MMBT1010LT1 Low Saturation Voltage PNP Silicon Driver Transistors Part of the GreenLine™ Portfolio of devices with energy−conserving traits. This PNP Silicon Epitaxial Planar Transistor is designed to conserve energy in general purpose driver applications. This device is housed in the SOT-23 and SC−59 packages which are designed for low power surface mount applications. • Low VCE(sat), < 0.1 V at 50 mA Applications • LCD Backlight Driver • Annunciator Driver • General Output Device Driver http://onsemi.com PNP GENERAL PURPOSE DRIVER TRANSISTORS SURFACE MOUNT 3 1 MAXIMUM RATINGS (TA = 25°C) Rating 2 Symbol Value Unit Collector-Base Voltage V(BR)CBO 45 Vdc Collector-Emitter Voltage V(BR)CEO 15 Vdc Emitter-Base Voltage V(BR)EBO 5.0 Vdc IC 100 mAdc Collector Current — Continuous DEVICE MARKING 3 2 1 CASE 318D−04, STYLE 1 SC-59 MMBT1010LT1 = GLP MSD1010T1 = GLP THERMAL CHARACTERISTICS Rating CASE 318−08, STYLE 6 SOT-23 COLLECTOR Symbol Max Unit Power Dissipation TA = 25°C Derate above 25°C PD(1) 250 mW 1.8 mW/°C Thermal Resistance Junction−to−Ambient RθJA 556 °C/W Junction Temperature TJ 150 °C Storage Temperature Range Tstg −55 ~ + 150 °C BASE EMITTER Preferred devices are ON Semiconductor recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 4 1 Publication Order Number: MMBT1010LT1/D MMBT1010LT1 ELECTRICAL CHARACTERISTICS Characteristic Symbol Condition Min Max Unit Collector-Emitter Breakdown Voltage V(BR)CEO IC = 10 mA, IB = 0 15 — Vdc Emitter-Base Breakdown Voltage V(BR)EBO IE = 10 μA, IE = 0 5.0 — Vdc Collector-Base Cutoff Current ICBO VCB = 20 V, IE = 0 — 0.1 μA Collector-Emitter Cutoff Current ICEO VCE = 10 V, IB = 0 — 100 μA DC Current Gain hFE1 (2) VCE = 5 V, IC = 100 mA 300 600 — Collector-Emitter Saturation Voltage VCE(sat)(2) IC = 10 mA, IB = 1.0 mA IC = 50 mA, IB = 5.0 mA IC = 100 mA, IB = 10 mA — — 0.1 0.1 0.19 Vdc Base-Emitter Saturation Voltage VBE(sat)(2) IC = 100 mA, IB = 10 mA — 1.1 Vdc (1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. (2) Pulse Test: Pulse Width ≤ 300 μs, D.C. ≤ 2%. http://onsemi.com 2 MMBT1010LT1 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS correct pad geometry, the packages will self align when subjected to a solder reflow process. Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the 0.037 0.95 0.037 0.95 0.037 0.95 0.037 0.95 0.098-0.118 2.5-3.0 0.079 2.0 0.094 2.4 0.039 1.0 0.035 0.9 0.031 0.8 0.031 0.8 inches mm SC−59 • • • inches mm SOT−23 SC-59/SOT-23 POWER DISSIPATION the equation for an ambient temperature TA of 25°C, one can The power dissipation of the SC-59/SOT-23 is a function calculate the power dissipation of the device which in this of the drain pad size. This can vary from the minimum pad case is 225 milliwatts. size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is 150°C − 25°C PD = = 225 milliwatts determined by TJ(max), the maximum rated junction 556°C/W temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, The 556°C/W assumes the use of the recommended TA. Using the values provided on the data sheet, PD can be footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. Another alternative calculated as follows. would be to use a ceramic substrate or an aluminum core TJ(max) − TA board such as Thermal Clad™. Using a board material such PD = RθJA as Thermal Clad, the power dissipation can be doubled using the same footprint. The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated • The soldering temperature and time should not exceed temperature of the device. When the entire device is heated 260°C for more than 10 seconds. to a high temperature, failure to complete soldering within • When shifting from preheating to soldering, the maximum a short time could result in device failure. Therefore, the temperature gradient should be 5°C or less. following items should always be observed in order to • After soldering has been completed, the device should be minimize the thermal stress to which the devices are allowed to cool naturally for at least three minutes. subjected. Gradual cooling should be used as the use of forced Always preheat the device. cooling will increase the temperature gradient and result The delta temperature between the preheat and soldering in latent failure due to mechanical stress. should be 100°C or less.* • Mechanical stress or shock should not be applied during When preheating and soldering, the temperature of the cooling leads and the case must not exceed the maximum * Soldering a device without preheating can cause temperature ratings as shown on the data sheet. When excessive thermal shock and stress which can result in using infrared heating with the reflow soldering method, damage to the device. the difference should be a maximum of 10°C. SOLDER STENCIL GUIDELINES http://onsemi.com 3 MMBT1010LT1 or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass TYPICAL SOLDER HEATING PROFILE graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177−189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 1 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the STEP 1 PREHEAT ZONE 1 RAMP" 200°C 150°C STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 SPIKE" SOAK" STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP" DESIRED CURVE FOR HIGH MASS ASSEMBLIES 205° TO 219°C PEAK AT SOLDER JOINT 170°C 160°C 150°C 140°C 100°C 100°C 50°C STEP 6 STEP 7 VENT COOLING SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 1. Typical Solder Heating Profile http://onsemi.com 4 MMBT1010LT1 PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 3 1 B S 2 V G C H D J K DIM A B C D G H J K L S V INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60 STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR SC−59 CASE 318D−04 ISSUE F A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. L 3 S 2 DIM A B C D G H J K L S B 1 D G J C H MILLIMETERS MIN MAX 2.70 3.10 1.30 1.70 1.00 1.30 0.35 0.50 1.70 2.10 0.013 0.100 0.09 0.18 0.20 0.60 1.25 1.65 2.50 3.00 INCHES MIN MAX 0.1063 0.1220 0.0512 0.0669 0.0394 0.0511 0.0138 0.0196 0.0670 0.0826 0.0005 0.0040 0.0034 0.0070 0.0079 0.0236 0.0493 0.0649 0.0985 0.1181 STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR K GreenLine is a trademark of Motorola, Inc . Thermal Clad is a registered trademark of the Berquist Company. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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