Microelectronic Products Quick Reference Guide NAND FLASH — SSD TRRUST-Stor™ 2.5 in. SATA Secure Storage Device Size 64GB 128GB 256GB 512GB 1TB Interface SATA SATA SATA SATA SATA Part Number MSD064AM2R-000I MSD128AS0R-000I MSD256AM2R-000I MSD512AM2R-000I MSD01TAM2R-000I Read/Write Speed 66/51 MB/s** 174/162 MB/s** 161/200 MB/s** 161/200 MB/s** 200/200 MB/s** Voltage (V) 5.0 5.0 5.0 5.0 5.0 Package 2.5" 2.5" 2.5" 2.5" 2.5" Dimensions 100.45 MAX × 69.85 × 9.5 mm 100.45 MAX × 69.85 × 9.5 mm 100.45 MAX × 69.85 × 9.5 mm 100.45 MAX × 69.85 × 9.5 mm 100.45 MAX × 69.85 × 9.5 mm Temperature I I I I I Part Number MSM032AM2L-M00I MSM064AM2L-M00I Read/Write Speed 35/25 MB/s** 66/51 MB/s** Voltage (V) 3.3-5.0 3.3-5.0 Package 524 PBGA 524 PBGA Dimensions 32mm x 28mm x 6mm 32mm x 28mm x 6mm Temperature I I Interface SATA SATA SATA Part Number MM3032AM2R-M00I MM3064AM2R-M00I MM3128AM2R-M00I Read/Write Speed 35/25 MB/s** 66/51 MB/s** 66/51 MB/s** Voltage (V) 3.3-5.0 3.3-5.0 3.3-5.0 Package mSATA mSATA mSATA Dimensions 30mm x 50mm 30mm x 50mm 30mm x 50mm Temperature I I I Interface SATA SATA Part Number MXMCM256AZL-001I MXMCM512AZL-001I Read/Write Speed 175/200 MB/s** 175/200 MB/s** Voltage (V) 5.0 5.0 Package XMC XMC Dimensions 143.75mm x 74mm 143.75mm x 74mm Temperature I I NAND SSD BGA Size 32GB* 64GB Interface SATA SATA mSATA SSD Size 32GB* 64GB 128GB* XMC SSD Size 256GB 512GB Extended Temperature Plastics — Memories DDR3 SDRAM MCPs Size 1GB 1GB 1GB 1GB 2GB 2GB 4GB 4GB 4GB 4GB Organization 128M x 64 128M x 72 128M x 64 128M x 72 512M x 32 512M x 32 512M x 64 512M x 72 512M x 64 512M x 72 DDR2 SDRAM MCPs Size 128MB 256MB 256MB 256MB 512MB 512MB 1GB 1GB Organization 64M x 16 2 x 64M x 16 32M x 64 32M x 72 64M x 64 64M x 72 128M x 72 128M x 64 Part Number W3J128M64X-XPBX W3J128M72X-XPBX W3J128M64X-XLBX W3J128M72X-XLBX W3J512M32X-XBX W3J512M32X-XB2X W3J512M64X-XPBX W3J512M72X-XPBX W3J512M64X-XLBX W3J512M72X-XLBX Data Rate (Mb/s) 800-1333 800-1333 800-1600 800-1600 800-1333 800-1333 800-1333 800-1333 800-1600 800-1600 Voltage (V) K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 K=1.35, G=1.5 Package 375 PBGA 375 PBGA 375 PBGA 375 PBGA 136 PBGA 204 PBGA 543 PBGA 543 PBGA 543 PBGA 543 PBGA Dimensions 21.5mm x 20.5mm 21.5mm x 20.5mm 21.5mm x 20.5mm 21.5mm x 20.5mm 10mm x 14.5mm 10mm x 14.5mm 23mm x 32mm 23mm x 32mm 23mm x 32mm 23mm x 32mm Temperature C, I C, I C, I, M C, I, M C, I, M C, I, M C, I C, I C, I, M C, I, M Part Number W3H64M16E-XBX W3H264M16E-XSBX W3H32M64E-XSBX W3H32M72E-XSB2X W3H64M64E-XSBX W3H64M72E-XSBX W3H128M72E-XSBX W3H128M64E-XSBX Data Rate (Mb/s) 400-667 400-667 400-667 400-667 400-667 400-667 400-667 400-667 Voltage (V) 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 Package 79 PBGA 79 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA 208 PBGA Dimensions 11mm x 14mm 11mm x 14mm 16mm x 20mm 16mm x 20mm 16mm x 22mm 16mm x 22mm 16mm x 22mm 16mm x 22mm Temperature C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M Part Number W3H128M72ER-XNBXƒ Data Rate (Mb/s) 400-667 Voltage (V) 1.8 Package 255 PBGA Dimensions 21mm x 23mm Temperature C, I, M Part Number W3E64M16S-XSBX W3E64M16S-XNBX W3E32M64S-XB2X W3E32M64SA-XB2X W3E32M64S-XB3X W3E32M72S-XB2X W3E32M72S-XB3X W3E64M72S-XBX Data Rate (Mb/s) 200-333 200-333 200-333 200-333 200-333 200-333 200-333 200-266 Voltage (V) 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 Package 60 PBGA 60 PBGA 219 PBGA 219 PBGA 208 PBGA 219 PBGA 208 PBGA 219 PBGA Dimensions 10mm x 12.5mm 10mm x 12.5mm 21mm x 21mm 21mm x 21mm 13mm x 22mm 21mm x 21mm 16mm x 22mm 32mm x 25mm Temperature C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M C, I, M Speed (MHz) 200-266 Voltage (V) 2.5 Package 208 PBGA Dimensions 16mm x 25mm Temperature C, I, M Registered DDR2 SDRAM MCPs Size 1GB Organization 128M x 72 DDR SDRAM MCPs Size 128MB 128MB 256MB 256MB 256MB 256MB 256MB 512MB Organization 64M x 16 64M x 16 32M x 64 32M x 64 32M x 64 32M x 72 32M x 72 64M x 72 Registered DDR SDRAM MCPs Size 256MB Organization 32M x 72 Part Number W3E32M72SR-XBX (ƒ) P reliminary product — This product is developmental, is not fully characterized or qualified and is subject to change without notice. Check with factory for availability. ∗A dvanced product — This product is developmental, is not qualified and is subject to change or cancellation without notice. ∗∗ P erformance values based on 128KiB sequential transfers. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. Microsemi Corporation — Microelectronic Products Quick Reference Guide — Rev. 30 1/16 — MS6-002-16 Microelectronic Products Quick Reference Guide Extended Temperature Plastics — Memories SSRAM MCPs Size 2MB 2MB 4MB 4MB Organization 512K x 32 256K x 72 512K x 72 NBL 512K x 72 NBL NOR Flash MCPs Size Organization Conventional 16MB 2M x 64 Page Mode 32MB 64MB 256MB 512MB 1GB 8M x 32 8M x 64 64M x 32 2 x 64M x 32 4 x 64M x 32 SDRAM MCPs Size 128MB 128MB Organization 16M x 64 16M x 72 Registered SDRAM MCPs Size 128MB Organization 16M x 72 Part Number WED2DL32512V-XBX WEDPY256K72V-XBX WEDPZ512K72V-XBX WEDPZ512K72S-XBX (continued) Speed (MHz) 133-200 100-200 100-150 100-150 Voltage (V) 3.3 3.3 3.3 2.5 Package 119 PBGA 159 PBGA 152 PBGA 152 PBGA Dimensions 14mm x 22mm 14mm x 22mm 17mm x 23mm 17mm x 23mm Temperature C, I, M C, I, M C, I, M C, I, M Speed (ns) Voltage (V) Package Dimensions Temperature 90-150 3.3 159 PBGA 13mm x 22mm C, I, M 110, 120 110, 120 100, 120 110, 120 110, 120 3.3 3.3 3.3 3.3 3.3 159 PBGA 159 PBGA 107 PBGA 107 PBGA 107 PBGA 13mm x 22mm 13mm x 22mm 14mm x 17mm 14mm x 17mm 14mm x 17mm C, I, M C, I, M C, I, M C, I, M C, I, M Part Number WEDPN16M64V-XB2X WEDPN16M72V-XB2X Speed (MHz) 100-133 100-133 Voltage (V) 3.3 3.3 Package 219 PBGA 219 PBGA Dimensions 21mm x 21mm 21mm x 25mm Temperature C, I, M C, I, M Part Number WEDPN16M72VR-XB2X Speed (MHz) 100-133 Voltage (V) 3.3 Package 219 PBGA Dimensions 25mm x 25mm Temperature C, I, M Part Number W72M64VB-XBX W78M32VP-XBX W78M64VP-XSBX W764M32V1-XBX W7264M32V1-XSBX W7464M32V1-XSBX TI OMAP, Sitara, Da Vinci ELP Memory Size 4Gb/2Gb 2Gb/1Gb 2Gb Part Number MS29C4G48MAZAKC1-XX MS29C2G24MAKLA1-XX MS46H64M32LP1-XX NAND Density 4Gb 2Gb — NAND Width x16 x16 — LPDDR Density 2Gb 1Gb 2Gb LPDDR Width x32 x32 x32 Voltage (V) 1.8 1.8 1.8 Package 152 PBGA 152 PBGA 152 PBGA Dimensions 14mm x 14mm 14mm x 14mm 14mm x 14mm Temperature C, I C, I C, I Ceramics SRAM • Flash • EEPROM • Mixed Memory MCPs • Hermetic • Mil-PRF • QML Multiple organizations of flash, SRAM and EE in various hermetic sealed ceramic packages including 32 CSOJ, 32 CerDIP, 56 CSOP, 68 CQFP, 66 PGA, CBGA. These are standard hermetic products available as Class H or K compliant. Microsemi ceramic products are available in industrial, military temperatures and as SMD-5962 qualified components. Applications Engineering Performance, Layout & Design Benefits to Customer This technology reduces PWB real estate, I/O requirements and memory down rounting, Reduced memory-down routing can cut design time by up to ~4 weeks, and save the by typically 20% to 70%. This frees up real-estate for additional product features and can associated opportunity cost. capture more sales opportunities for the board designer. Reduced I/O and routing allows wider pitch on BGA leads and hence easier class 3 PWB Reduction of memory-down routing can save 2-4 PWB layers rule compliance since 0.5mm - 0.65mm pitch memory parts are not placed on the board. Improves parasitic performance (L, Z, C) at first and second level. Use of MCP BOM maintenance costs are reduced since the MCP interface is consistent despite part provides reduced bus capacitance and better signal integrity on the PCB. obsolescence issues which are managed by the Microsemi. SiP Capabilities and Typical Applications Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 email: [email protected] www.microsemi.com Processor Control Configuration NOR Data I/O DMEA trusted on shore facility for design, assembly and test. ITAR conformance Plastic encapsulation or hermetic sealing; laminate or ceramic based packages. QFP, BGA or customer specified packages. Complete turnkey assembly; wire bond, flip chip attach, and specialized die processing including redistribution, wafer dicing and die stacking techniques. Spice (HSpice), ELDO, EBD and IBIS modeling. Environmental and electrical testing: 100% military, industrial or customer defined temperature ranges. Microsemi’s high reliability products are manufactured and tested in accordance with MIL‑PRF‑38534 (Class H and K) and MIL-PRF-38535 (Class Q) Certified. Anti-tamper Circuit card assembly Address DDR2/3 SDRAM DDR2/3 SDRAM DDR2/3 SDRAM DDR2/3 SDRAM DDR2/3 SDRAM x64/x72 FPGA/ASIC/Chipset SATA BGA SSD Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-overEthernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com. ©2015 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi Corporation — Microelectronic Products Quick Reference Guide — Rev. 30 1/16 — MS6-002-16