DATA SHEET Part No. AN44075A Package Code No. HSOP034-P-0300A Publication date: October 2008 SDL00013BEB 1 AN44075A Contents Overview ………………………………………………….…………………………………………………………. 3 Features ………………………………………………….…………………………………………………………. 3 Applications ……….………………………………………………………………………………………………… 3 Package ……………………………………………………………………………………………………………. 3 Type …………………………………...……………………………………………………………………………. 3 Application Circuit Example (Block Diagram) …………………………………………………………………… 4 Pin Descriptions …………………..………………………………………………………………………………. 5 Absolute Maximum Ratings ……………………..……………..…………………………………………………. 6 Operating Supply Voltage Range …………..……………………………………………………………………. 6 Electrical Characteristics ………………….………………….………………….………………………………. 7 Electrical Characteristics (Reference values for design) ………………….………………….………………. 9 Technical Data …………………………………….………………….……………………………………………. 10 • Control mode (truth table) ……....................................…………….…………………………………………. 10 SDL00013BEB 2 AN44075A AN44075A Driver IC for DC motor Overview AN44075A is a one channel H-bridge driver IC. 1-ch. DC motor can be controlled by a single driver IC. Features y Built-in thermal protection and low voltage detection circuit y Built-in over current protection (when external resistance is added to pin 7 and pin 8.) y Built-in 5 V power supply Applications y IC for DC motor drives Package y 34 pin plastic small outline package with back heat sink (SOP type) Type y Bi-CDMOS IC SDL00013BEB 3 AN44075A Application Circuit Example (Block Diagram) BC1 19 0.01 μF 17 VPUMP CHARGE PUMP BC2 18 0.01 μF 100 kΩ STBY 28 S5VOUT AIN2 31 AIN1 30 51 kΩ Gate circuit NFAULT 32 100 kΩ 3 AOUT2 SEL 27 APWM 29 ref_a ref_b TJMON 34 14 AOUT1 1 VM2 50 kΩ 0.1 μF PWM OSC TSD UVLO BLANK S5VOUT 24 0.1 μF M 7 RCSA1 8 RCSA2 Comp REG VM 47 μF 16 VM1 VREFA 22 VREFB 23 Level shift B ref_b Level shift A 25 GND ref_a Note) This application circuit is shown as an example but does not guarantee the design for mass production set. SDL00013BEB 4 AN44075A Pin Descriptions Pin No. Pin name Type Description 1 VM2 Power supply 2 N.C. — 3 AOUT2 4 N.C. — not used 5 N.C. — not used 6 N.C. — not used 7 RCSA1 Input / Output Current detection 1 8 RCSA2 Input / Output Current detection 2 9 GND Ground 10 N.C. — not used 11 N.C. — not used 12 N.C. — not used 13 N.C. — not used 14 AOUT1 15 N.C. — 16 VM1 Power supply 17 VPUMP Output Charge pump circuit output 18 BC2 Output Charge pump capacitor connection 2 19 BC1 Output Charge pump capacitor connection 1 20 N.C. — not used 21 N.C. — not used 22 VREFA Input Peak current setting input 23 VREFB Input Load short threshold input 24 S5VOUT Output Internal reference voltage (5 V output) 25 GND Ground Signal ground 26 GND Ground Die pad ground 27 SEL Input Test mode input 28 STBY Input Standby input 29 APWM Input PWM input 30 AIN1 Input Forward-reverse input 31 AIN2 Input Brake mode input 32 NFAULT 33 N.C. 34 TJMON Output Output Output — Output Motor power supply 2 not used Motor drive output 2 Die pad ground Motor drive output 1 not used Motor power supply 1 Abnormal detection output not used VBE monitor SDL00013BEB 5 AN44075A Absolute Maximum Ratings A No. Parameter Symbol Rating Unit Note VM 37 V *1 1 Supply voltage (pin 1, pin 16) 5 Output pin voltage (pin 3, pin 14) VOUT 37 V *2 6 Motor drive current (pin 3, pin 14) IOUT ±3.0 A *2, *3 7 Flywheel diode current (pin 3, pin 14) If 3.0 A *2, *3 2 Power dissipation PD 0.466 W *4 3 Operating ambient temperature Topr –20 to +70 °C *5 4 Storage temperature Tstg –55 to +150 °C *5 Note) *1: The range under absolute maximum ratings, power dissipation. *2: Do not apply external currents to any pin specially mentioned. For circuit currents, (+) denotes current flowing into the IC and (–) denotes current flowing out of the IC. *3: Rating when cooling fin on the back side of the IC is connected to the GND pattern of the glass epoxy 4-layer board. (GND area: 2nd-layer or 3rd-layer: more than 1 500 mm2 ) In case of no cooling fin on the back side of the IC, rating current is 1.5 A on the glass epoxy 2-layer board. *4: Power dissipation shows the value of only package at Ta = 70°C. When using this IC, refer to the • PD – Ta diagram in the Technical Data and use under the condition not exceeding the allowable value. *5: Expect for the storage temperature and operating ambient temperature, all ratings are for Ta = 25°C. Operating Supply Voltage Range Parameter Supply voltage range Symbol Range Unit Note VM 10.0 to 35.0 V ⎯ Note) The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. SDL00013BEB 6 AN44075A Electrical Characteristics at VCC = 24 V Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Unit No te — V — Max Output drivers VM VM – 0.47 – 0.36 1 High-level output saturation voltage VOH ISA1 = ISA2 = –1 A 2 Low-level output saturation voltage VOL ISA1 = ISA2 = 1 A — 0.50 0.65 V — 3 Flywheel diode forward voltage VDI IDI = ±1 A 0.5 1.0 1.5 V — 4 Output leakage current VM = 37 V, VSRCS = 0 V — 10 20 μA — ILEAK Power supply 5 Supply current 1 (sleep) IM1 VSTBY = 0 V — 65 105 μA — 6 Supply current 2 (with circuit turned on) IM2 VSTBY = 5 V — 7.3 12 mA — 7 Reference voltage VS5VOUT IS5VOUT = –2.5 mA 4.5 5.0 5.5 V — 8 Output impedance ZS5VOUT ΔIS5VOUT = –5 mA — 18 27 Ω — IN input 9 High-level IN input voltage VINH — 2.1 — 5 V — 10 Low-level IN input voltage VINL — 0 — 0.6 V — 11 High-level IN input current IINH VAIN1 = VAIN2 = 5 V – 10 — 10 μA — 12 Low-level IN input current IINL VAIN1 = VAIN2 = 0 V –10 — 10 μA — Standby input 13 High-level STBY input voltage VSTBYH — 2.1 — 5 V — 14 Low-level STBY input voltage VSTBYL — 0 — 0.6 V — 15 High-level STBY input current ISTBYH VSTBY = 5 V 30 — 80 μA — 16 Low-level STBY input current ISTBYL VSTBY = 0 V –10 — 10 μA — PWM input 17 High-level PWM input voltage VPWMH — 2.1 — 5 V — 18 Low-level PWM input voltage VPWML — 0 — 0.6 V — 19 High-level PWM input current IPWMH VAPWM = 5 V 60 — 150 μA — 20 Low-level PWM input current IPWML VAPWM = 0 V –10 — 10 μA — 21 PWM input max. frequency fPWM — — — 200 kHz — 22 Input min. pulse width tW — 2 — — μs — SDL00013BEB 7 AN44075A Electrical Characteristics at VCC = 24 V (continued) Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit No te Peak current detection / over current protection 23 Input bias current IREF VREFA = VREFB = 5 V 83 100 125 μA — 24 PWM frequency fPWM VREFA = 0 V, VREFB = 5 V 17 26 35 kHz — 25 Pulse blanking time TB VREFA = 0 V, VREFB = 5 V 1.5 2.5 4.5 μs — 26 Comp threshold 1 VTH1 VREFA = VREFB = 5 V 480 500 520 mV — 27 Comp threshold 2 VTH2 VREFA = 5.5 V, VREFB = 2.5 V 475 500 525 mV — 28 NFAULT output voltage VNFLT INFLT = 1 mA — — 0.4 V — SDL00013BEB 8 AN44075A Electrical Characteristics (Reference values for design) at VCC = 9 V Note) Ta = 25°C±2°C unless otherwise specified. The characteristics listed below are reference values for design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, Panasonic will respond in good faith to user concerns. B No. Parameter Symbol Conditions Limits Min Typ Max Unit No te Output drivers 29 Output slew rate 1 VTr Rising edge — 270 — V/μs — 30 Output slew rate 2 VTf Falling edge — 330 — V/μs — 31 Dead time TD — — 0.45 — μs — Thermal protection 32 Thermal protection operating temperature TSDon — — 150 — ºC — 33 Thermal protection hysteresis width ΔTSD — — 40 — ºC — Low voltage protection 34 Protection operating voltage UVLO1 — — 8.0 — V — 35 Protection release voltage UVLO2 — — 8.6 — V — SDL00013BEB 9 AN44075A Technical Data y Control mode (truth table) INPUT STBY "H" "L" OUTPUT AIN1 AIN2 APWM AOUT1 AOUT2 Mode — "H" "L" "H" "H" Short brake "L" — "H" "L" "H" Forward "H" — "H" "H" "L" Reverse — "L" "L" OFF OFF Stop — — — OFF OFF Standby INPUT OUTPUT SEL Mode "H" Short detect off "L" Short detect on SDL00013BEB 10 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805