ADI Known Good Die (KGD) ADI KGD Capability: • Tested to Full Data Sheet Specs (Zero PPM) • Probing at Temperature (-60oC >190oC) • Die Thicknesses from 70µm • Die Sizes from 500µm2 • Full Traceability for each Die Shipped • Auto Inspection Options • Outlier Removal Options Shipping Options: • Reconstituted Die on Film Frame • Sawn Wafer on Film Frame • Waffle Pack • Tape and Reel • Certified to ISO9001:2008 and ISO/TS16949 ADI Turnkey Known Good Die (KGD) In today’s technologically driven world there is an ever-increasing demand for portable, hand-held, reduced-scale electronic equipment. Products tend to be lighter, thinner and faster, but their functionality continues to expand and develop at high intensity. Wafer Fab Back Grind and Saw This drive for miniaturisation of portable products, in conjunction with decreased cost requirements and space reduction in larger products, is paving the way not only for Wafer Level Chip Scale packages (WLCSP), Flip Chips etc., but also, Bare Die. Customer demand for increased reliability has greatly contributed to the requirement of what is termed: Known Good Die (KGD). 100% Electrical Probe/Test ADI has been offering Known Good Die (KGD) since mid 2006. Our KGD processes allow for the shipment of product in die format to exceptionally high quality and reliability standards. The objective of KGD is to supply die products that meet full product specification (at-speed function test, burn-in process and PPM level defects, over the entire temperature range). The innovative Known Good Die manufacturing process at ADI is an ideal solution for customers whose applications demand zero defects. ADI employs a unique delivery process whereby KGD parts are tested to Full Data Sheet Specification, post singulation. Part Average Testing 100% Auto Inspection Pick and Place Refer to link below for the full listing of ADI released KGD products. Please note: The majority of ADI’s Standard Product Portfolio can be provided in KGD Format. http://mil-aero.analog.com/static/imported-files/microsites/ Mil_Aero/KnownGoodDie.pdf If you require a KGD Part please email: Reconstituted Die on Film, Sawn Wafer on Film, Waffle Pack, Tape and Reel [email protected] KGD to Customer Portfolio Snapshot: Generic Material Temp Range Status ADG841ADG841-KGD-CHIPS-40oC to 125oC Released AD7924AD7924-KGD-DF -40oC to 85oC Released AD7466AD7466-KGD-DF -40oC to 85oC Released AD8229AD8229-KGD-CHIPS-40oC to 210oC Released AD8028AD8028-KGD-CHIPS-40oC to 125oC Released AD8065AD8065-KGD-CHIPS-40oC to 85oC Released ADT7517ADT7517-KGD-DF -40oC to 125oC In process AD8202AD8202W-KGD-R7 -40oC to 125oC In process ADA4897-2ADA4897-2-KGD-CHIPS-40oC to 125oC In process Description 0.28 Ω CMOS 1.65 V to 3.6 V Single SPST Switches in SC70 Closed for a Logic 1 Input 4-Channel, 1 MSPS, 12-Bit A/D Converter with Sequencer in 16-Lead TSSOP 1.6 V Micro-Power 12-Bit ADC 1nV/√Hz Low Noise 210°C Instrumentation Amplifier Low Distortion, High Speed Rail-to-Rail Input/Output Amplifier High Performance, 145 MHz FastFET™ Op Amp SPI-/I2°C Compatible, Temperature Sensor, 4-Channel ADC and Quad Voltage Output High Common-Mode Voltage, SingleSupply Difference Amplifier 1nV/√Hz Low Power Operational Amplifier