circuit.
11
DRVH1
12
PHASE1
13
DRVL1
Low side gate drive for output 1.
14
PGND
Power ground of low-side drivers.
15
PVC C
Supply voltage for low-side gate drivers.
16
DRVL2
Low-side gate drive for output 2.
17
PHASE2
18
DRVH2
19
BST2
Boost capacitor connection for the OUTPUT2 high side gate drive. Connect an external
capacitors as shown in the Typical Application Circuit.
20
ILIM2
An external resistor connected from this pin to PHASE2 sets the overcurrent shutdown trip
point.
21
SS2
An external capacitor connected from this pin to AGND sets the soft-start time. Disable output
2 by pulling this pin below 0.65V.
22
MINSET2
Connect one external resistor from this pin to AGND to set the minimum pulse width in
discontinuous mode. This also sets the operating frequency in skip mode for a given load.
23
ERROUT2
Error amplifier output for buck converter 2.
24
FB 2
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Pin Function
Input supply voltage. The range is from 6.5V to 28V.
10V regulator output. Supply voltage for chip bias and gate drivers.
TTL compatible level. Then ENABLE is low, all outputs are disabled. Typical shitdown current
is 100nA.
When pulled low the 10V regulator and both switcher outputs are disabled. Only 5VSBY is
available. Quiescent current is typically 200µA.
Negative input of the error amplifier for output 1.
Gate drive for the high side MOSFET of OUTPUT1. 180 degree out of phase with DRVH2.
Phase node for output 1.
Phase node for output 2.
Gate drive for the high side MOSFET of OUTPUT2. 180 degree out pf phase with GDRVH1.
Negative input of the error amplifier for output 2.
6
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SC2542
POWER MANAGEMENT
Pin Descriptions (Cont.)
Pin #
Pin Name
25
PWRGD
26
ROSC
An external resistor connected from this pin to AGND sets oscillator frequency.
27
5V S B Y
5V regulator output. Disabled when ENABLE is pulled low.
28
AGND
Analog signal ground.
-
THERMAL
PAD
2005 Semtech Corp.
Pin Function
Open collector output. Pulls low when eigher output is below the power good threshold level.
Pad for heatsinking purposes. Connect to ground plane using multiple vias. Not connected
internally.
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SC2542
POWER MANAGEMENT
Block Diagram (Only Channel-1 shown)
PVCC
BST1
Protect 1
DRVH1
PHASE1
Ramp1
ROSC
PHASE1
PVCC
+
Oscillator
Ramp
generator
S
Q
DRVL1
-
CLK1
R
ERROUT1
FB1
PVCC
PWM
FB1
-
VCC
Minumin
Pulse
Generator
Protect 1
MINSET1
E/A
OUT
85uA
0.75V
+
+
OUT
OUT
-
SS1
Skip
Mode
dector
0.65V
+
VCC
R
-
3R
R
S
/Q
Protect 1
10u A
UVLO
ILIM1
OCP
15uA
OUT
+
VCC
VCC
+
OVP
VIN
OUT
5VSBY
ENABLE
-
EN
ON/OFF
VCC
STBY
STBY
0.89V
0.75V
5V
LDO
Band
Gap 1
10V
LDO
Band
Gap 2
UVLO
PWRGD
0.75V
0.675V
FB1
FB2
AGND
© 2005 Semtech Corp.
FB1
8
+
-
OUT
OVP
OCP
-
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SC2542
POWER MANAGEMENT
Applications Information
General Description
DRVH 1
The SC2542 is a fixed frequency dual voltage mode stepdown PWM controller for adapter or battery operated
systems. The two channels of the controller operate 180
degrees out of phase, which results in lower input current ripple and reduces the amount of input filtering capacitance needed.
DRVL 1
PHASE 1
Synchronous and “pulse skip” mode of operation are
adopted in both switching channels to increase overall
efficiency. The internal light-load current detection circuit and minimum pulse setting circuit determine the
mode of operation and the “pulse skip” duration.
IL 1
To extend battery life, the SC2542 features shutdown
mode, where the quiescent current is 100nA (typical),
and standby mode, where the 5V linear standby regulator is active and quiescent current is typically 200uA.
Figure 2. Typical waveforms of SPWM mode.
To enhance light-load efficiency, “pulse skip” mode (SKIP)
can be enabled by placing a resistor from the RMIN pin
to ground. For normal loads the controller will operate in
SPWM mode, but when the load is light enough, the pulse
widths of the top and bottom MOSFETs will be adjusted
by the load condition. The SC2542 employs a simple
circuit to detect the load condition by monitoring the
PHASE node of the circuit. The PHASE node will start to
turn positive if the inductor current begins to reverse (IL
< 0) signaling a light-load condition.
The functional block diagram is shown in Figure 1.
INPUT
EN
5VSBY
5V
Power in
Linear
Sequence
STBY
Regulator
VO1
VO2
Channel 1
Channel 2
SMPS
SMPS
If a light-load condition is detected the SC2542 will operate in SKIP mode. Similar to a buck converter in discontinuous conduction mode (DCM), the converter will
try to reduce its duty cycle as the load decreases. For
example, it would start out with continuous conduction
mode (CCM) duty cycle values, but as the load decreases,
the duty cycle would try to shrink to zero as shown in
Figure 3. However, the SC2542 clamps the DCM duty
cycle to a minimum percentage (set by the RMIN resistor)
of the CCM value. If the DCM duty cycle falls below this
percentage, SKIP mode will be active.
PWG
Power
Good
Figure 1. The functional block diagram.
Skip Mode Operation
When the RMIN pin is left open, the SC2542 operates
as a synchronous PWM (SPWM) controller with the bottom MOSFET ON whenever the top MOSFET is OFF. Figure 2 shows the typical SPWM waveforms.
© 2005 Semtech Corp.
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
Duty
D<
Vo
Vi
D
SKIP mode therefore leads to a reduction in the average
switching frequency. MOSFET switching losses and driver
losses, both of which are proportional to frequency, are
significantly reduced at these light loads resulting in increased efficiency. SKIP mode also reduces the circulating currents associated with SPWM mode. The test result (Figure 5) shows the efficiency improvement in SKIP
mode.
Vo
Vi
Nominal
duty
Min. duty
clamp
DCM
CCM
Iout
E ffic ie n c
1 00 .00 %
Figure 3. Conventional Buck converter duty cycle vs.
load current.
80 .00 %
60 .00 %
40 .00 %
Skip Mod e
Sy n c h r on o us CCM
20 .00 %
0 .00 %
10
1 00
10 00
1 00 00
Io (m A)
Figure 4 further explains the basic theory of SKIP mode
operation. When the load current falls from CCM to DCM,
the duty cycle of DRVH (output of PWM comparator) will
shrink. The programmed minimum pulse width of
SC2542 with the DRVH signal to get the TG (top side
MOSFET gate driver) pulse output. The TG output will
maintain at least the programmed minimum pulse width.
This TG pulse pumps up the output voltage causing the
Error Amplifier output to decrease as the output voltage
moves up. The PWM comparator may skip several cycles
before sending another pulse when the output voltage
drops down. The BG (bottom side MOSFET gate driver)
output will terminate whenever the inductor current
crosses zero.
Figure 5. Skip mode improves light load efficiency.
Figure 6 (a) and (b) show typical waveforms of SKIP mode
at different light load conditions. The frequency can actually fall very low at very light loads. When the switching
frequency drops to the acoustic frequency range, very
minor acoustic frequency noise might be generated, but
the level of the noise is usually very low due to very small
flux excursion in the magnetics. The acoustic noise can
be totally avoided by using well constructed magnetics
or by knowing the minimum system loads to program the
SKIP mode operation accordingly.
Ramp
Veo
TG
IL
BG
Vo
Vo
TG
DRVH
Inductor
Current
Min pulse
DRVL
Figure 4. The waveforms of SKIP mode operation.
© 2005 Semtech Corp.
(a)
10
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
350
TG
300
Fsw(KHz)
BG
Vo
250
200
150
100
Inductor
Current
50
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
Rosc(KOHM)
(b)
Figure 6. Typical waveforms of SKIP mode.
Figure 7. Switching frequency versus Rosc.
Power on Sequence
Frequency Setting
After applying the input voltage and with STBY and EN
inputs high, Vcc and 5VSTBY will rise. When Vcc rises
above the UVLO threshold both switcher outputs will also
ramp up. By pulling the SS pins low, the two switcher
outputs can be disabled, with Vcc and 5VSTBY maintaining regulation. Vcc will turn off when STBY is pulled low,
with 5VSTBY maintaining regulation. And finally 5VSTBY
will turn off when EN is pulled low, and the device will be
in shutdown mode.
The frequency of the SC2542 is user- programmable.
The oscillator of SC2542 can be programmed with an
external resistor from the Rosc pin to ground. The stepdown controller is capable of operating up to 300KHz.
The relationship between oscillation frequency versus
oscillation resistor is shown in Figure 7.
The advantages of using constant frequency operation
include simple passive component selection and ease of
feedback compensation. Before setting the operating frequency, the following trade-offs should be considered.
1) Passive component size
2) Circuitry efficiency
3) EMI condition
4) Minimum switch on time
5) Maximum duty ratio
For a given output power, the sizes of the passive components are inversely proportional to the switching
frequency, whereas MOSFETs/Diodes switching losses
are proportional to the operating frequency. Other issues
such as heat dissipation, packaging, and cost also need
to be considered. The frequency bands for signal transmission should be avoided because of EM interference.
© 2005 Semtech Corp.
Mode
Logic input
Normal Mode:
Both PWM rails in regulation
5V STBY rail in regulation
VCC rail in regulation
Setting EN pin to logic high
Setting STBY pin to logic high
No pull down of SS
Standby Mode:
5V STBY rail in regulation
Setting EN pin to logic high
Setting STBY pin to logic high
Shutdow n Mode:
Setting EN pin to logic low
Soft Start
During start-up, the reference voltage of the error amplifier equals 30% of the voltage on Css (soft-start capacitor) which is connected between the SS pin and ground.
When the controller is enabled (by pulling EN pin or STBY
11
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
is an internal current source that flows out of the ILIM
pin which will generate a voltage drop on the setting resistor. When the sum of the setting resistor voltage and
the MOSFET drain to source voltage is less then zero,
the OCP condition will be flagged. This functionality is
depicted in Figure 8.
pin high), an internal 84uA current source, Iss, (soft start
current) will charge the soft-start capacitor gradually. The
PWM output starts pulsing when the soft start voltage
reaches 1V.
This soft start scheme will ensure the duty cycle increases
slowly, therefore limiting the in rush current into the output capacitor and also ensuring the inductor does not
saturate. The soft start capacitor will eventually be
charged up to 2.5V.
The following formula is used to set the OCP level:
10µ A× RILIM = IL _ PEAK × RDS(ON)
When OCP is tripped, both high side and low side MOSFETs will be turned off and this condition is latched. At
the same time, the soft start cap will be discharged by
the internal current source of 15uA. When the Vss drops
bellow 0.65V, the DRVL pin will go high again.
The soft-start sequence is initiated when EN pin or STBY
pin is high and Vcc > 5.5V or during recovery from a fault
condition ( OCP, OVP, or UVLO).
The period of start up can be programmed by the soft
start capacitor:
To avoid switching noise during the phase node commutation, a 100nS blanking time is built in after the low
side MOSFET is turned on, as shown in Fig. 9.
C ×2.5V
TSS = SS
84 µ A
Shutdown
VCC
When the EN pin or STBY pin is pulled low, an internal
15uA current source discharges the soft-start capacitor
and DRVH/DRVL signals stop pulsing. The output voltage ramps down at a rate determined by the load condition.
10uA
+
OCP
DRVH
ILIM
OUTPUT
Out
The SC2542 can also be shutdown by pulling down directly on the SS pin. The designer needs to consider the
slope of the SS pin voltage and choose a suitable pull
down resistor to prevent the output from undershooting.
-
Shutdown can also be triggered under an OCP condition.
When an OCP condition is detected, DRVH and DRVL will
stop pulsing and enter a “tri-state shutdown” with the
output voltage ramping down at a rate determined by
the load condition. The internal 15uA current source will
begin discharging the soft-start capacitor and when the
soft-start voltage reaches 0.65V, DRVL will go high.
DRVL
Figure 8. Block diagram of over current protection.
TG
IL
Over Current Protection (OCP)
The inductor current is sensed by using the low side
MOSFET Rds(on). After low side MOSFET is turned on,
the OCP comparator starts monitoring the voltage drop
across the MOSFET. The OCP trip level is programmed
by a resistor from the ILIM pin to the phase node. There
© 2005 Semtech Corp.
100nS
Blanking
OCP
Figure 9. OCP comparator timing chart.
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
FO =
1
2π LCO
FZ =
1
2π R ESRCO
A resistive divider is used to program the output voltage.
The top resistor, Rtop, of the divider in Figure 12 can be
chosen from 20kΩ to 30kΩ. Then the bottom resistor,
Rbot, is found from:
RBOT =
0.75 V
∗ R TOP
VO − 0.75 V
where 0.75V is the internal reference voltage of the
SC2542.
The other components of the compensator can be calculated using following design procedure:
The compensator in Figure 10 includes an error amplifier and compensation networks Zf and Zs. It is implemented by the circuit in Figure 12. The compensator provides an integrator, double poles, and double zeros. As
shown in Figure 11, the integrator is used to boost the
gain at low frequency. Two zeros are introduced to compensate excessive phase lag at the loop gain crossover
due to the integrator (-90deg) and the complex pole pair
(-180deg). Two high frequency poles are designed to compensate the ESR zero and to attenuate high frequency
noise.
(1). Plot the converter gain, including LC filter and PWM
modulator.
(2). Select the open loop crossover frequency Fc located
at 10% to 20% of the switching frequency.
(3). Use the first compensator pole Fp1 to cancel the
ESR zero.
(4). Have the second compensator pole Fp2 at half the
switching frequency to attenuate the switching ripple and
high frequency noise.
(5). Place the first compensator zero Fz1 at or below
50% of the power stage resonant frequency Fo.
(6). Place the second compensator zero Fz2 at or below
the power stage resonant frequency Fo.
A MathCAD program is available upon request for the
calculation of the compensation parameters.
Design Procedure for a Step-down Power Converter
Selection criteria and design procedures for the following parameters are described:
Figure 11. Bode plots for control loop design.
1) Output inductor (L) type and value
2) Output capacitor (Co) type and value
3) Input capacitor (Cin) type and value
4) Power MOSFETs
5) Current sensing and limiting circuit
6) Voltage sensing circuit
7) Loop compensation network
C2
C1
R2
C3
Rtop
Vc
R3
Vo
Out
E/A
The following step-down converter specifications are
needed:
+
0.75V
Rbot
Figure 12. Compensation network.
2005 Semtech Corp.
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
Input voltage range: Vin,min and Vin,max
Input voltage ripple (peak-to-peak): DVin
Output voltage: Vo
Output voltage accuracy: e
Output voltage ripple (peak-to-peak): DVo
Nominal output (load) current: Io
Maximum output current limit: Io,max
Output (load) current transient slew rate: dIo/dt (A/s)
Circuit efficiency: η
tance value. The inductance varies with temperature and
DC current. It is a good engineering practice to re-evaluate the resultant current ripple at the rated DC output
current.
c) Current rating: The saturation current of the inductor
should be at least 1.5 times of the peak inductor current under all conditions.
Inductor (L) and Ripple Current
The output capacitor provides output current filtering in
steady state and serves as a reservoir during load transient. The output capacitor can be modeled as an ideal
capacitor in series with its parasitic ESR and ESL as shown
in Figure 13.
Output Capacitor (Co) and Vout Ripple
Both step-down controllers in the SC2542 operate in
synchronous continuous-conduction mode (CCM)
regardless except in light-load mode. The output
inductor selection/design is based on the output DC
and transient requirements. Both output current and
voltage ripples are reduced with larger inductance but
it takes longer to change the inductor current during
load transients. Conversely smaller inductance results
in lower DC copper losses but the AC core losses (flux
swing) and the winding AC resistance losses are higher.
A compromise is to choose the inductance such that
peak-to-peak inductor ripple-current is 20% to 30% of
the rated output load current.
Assuming that the inductor current ripple (peak-topeak) value is δ Io, the inductance value will then be:
L=
Figure 13. An equivalent circuit of output.
If the current through the branch is ib(t), the voltages
across the terminalst will then be:
VO(t ) = VO +
This basic equation illustrates the effects of ESR, ESL,
and Co on the output voltage.
VO (1 − D )
δ IOFS
The first term is the DC voltage across Co at time t = 0.
The second term is the voltage variation caused by the
charge balance between the load and the converter output. The third term is voltage ripple due to ESL and the
fourth term is the voltage ripple due to ESR. The total
output voltage ripple is then a vector sum of the last
three terms. Since the inductor current is a triangular
waveform with peak-to-peak value ä*Io, the ripple-voltage caused by inductor current ripples is:
The peak current in the inductor becomes:
(1 + δ / 2) * IO
and RMS current is:
IL,rms = IO 1 +
δ2
12
The followings are to be considered when choosing inductors.
a) Inductor core material: For higher efficiency applications above 300 KHz, ferrite, Kool-Mu and polypermalloy
materials should be used. Low-cost powdered iron cores
can be used for cost sensitive-applications below 300
KHz but with attendant higher core losses.
b) Select inductance value: Sometimes the calculated
inductance value is not available off-the-shelf. The designer can choose the adjacent (larger) standard induc 2005 Semtech Corp.
1
dib(t )
ib(t )dt + Lesl
+ Re srib(t ).
∫
Co 0
dt
∆VC ≈
δIO
,
8CO fs
the ripple-voltage due to ESL is:
∆VESL = L esl fs
δIO
,
D
and the ESR ripple-voltage is:
∆VESR = R esr δIO
15
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
Remark 1: High frequency ceramic capacitors may not
carry most of the ripple current. It also depends on the
capacitor value. Only when the capacitor value is set
properly, the effect of ceramic capacitor low ESR starts
to be significant. For example, if a 10uF, 4mÙ ceramic
capacitor is connected in parallel with 2x1500uF, 90mÙ
electrolytic capacitors, the ripple current in the ceramic
capacitor is only about 42% of the current in the electrolytic capacitors at the ripple frequency. If a 100uF, 2mÙ
ceramic capacitor is used, the ripple current in the ceramic capacitor will be about 4.2 times of that in the
electrolytic capacitors. When two 100uF, 2mÙ ceramic
capacitors are used, the current ratio increases to 8.3.
In this case most of the ripple current flows in the ceramic decoupling capacitor. The ESR of the ceramic capacitors will then determine the output ripple-voltage.
Aluminum capacitors (e.g. electrolytic) have high capacitances and low ESL. The ESR has the dominant effect
on the output ripple voltage. It is therefore very important to minimize the ESR. Other types to choose are
solid OS-CON, POSCAP, and tantalum.
When determining the ESR value, both the steady state
ripple-voltage and the dynamic load transient need to be
considered. To meet the steady state output ripple-voltage spec, the ESR should satisfy:
RESR1 <
∆VO
δIO
To limit the dynamic output voltage overshoot/undershoot within a (say 3%) of the steady state output voltage from no load to full load, the ESR value should satisfy:
RESR 2 <
Remark 2: The total equivalent capacitance of the filter
bank is not simply the sum of all the paralleled capacitors. The total equivalent ESR is not simply the parallel
combination of all the individual ESR either. Instead they
should be calculated using the following formula.
3%VO
IO
Then, the required ESR value of the output capacitors
should be:
Resr = min{Resr1,Resr2 }.
C EQ (ω ) =
The voltage rating of aluminum capacitors should be at
least 1.5Vo. The RMS current ripple rating should also
be greater than:
δ IO
C EQ (ω ) =
2 3
2
2
2
2
2
R1 A R1 B ( R1 A + R1 B )ω 2 C1 A C1B + ( R 1 B C1 B + R1 AC1 A )
2
2
( R1 A + R1B ) 2 ω 2 C1 A C1B + (C1 A + C1B ) 2
where R1a and C1a are the ESR and capacitance of electrolytic capacitors, and R1b and C1b are the ESR and
capacitance of the ceramic capacitors, respectively (Figure 13)
Usually it is necessary to have several capacitors of the
same type in parallel to satisfy the ESR requirement. The
voltage ripple caused by the capacitor charge/discharge
should be an order of magnitude smaller than the voltage ripple caused by the ESR. To guarantee this, the capacitance should satisfy:
CO >
2
( R1 A + R1B ) 2 ω 2 C1 A C1 B + (C1 A + C 1 B ) 2
2
2
( R1 A C1 A + R1B C1B )ω 2 C1 AC1B + (C1 A + C1B )
10
2π fs RESR
In many applications, several low ESR ceramic capacitors are added in parallel with the aluminum capacitors
in order to further reduce ESR and improve high frequency decoupling. Because the values of capacitance
and ESR are usually different in ceramic and aluminum
capacitors, the following remarks are made to clarify
some practical issues.
C1a
C1b
Ceq
R1a
R1b
Req
Figure 14. Equivalent RC branch.
2005 Semtech Corp.
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
Req and Ceq are both functions of frequency. For rigorous design, the equivalent ESR should be evaluated at
the ripple frequency for voltage ripple calculation when
both ceramic and electrolytic capacitors are used. If R1a
= R1b = R1 and C1a = C1b = C1, then Req and Ceq will
be frequency-independent and
Req = 1/2 R1 and Ceq = 2C1.
Input Capacitor (Cin)
The input supply to the converter usually comes from a
pre-regulator. Since the input supply is not ideal, input
capacitors are needed to filter the current pulses at the
switching frequency. A simple buck converter is shown in
Figure 14.
L1
Q1
Rin
Figure 15. Typical waveforms at converter input.
Resr
D1
Co
It can be seen that the current in the input capacitor
pulses with high di/dt. Capacitors with low ESL should be
used. It is also important to place the input capacitor
close to the MOSFETs on the PC board to reduce trace
inductances around the pulse current loop.
Ro
VDC
Cin
Figure 14. A simple model for the converter input.
The RMS value of the capacitor current is approximately:
In Figure 14 the DC input voltage source has an internal
impedance Rin and the input capacitor Cin has an ESR
of Resr. MOSFET and input capacitor current waveforms,
ESR voltage ripple and input voltage ripple are shown in
Figure 15.
ICin = IO
δ2
D 2
D (1 + )(1 − ) + (1 − D)
12
η
The power dissipated in the input capacitors is then:
PCin = I Cin
2
Resr
For reliable operation, the maximum power dissipation
in the capacitors should not result in more than 10°C of
temperature rise. Many manufacturers specify the maximum allowable ripple current (ARMS) rating of the capacitor at a given ripple frequency and ambient temperature. The input capacitance should be high enough to
handle the ripple current. It is common practice that multiple capacitors are placed in parallel to increase the
ripple current handling capability.
Sometimes meeting tight input voltage ripple specifications may require the use of larger input capacitance. At
full load, the peak-to-peak input voltage ripple due to
2005 Semtech Corp.
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
losses and conduction losses of the MOSFET are directly
related to the total gate charge (Cg) and channel on-resistance (Rds(on)). In order to judge the performance of
MOSFET, the product of the total gate charge and onresistance is used as a figure of merit (FOM). Transistors
with the same FOM follow the same curve in Figure 16
the ESR is:
δ
∆VESR = RESR (1 + ) IO
2
The peak-to-peak input voltage ripple due to the capacitor is:
∆VC ≈
DIO
CIN fS
From these two expressions, CIN can be found to meet
the input voltage ripple specification. In a multi-phase
converter, channel interleaving can be used to reduce
ripple. The two step-down channels of the SC2542 operate at 180 degrees from each other. If both step-down
channels in the SC2542 are connected to the same input rail, the input RMS currents will be reduced. Ripple
cancellation effect of interleaving allows the use of
smaller input capacitors.
Gate Charge (nC)
50
When two channels with a common input are interleaved, the total DC input current is simply the sum of
the individual DC input currents. The combined input current waveform depends on duty ratio and the output
current waveform. Assuming that the output current
ripple is small, the following formula can be used to estimate the RMS value of the ripple current in the input
capacitor.
If D1>0.5 and (D1-0.5) < D2<0.5, then:
ICIN ≈ 0.5IO1 + (D1 − 0.5)(IO1 + IO2)2 + (D2 − D1 + 0.5)IO22
If D1>0.5 and D2 < (D1-0.5) < 0.5, then:
ICIN ≈ (D1+ D2 −1)(IO1 + IO2 )2 + (1− D2 )I
20
1
0
0
5
15
20
1
Rds
On-resistance (mOhm)
10
20
The closer the curve is to the origin, the lower is the FOM.
This means lower switching loss or lower conduction loss
or both. It may be difficult to find MOSFET with both low
Cg and low Rds(on). Usually a trade-off between
Rds(on)and Cg has to be made.
MOSFET selection also depends on applications. In many
applications, either switching loss or conduction loss dominates for a particular MOSFET. For synchronous buck
converters with high input to output voltage ratios, the
top MOSFET is hard switched but conducts with very low
duty cycle. The bottom switch conducts at high duty cycle
but switches at near zero voltage. For such applications,
MOSFET with low Cg are used for the top switch and
MOSFET with low Rds(on) are used for the bottom switch.
2
2
O1
Cg( 500 ?Rds)
Figure 16. Figure of Merit curves.
If D1<0.5 and D2<0.5, then:
2
Cg( 200 ?Rds)
FOM:100*10^{-12}
FOM:200*10^{-12}
FOM:500*10^{-12}
Let the duty ratio and output current of Channel 1 and
Channel 2 be D1, D2 and Io1, Io2, respectively.
ICIN ≈ D1IO1 + D2IO2
40
Cg( 100 ?Rds)
MOSFET power dissipation consists of:
a) conduction loss due to the channel resistance Rds(on);
b) switching loss due to the switch rise time tr and fall
time tf; and
c) the gate loss due to the gate resistance RG.
2
O2
+ (1− D1)I
Choosing Power MOSFETs
Main considerations in selecting the MOSFETs are power
dissipation, MOSFETs cost, and packaging. Switching
2005 Semtech Corp.
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
Top Switch
the switch current to reach its full-scale value Ids,.and
Qgd is the charge needed to charge gate-to-drain (Miller)
capacitance when Vds is falling.
The RMS value of the top switch current is calculated as:
I Q 1, rms = I O
D (1 +
δ2
12
Switching losses occur during the time interval [t1, t3].
Defining tr = t3-t1 and tr can be approximated as:
)
Tr =
The conduction losses are then:
PTC = IQ1,rms 2R
( Q gs 2 + Q gd ) R gt
V cc − V gsp
where Rgt is the total resistance from the driver supply
rail to the gate of the MOSFET. It includes the gate driver
internal impedance Rgi, external resistance Rge and the
gate resistance Rg within the MOSFET:
DS ( ON )
Rds(on) varies with temperature and gate-source voltage.
Curves showing Rds(on) variations can be found in manufacturers’ data sheet. From the Si4860 datasheet, Rds
(on) is less than 8mΩ when Vgs is greater than 10V.
However Rds(on) increases by 50% as the junction temperature increases from 25°C to 110°C.
RGT = RGI + RGE + RG
Vgsp is the Miller plateau voltage shown in Figure17.
Similarly an approximate expression for tf is:
The switching losses can be estimated using the simple
formula:
Tf =
1
δ
PTS = (tr + t f )(1 + ) IOVIN f S
2
2
(Qgs 2 + Qgd ) Rgt
Vgsp
Only a portion of the total losses Pg = QgVccfs is dissipated in the MOSFET package. Here Qg is the total gate
charge specified in the datasheet. The power dissipated
within the MOSFET package is:
where tr is the rise time and tf is the fall time of the
switching process. Different manufactures have different definitions and test conditions for tr and tf. To clarify
these, we sketch the typical MOSFET switching characteristics under clamped inductive mode in Figure 17
PTG =
RG
QG VCC fS
RGT
The total bottom switch losses are then:
PT = PTC + PTS + PTG
If the input supply of the power converter varies over a
wide range, then it will be necessary to weigh the relative
importance of conduction and switching losses. This is
because conduction losses are inversely proportional to
the input voltage. Switching loss however increases with
the input voltage. The total power loss of MOSFET should
be calculated and compared for high-line and low-line
cases. The worst case is then used for thermal design.
Bottom Switch
The RMS current in bottom switch is given by:
Figure 17. MOSFET switching characteristics
I Q 2, rms = IO (1 − D)(1 +
In Figure 17, Qgs1 is the gate charge needed to bring the
gate-to-source voltage Vgs to the threshold voltage
Vgs_th. Qgs2 is the additional gate charge required for
© 2005 Semtech Corp.
δ2
12
)
The conduction losses are then:
19
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SC2542
POWER MANAGEMENT
Applications Information (Cont.)
2
Pbc = I Q 2, RMS RDS (ON )
Power Stage
1) Separate the power ground from the signal ground. In
SC2542 design, use an isolated local ground plane for
the controller and tie it to power grand.
where Rds(on) is the channel resistance of bottom MOSFET. If the input voltage to output voltage ratio is high
(e.g. Vin = 12V, Vo = 1.5V), the duty ratio D will be small.
Since the bottom switch conducts with duty ratio (1-D),
the corresponding conduction losses can be quite high.
Due to non-overlapping conduction between the top and
the bottom MOSFET, the internal body diode or the external Schottky diode across the drain and source terminals always conducts prior to the turn on of the bottom
MOSFET. The bottom MOSFET switches on with only a
diode voltage between its drain and source terminals.
The switching loss is negligible due to near zero-voltage
switching.
2) Minimize the size of the high pulse current loop. Keep
the top MOSFET, the bottom MOSFET and the input capacitors within a small area with short and wide traces.
In addition to the aluminum energy storage capacitors,
add multi-layer ceramic (MLC) capacitors from the input
to the power ground to improve high frequency bypass.
3) Reduce high frequency voltage ringing. Widen and
shorten the drain and source traces of the MOSFETs to
reduce stray inductances. Add a small RC snubber if necessary to reduce the high frequency ringing at the phase
node. Sometimes slowing down the gate drive signal also
helps in reducing the high frequency ringing at the phase
node if the EMI is a concern for the system.
The gate losses are estimated as:
PBG =
RG
QG VCC fS
RGT
The total bottom switch losses are then:
4) Shorten the gate drive trace. Integrity of the gate
drive (voltage level, leading and falling edges) is important for circuit operation and efficiency. Short and wide
gate drive traces reduce trace inductances. Bond wire
inductance is about 2~3nH. If the length of the PCB
trace from the gate driver to the MOSFET gate is 1 inch,
the trace inductance will be about 25nH. If the gate drive
current is 2A with 10ns rise and falling times, the voltage
drops across the bond wire and the PCB trace will be
0.6V and 5V respectively. This may slow down the switching transient of the MOSFET. These inductances may also
ring with the gate capacitance.
PB = PBC + PBG
Once the power losses for the top and bottom MOSFET
are known, thermal and package design at component
and system level should be done to verify that the maximum die junction temperature (Tj,max, usually 125°C) is
not exceeded under the worst-case condition. The equivalent thermal impedance from junction to ambient (θJA)
should satisfy:
θ JA ≤
TJ , MAX − TA , MAX
5) Put the decoupling capacitor for the gate drive power
supplies (BST and PVCC) close to the IC and power ground.
PLOSS
θJA depends on the die to substrate bonding, packaging
material, the thermal contact surface, thermal compound
property, the available effective heat sink area, and the
air flow condition (natural or forced convection). Actual
temperature measurement of the prototype should be
carried out to verify the thermal design.
Control Section
6) The frequency-setting resistor Rosc should be placed
close to Pin 23. Trace length from this resistor to the
analog ground should be minimized.
PC Board Layout Issues
7) Place the bias decoupling capacitor right across the
VCC and analog ground AGND.
Circuit board layout is very important for the proper operation of high frequency switching power converters. A
power ground plane is required to reduce ground bounces.
The followings are suggested for proper layout.
© 2005 Semtech Corp.
20
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SC2542
POWER MANAGEMENT
Typical Applications Schematic
1uF/16V VCC 2
3
4
SB
C4 12nF
C6
R6
1n F
6
R8
88.7k
C8
1uF/16V 8
7
R10
15K
C15
1uF/16V
10
R12
R14
41.2k
5
0
2.2
9
11
12
13
14
VIN+
SC2542
VIN
AGND
VCC
5VSBY
EN
ROSC
STBY
PWRGD
FB1
FB2
ERROUT1
ERROUT2
MINSET1
MINSET2
SS1
SS2
ILIM1
ILIM2
BST1
BST2
DRVH1
DRVH2
PHASE1
PHASE2
DRVL1
PGND
DRVL2
PVCC
28
5VSBY
C3
27
R4
26
5VSBY
4.7uF
R5
73.2K
10K
25
24
R7
23
22
R9
21
C9
133k
1uF/16V
20 R11
15K
19 C16
1uF/16V
0
18 R13
2.2
R15
17
16
15
VCC
VIN+
0
Q2
C10
C11
10uF/25V
1uF/16V
0.1uF/25V
Q1
R22
Si4800
0.1uF/25V
TH-PAD
Si4800
C17
10uF/25V
10uF/25V
C14
FB2
41.2k C5 12nF
C7 1n F
C22
C13
PWGRD
C12
10uF/25V
C2
1
GND
VIN+
1uF/25V
EN
FB1
U1
C1
VO1
8.25k
2005 Semtech Corp.
2.2/n.p.
Q4
C23
1n/n.p.
R18
2.2/n.p.
C24
C28 2.2n/n.p.
C27
21
2.2n/n.p.
1n/n.p.
C18
C19
330uF/6.3V
4.7n F
R20 C25
R17
Q3
VO2
4.7 u H
330uF/6.3V
C21
Si4800
C20
470uF/4V
FB1
28k
R25
330
470uF/4V
R16
L2
4.7uH
Si4800
L1
R26
R19
330 C26
4.7n F
28k FB2
R21
4.87k
www.semtech.com
SC2542
POWER MANAGEMENT
Typical Applications Schematic - BOM
R ef
Qty
1
1
C1
1uF, 25V, X5R, Ceramic, 0805
Any
2
6
C2,C8,C9,C15,C16,C22
1uF, 16V, X5R, Ceramic , 0805
Any
3
1
C3
4.7uF, 16V, X5R, Ceramic 1206
Any
4
2
C4,C5
12nF, Ceramic, 0603
Any
5
2
C 6, C 7
1nF, Ceramic 0603
Any
6
2
C 10, C 17
0.1nF, Ceramic 0603
Any
7
4
C11,C12, C13,C14
10uF, 25V, X5R, Ceramic, 1210
Panasonic, ECJ4YB1E106M
8
2
C18,C19
330uF, 6.3V, 18mohm, PosCap
Sanyo, 6TPE330MIL
9
2
C20,C21
470uF, 4V, 15mohm, PosCap
Sanyo, 4TPE470MFL
10
4
C 23, C 24, C 27, C 28
N.P.
11
2
C25,C26
4.7nF, Ceramic, 0603
Any
12
2
L1, L2
4.7uH, 6.8A, 15mohm
Sumida, CDRH127
13
4
Q1, Q2, A3, Q4
S i 4800
Vishay
14
1
R4
73.2K, 0603
Any
15
1
R5
10K , 0603
Any
16
2
R6, R7
41.2K, 0603
Any
17
1
R8
88.7K, 0603
Any
18
1
R9
133K , 0603
Any
19
2
R10,R11
15K , 0603
Any
20
3
R12, R13,R22
0
Any
21
2
R14, R15
2.2, 0603
Any
22
2
R16,R19
28K , 0603
Any
23
2
R17, R18
N.P.
24
1
R20
8.25K, 0603
Any
25
1
R21
4.87K, 0603
Any
26
2
R25,R26
330, 0603
Any
27
1
U1
S C 2542
Semtech
2005 Semtech Corp.
Reference
Part Number/Value
22
Manufacturer
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SC2542
POWER MANAGEMENT
Typical Characteristics
Gate waveform (SPWM Mode)
Gate waveform (SKIP Mode)
CH1:
CH2:
CH2:
CH2:
TG1
BG1
TG2
BG2
Start up
TG1
BG1
TG2
BG2
CH1:
CH2:
CH3:
CH4:
Vi
Vcc
Vss
Vo
Shutdown by pulling down SS pin voltage
CH1:
CH2:
CH3:
CH4:
TG
BG
Vss
Vo
Shutdown by pulling down EN/STBY pin voltage
CH1:
CH2:
CH3:
CH4:
2005 Semtech Corp.
CH1:
CH2:
CH2:
CH2:
Transient response (3 ~ 8A
TG
BG
Vss
Vo
CH1: Vo
CH4: Io
23
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SC2542
POWER MANAGEMENT
Typical Characteristics (Cont.)
Over current protection (5A/10mV)
CH1:
CH2:
CH3:
CH4:
TG
BG
IL
Vo
Efficiency curve for Vout = 3.3V
Operating frequency vs. Rosc
V in= 8V
V in= 16V
3 50
100%
3 00
F s w( K H z
Effic ient
80%
60%
40%
2 50
2 00
1 50
1 00
20%
50
1 80
1 70
160
10
150
9
140
8
1 30
7
1 20
6
1 10
5
Io( A )
1 00
4
90
3
80
2
70
1
60
0
50
40
0%
Ro s c( K OHM)
Efficiency curve for SPWM Mode vs. SKIP Mode
RILIM vs. OCP (Vin = 12V)
9
100.00%
8
Io ( A
Efficiency
80.00%
60.00%
40.00%
skip mode
Synchronize
0.00%
100
1000
6
5
20.00%
10
7
4
10000
4.5
Io(mA)
5 .0
5 .5
6 .0
6 .5
7 .0
7 .5
8 .0
8 .5
9.0
9 .5
RIL IM (K O H M)
© 2005 Semtech Corp.
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SC2542
POWER MANAGEMENT
Typical Characteristics (Cont.)
Icc vs. Vin (Ta = 25 Degree C)
192
190
188
186
184
182
180
178
176
7 .0
6 .5
Icc (mA)
Fs (kHz)
Frequency vs. Temp. (Rosc = 75kohm, Vin = 16V)
6 .0
5 .5
5 .0
-40
-15
10
35
60
85
110
135
8
1 0 1 2 1 4 16
Temp. (Degree C)
Minimum pulse width vs. Temp (Ta)
10.3
1060
Min pulse (nS)
10.1
Vcc (V)
26 28
Vi n(V)
Vcc vs. Vin (Ta = 25 Degree C)
9.9
9.7
9.5
1055
1050
1045
1040
12
14
16
18
20
22
24
26
28
-40
-20
0
20
40
60
80
100
120
Temp. (Degree C)
Vin (V)
Vcc vs. Temp. (Ta = 25 Degree C)
Dead time vs. Ta (Vin = 16V, DH falling to DL rising)
10
100
9.95
90
Dead time
Vcc (V)
18 20 22 24
9.9
9.85
80
70
60
9.8
50
-40
-20
0
20
40
60
80
100
120
-40
Temp. (Ta Degree C)
2005 Semtech Corp.
-20
0
20
40
60
80
100
120
Ta (Degree C)
25
www.semtech.com
SC2542
POWER MANAGEMENT
Outline Drawing - TSSOP-28-EDP
A
D
e
N
2X E/2
E1
E
PIN 1
INDICATOR
ccc C
2X N/2 TIPS
1 23
e/2
B
aaa C
SEATING
PLANE
D
A2 A
C
A1
bxN
bbb
C A-B D
DIMENSIONS
INCHES
MILLIMETERS
DIM
MIN NOM MAX MIN NOM MAX
A
A1
A2
b
c
D
E1
E
e
F
H
L
L1
N
01
aaa
bbb
ccc
.047
.000
.006
.031
.041
.007
.012
.008
.003
.378 .382 .386
.169 .173 .177
.252 BSC
.026 BSC
.210 .216 .220
.112 .118 .122
.018 .024 .030
(.039)
28
8°
0°
.004
.004
.008
1.20
0.00
0.15
0.80
1.05
0.19
0.30
0.09
0.20
9.60 9.70 9.80
4.30 4.40 4.50
6.40 BSC
0.65 BSC
5.35 5.50 5.60
2.85 3.00 3.10
0.45 0.60 0.75
(1.0)
28
0°
8°
0.10
0.10
0.20
F
SEE DETAIL
SIDE VIEW
EXPOSED PAD
H
H
c
GAGE
PLANE
0.25
BOTTOM VIEW
A
L
(L1)
DETAIL
01
A
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B-
TO BE DETERMINED AT DATUM PLANE-H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MO-153, VARIATION AET.
2005 Semtech Corp.
26
www.semtech.com
SC2542
POWER MANAGEMENT
Land Pattern - TSSOP-28-EDP
F
X
DIM
(C)
H
G
Z
Y
P
C
F
G
H
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
(.222)
.224
.161
.126
.026
.016
.061
.283
(5.65)
5.70
4.10
3.20
0.65
0.40
1.55
7.20
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
2005 Semtech Corp.
27
www.semtech.com