Known Good Die Information PDF

ADI Known Good Die (KGD)
ADI KGD
Capability:
• Tested to Full Data Sheet Specs (Zero PPM)
• Probing at Temperature (-60oC >190oC)
• Die Thicknesses from 70µm
• Die Sizes from 500µm2
• Full Traceability for each Die Shipped
• Auto Inspection Options
• Outlier Removal Options
Shipping Options:
• Reconstituted Die on Film Frame
• Sawn Wafer on Film Frame
• Waffle Pack
• Tape and Reel
• Certified to ISO9001:2008 and ISO/TS16949
ADI Turnkey Known Good Die (KGD)
In today’s technologically driven world there is an ever-increasing
demand for portable, hand-held, reduced-scale electronic
equipment. Products tend to be lighter, thinner and faster,
but their functionality continues to expand and develop at
high intensity.
Wafer Fab
Back Grind and Saw
This drive for miniaturisation of portable products, in conjunction
with decreased cost requirements and space reduction in larger
products, is paving the way not only for Wafer Level Chip Scale
packages (WLCSP), Flip Chips etc., but also, Bare Die. Customer
demand for increased reliability has greatly contributed to the
requirement of what is termed: Known Good Die (KGD).
100% Electrical Probe/Test
ADI has been offering Known Good Die (KGD) since mid 2006.
Our KGD processes allow for the shipment of product in die format
to exceptionally high quality and reliability standards.
The objective of KGD is to supply die products that meet full
product specification (at-speed function test, burn-in process and
PPM level defects, over the entire temperature range).
The innovative Known Good Die manufacturing process at ADI is
an ideal solution for customers whose applications demand zero
defects. ADI employs a unique delivery process whereby KGD
parts are tested to Full Data Sheet Specification, post singulation.
Part Average Testing
100% Auto Inspection
Pick and Place
Refer to link below for the full listing of ADI released KGD products.
Please note: The majority of ADI’s Standard Product Portfolio can
be provided in KGD Format.
http://mil-aero.analog.com/static/imported-files/microsites/
Mil_Aero/KnownGoodDie.pdf
If you require a KGD Part please email:
Reconstituted Die on Film,
Sawn Wafer on Film,
Waffle Pack,
Tape and Reel
[email protected]
KGD to Customer
Portfolio Snapshot:
Generic
Material
Temp Range Status
ADG841ADG841-KGD-CHIPS-40oC to 125oC Released
AD7924AD7924-KGD-DF -40oC to 85oC Released
AD7466AD7466-KGD-DF -40oC to 85oC Released
AD8229AD8229-KGD-CHIPS-40oC to 210oC Released
AD8028AD8028-KGD-CHIPS-40oC to 125oC Released
AD8065AD8065-KGD-CHIPS-40oC to 85oC Released
ADT7517ADT7517-KGD-DF -40oC to 125oC In process
AD8202AD8202W-KGD-R7 -40oC to 125oC In process
ADA4897-2ADA4897-2-KGD-CHIPS-40oC to 125oC In process
Description
0.28 Ω CMOS 1.65 V to 3.6 V Single SPST Switches
in SC70 Closed for a Logic 1 Input
4-Channel, 1 MSPS, 12-Bit A/D Converter with
Sequencer in 16-Lead TSSOP
1.6 V Micro-Power 12-Bit ADC
1nV/√Hz Low Noise 210°C Instrumentation Amplifier
Low Distortion, High Speed Rail-to-Rail
Input/Output Amplifier
High Performance, 145 MHz FastFET™ Op Amp
SPI-/I2°C Compatible, Temperature Sensor,
4-Channel ADC and Quad Voltage Output
High Common-Mode Voltage, SingleSupply Difference Amplifier
1nV/√Hz Low Power Operational Amplifier